Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (35275) > Сторінка 437 з 588
| Фото | Назва | Виробник | Інформація |
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TJA1049TK/1Z | NXP USA Inc. |
 Description: IC TXRX HS-CAN HALF 1/1 8HVSONPackaging: Tape & Reel (TR) Package / Case: 8-VDFN Exposed Pad Mounting Type: Surface Mount Supplier Device Package: 8-HVSON (3x3) |
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TJA1049TK/3/1Z | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 8HVSON Packaging: Tape & Reel (TR) Package / Case: 8-VDFN Exposed Pad Mounting Type: Surface Mount Supplier Device Package: 8-HVSON (3x3) |
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74AUP1G07GX/S500125 | NXP USA Inc. |
Description: IC BUFFER NON-INVERT 3.6V 5X2SON |
на замовлення 794428 шт: термін постачання 21-31 дні (днів) |
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74AUP1G07GF/S500132 | NXP USA Inc. |
Description: IC BUFFER NON-INVERT 3.6V 6XSON Packaging: Bulk Package / Case: 6-XFDFN Output Type: Open Drain Mounting Type: Surface Mount Number of Elements: 1 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 0.8V ~ 3.6V Number of Bits per Element: 1 Current - Output High, Low: -, 4mA Supplier Device Package: 6-XSON (1x1) Part Status: Active |
на замовлення 568668 шт: термін постачання 21-31 дні (днів) |
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74LVC1G07GM/S505125 | NXP USA Inc. |
Description: BUFFER, LVC/LCX/Z SERIES Packaging: Bulk Package / Case: 6-XFDFN Output Type: Open Drain Mounting Type: Surface Mount Number of Elements: 1 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1.65V ~ 5.5V Number of Bits per Element: 1 Current - Output High, Low: -, 32mA Supplier Device Package: 6-XSON (1.45x1) Part Status: Active |
на замовлення 6759 шт: термін постачання 21-31 дні (днів) |
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K32W041Y | NXP USA Inc. |
Description: K32W041 BLE/ZIGBEE SOC Packaging: Tape & Reel (TR) Package / Case: 40-VFQFN Exposed Pad Sensitivity: -101.3dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 640kB Flash, 152kB SRAM Type: TxRx + MCU Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.9V ~ 3.6V Power - Output: 11.2dBm Protocol: Bluetooth v5.0, Thread, Zigbee® Current - Receiving: 4.3mA Data Rate (Max): 2Mbps Current - Transmitting: 7.4mA ~ 20.3mA Supplier Device Package: 40-HVQFN (6x6) GPIO: 22 RF Family/Standard: 802.15.4, Bluetooth Serial Interfaces: I2C, SPI, PWM, UART Part Status: Active DigiKey Programmable: Not Verified |
на замовлення 4000 шт: термін постачання 21-31 дні (днів) |
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SP5748CSK0AMMJ6R | NXP USA Inc. | Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA |
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SPC5748CSK0AMMJ6 | NXP USA Inc. |
Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA Packaging: Tray Package / Case: 256-LBGA Mounting Type: Surface Mount Speed: 80MHz, 160MHz Program Memory Size: 6MB (6M x 8) RAM Size: 768K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z2, e200z4 Data Converters: A/D 48x10b, 16x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 256-MAPPBGA (17x17) Part Status: Active Number of I/O: 178 DigiKey Programmable: Not Verified |
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FS32K146HRT0VLHT | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 64LQFP |
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FS32K146HRT0VLHR | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 64LQFP Packaging: Tape & Reel (TR) Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 1MB (1M x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M4F Data Converters: A/D 24x12b SAR; D/A1x8b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 58 DigiKey Programmable: Not Verified |
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| P60D080MX1C/9C980J | NXP USA Inc. | Description: P60D080MX1C/9C980J |
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K32WA-001-T10 | NXP USA Inc. |
Description: K32W041A UPGRADE BOARD Packaging: Bulk For Use With/Related Products: K32W041A Frequency: 2.4GHz Type: Transceiver; 802.15.4 (Thread, ZigBee®), Bluetooth® 5 Supplied Contents: Board(s) |
на замовлення 10 шт: термін постачання 21-31 дні (днів) |
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S9S12G48F0CLFR | NXP USA Inc. |
Description: IC MCU 16BIT 48KB FLASH 48LQFP Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 48KB (48K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 1.5K x 8 Core Processor: 12V1 Data Converters: A/D 12x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 40 DigiKey Programmable: Not Verified |
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SSL1750T/N1,518 | NXP USA Inc. |
Description: IC LED DRIVER OFFL SWITCHER 16SO Packaging: Bulk Package / Case: 16-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Number of Outputs: 2 Frequency: 125kHz Type: AC DC Offline Switcher Operating Temperature: -20°C ~ 150°C (TJ) Applications: Lighting Internal Switch(s): No Topology: Flyback Supplier Device Package: 16-SO Voltage - Supply (Min): 70V Voltage - Supply (Max): 276V Part Status: Obsolete |
на замовлення 2500 шт: термін постачання 21-31 дні (днів) |
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DSP56321VF200 | NXP USA Inc. |
Description: DIGITAL SIGNAL PROCESSOR, 24-EXT Packaging: Bulk Package / Case: 196-BGA Mounting Type: Surface Mount Interface: Host Interface, SSI, SCI Type: Fixed Point Operating Temperature: -40°C ~ 100°C (TJ) Non-Volatile Memory: ROM (576B) On-Chip RAM: 576kB Voltage - I/O: 3.30V Voltage - Core: 1.60V Clock Rate: 200MHz Supplier Device Package: 196-MAPBGA (15x15) Part Status: Active |
на замовлення 60 шт: термін постачання 21-31 дні (днів) |
