Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (35275) > Сторінка 434 з 588

Обрати Сторінку:   [  << Попередня Сторінка ]  1 58 116 174 232 290 348 406 429 430 431 432 433 434 435 436 437 438 439 464 522 580 588  [ Наступна Сторінка >> ]
Фото Назва Виробник Інформація Доступність
Ціна
без ПДВ
LPC1785FBD208,551 LPC1785FBD208,551 NXP USA Inc. LPC178X_7X.pdf Description: IC MCU 32BIT 256KB FLASH 208LQFP
Packaging: Bulk
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Number of I/O: 165
DigiKey Programmable: Not Verified
на замовлення 8761 шт:
термін постачання 21-31 дні (днів)
22+991.81 грн
Мінімальне замовлення: 22
LPC1785FBD208557 LPC1785FBD208557 NXP USA Inc. LPC178X_7X.pdf Description: IC MCU 32BIT 256KB FLASH 208LQFP
товар відсутній
LPC2470FBD208,551 LPC2470FBD208,551 NXP USA Inc. LPC2470.pdf Description: IC MCU 16/32BIT ROMLESS 208LQFP
Packaging: Bulk
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
RAM Size: 98K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM7®
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Number of I/O: 160
DigiKey Programmable: Not Verified
на замовлення 15810 шт:
термін постачання 21-31 дні (днів)
22+988.36 грн
Мінімальне замовлення: 22
LPC2939FBD208551 LPC2939FBD208551 NXP USA Inc. LPC2939.pdf Description: IC MCU 16/32B 768KB FLSH 208LQFP
Packaging: Bulk
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 125MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 56K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM9®
Data Converters: A/D 24x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, LINbus, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Number of I/O: 152
DigiKey Programmable: Not Verified
товар відсутній
LPC54607J256BD208551 LPC54607J256BD208551 NXP USA Inc. PHGL-S-A0006515862-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 256KB FLASH 208LQFP
товар відсутній
LX2160SN71826B LX2160SN71826B NXP USA Inc. Description: IC MPU QORLQ 1.8GHZ 1517FCPBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A72
Voltage - I/O: 1.2V, 1.8V, 3.3V
Supplier Device Package: 1517-FCPBGA (40x40)
Ethernet: 100Gbps (2)
USB: USB 3.0 (2) + PHY (2)
Number of Cores/Bus Width: 16 Core, 64-Bit
RAM Controllers: DDR4
Graphics Acceleration: Yes
Security Features: Secure Boot, TrustZone®
SATA: SATA 3.0 (4)
Part Status: Active
товар відсутній
BZX84-C18/LF1R BZX84-C18/LF1R NXP USA Inc. PHGLS29437-1.pdf?t.download=true&u=5oefqw Description: DIODE ZENER 18V 250MW TO236AB
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 18 V
Impedance (Max) (Zzt): 45 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 12.6 V
Grade: Automotive
Qualification: AEC-Q101
товар відсутній
BZX84-C18/LF1VL BZX84-C18/LF1VL NXP USA Inc. PHGLS29437-1.pdf?t.download=true&u=5oefqw Description: DIODE ZENER 18V 250MW TO236AB
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 18 V
Impedance (Max) (Zzt): 45 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 12.6 V
товар відсутній
74ALVCH16244DL,118 74ALVCH16244DL,118 NXP USA Inc. PHGLS11539-1.pdf?t.download=true&u=5oefqw Description: IC BUFFER NON-INVERT 3.6V 48SSOP
Packaging: Bulk
Package / Case: 48-BSSOP (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 48-SSOP
на замовлення 4819 шт:
термін постачання 21-31 дні (днів)
494+43.42 грн
Мінімальне замовлення: 494
74ALVCH16244DL,112 74ALVCH16244DL,112 NXP USA Inc. PHGLS11539-1.pdf?t.download=true&u=5oefqw Description: BUS DRIVER, ALVC/VCX/A SERIES, 4
на замовлення 1581 шт:
термін постачання 21-31 дні (днів)
74ALVCH16374DL,118 74ALVCH16374DL,118 NXP USA Inc. PHGLS25100-1.pdf?t.download=true&u=5oefqw Description: IC FF D-TYPE DUAL 8BIT 48SSOP
