Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (35278) > Сторінка 483 з 588
Фото | Назва | Виробник | Інформація |
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PCA9502BS,157 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 24-VFQFN Exposed Pad Output Type: Push-Pull Mounting Type: Surface Mount Interface: I2C, SPI Number of I/O: 8 Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.3V ~ 3.6V Clock Frequency: 400 kHz Interrupt Output: No Supplier Device Package: 24-HVQFN (4x4) Part Status: Obsolete DigiKey Programmable: Not Verified |
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UJA1169AF-EVB | NXP USA Inc. |
![]() Packaging: Bulk Function: System Basis Chip (SBC) Type: Interface Utilized IC / Part: UJA1169A Supplied Contents: Board(s) Primary Attributes: 12V Supply Secondary Attributes: SPI Interface(s) Embedded: Yes, MCU Part Status: Active |
на замовлення 4 шт: термін постачання 21-31 дні (днів) |
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PHPT60603PY115 | NXP USA Inc. |
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MC13202FC | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 32-VFQFN Exposed Pad Sensitivity: -92dBm Mounting Type: Surface Mount Frequency: 2.4GHz Type: TxRx Only Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2V ~ 3.4V Power - Output: 4dBm Protocol: Zigbee® Current - Receiving: 37mA Data Rate (Max): 250kbps Current - Transmitting: 30mA Supplier Device Package: 32-HVQFN (5x5) GPIO: 7 Modulation: DSSS, O-QPSK RF Family/Standard: 802.15.4, General ISM > 1GHz Serial Interfaces: SPI Part Status: Obsolete DigiKey Programmable: Not Verified |
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PCA24S08AD | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Memory Size: 8Kbit Memory Type: Non-Volatile Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.5V ~ 3.6V Technology: EEPROM Clock Frequency: 400 kHz Memory Format: EEPROM Supplier Device Package: 8-SO Memory Interface: I2C Memory Organization: 1K x 8 DigiKey Programmable: Not Verified |
на замовлення 4264 шт: термін постачання 21-31 дні (днів) |
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PCA24S08AD112 | NXP USA Inc. | Description: EEPROM 1MX8 |
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PCA24S08AD,112 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Memory Size: 8Kbit Memory Type: Non-Volatile Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.5V ~ 3.6V Technology: EEPROM Clock Frequency: 400 kHz Memory Format: EEPROM Supplier Device Package: 8-SO Memory Interface: I2C Memory Organization: 1K x 8 DigiKey Programmable: Not Verified |
на замовлення 1839 шт: термін постачання 21-31 дні (днів) |
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FXLS8964AFR3 | NXP USA Inc. |
![]() Features: Adjustable Bandwidth, Sleep Mode, Temperature Sensor Packaging: Tape & Reel (TR) Package / Case: 10-VFDFN Output Type: I2C, SPI Mounting Type: Surface Mount Type: Digital Axis: X, Y, Z Acceleration Range: ±2g, 4g, 8g, 16g Operating Temperature: -40°C ~ 105°C Voltage - Supply: 1.71V ~ 3.6V Bandwidth: 1.6kHz Supplier Device Package: 10-DFN (2x2) Sensitivity (LSB/g): 1024 (±2g) ~ 128 (±16g) Grade: Automotive Part Status: Active Qualification: AEC-Q100 |
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FXLS8964AFR3 | NXP USA Inc. |
![]() Features: Adjustable Bandwidth, Sleep Mode, Temperature Sensor Packaging: Cut Tape (CT) Package / Case: 10-VFDFN Output Type: I2C, SPI Mounting Type: Surface Mount Type: Digital Axis: X, Y, Z Acceleration Range: ±2g, 4g, 8g, 16g Operating Temperature: -40°C ~ 105°C Voltage - Supply: 1.71V ~ 3.6V Bandwidth: 1.6kHz Supplier Device Package: 10-DFN (2x2) Sensitivity (LSB/g): 1024 (±2g) ~ 128 (±16g) Grade: Automotive Part Status: Active Qualification: AEC-Q100 |
на замовлення 2100 шт: термін постачання 21-31 дні (днів) |
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NX7002BK215 | NXP USA Inc. |
![]() Packaging: Bulk Part Status: Active |
на замовлення 813665 шт: термін постачання 21-31 дні (днів) |
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MC56F80746MLF | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 64KB (64K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: 56800EF Data Converters: A/D 14x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V Connectivity: I²C, LINbus, SCI, SPI Peripherals: Brown-out Detect/Reset, DMA, LVI, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Part Status: Active Number of I/O: 39 DigiKey Programmable: Not Verified |
на замовлення 1250 шт: термін постачання 21-31 дні (днів) |
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MC56F80646VLF | NXP USA Inc. |
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MC56F80626VLF | NXP USA Inc. |
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MC56F80736VLF | NXP USA Inc. |
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MC56F80746VLF | NXP USA Inc. |
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MC56F80726VLF | NXP USA Inc. |
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MC56F8027VLHR | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 32KB (16K x 16) RAM Size: 2K x 16 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: 56800E Data Converters: A/D 16x12b; D/A 2x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: I2C, LINbus, SCI, SPI Peripherals: POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 53 DigiKey Programmable: Not Verified |
на замовлення 3000 шт: термін постачання 21-31 дні (днів) |
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BLF7G24L-100,112 | NXP USA Inc. |
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на замовлення 45 шт: термін постачання 21-31 дні (днів) |