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MCF5485CZP200 | NXP USA Inc. |
Description: RISC MICROPROCESSOR, 32-BIT, COL Packaging: Bulk Part Status: Active |
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BZX84-A33,215 | NXP USA Inc. |
Description: DIODE ZENER 33V 250MW TO236AB Tolerance: ±1% Packaging: Bulk Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Operating Temperature: -65°C ~ 150°C Voltage - Zener (Nom) (Vz): 33 V Impedance (Max) (Zzt): 80 Ohms Supplier Device Package: SOT-23 Grade: Automotive Power - Max: 250 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 50 nA @ 700 mV Qualification: AEC-Q101 |
на замовлення 5820 шт: термін постачання 21-31 дні (днів) |
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PDTA114YU | NXP USA Inc. |
Description: PDTA114Y SERIES - PNP RESISTOR-E Packaging: Bulk Part Status: Active |
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| 74LVC1G07GW/C4125 | NXP USA Inc. |
Description: BUFFER, LVC/LCX/Z SERIES Packaging: Bulk Part Status: Active |
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PEMI6QFN/LM,132 | NXP USA Inc. |
Description: FILTER RC(PI) 65 OHM/16PF SMD Packaging: Bulk Package / Case: 12-XFDFN Size / Dimension: 0.098" L x 0.047" W (2.50mm x 1.20mm) Mounting Type: Surface Mount Type: Low Pass Operating Temperature: -40°C ~ 85°C Values: R = 65Ohms, C = 16pF (Total) Height: 0.020" (0.50mm) Attenuation Value: 17dB @ 800MHz ~ 3GHz Filter Order: 2nd Applications: LAN, PCS, WAN Technology: RC (Pi) Resistance - Channel (Ohms): 65 ESD Protection: Yes Number of Channels: 6 |
на замовлення 24000 шт: термін постачання 21-31 дні (днів) |
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| P5010NXN7TNB557 | NXP USA Inc. |
Description: QORIQ RISC MICROPROCESSOR 64 BI Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
на замовлення 21 шт: термін постачання 21-31 дні (днів) |
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B4860NXN7QUMD | NXP USA Inc. |
Description: B4860 - QORIQ QONVERGE SOC, 6X1. Packaging: Bulk Part Status: Active |
на замовлення 112 шт: термін постачання 21-31 дні (днів) |
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| LS1043AXN7KQB | NXP USA Inc. |
Description: LS1043 - QORIQ, 4XCPU 64-BIT ARM Packaging: Bulk Part Status: Active |
на замовлення 10 шт: термін постачання 21-31 дні (днів) |
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TJR1442ATK/0Z | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 8HVSON Packaging: Cut Tape (CT) Package / Case: 8-VDFN Exposed Pad Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 175°C (TJ) Voltage - Supply: 4.5V ~ 5.5V Number of Drivers/Receivers: 1/1 Data Rate: 5Mbps Protocol: CANbus Supplier Device Package: 8-HVSON (3x3) Receiver Hysteresis: 50 mV Duplex: Half |
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PEMI4QFN/WK,132 | NXP USA Inc. |
Description: FILTER RC(PI) 200 OHM/13.5PF SMD Packaging: Bulk Package / Case: 8-XFDFN Size / Dimension: 0.067" L x 0.047" W (1.70mm x 1.20mm) Mounting Type: Surface Mount Type: Low Pass Operating Temperature: -40°C ~ 85°C Values: R = 200Ohms, C = 13.5pF (Total) Height: 0.020" (0.50mm) Attenuation Value: 24dB @ 800MHz ~ 3GHz Filter Order: 2nd Applications: LAN, PCS, WAN Technology: RC (Pi) Resistance - Channel (Ohms): 200 ESD Protection: Yes Part Status: Obsolete Number of Channels: 4 |
на замовлення 32000 шт: термін постачання 21-31 дні (днів) |
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MC33PF8200DEES | NXP USA Inc. |
Description: IC POWER MANAGEMENT I.MX8QXP Packaging: Tray Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 2.5V ~ 5.5V Applications: High Performance i.MX 8, S32x Processor Based Supplier Device Package: 56-HVQFN (8x8) Part Status: Active |
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S912XES384J3VAA | NXP USA Inc. | Description: IC MCU 16BIT 384KB FLASH 80QFP |
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MCHSC705C8ACPE | NXP USA Inc. |
Description: IC MCU 8BIT 8KB OTP 40DIP Packaging: Bulk Package / Case: 40-DIP (0.600", 15.24mm) Mounting Type: Through Hole Speed: 4MHz Program Memory Size: 8KB (8K x 8) RAM Size: 304 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: OTP Core Processor: HC05 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: SCI, SPI Peripherals: POR, WDT Supplier Device Package: 40-PDIP Part Status: Obsolete Number of I/O: 24 DigiKey Programmable: Not Verified |
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| T1014NSE7KQA | NXP USA Inc. |
Description: IC MPU QORIQ T1 1GHZ 780FBGA Packaging: Tray Package / Case: 780-FBGA Mounting Type: Surface Mount Speed: 1GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e5500 Supplier Device Package: 780-FBGA (23x23) Ethernet: GbE (8) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 64-Bit RAM Controllers: DDR3L, DDR4 Graphics Acceleration: No Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage SATA: SATA 3Gbps (2) Part Status: Active Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART |
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ADC1412D105HN/C1,5 | NXP USA Inc. |
Description: IC ADC 14BIT PIPELINED 64HVQFN Packaging: Tray Features: Simultaneous Sampling Package / Case: 64-VFQFN Exposed Pad Mounting Type: Surface Mount Number of Bits: 14 Configuration: S/H-ADC Data Interface: LVDS - Parallel, Parallel Reference Type: External, Internal Operating Temperature: -40°C ~ 85°C Voltage - Supply, Analog: 2.85V ~ 3.4V Voltage - Supply, Digital: 1.65V ~ 3.6V Sampling Rate (Per Second): 105M Input Type: Differential, Single Ended Number of Inputs: 2 Supplier Device Package: 64-HVQFN (9x9) Architecture: Pipelined Ratio - S/H:ADC: 1:1 Part Status: Active Number of A/D Converters: 2 |
на замовлення 13 шт: термін постачання 21-31 дні (днів) |