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MC9S08AC48CFDE | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 48KB (48K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I²C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-QFN-EP (7x7) Part Status: Active Number of I/O: 38 DigiKey Programmable: Not Verified |
на замовлення 600 шт: термін постачання 21-31 дні (днів) |
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MC9S08AC48CFDE | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 48KB (48K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I²C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-QFN-EP (7x7) Part Status: Active Number of I/O: 38 DigiKey Programmable: Not Verified |
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MPC860ENCVR66D4 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 66MHz Operating Temperature: -40°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (4) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
на замовлення 114 шт: термін постачання 21-31 дні (днів) |
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NVT4858UKZ | NXP USA Inc. |
Description: IC TRANSLATOR BIDIR 16WLCSP Packaging: Tape & Reel (TR) Package / Case: 16-UFBGA, WLCSP Output Type: Non-Inverted Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Data Rate: 104Mbps Supplier Device Package: 16-WLCSP (1.84x1.87) Channel Type: Bidirectional Translator Type: Voltage Level Channels per Circuit: 6 Voltage - VCCA: 1.08 V ~ 1.95 V Voltage - VCCB: 1.65 V ~ 3.6 V Part Status: Active Number of Circuits: 1 |
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NVT4858UKZ | NXP USA Inc. |
Description: IC TRANSLATOR BIDIR 16WLCSP Packaging: Cut Tape (CT) Package / Case: 16-UFBGA, WLCSP Output Type: Non-Inverted Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Data Rate: 104Mbps Supplier Device Package: 16-WLCSP (1.84x1.87) Channel Type: Bidirectional Translator Type: Voltage Level Channels per Circuit: 6 Voltage - VCCA: 1.08 V ~ 1.95 V Voltage - VCCB: 1.65 V ~ 3.6 V Part Status: Active Number of Circuits: 1 |
на замовлення 2500 шт: термін постачання 21-31 дні (днів) |
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MC68HC908QY4CDTE | NXP USA Inc. |
![]() Packaging: Tube Package / Case: 16-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 4KB (4K x 8) RAM Size: 128 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 4x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Peripherals: LVD, POR, PWM Supplier Device Package: 16-TSSOP Part Status: Not For New Designs Number of I/O: 13 DigiKey Programmable: Verified |
на замовлення 2440 шт: термін постачання 21-31 дні (днів) |
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74CBTLVD3245DS,118 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 20-SSOP (0.154", 3.90mm Width) Mounting Type: Surface Mount Circuit: 8 x 1:1 Type: Bus Switch Operating Temperature: -40°C ~ 125°C Voltage - Supply: 3V ~ 3.6V Independent Circuits: 1 Voltage Supply Source: Single Supply Supplier Device Package: 20-SSOP Part Status: Obsolete |
на замовлення 1482 шт: термін постачання 21-31 дні (днів) |
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MC33FS8530A1ESR2 | NXP USA Inc. |
Description: SYSTEM BASIS CHIP FS8500 Packaging: Tape & Reel (TR) |
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SPC5606BK0VLQ6 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 64MHz Program Memory Size: 1MB (1M x 8) RAM Size: 80K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0h Data Converters: A/D 15x10b, 5x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Part Status: Active Number of I/O: 121 DigiKey Programmable: Not Verified |
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74ALVCH16373DL,118 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 48-BSSOP (0.295", 7.50mm Width) Output Type: Tri-State Mounting Type: Surface Mount Circuit: 8:8 Logic Type: D-Type Transparent Latch Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.3V ~ 2.7V, 3V ~ 3.6V Independent Circuits: 2 Current - Output High, Low: 24mA, 24mA Delay Time - Propagation: 2.1ns Supplier Device Package: 48-SSOP Part Status: Active |
на замовлення 4000 шт: термін постачання 21-31 дні (днів) |
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BUJD203A,127 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: TO-220-3 Mounting Type: Through Hole Transistor Type: NPN Operating Temperature: 150°C (TJ) Vce Saturation (Max) @ Ib, Ic: 1V @ 600mA, 3A Current - Collector Cutoff (Max): 100µA DC Current Gain (hFE) (Min) @ Ic, Vce: 11 @ 2A, 5V Supplier Device Package: TO-220AB Current - Collector (Ic) (Max): 4 A Voltage - Collector Emitter Breakdown (Max): 425 V Power - Max: 80 W |
на замовлення 1499 шт: термін постачання 21-31 дні (днів) |
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BUJD103AD,118 | NXP USA Inc. |
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MPC860ENVR50D4 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 50MHz Operating Temperature: 0°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (4) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
на замовлення 2706 шт: термін постачання 21-31 дні (днів) |
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MCF52212CAE50 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 64KB (64K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: Coldfire V2 Data Converters: A/D 8x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: I2C, SPI, UART/USART, USB OTG Peripherals: DMA, LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Last Time Buy Number of I/O: 56 DigiKey Programmable: Not Verified |
на замовлення 690 шт: термін постачання 21-31 дні (днів) |