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ADC1410S080HN/C1,5 | NXP USA Inc. |
Description: IC ADC 14BIT PIPELINED 40HVQFN Packaging: Tray Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Number of Bits: 14 Configuration: S/H-ADC Data Interface: LVDS - Parallel, Parallel Reference Type: External, Internal Operating Temperature: -40°C ~ 85°C Voltage - Supply, Analog: 2.85V ~ 3.4V Voltage - Supply, Digital: 2.85V ~ 3.4V Sampling Rate (Per Second): 80M Input Type: Differential, Single Ended Number of Inputs: 1 Supplier Device Package: 40-HVQFN (6x6) Architecture: Pipelined Ratio - S/H:ADC: 1:1 Part Status: Obsolete Number of A/D Converters: 1 |
на замовлення 34 шт: термін постачання 21-31 дні (днів) |
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TEA2209T/1J | NXP USA Inc. |
Description: IC ACTIVE BRIDGE CTRL SO16 Packaging: Tape & Reel (TR) Package / Case: 16-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TJ) Voltage - Supply: 440V Applications: Desktop, Notebook PCs Current - Supply: 2mA Supplier Device Package: 16-SO Part Status: Active |
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TEA2209T/1J | NXP USA Inc. |
Description: IC ACTIVE BRIDGE CTRL SO16 Packaging: Cut Tape (CT) Package / Case: 16-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TJ) Voltage - Supply: 440V Applications: Desktop, Notebook PCs Current - Supply: 2mA Supplier Device Package: 16-SO Part Status: Active |
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| 74LVC2G04GM | NXP USA Inc. |
Description: INVERTER, LVC/LCX/Z SERIES, 2-FU Packaging: Bulk Package / Case: 6-XFDFN Mounting Type: Surface Mount Logic Type: Inverter Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.65V ~ 5.5V Current - Output High, Low: 32mA, 32mA Number of Inputs: 2 Supplier Device Package: 6-XSON, SOT886 (1.45x1) Input Logic Level - High: 1.7V ~ 2V Input Logic Level - Low: 0.7V ~ 0.8V Max Propagation Delay @ V, Max CL: 3.2ns @ 5V, 50pF Part Status: Active Number of Circuits: 2 Current - Quiescent (Max): 4 µA |
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| 74LVC2G04GX147 | NXP USA Inc. |
Description: 74LVC2G04GX - INVERTER, LVC/LCX/ Packaging: Bulk Part Status: Active |
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74LVC2G17GM132 | NXP USA Inc. |
Description: NOW NEXPERIA 74LVC2G17GM - BUFFE Packaging: Bulk Part Status: Active |
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| 74LVC2G17GS132 | NXP USA Inc. |
Description: NOW NEXPERIA 74LVC2G17GS BUFFER, Packaging: Bulk |
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| 74LVC2G02GN115 | NXP USA Inc. |
Description: NOW NEXPERIA 74LVC2G02GN NOR GAT |
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PCF85263AUKZ | NXP USA Inc. |
Description: IC RTC CLK/CALENDAR I2C 12WLCSP Features: Alarm, Leap Year, Watchdog Timer Packaging: Tape & Reel (TR) Package / Case: 12-XFBGA, WLCSP Mounting Type: Surface Mount Interface: I2C Type: Clock/Calendar Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 0.9V ~ 5.5V, 1.8V ~ 5.5V Time Format: HH:MM:SS:hh (12/24 hr) Date Format: YY-MM-DD-dd Supplier Device Package: 12-WLCSP (1.19x0.94) Voltage - Supply, Battery: 0.9V ~ 5.5V Current - Timekeeping (Max): 0.885µA @ 3.3V Part Status: Active DigiKey Programmable: Not Verified |
на замовлення 20000 шт: термін постачання 21-31 дні (днів) |
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PCF85263AUKZ | NXP USA Inc. |
Description: IC RTC CLK/CALENDAR I2C 12WLCSP Features: Alarm, Leap Year, Watchdog Timer Packaging: Cut Tape (CT) Package / Case: 12-XFBGA, WLCSP Mounting Type: Surface Mount Interface: I2C Type: Clock/Calendar Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 0.9V ~ 5.5V, 1.8V ~ 5.5V Time Format: HH:MM:SS:hh (12/24 hr) Date Format: YY-MM-DD-dd Supplier Device Package: 12-WLCSP (1.19x0.94) Voltage - Supply, Battery: 0.9V ~ 5.5V Current - Timekeeping (Max): 0.885µA @ 3.3V Part Status: Active DigiKey Programmable: Not Verified |
на замовлення 39965 шт: термін постачання 21-31 дні (днів) |
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BZX84-C20/LF1R | NXP USA Inc. |
Description: DIODE ZENER 20V 250MW TO236AB Tolerance: ±5% Packaging: Tape & Reel (TR) Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Operating Temperature: -65°C ~ 150°C Voltage - Zener (Nom) (Vz): 20 V Impedance (Max) (Zzt): 55 Ohms Supplier Device Package: SOT-23 (TO-236AB) Part Status: Active Power - Max: 250 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 50 nA @ 14 V |
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MC9S08PA8VWJ | NXP USA Inc. |
Description: IC MCU 8BIT 8KB FLASH 20SOIC |
на замовлення 494 шт: термін постачання 21-31 дні (днів) |
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MC56F8255VLD | NXP USA Inc. |
Description: IC MCU 16BIT 64KB FLASH 44LQFP Packaging: Tray Package / Case: 44-LQFP Mounting Type: Surface Mount Speed: 60MHz Program Memory Size: 64KB (32K x 16) RAM Size: 4K x 16 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: 56800E Data Converters: A/D 8x12b; D/A 1x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 44-LQFP (10x10) Part Status: Active Number of I/O: 35 DigiKey Programmable: Not Verified |
на замовлення 44 шт: термін постачання 21-31 дні (днів) |
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| MC56F8013VFAER2,528 | NXP USA Inc. | Description: DIGITAL SIGNAL PROCESSOR, 16 BIT |
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MC56F8013VFAE557 | NXP USA Inc. |
Description: DIGITAL SIGNAL PROCESSOR, 56800E |
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BZX84-C5V1 | NXP USA Inc. |