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PSMN7R8-120PSQ | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: TO-262-3 Long Leads, I²Pak, TO-262AA Mounting Type: Through Hole Operating Temperature: -55°C ~ 175°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 70A (Tc) Rds On (Max) @ Id, Vgs: 7.9mOhm @ 25A, 10V Power Dissipation (Max): 349W (Tc) Vgs(th) (Max) @ Id: 4V @ 1mA Supplier Device Package: I2PAK Part Status: Active Drive Voltage (Max Rds On, Min Rds On): 10V Vgs (Max): ±20V Drain to Source Voltage (Vdss): 120 V Gate Charge (Qg) (Max) @ Vgs: 167 nC @ 10 V Input Capacitance (Ciss) (Max) @ Vds: 9473 pF @ 60 V |
на замовлення 242 шт: термін постачання 21-31 дні (днів) |
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BZX79-B36,133 | NXP USA Inc. |
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на замовлення 16000 шт: термін постачання 21-31 дні (днів) |
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PH1225AL,115 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: SOT-1023, 4-LFPAK Mounting Type: Surface Mount Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 100A (Tc) Rds On (Max) @ Id, Vgs: 1.2mOhm @ 15A, 10V Vgs(th) (Max) @ Id: 2.15V @ 1mA Supplier Device Package: LFPAK56; Power-SO8 Drain to Source Voltage (Vdss): 25 V Gate Charge (Qg) (Max) @ Vgs: 105 nC @ 10 V Input Capacitance (Ciss) (Max) @ Vds: 6380 pF @ 12 V |
на замовлення 24733 шт: термін постачання 21-31 дні (днів) |
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K32W041AY | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 40-VFQFN Exposed Pad Sensitivity: -101.3dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 640kB Flash, 152kB SRAM Type: TxRx + MCU Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.9V ~ 3.6V Power - Output: 11.2dBm Protocol: Bluetooth v5.0, Thread, Zigbee® Current - Receiving: 4.3mA Data Rate (Max): 2Mbps Current - Transmitting: 7.4mA ~ 20.3mA Supplier Device Package: 40-HVQFN (6x6) GPIO: 22 RF Family/Standard: 802.15.4, Bluetooth Serial Interfaces: I2C, SPI, PWM, UART DigiKey Programmable: Not Verified |
на замовлення 4000 шт: термін постачання 21-31 дні (днів) |
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K32W041AMK | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 40-VFQFN Exposed Pad Sensitivity: -101.3dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 640kB Flash, 152kB SRAM Type: TxRx + MCU Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.9V ~ 3.6V Power - Output: 11.2dBm Protocol: Bluetooth v5.0, Thread, Zigbee® Current - Receiving: 4.3mA Data Rate (Max): 2Mbps Current - Transmitting: 7.4mA ~ 20.3mA Supplier Device Package: 40-HVQFN (6x6) GPIO: 22 RF Family/Standard: 802.15.4, Bluetooth Serial Interfaces: I2C, SPI, PWM, UART DigiKey Programmable: Not Verified |
на замовлення 2450 шт: термін постачання 21-31 дні (днів) |
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K32W041AMY | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 40-VFQFN Exposed Pad Sensitivity: -101.3dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 640kB Flash, 152kB SRAM Type: TxRx + MCU Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.9V ~ 3.6V Power - Output: 11.2dBm Protocol: Bluetooth v5.0, Thread, Zigbee® Current - Receiving: 4.3mA Data Rate (Max): 2Mbps Current - Transmitting: 7.4mA ~ 20.3mA Supplier Device Package: 40-HVQFN (6x6) GPIO: 22 RF Family/Standard: 802.15.4, Bluetooth Serial Interfaces: I2C, SPI, PWM, UART DigiKey Programmable: Not Verified |
на замовлення 4000 шт: термін постачання 21-31 дні (днів) |
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SPC5634MF2MMG80 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 208-BGA Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 1.5MB (1.5M x 8) RAM Size: 94K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z3 Data Converters: A/D 34x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 208-BGA (17x17) Part Status: Active Number of I/O: 80 DigiKey Programmable: Not Verified |
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IMXEBOOKDC4 | NXP USA Inc. |
Description: KIT EVAL Packaging: Bulk For Use With/Related Products: i.MX 6SoloLite Accessory Type: Electronic Paper Display (EPD) Part Status: Active |
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MCZ33905CS5EKR2,518 | NXP USA Inc. |
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MCZ33905CD5EK | NXP USA Inc. |
![]() Packaging: Tube Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad Mounting Type: Surface Mount Interface: CAN, LIN Voltage - Supply: 5.5V ~ 28V Applications: System Basis Chip Supplier Device Package: 54-SOIC-EP |
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MCZ33905CS5EK | NXP USA Inc. |
![]() Packaging: Tube Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Mounting Type: Surface Mount Interface: CAN, LIN Voltage - Supply: 5.5V ~ 28V Applications: System Basis Chip Supplier Device Package: 32-SOIC-EP |
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MCZ33905CS5EKR2 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Mounting Type: Surface Mount Interface: CAN, LIN Voltage - Supply: 5.5V ~ 28V Applications: System Basis Chip Supplier Device Package: 32-SOIC-EP |
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MC908GR16MFAE | NXP USA Inc. |
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74LVCH32373AEC/G557 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 96-LFBGA Output Type: Tri-State, Non-Inverted Mounting Type: Surface Mount Circuit: 8:8 Logic Type: D-Type Transparent Latch Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.2V ~ 3.6V Independent Circuits: 4 Current - Output High, Low: 24mA, 24mA Delay Time - Propagation: 3ns Supplier Device Package: 96-LFBGA (13.5x5.5) |
на замовлення 8191 шт: термін постачання 21-31 дні (днів) |
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74LVCH32373AEC/G551 | NXP USA Inc. |
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KIT10XS6225EKEVB | NXP USA Inc. |
Description: EVALUATION KIT - MC10XS6225 12 Packaging: Bulk Function: Power Distribution Switch (Load Switch) Type: Power Management Utilized IC / Part: MC10XS6225 Supplied Contents: Board(s) Part Status: Active |