Description: BZX84 SERIES - VOLTAGE REGULATOR Tolerance: ±5.88% Packaging: Bulk Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Operating Temperature: -55°C ~ 150°C (TJ) Voltage - Zener (Nom) (Vz): 5.1 V Impedance (Max) (Zzt): 60 Ohms Supplier Device Package: SOT-23 Part Status: Active Power - Max: 350 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 2 µA @ 2 V |
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BZX84-C5V1/LF1VL | NXP USA Inc. |
Description: DIODE ZENER 5.1V 250MW TO236AB Tolerance: ±5% Packaging: Tape & Reel (TR) Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Operating Temperature: -65°C ~ 150°C Voltage - Zener (Nom) (Vz): 5.1 V Impedance (Max) (Zzt): 60 Ohms Supplier Device Package: SOT-23 (TO-236AB) Part Status: Active Power - Max: 250 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 2 µA @ 2 V |
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BZX84-C5V1/LF1R | NXP USA Inc. |
Description: DIODE ZENER 5.1V 250MW TO236AB Tolerance: ±5% Packaging: Tape & Reel (TR) Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Operating Temperature: -65°C ~ 150°C Voltage - Zener (Nom) (Vz): 5.1 V Impedance (Max) (Zzt): 60 Ohms Supplier Device Package: SOT-23 (TO-236AB) Part Status: Active Power - Max: 250 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 2 µA @ 2 V |
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MC9S08PB8MTJ | NXP USA Inc. |
Description: IC MCU 8BIT 8KB FLASH 20TSSOP Packaging: Tube Package / Case: 20-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 8KB (8K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 12x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 20-TSSOP Part Status: Active Number of I/O: 18 DigiKey Programmable: Not Verified |
на замовлення 775 шт: термін постачання 21-31 дні (днів) |
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| SPC5673KF0VJM1R | NXP USA Inc. | Description: IC MCU 32BIT 1MB FLASH 257MAPBGA |
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| MC908KX2CDWER-NXP | NXP USA Inc. |
Description: MICROCONTROLLER, 8 BIT, HC08/S08 Packaging: Bulk Package / Case: 16-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 2KB (2K x 8) RAM Size: 192 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 4x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: SCI Peripherals: LVD, POR, PWM Supplier Device Package: 16-SOIC Part Status: Active Number of I/O: 13 DigiKey Programmable: Not Verified |
на замовлення 1948 шт: термін постачання 21-31 дні (днів) |
|
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| MC908AP16CFAE-NXP | NXP USA Inc. |
Description: MICROCONTROLLER, 8 BIT, HC08/S08 Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 16KB (16K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I²C, IRSCI, SCI, SPI Peripherals: LED, LVD, POR, PWM Supplier Device Package: 48-LQFP (7x7) Part Status: Active Number of I/O: 32 DigiKey Programmable: Not Verified |
на замовлення 2641 шт: термін постачання 21-31 дні (днів) |
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| PCA2131TF/Q900Y | NXP USA Inc. |
Description: IC RTC W/XTAL AUTO HLSON16 Packaging: Tape & Reel (TR) Part Status: Active DigiKey Programmable: Not Verified |
товар відсутній |
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| PCA2131TF/Q900Y | NXP USA Inc. |
Description: IC RTC W/XTAL AUTO HLSON16 Packaging: Cut Tape (CT) Part Status: Active DigiKey Programmable: Not Verified |
на замовлення 1987 шт: термін постачання 21-31 дні (днів) |
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 |
LPC1112FDH28/102518 | NXP USA Inc. |
Description: IC MCU 32BIT 16KB FLASH 28TSSOP Packaging: Bulk Package / Case: 28-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 16KB (16K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0 Data Converters: A/D 6x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I²C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Supplier Device Package: 28-TSSOP Part Status: Active Number of I/O: 22 |
товар відсутній |
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S9KEAZN16AMLH | NXP USA Inc. |
Description: IC MCU 32BIT 16KB FLASH 64LQFP |
товар відсутній |
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| NCJ29D0AHN/0NY | NXP USA Inc. | Description: UWB |
товар відсутній |
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| NCJ29D0AHN/0Y | NXP USA Inc. | Description: UWB |
товар відсутній |
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PCAL9555APW118 | NXP USA Inc. |
Description: IC GPIO EXPANDER 24TSSOP Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
товар відсутній |
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| PCA9539APW | NXP USA Inc. |
Description: IC GPIO EXPANDER 24TSSOP Packaging: Bulk DigiKey Programmable: Not Verified |
товар відсутній |
| TJA1049TK/1Z |
|
Виробник: NXP USA Inc.
Description: IC TXRX HS-CAN HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 8-HVSON (3x3)
Description: IC TXRX HS-CAN HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 8-HVSON (3x3)
товар відсутній
| TJA1049TK/3/1Z |
|
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 8-HVSON (3x3)
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 8-HVSON (3x3)
товар відсутній
| 74AUP1G07GX/S500125 |
|
Виробник: NXP USA Inc.
Description: IC BUFFER NON-INVERT 3.6V 5X2SON
Description: IC BUFFER NON-INVERT 3.6V 5X2SON
на замовлення 794428 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 4236+ | 5.13 грн |
| 74AUP1G07GF/S500132 |
|
Виробник: NXP USA Inc.
Description: IC BUFFER NON-INVERT 3.6V 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: -, 4mA
Supplier Device Package: 6-XSON (1x1)
Part Status: Active
Description: IC BUFFER NON-INVERT 3.6V 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: -, 4mA
Supplier Device Package: 6-XSON (1x1)
Part Status: Active
на замовлення 568668 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 3781+ | 5.69 грн |
| 74LVC1G07GM/S505125 |
|
Виробник: NXP USA Inc.