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KIT10XS6200EKEVB | NXP USA Inc. |
Description: EVALUATION KIT - MC10XS6200 12 Packaging: Bulk Function: Power Distribution Switch (Load Switch) Type: Power Management Utilized IC / Part: MC10XS6200 Supplied Contents: Board(s) Part Status: Active |
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KIT25XS6300EKEVB | NXP USA Inc. |
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LFVBBM34QA | NXP USA Inc. |
Description: MPC5534 EVAL BRD Packaging: Box Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: e200 Board Type: Evaluation Platform Utilized IC / Part: MPC5534 Part Status: Obsolete |
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BYV415K-600PQ127 | NXP USA Inc. |
![]() Packaging: Bulk Part Status: Active |
на замовлення 438 шт: термін постачання 21-31 дні (днів) |
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PDZ27B/ZL115 | NXP USA Inc. |
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S912B32E4CFUE8R | NXP USA Inc. |
Description: IC MCU 16BIT 32KB FLASH 80QFP Packaging: Tape & Reel (TR) Package / Case: 80-QFP Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 32KB (32K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 768 x 8 Core Processor: CPU12 Data Converters: A/D 8x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: SCI, SPI Peripherals: POR, PWM, WDT Supplier Device Package: 80-QFP (14x14) Number of I/O: 63 DigiKey Programmable: Not Verified |
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74AUP1G386GF,132 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 6-XFDFN Mounting Type: Surface Mount Logic Type: XOR (Exclusive OR) Operating Temperature: -40°C ~ 125°C Voltage - Supply: 0.8V ~ 3.6V Current - Output High, Low: 4mA, 4mA Number of Inputs: 3 Supplier Device Package: 6-XSON, SOT891 (1x1) Input Logic Level - High: 1.6V ~ 2V Input Logic Level - Low: 0.7V ~ 0.9V Max Propagation Delay @ V, Max CL: 6.1ns @ 3.3V, 30pF Number of Circuits: 1 Current - Quiescent (Max): 500 nA |
на замовлення 15000 шт: термін постачання 21-31 дні (днів) |
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74LVC08APW/S400118 | NXP USA Inc. |
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74LVC08APW-Q100118 | NXP USA Inc. |
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S9S08DZ48F2MLFR | NXP USA Inc. |
Description: IC MCU 8BIT 48KB FLASH 48LQFP Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 48KB (48K x 8) RAM Size: 3K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 1.5K x 8 Core Processor: S08 Data Converters: A/D 16x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 39 DigiKey Programmable: Not Verified |
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NTM88J125T1 | NXP USA Inc. |
Description: IC PRESSURE SENSOR 24HQFN Packaging: Tape & Reel (TR) Part Status: Obsolete |
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NTM88J125T1 | NXP USA Inc. |
Description: IC PRESSURE SENSOR 24HQFN Packaging: Cut Tape (CT) Part Status: Obsolete |
товар відсутній |
PCA9502BS,157 |
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Виробник: NXP USA Inc.
Description: IC XPNDR 400KHZ I2C SPI 24HVQFN
Packaging: Tray
Package / Case: 24-VFQFN Exposed Pad
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SPI
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 3.6V
Clock Frequency: 400 kHz
Interrupt Output: No
Supplier Device Package: 24-HVQFN (4x4)
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: IC XPNDR 400KHZ I2C SPI 24HVQFN
Packaging: Tray
Package / Case: 24-VFQFN Exposed Pad
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SPI
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 3.6V
Clock Frequency: 400 kHz
Interrupt Output: No
Supplier Device Package: 24-HVQFN (4x4)
Part Status: Obsolete
DigiKey Programmable: Not Verified
товар відсутній
UJA1169AF-EVB |
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Виробник: NXP USA Inc.
Description: UJA1169A EVALUATION BOARD
Packaging: Bulk
Function: System Basis Chip (SBC)
Type: Interface
Utilized IC / Part: UJA1169A
Supplied Contents: Board(s)
Primary Attributes: 12V Supply
Secondary Attributes: SPI Interface(s)
Embedded: Yes, MCU
Part Status: Active
Description: UJA1169A EVALUATION BOARD
Packaging: Bulk
Function: System Basis Chip (SBC)
Type: Interface
Utilized IC / Part: UJA1169A
Supplied Contents: Board(s)
Primary Attributes: 12V Supply
Secondary Attributes: SPI Interface(s)
Embedded: Yes, MCU
Part Status: Active
на замовлення 4 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 5597.34 грн |
PHPT60603PY115 |
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товар відсутній
MC13202FC |
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Виробник: NXP USA Inc.
Description: IC RF TXRX 802.15.4 32VFQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Sensitivity: -92dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 3.4V
Power - Output: 4dBm
Protocol: Zigbee®
Current - Receiving: 37mA
Data Rate (Max): 250kbps
Current - Transmitting: 30mA
Supplier Device Package: 32-HVQFN (5x5)
GPIO: 7
Modulation: DSSS, O-QPSK
RF Family/Standard: 802.15.4, General ISM > 1GHz
Serial Interfaces: SPI
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: IC RF TXRX 802.15.4 32VFQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Sensitivity: -92dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 3.4V
Power - Output: 4dBm
Protocol: Zigbee®
Current - Receiving: 37mA
Data Rate (Max): 250kbps
Current - Transmitting: 30mA
Supplier Device Package: 32-HVQFN (5x5)
GPIO: 7
Modulation: DSSS, O-QPSK
RF Family/Standard: 802.15.4, General ISM > 1GHz
Serial Interfaces: SPI
Part Status: Obsolete
DigiKey Programmable: Not Verified
товар відсутній
PCA24S08AD |
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Виробник: NXP USA Inc.
Description: IC EEPROM 8KBIT 400KHZ 8SO
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 8Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 3.6V
Technology: EEPROM
Clock Frequency: 400 kHz
Memory Format: EEPROM
Supplier Device Package: 8-SO
Memory Interface: I2C
Memory Organization: 1K x 8
DigiKey Programmable: Not Verified
Description: IC EEPROM 8KBIT 400KHZ 8SO
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 8Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 3.6V
Technology: EEPROM
Clock Frequency: 400 kHz
Memory Format: EEPROM
Supplier Device Package: 8-SO
Memory Interface: I2C
Memory Organization: 1K x 8
DigiKey Programmable: Not Verified
на замовлення 4264 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
740+ | 28.78 грн |
PCA24S08AD,112 |
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Виробник: NXP USA Inc.
Description: IC EEPROM 8KBIT I2C 400KHZ 8SO
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 8Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 3.6V
Technology: EEPROM
Clock Frequency: 400 kHz
Memory Format: EEPROM
Supplier Device Package: 8-SO
Memory Interface: I2C
Memory Organization: 1K x 8
DigiKey Programmable: Not Verified
Description: IC EEPROM 8KBIT I2C 400KHZ 8SO
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 8Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 3.6V
Technology: EEPROM
Clock Frequency: 400 kHz
Memory Format: EEPROM
Supplier Device Package: 8-SO
Memory Interface: I2C
Memory Organization: 1K x 8
DigiKey Programmable: Not Verified
на замовлення 1839 шт:
термін постачання 21-31 дні (днів)FXLS8964AFR3 |
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Виробник: NXP USA Inc.
Description: ACCELEROMETER 2-16G 10DFN
Features: Adjustable Bandwidth, Sleep Mode, Temperature Sensor
Packaging: Tape & Reel (TR)
Package / Case: 10-VFDFN
Output Type: I2C, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g, 16g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.71V ~ 3.6V
Bandwidth: 1.6kHz
Supplier Device Package: 10-DFN (2x2)
Sensitivity (LSB/g): 1024 (±2g) ~ 128 (±16g)
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Description: ACCELEROMETER 2-16G 10DFN
Features: Adjustable Bandwidth, Sleep Mode, Temperature Sensor
Packaging: Tape & Reel (TR)
Package / Case: 10-VFDFN
Output Type: I2C, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g, 16g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.71V ~ 3.6V
Bandwidth: 1.6kHz
Supplier Device Package: 10-DFN (2x2)
Sensitivity (LSB/g): 1024 (±2g) ~ 128 (±16g)
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
товар відсутній
FXLS8964AFR3 |
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Виробник: NXP USA Inc.
Description: ACCELEROMETER 2-16G 10DFN
Features: Adjustable Bandwidth, Sleep Mode, Temperature Sensor
Packaging: Cut Tape (CT)
Package / Case: 10-VFDFN
Output Type: I2C, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g, 16g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.71V ~ 3.6V
Bandwidth: 1.6kHz
Supplier Device Package: 10-DFN (2x2)
Sensitivity (LSB/g): 1024 (±2g) ~ 128 (±16g)
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Description: ACCELEROMETER 2-16G 10DFN
Features: Adjustable Bandwidth, Sleep Mode, Temperature Sensor
Packaging: Cut Tape (CT)
Package / Case: 10-VFDFN
Output Type: I2C, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g, 16g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.71V ~ 3.6V
Bandwidth: 1.6kHz
Supplier Device Package: 10-DFN (2x2)
Sensitivity (LSB/g): 1024 (±2g) ~ 128 (±16g)
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
на замовлення 2100 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
2+ | 234.17 грн |
10+ | 169.2 грн |
25+ | 150.41 грн |
50+ | 134.11 грн |
100+ | 130.58 грн |
500+ | 109.41 грн |
1000+ | 100.67 грн |
NX7002BK215 |
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на замовлення 813665 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
15000+ | 1.4 грн |
MC56F80746MLF |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: 56800EF
Data Converters: A/D 14x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: Brown-out Detect/Reset, DMA, LVI, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: 56800EF
Data Converters: A/D 14x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: Brown-out Detect/Reset, DMA, LVI, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Not Verified
на замовлення 1250 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 633.33 грн |
10+ | 479.26 грн |
80+ | 396.76 грн |
1000+ | 324.76 грн |
MC56F8027VLHR |
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Виробник: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (16K x 16)
RAM Size: 2K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 16x12b; D/A 2x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 53
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 32KB FLASH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (16K x 16)
RAM Size: 2K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 16x12b; D/A 2x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 53
DigiKey Programmable: Not Verified
на замовлення 3000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 1084.95 грн |
10+ | 834.86 грн |
100+ | 705.08 грн |
500+ | 657.63 грн |
BLF7G24L-100,112 |
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Виробник: NXP USA Inc.