Description: BUFFER, LVC/LCX/Z SERIES
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: -, 32mA
Supplier Device Package: 6-XSON (1.45x1)
Part Status: Active
Description: BUFFER, LVC/LCX/Z SERIES
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: -, 32mA
Supplier Device Package: 6-XSON (1.45x1)
Part Status: Active
на замовлення 6759 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 5323+ | 4.16 грн |
| K32W041Y |
|
Виробник: NXP USA Inc.
Description: K32W041 BLE/ZIGBEE SOC
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0, Thread, Zigbee®
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
Part Status: Active
DigiKey Programmable: Not Verified
Description: K32W041 BLE/ZIGBEE SOC
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0, Thread, Zigbee®
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 4000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 4000+ | 293.51 грн |
| SP5748CSK0AMMJ6R |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
товар відсутній
| SPC5748CSK0AMMJ6 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 48x10b, 16x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 48x10b, 16x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
товар відсутній
| FS32K146HRT0VLHR |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
товар відсутній
| K32WA-001-T10 |
Виробник: NXP USA Inc.
Description: K32W041A UPGRADE BOARD
Packaging: Bulk
For Use With/Related Products: K32W041A
Frequency: 2.4GHz
Type: Transceiver; 802.15.4 (Thread, ZigBee®), Bluetooth® 5
Supplied Contents: Board(s)
Description: K32W041A UPGRADE BOARD
Packaging: Bulk
For Use With/Related Products: K32W041A
Frequency: 2.4GHz
Type: Transceiver; 802.15.4 (Thread, ZigBee®), Bluetooth® 5
Supplied Contents: Board(s)
на замовлення 10 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 2694.51 грн |
| S9S12G48F0CLFR |
|
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
товар відсутній
| SSL1750T/N1,518 |
|
Виробник: NXP USA Inc.
Description: IC LED DRIVER OFFL SWITCHER 16SO
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Outputs: 2
Frequency: 125kHz
Type: AC DC Offline Switcher
Operating Temperature: -20°C ~ 150°C (TJ)
Applications: Lighting
Internal Switch(s): No
Topology: Flyback
Supplier Device Package: 16-SO
Voltage - Supply (Min): 70V
Voltage - Supply (Max): 276V
Part Status: Obsolete
Description: IC LED DRIVER OFFL SWITCHER 16SO
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Outputs: 2
Frequency: 125kHz
Type: AC DC Offline Switcher
Operating Temperature: -20°C ~ 150°C (TJ)
Applications: Lighting
Internal Switch(s): No
Topology: Flyback
Supplier Device Package: 16-SO
Voltage - Supply (Min): 70V
Voltage - Supply (Max): 276V
Part Status: Obsolete
на замовлення 2500 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 151+ | 140.41 грн |
| DSP56321VF200 |
|
Виробник: NXP USA Inc.
Description: DIGITAL SIGNAL PROCESSOR, 24-EXT
Packaging: Bulk
Package / Case: 196-BGA
Mounting Type: Surface Mount
Interface: Host Interface, SSI, SCI
Type: Fixed Point
Operating Temperature: -40°C ~ 100°C (TJ)
Non-Volatile Memory: ROM (576B)
On-Chip RAM: 576kB
Voltage - I/O: 3.30V
Voltage - Core: 1.60V
Clock Rate: 200MHz
Supplier Device Package: 196-MAPBGA (15x15)
Part Status: Active
Description: DIGITAL SIGNAL PROCESSOR, 24-EXT
Packaging: Bulk
Package / Case: 196-BGA
Mounting Type: Surface Mount
Interface: Host Interface, SSI, SCI
Type: Fixed Point
Operating Temperature: -40°C ~ 100°C (TJ)
Non-Volatile Memory: ROM (576B)
On-Chip RAM: 576kB
Voltage - I/O: 3.30V
Voltage - Core: 1.60V
Clock Rate: 200MHz
Supplier Device Package: 196-MAPBGA (15x15)
Part Status: Active
на замовлення 60 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 3+ | 8550.36 грн |
| MCF5485CZP200 |
|
Виробник: NXP USA Inc.
Description: RISC MICROPROCESSOR, 32-BIT, COL
Packaging: Bulk
Part Status: Active
Description: RISC MICROPROCESSOR, 32-BIT, COL
Packaging: Bulk
Part Status: Active
товар відсутній
| BZX84-A33,215 |
|
Виробник: NXP USA Inc.
Description: DIODE ZENER 33V 250MW TO236AB
Tolerance: ±1%
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 33 V
Impedance (Max) (Zzt): 80 Ohms
Supplier Device Package: SOT-23
Grade: Automotive
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 700 mV
Qualification: AEC-Q101
Description: DIODE ZENER 33V 250MW TO236AB
Tolerance: ±1%
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 33 V
Impedance (Max) (Zzt): 80 Ohms
Supplier Device Package: SOT-23
Grade: Automotive
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 700 mV
Qualification: AEC-Q101
на замовлення 5820 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2681+ | 7.64 грн |
| PDTA114YU |
|
Виробник: NXP USA Inc.
Description: PDTA114Y SERIES - PNP RESISTOR-E
Packaging: Bulk
Part Status: Active
Description: PDTA114Y SERIES - PNP RESISTOR-E
Packaging: Bulk
Part Status: Active
товар відсутній
| 74LVC1G07GW/C4125 |
|
товар відсутній
| PEMI6QFN/LM,132 |
|
Виробник: NXP USA Inc.