Description: RF TRANSISTOR
Description: RF TRANSISTOR
на замовлення 45 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
6+ | 4148.84 грн |
MC9S08AC48CFDE |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT 48KB FLASH 48QFN
Packaging: Bulk
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Part Status: Active
Number of I/O: 38
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 48KB FLASH 48QFN
Packaging: Bulk
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Part Status: Active
Number of I/O: 38
DigiKey Programmable: Not Verified
на замовлення 600 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
48+ | 475.19 грн |
MC9S08AC48CFDE |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT 48KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Part Status: Active
Number of I/O: 38
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 48KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Part Status: Active
Number of I/O: 38
DigiKey Programmable: Not Verified
товар відсутній
MPC860ENCVR66D4 |
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Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Bulk
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: -40°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Bulk
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: -40°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
на замовлення 114 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
2+ | 13278.3 грн |
NVT4858UKZ |
Виробник: NXP USA Inc.
Description: IC TRANSLATOR BIDIR 16WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 16-UFBGA, WLCSP
Output Type: Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Data Rate: 104Mbps
Supplier Device Package: 16-WLCSP (1.84x1.87)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 6
Voltage - VCCA: 1.08 V ~ 1.95 V
Voltage - VCCB: 1.65 V ~ 3.6 V
Part Status: Active
Number of Circuits: 1
Description: IC TRANSLATOR BIDIR 16WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 16-UFBGA, WLCSP
Output Type: Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Data Rate: 104Mbps
Supplier Device Package: 16-WLCSP (1.84x1.87)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 6
Voltage - VCCA: 1.08 V ~ 1.95 V
Voltage - VCCB: 1.65 V ~ 3.6 V
Part Status: Active
Number of Circuits: 1
товар відсутній
NVT4858UKZ |
Виробник: NXP USA Inc.
Description: IC TRANSLATOR BIDIR 16WLCSP
Packaging: Cut Tape (CT)
Package / Case: 16-UFBGA, WLCSP
Output Type: Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Data Rate: 104Mbps
Supplier Device Package: 16-WLCSP (1.84x1.87)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 6
Voltage - VCCA: 1.08 V ~ 1.95 V
Voltage - VCCB: 1.65 V ~ 3.6 V
Part Status: Active
Number of Circuits: 1
Description: IC TRANSLATOR BIDIR 16WLCSP
Packaging: Cut Tape (CT)
Package / Case: 16-UFBGA, WLCSP
Output Type: Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Data Rate: 104Mbps
Supplier Device Package: 16-WLCSP (1.84x1.87)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 6
Voltage - VCCA: 1.08 V ~ 1.95 V
Voltage - VCCB: 1.65 V ~ 3.6 V
Part Status: Active
Number of Circuits: 1
на замовлення 2500 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
3+ | 118.61 грн |
10+ | 102.35 грн |
25+ | 97.17 грн |
100+ | 74.91 грн |
250+ | 70.02 грн |
500+ | 61.88 грн |
1000+ | 48.05 грн |
MC68HC908QY4CDTE |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-TSSOP
Part Status: Not For New Designs
Number of I/O: 13
DigiKey Programmable: Verified
Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-TSSOP
Part Status: Not For New Designs
Number of I/O: 13
DigiKey Programmable: Verified
на замовлення 2440 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 579.35 грн |
10+ | 437.97 грн |
96+ | 362.59 грн |
1056+ | 296.79 грн |
74CBTLVD3245DS,118 |
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Виробник: NXP USA Inc.
Description: IC BUS SWITCH 8 X 1:1 20SSOP
Packaging: Bulk
Package / Case: 20-SSOP (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 8 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 3.6V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 20-SSOP
Part Status: Obsolete
Description: IC BUS SWITCH 8 X 1:1 20SSOP
Packaging: Bulk
Package / Case: 20-SSOP (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 8 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 3.6V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 20-SSOP
Part Status: Obsolete
на замовлення 1482 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1110+ | 19.14 грн |
MC33FS8530A1ESR2 |
товар відсутній
SPC5606BK0VLQ6 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 121
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 121
DigiKey Programmable: Not Verified
товар відсутній
74ALVCH16373DL,118 |
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Виробник: NXP USA Inc.
Description: BUS DRIVER, ALVC/VCX/A SERIES, 2
Packaging: Bulk
Package / Case: 48-BSSOP (0.295", 7.50mm Width)
Output Type: Tri-State
Mounting Type: Surface Mount
Circuit: 8:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 2.7V, 3V ~ 3.6V
Independent Circuits: 2
Current - Output High, Low: 24mA, 24mA
Delay Time - Propagation: 2.1ns
Supplier Device Package: 48-SSOP
Part Status: Active
Description: BUS DRIVER, ALVC/VCX/A SERIES, 2
Packaging: Bulk
Package / Case: 48-BSSOP (0.295", 7.50mm Width)
Output Type: Tri-State
Mounting Type: Surface Mount
Circuit: 8:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 2.7V, 3V ~ 3.6V
Independent Circuits: 2
Current - Output High, Low: 24mA, 24mA
Delay Time - Propagation: 2.1ns
Supplier Device Package: 48-SSOP
Part Status: Active
на замовлення 4000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
430+ | 49.83 грн |
BUJD203A,127 |
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Виробник: NXP USA Inc.
Description: NOW WEEN - BUJD203A - POWER BIPO
Packaging: Bulk
Package / Case: TO-220-3
Mounting Type: Through Hole
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1V @ 600mA, 3A
Current - Collector Cutoff (Max): 100µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 11 @ 2A, 5V
Supplier Device Package: TO-220AB
Current - Collector (Ic) (Max): 4 A
Voltage - Collector Emitter Breakdown (Max): 425 V
Power - Max: 80 W
Description: NOW WEEN - BUJD203A - POWER BIPO
Packaging: Bulk
Package / Case: TO-220-3
Mounting Type: Through Hole
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1V @ 600mA, 3A
Current - Collector Cutoff (Max): 100µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 11 @ 2A, 5V
Supplier Device Package: TO-220AB
Current - Collector (Ic) (Max): 4 A
Voltage - Collector Emitter Breakdown (Max): 425 V
Power - Max: 80 W
на замовлення 1499 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
908+ | 23.16 грн |
MPC860ENVR50D4 |
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Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 357BGA
Packaging: Bulk
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Description: IC MPU MPC8XX 50MHZ 357BGA
Packaging: Bulk
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
на замовлення 2706 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
2+ | 11707.89 грн |
MCF52212CAE50 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Last Time Buy
Number of I/O: 56
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Last Time Buy
Number of I/O: 56
DigiKey Programmable: Not Verified
на замовлення 690 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 1119.16 грн |
10+ | 861 грн |
80+ | 727.19 грн |
PSMN7R8-120PSQ |
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Виробник: NXP USA Inc.
Description: MOSFET N-CH 120V 70A I2PAK
Packaging: Bulk
Package / Case: TO-262-3 Long Leads, I²Pak, TO-262AA
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 70A (Tc)
Rds On (Max) @ Id, Vgs: 7.9mOhm @ 25A, 10V
Power Dissipation (Max): 349W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: I2PAK
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 120 V
Gate Charge (Qg) (Max) @ Vgs: 167 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 9473 pF @ 60 V
Description: MOSFET N-CH 120V 70A I2PAK
Packaging: Bulk
Package / Case: TO-262-3 Long Leads, I²Pak, TO-262AA
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 70A (Tc)
Rds On (Max) @ Id, Vgs: 7.9mOhm @ 25A, 10V
Power Dissipation (Max): 349W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: I2PAK
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 120 V
Gate Charge (Qg) (Max) @ Vgs: 167 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 9473 pF @ 60 V
на замовлення 242 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
177+ | 129.25 грн |
BZX79-B36,133 |
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Виробник: NXP USA Inc.
Description: DIODE ZENER 36V 400MW ALF2
Description: DIODE ZENER 36V 400MW ALF2
на замовлення 16000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
16000+ | 1.43 грн |
PH1225AL,115 |
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Виробник: NXP USA Inc.
Description: MOSFET N-CH 25V 100A LFPAK56
Packaging: Bulk
Package / Case: SOT-1023, 4-LFPAK
Mounting Type: Surface Mount
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
Rds On (Max) @ Id, Vgs: 1.2mOhm @ 15A, 10V
Vgs(th) (Max) @ Id: 2.15V @ 1mA
Supplier Device Package: LFPAK56; Power-SO8
Drain to Source Voltage (Vdss): 25 V
Gate Charge (Qg) (Max) @ Vgs: 105 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 6380 pF @ 12 V
Description: MOSFET N-CH 25V 100A LFPAK56
Packaging: Bulk
Package / Case: SOT-1023, 4-LFPAK
Mounting Type: Surface Mount
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
Rds On (Max) @ Id, Vgs: 1.2mOhm @ 15A, 10V
Vgs(th) (Max) @ Id: 2.15V @ 1mA
Supplier Device Package: LFPAK56; Power-SO8
Drain to Source Voltage (Vdss): 25 V
Gate Charge (Qg) (Max) @ Vgs: 105 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 6380 pF @ 12 V
на замовлення 24733 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1268+ | 17.02 грн |
K32W041AY |
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Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0, Thread, Zigbee®
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
DigiKey Programmable: Not Verified
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0, Thread, Zigbee®
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
DigiKey Programmable: Not Verified
на замовлення 4000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
4000+ | 192.27 грн |
K32W041AMK |
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Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0, Thread, Zigbee®
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
DigiKey Programmable: Not Verified
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0, Thread, Zigbee®
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
DigiKey Programmable: Not Verified
на замовлення 2450 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 470.63 грн |
10+ | 404.66 грн |
25+ | 364.2 грн |
80+ | 311.43 грн |
230+ | 281.04 грн |
440+ | 252.18 грн |
2450+ | 198.73 грн |
K32W041AMY |
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Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0, Thread, Zigbee®
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
DigiKey Programmable: Not Verified
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0, Thread, Zigbee®
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
DigiKey Programmable: Not Verified
на замовлення 4000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
4000+ | 223.58 грн |
SPC5634MF2MMG80 |
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Виробник: NXP USA Inc.
Description: IC MCU 32B 1.5MB FLASH 208MAPBGA
Packaging: Tray
Package / Case: 208-BGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 94K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z3
Data Converters: A/D 34x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-BGA (17x17)
Part Status: Active
Number of I/O: 80
DigiKey Programmable: Not Verified
Description: IC MCU 32B 1.5MB FLASH 208MAPBGA
Packaging: Tray
Package / Case: 208-BGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 94K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z3
Data Converters: A/D 34x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-BGA (17x17)
Part Status: Active
Number of I/O: 80
DigiKey Programmable: Not Verified
товар відсутній
IMXEBOOKDC4 |
Виробник: NXP USA Inc.