Description: FILTER RC(PI) 65 OHM/16PF SMD
Packaging: Bulk
Package / Case: 12-XFDFN
Size / Dimension: 0.098" L x 0.047" W (2.50mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 65Ohms, C = 16pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 17dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 65
ESD Protection: Yes
Number of Channels: 6
Description: FILTER RC(PI) 65 OHM/16PF SMD
Packaging: Bulk
Package / Case: 12-XFDFN
Size / Dimension: 0.098" L x 0.047" W (2.50mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 65Ohms, C = 16pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 17dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 65
ESD Protection: Yes
Number of Channels: 6
на замовлення 24000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1902+ | 11.39 грн |
| P5010NXN7TNB557 |
|
Виробник: NXP USA Inc.
Description: QORIQ RISC MICROPROCESSOR 64 BI
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: QORIQ RISC MICROPROCESSOR 64 BI
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 21 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 36634.4 грн |
| B4860NXN7QUMD |
|
Виробник: NXP USA Inc.
Description: B4860 - QORIQ QONVERGE SOC, 6X1.
Packaging: Bulk
Part Status: Active
Description: B4860 - QORIQ QONVERGE SOC, 6X1.
Packaging: Bulk
Part Status: Active
на замовлення 112 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 49865.18 грн |
| LS1043AXN7KQB |
|
Виробник: NXP USA Inc.
Description: LS1043 - QORIQ, 4XCPU 64-BIT ARM
Packaging: Bulk
Part Status: Active
Description: LS1043 - QORIQ, 4XCPU 64-BIT ARM
Packaging: Bulk
Part Status: Active
на замовлення 10 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 4+ | 5765.37 грн |
| TJR1442ATK/0Z |
|
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 175°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 50 mV
Duplex: Half
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 175°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 50 mV
Duplex: Half
товар відсутній
| PEMI4QFN/WK,132 |
|
Виробник: NXP USA Inc.
Description: FILTER RC(PI) 200 OHM/13.5PF SMD
Packaging: Bulk
Package / Case: 8-XFDFN
Size / Dimension: 0.067" L x 0.047" W (1.70mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 200Ohms, C = 13.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 24dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 200
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 4
Description: FILTER RC(PI) 200 OHM/13.5PF SMD
Packaging: Bulk
Package / Case: 8-XFDFN
Size / Dimension: 0.067" L x 0.047" W (1.70mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 200Ohms, C = 13.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 24dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 200
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 4
на замовлення 32000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2959+ | 6.99 грн |
| MC33PF8200DEES |
|
Виробник: NXP USA Inc.
Description: IC POWER MANAGEMENT I.MX8QXP
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 56-HVQFN (8x8)
Part Status: Active
Description: IC POWER MANAGEMENT I.MX8QXP
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 56-HVQFN (8x8)
Part Status: Active
товар відсутній
| MCHSC705C8ACPE |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB OTP 40DIP
Packaging: Bulk
Package / Case: 40-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 4MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 304 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 40-PDIP
Part Status: Obsolete
Number of I/O: 24
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 8KB OTP 40DIP
Packaging: Bulk
Package / Case: 40-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 4MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 304 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 40-PDIP
Part Status: Obsolete
Number of I/O: 24
DigiKey Programmable: Not Verified
товар відсутній
| T1014NSE7KQA |
|
Виробник: NXP USA Inc.
Description: IC MPU QORIQ T1 1GHZ 780FBGA
Packaging: Tray
Package / Case: 780-FBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FBGA (23x23)
Ethernet: GbE (8)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Part Status: Active
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Description: IC MPU QORIQ T1 1GHZ 780FBGA
Packaging: Tray
Package / Case: 780-FBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FBGA (23x23)
Ethernet: GbE (8)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Part Status: Active
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
товар відсутній
| ADC1412D105HN/C1,5 |
|
Виробник: NXP USA Inc.
Description: IC ADC 14BIT PIPELINED 64HVQFN
Packaging: Tray
Features: Simultaneous Sampling
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Number of Bits: 14
Configuration: S/H-ADC
Data Interface: LVDS - Parallel, Parallel
Reference Type: External, Internal
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Analog: 2.85V ~ 3.4V
Voltage - Supply, Digital: 1.65V ~ 3.6V
Sampling Rate (Per Second): 105M
Input Type: Differential, Single Ended
Number of Inputs: 2
Supplier Device Package: 64-HVQFN (9x9)
Architecture: Pipelined
Ratio - S/H:ADC: 1:1
Part Status: Active
Number of A/D Converters: 2
Description: IC ADC 14BIT PIPELINED 64HVQFN
Packaging: Tray
Features: Simultaneous Sampling
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Number of Bits: 14
Configuration: S/H-ADC
Data Interface: LVDS - Parallel, Parallel
Reference Type: External, Internal
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Analog: 2.85V ~ 3.4V
Voltage - Supply, Digital: 1.65V ~ 3.6V
Sampling Rate (Per Second): 105M
Input Type: Differential, Single Ended
Number of Inputs: 2
Supplier Device Package: 64-HVQFN (9x9)
Architecture: Pipelined
Ratio - S/H:ADC: 1:1
Part Status: Active
Number of A/D Converters: 2
на замовлення 13 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 10+ | 2521.92 грн |
| ADC1410S080HN/C1,5 |
|
Виробник: NXP USA Inc.
Description: IC ADC 14BIT PIPELINED 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Number of Bits: 14
Configuration: S/H-ADC
Data Interface: LVDS - Parallel, Parallel
Reference Type: External, Internal
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Analog: 2.85V ~ 3.4V
Voltage - Supply, Digital: 2.85V ~ 3.4V
Sampling Rate (Per Second): 80M
Input Type: Differential, Single Ended
Number of Inputs: 1
Supplier Device Package: 40-HVQFN (6x6)
Architecture: Pipelined
Ratio - S/H:ADC: 1:1
Part Status: Obsolete
Number of A/D Converters: 1
Description: IC ADC 14BIT PIPELINED 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Number of Bits: 14
Configuration: S/H-ADC
Data Interface: LVDS - Parallel, Parallel
Reference Type: External, Internal
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Analog: 2.85V ~ 3.4V
Voltage - Supply, Digital: 2.85V ~ 3.4V
Sampling Rate (Per Second): 80M
Input Type: Differential, Single Ended
Number of Inputs: 1
Supplier Device Package: 40-HVQFN (6x6)
Architecture: Pipelined
Ratio - S/H:ADC: 1:1
Part Status: Obsolete
Number of A/D Converters: 1
на замовлення 34 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 17+ | 1274.45 грн |
| TEA2209T/1J |
|
Виробник: NXP USA Inc.