Description: KIT EVAL
Packaging: Bulk
For Use With/Related Products: i.MX 6SoloLite
Accessory Type: Electronic Paper Display (EPD)
Part Status: Active
Description: KIT EVAL
Packaging: Bulk
For Use With/Related Products: i.MX 6SoloLite
Accessory Type: Electronic Paper Display (EPD)
Part Status: Active
товар відсутній
MCZ33905CS5EKR2,518 |
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Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP, LIN, 2X 5.0V
Description: SYSTEM BASIS CHIP, LIN, 2X 5.0V
товар відсутній
MCZ33905CD5EK |
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Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 54SOIC
Packaging: Tube
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 54-SOIC-EP
Description: IC INTERFACE SPECIALIZED 54SOIC
Packaging: Tube
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 54-SOIC-EP
товар відсутній
MCZ33905CS5EK |
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Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 32-SOIC-EP
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 32-SOIC-EP
товар відсутній
MCZ33905CS5EKR2 |
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Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 32-SOIC-EP
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 32-SOIC-EP
товар відсутній
74LVCH32373AEC/G557 |
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Виробник: NXP USA Inc.
Description: BUS DRIVER, LVC/LCX/Z SERIES
Packaging: Bulk
Package / Case: 96-LFBGA
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Circuit: 8:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.2V ~ 3.6V
Independent Circuits: 4
Current - Output High, Low: 24mA, 24mA
Delay Time - Propagation: 3ns
Supplier Device Package: 96-LFBGA (13.5x5.5)
Description: BUS DRIVER, LVC/LCX/Z SERIES
Packaging: Bulk
Package / Case: 96-LFBGA
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Circuit: 8:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.2V ~ 3.6V
Independent Circuits: 4
Current - Output High, Low: 24mA, 24mA
Delay Time - Propagation: 3ns
Supplier Device Package: 96-LFBGA (13.5x5.5)
на замовлення 8191 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
64+ | 326.48 грн |
74LVCH32373AEC/G551 |
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товар відсутній
KIT10XS6225EKEVB |
Виробник: NXP USA Inc.
Description: EVALUATION KIT - MC10XS6225 12
Packaging: Bulk
Function: Power Distribution Switch (Load Switch)
Type: Power Management
Utilized IC / Part: MC10XS6225
Supplied Contents: Board(s)
Part Status: Active
Description: EVALUATION KIT - MC10XS6225 12
Packaging: Bulk
Function: Power Distribution Switch (Load Switch)
Type: Power Management
Utilized IC / Part: MC10XS6225
Supplied Contents: Board(s)
Part Status: Active
товар відсутній
KIT10XS6200EKEVB |
Виробник: NXP USA Inc.
Description: EVALUATION KIT - MC10XS6200 12
Packaging: Bulk
Function: Power Distribution Switch (Load Switch)
Type: Power Management
Utilized IC / Part: MC10XS6200
Supplied Contents: Board(s)
Part Status: Active
Description: EVALUATION KIT - MC10XS6200 12
Packaging: Bulk
Function: Power Distribution Switch (Load Switch)
Type: Power Management
Utilized IC / Part: MC10XS6200
Supplied Contents: Board(s)
Part Status: Active
товар відсутній
LFVBBM34QA |
Виробник: NXP USA Inc.
Description: MPC5534 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Board Type: Evaluation Platform
Utilized IC / Part: MPC5534
Part Status: Obsolete
Description: MPC5534 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Board Type: Evaluation Platform
Utilized IC / Part: MPC5534
Part Status: Obsolete
товар відсутній
BYV415K-600PQ127 |
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на замовлення 438 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
252+ | 82.77 грн |
S912B32E4CFUE8R |
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 768 x 8
Core Processor: CPU12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 63
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 32KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 768 x 8
Core Processor: CPU12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 63
DigiKey Programmable: Not Verified
товар відсутній
74AUP1G386GF,132 |
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Виробник: NXP USA Inc.
Description: IC GATE XOR 1CH 3-INP 6-XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: XOR (Exclusive OR)
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 3
Supplier Device Package: 6-XSON, SOT891 (1x1)
Input Logic Level - High: 1.6V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.9V
Max Propagation Delay @ V, Max CL: 6.1ns @ 3.3V, 30pF
Number of Circuits: 1
Current - Quiescent (Max): 500 nA
Description: IC GATE XOR 1CH 3-INP 6-XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: XOR (Exclusive OR)
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 3
Supplier Device Package: 6-XSON, SOT891 (1x1)
Input Logic Level - High: 1.6V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.9V
Max Propagation Delay @ V, Max CL: 6.1ns @ 3.3V, 30pF
Number of Circuits: 1
Current - Quiescent (Max): 500 nA
на замовлення 15000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1972+ | 10.49 грн |
S9S08DZ48F2MLFR |
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 48KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 3K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 48KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 3K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
товар відсутній
NTM88J125T1 |
Виробник: NXP USA Inc.
Description: IC PRESSURE SENSOR 24HQFN
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Description: IC PRESSURE SENSOR 24HQFN
Packaging: Tape & Reel (TR)
Part Status: Obsolete
товар відсутній
NTM88J125T1 |
Виробник: NXP USA Inc.
Description: IC PRESSURE SENSOR 24HQFN
Packaging: Cut Tape (CT)
Part Status: Obsolete
Description: IC PRESSURE SENSOR 24HQFN
Packaging: Cut Tape (CT)
Part Status: Obsolete
товар відсутній