Description: IC ACTIVE BRIDGE CTRL SO16
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 440V
Applications: Desktop, Notebook PCs
Current - Supply: 2mA
Supplier Device Package: 16-SO
Part Status: Active
Description: IC ACTIVE BRIDGE CTRL SO16
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 440V
Applications: Desktop, Notebook PCs
Current - Supply: 2mA
Supplier Device Package: 16-SO
Part Status: Active
товар відсутній
| TEA2209T/1J |
|
Виробник: NXP USA Inc.
Description: IC ACTIVE BRIDGE CTRL SO16
Packaging: Cut Tape (CT)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 440V
Applications: Desktop, Notebook PCs
Current - Supply: 2mA
Supplier Device Package: 16-SO
Part Status: Active
Description: IC ACTIVE BRIDGE CTRL SO16
Packaging: Cut Tape (CT)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 440V
Applications: Desktop, Notebook PCs
Current - Supply: 2mA
Supplier Device Package: 16-SO
Part Status: Active
товар відсутній
| 74LVC2G04GM |
|
Виробник: NXP USA Inc.
Description: INVERTER, LVC/LCX/Z SERIES, 2-FU
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: 32mA, 32mA
Number of Inputs: 2
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Input Logic Level - High: 1.7V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.8V
Max Propagation Delay @ V, Max CL: 3.2ns @ 5V, 50pF
Part Status: Active
Number of Circuits: 2
Current - Quiescent (Max): 4 µA
Description: INVERTER, LVC/LCX/Z SERIES, 2-FU
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: 32mA, 32mA
Number of Inputs: 2
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Input Logic Level - High: 1.7V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.8V
Max Propagation Delay @ V, Max CL: 3.2ns @ 5V, 50pF
Part Status: Active
Number of Circuits: 2
Current - Quiescent (Max): 4 µA
товар відсутній
| 74LVC2G04GX147 |
|
Виробник: NXP USA Inc.
Description: 74LVC2G04GX - INVERTER, LVC/LCX/
Packaging: Bulk
Part Status: Active
Description: 74LVC2G04GX - INVERTER, LVC/LCX/
Packaging: Bulk
Part Status: Active
товар відсутній
| 74LVC2G17GM132 |
|
Виробник: NXP USA Inc.
Description: NOW NEXPERIA 74LVC2G17GM - BUFFE
Packaging: Bulk
Part Status: Active
Description: NOW NEXPERIA 74LVC2G17GM - BUFFE
Packaging: Bulk
Part Status: Active
товар відсутній
| 74LVC2G17GS132 |
|
товар відсутній
| PCF85263AUKZ |
|
Виробник: NXP USA Inc.
Description: IC RTC CLK/CALENDAR I2C 12WLCSP
Features: Alarm, Leap Year, Watchdog Timer
Packaging: Tape & Reel (TR)
Package / Case: 12-XFBGA, WLCSP
Mounting Type: Surface Mount
Interface: I2C
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 0.9V ~ 5.5V, 1.8V ~ 5.5V
Time Format: HH:MM:SS:hh (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 12-WLCSP (1.19x0.94)
Voltage - Supply, Battery: 0.9V ~ 5.5V
Current - Timekeeping (Max): 0.885µA @ 3.3V
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC RTC CLK/CALENDAR I2C 12WLCSP
Features: Alarm, Leap Year, Watchdog Timer
Packaging: Tape & Reel (TR)
Package / Case: 12-XFBGA, WLCSP
Mounting Type: Surface Mount
Interface: I2C
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 0.9V ~ 5.5V, 1.8V ~ 5.5V
Time Format: HH:MM:SS:hh (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 12-WLCSP (1.19x0.94)
Voltage - Supply, Battery: 0.9V ~ 5.5V
Current - Timekeeping (Max): 0.885µA @ 3.3V
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 20000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 20000+ | 39.82 грн |
| PCF85263AUKZ |
|
Виробник: NXP USA Inc.
Description: IC RTC CLK/CALENDAR I2C 12WLCSP
Features: Alarm, Leap Year, Watchdog Timer
Packaging: Cut Tape (CT)
Package / Case: 12-XFBGA, WLCSP
Mounting Type: Surface Mount
Interface: I2C
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 0.9V ~ 5.5V, 1.8V ~ 5.5V
Time Format: HH:MM:SS:hh (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 12-WLCSP (1.19x0.94)
Voltage - Supply, Battery: 0.9V ~ 5.5V
Current - Timekeeping (Max): 0.885µA @ 3.3V
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC RTC CLK/CALENDAR I2C 12WLCSP
Features: Alarm, Leap Year, Watchdog Timer
Packaging: Cut Tape (CT)
Package / Case: 12-XFBGA, WLCSP
Mounting Type: Surface Mount
Interface: I2C
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 0.9V ~ 5.5V, 1.8V ~ 5.5V
Time Format: HH:MM:SS:hh (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 12-WLCSP (1.19x0.94)
Voltage - Supply, Battery: 0.9V ~ 5.5V
Current - Timekeeping (Max): 0.885µA @ 3.3V
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 39965 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 5+ | 74.51 грн |
| 10+ | 64.21 грн |
| 25+ | 60.97 грн |
| 100+ | 47.02 грн |
| 250+ | 43.95 грн |
| 500+ | 38.84 грн |
| 1000+ | 35.4 грн |
| BZX84-C20/LF1R |
|
Виробник: NXP USA Inc.
Description: DIODE ZENER 20V 250MW TO236AB
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 20 V
Impedance (Max) (Zzt): 55 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 14 V
Description: DIODE ZENER 20V 250MW TO236AB
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 20 V
Impedance (Max) (Zzt): 55 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 14 V
товар відсутній
| MC9S08PA8VWJ |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 20SOIC
Description: IC MCU 8BIT 8KB FLASH 20SOIC
на замовлення 494 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 56+ | 327.79 грн |
| MC56F8255VLD |
|
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 64KB (32K x 16)
RAM Size: 4K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 8x12b; D/A 1x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 35
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 64KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 64KB (32K x 16)
RAM Size: 4K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 8x12b; D/A 1x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 35
DigiKey Programmable: Not Verified
на замовлення 44 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 888.03 грн |
| 10+ | 683.38 грн |
| MC56F8013VFAER2,528 |
Виробник: NXP USA Inc.
Description: DIGITAL SIGNAL PROCESSOR, 16 BIT
Description: DIGITAL SIGNAL PROCESSOR, 16 BIT
товар відсутній
| MC56F8013VFAE557 |
|
Виробник: NXP USA Inc.
Description: DIGITAL SIGNAL PROCESSOR, 56800E
Description: DIGITAL SIGNAL PROCESSOR, 56800E
товар відсутній
| BZX84-C5V1 |
|
Виробник: NXP USA Inc.
Description: BZX84 SERIES - VOLTAGE REGULATOR
Tolerance: ±5.88%
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Voltage - Zener (Nom) (Vz): 5.1 V
Impedance (Max) (Zzt): 60 Ohms
Supplier Device Package: SOT-23
Part Status: Active
Power - Max: 350 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 2 µA @ 2 V
Description: BZX84 SERIES - VOLTAGE REGULATOR
Tolerance: ±5.88%
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Voltage - Zener (Nom) (Vz): 5.1 V
Impedance (Max) (Zzt): 60 Ohms
Supplier Device Package: SOT-23
Part Status: Active
Power - Max: 350 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 2 µA @ 2 V
товар відсутній
| BZX84-C5V1/LF1VL |
|
Виробник: NXP USA Inc.
Description: DIODE ZENER 5.1V 250MW TO236AB
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 5.1 V
Impedance (Max) (Zzt): 60 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 2 µA @ 2 V
Description: DIODE ZENER 5.1V 250MW TO236AB
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 5.1 V
Impedance (Max) (Zzt): 60 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 2 µA @ 2 V
товар відсутній
| BZX84-C5V1/LF1R |
|
Виробник: NXP USA Inc.
Description: DIODE ZENER 5.1V 250MW TO236AB
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 5.1 V
Impedance (Max) (Zzt): 60 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 2 µA @ 2 V
Description: DIODE ZENER 5.1V 250MW TO236AB
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 5.1 V
Impedance (Max) (Zzt): 60 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 2 µA @ 2 V
товар відсутній
| MC9S08PB8MTJ |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Part Status: Active
Number of I/O: 18
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 8KB FLASH 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Part Status: Active
Number of I/O: 18
DigiKey Programmable: Not Verified
на замовлення 775 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 160.42 грн |
| 10+ | 120.58 грн |
| 150+ | 96.96 грн |
| 525+ | 85.98 грн |
| MC908KX2CDWER-NXP |
|
Виробник: NXP USA Inc.
Description: MICROCONTROLLER, 8 BIT, HC08/S08
Packaging: Bulk
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 192 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-SOIC
Part Status: Active
Number of I/O: 13
DigiKey Programmable: Not Verified
Description: MICROCONTROLLER, 8 BIT, HC08/S08
Packaging: Bulk
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 192 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-SOIC
Part Status: Active
Number of I/O: 13
DigiKey Programmable: Not Verified
на замовлення 1948 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 52+ | 443.26 грн |
| MC908AP16CFAE-NXP |
|
Виробник: NXP USA Inc.
Description: MICROCONTROLLER, 8 BIT, HC08/S08
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, IRSCI, SCI, SPI
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 32
DigiKey Programmable: Not Verified
Description: MICROCONTROLLER, 8 BIT, HC08/S08
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, IRSCI, SCI, SPI
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 32
DigiKey Programmable: Not Verified
на замовлення 2641 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 30+ | 760.3 грн |
| PCA2131TF/Q900Y |
|
Виробник: NXP USA Inc.
Description: IC RTC W/XTAL AUTO HLSON16
Packaging: Tape & Reel (TR)
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC RTC W/XTAL AUTO HLSON16
Packaging: Tape & Reel (TR)
Part Status: Active
DigiKey Programmable: Not Verified
товар відсутній
| PCA2131TF/Q900Y |
|
Виробник: NXP USA Inc.
Description: IC RTC W/XTAL AUTO HLSON16
Packaging: Cut Tape (CT)
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC RTC W/XTAL AUTO HLSON16
Packaging: Cut Tape (CT)
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 1987 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 327.69 грн |
| 10+ | 283.34 грн |
| 25+ | 267.88 грн |
| 100+ | 217.87 грн |
| 250+ | 206.7 грн |
| 500+ | 185.47 грн |
| 1000+ | 153.85 грн |
| LPC1112FDH28/102518 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 28TSSOP
Packaging: Bulk
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 6x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 28-TSSOP
Part Status: Active
Number of I/O: 22
Description: IC MCU 32BIT 16KB FLASH 28TSSOP
Packaging: Bulk
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 6x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 28-TSSOP
Part Status: Active
Number of I/O: 22
товар відсутній
| PCAL9555APW118 |
|
Виробник: NXP USA Inc.
Description: IC GPIO EXPANDER 24TSSOP
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC GPIO EXPANDER 24TSSOP
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
товар відсутній
| PCA9539APW |
|
Виробник: NXP USA Inc.
Description: IC GPIO EXPANDER 24TSSOP
Packaging: Bulk
DigiKey Programmable: Not Verified
Description: IC GPIO EXPANDER 24TSSOP
Packaging: Bulk
DigiKey Programmable: Not Verified
товар відсутній