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)
466+46.93 грн
Мінімальне замовлення: 466
74ALVC574D,112 74ALVC574D,112 NXP USA Inc. PHGLS14966-1.pdf?t.download=true&u=5oefqw Description: IC FF D-TYPE SNGL 8BIT 20SO
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Current - Quiescent (Iq): 10 µA
Current - Output High, Low: 24mA, 24mA
Trigger Type: Positive Edge
Clock Frequency: 300 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 20-SO
Max Propagation Delay @ V, Max CL: 3.6ns @ 3.3V, 50pF
Part Status: Active
Number of Bits per Element: 8
на замовлення 2790 шт:
термін постачання 21-31 дні (днів)
1135+19.77 грн
Мінімальне замовлення: 1135
NX3L1T53GT,115 NX3L1T53GT,115 NXP USA Inc. NX3L1T53.pdf Description: IC SWITCH SPDT X 1 750MOHM 8XSON
Packaging: Cut Tape (CT)
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 20mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Active
Number of Circuits: 1
на замовлення 579 шт:
термін постачання 21-31 дні (днів)
6+58.54 грн
10+ 50.37 грн
25+ 47.79 грн
100+ 36.84 грн
250+ 34.44 грн
500+ 30.43 грн
Мінімальне замовлення: 6
NX3V1G66GM,132 NX3V1G66GM,132 NXP USA Inc. NX3V1G66.pdf Description: IC SW SPST-NOX1 450MOHM 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 450mOhm
-3db Bandwidth: 25MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 12pC
Switch Circuit: SPST - NO
Multiplexer/Demultiplexer Circuit: 1:1
Switch Time (Ton, Toff) (Max): 24ns, 9ns
Channel Capacitance (CS(off), CD(off)): 70pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 1
товар відсутній
NX3V1G384GM,132 NX3V1G384GM,132 NXP USA Inc. NX3V1G384.pdf Description: IC SW SPST-NCX1 450MOHM 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 450mOhm
-3db Bandwidth: 25MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 12pC
Switch Circuit: SPST - NC
Multiplexer/Demultiplexer Circuit: 1:1
Switch Time (Ton, Toff) (Max): 26ns, 10ns
Channel Capacitance (CS(off), CD(off)): 70pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 1
товар відсутній
NX3V1G384GM,132 NX3V1G384GM,132 NXP USA Inc. NX3V1G384.pdf Description: IC SW SPST-NCX1 450MOHM 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 450mOhm
-3db Bandwidth: 25MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 12pC
Switch Circuit: SPST - NC
Multiplexer/Demultiplexer Circuit: 1:1
Switch Time (Ton, Toff) (Max): 26ns, 10ns
Channel Capacitance (CS(off), CD(off)): 70pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 1
на замовлення 6211 шт:
термін постачання 21-31 дні (днів)
2219+9.83 грн
Мінімальне замовлення: 2219
NX3V1G384GM,115 NX3V1G384GM,115 NXP USA Inc. NX3V1G384.pdf Description: IC SW SPST-NCX1 450MOHM 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 450mOhm
-3db Bandwidth: 25MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 12pC
Switch Circuit: SPST - NC
Multiplexer/Demultiplexer Circuit: 1:1
Switch Time (Ton, Toff) (Max): 26ns, 10ns
Channel Capacitance (CS(off), CD(off)): 70pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 1
на замовлення 14539 шт:
термін постачання 21-31 дні (днів)
2219+9.83 грн
Мінімальне замовлення: 2219
NX3V1G66GM,115 NX3V1G66GM,115 NXP USA Inc. NX3V1G66.pdf Description: IC SW SPST-NOX1 450MOHM 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 450mOhm
-3db Bandwidth: 25MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 12pC
Switch Circuit: SPST - NO
Multiplexer/Demultiplexer Circuit: 1:1
Switch Time (Ton, Toff) (Max): 24ns, 9ns
Channel Capacitance (CS(off), CD(off)): 70pF
Current - Leakage (IS(off)) (Max): 10nA
Number of Circuits: 1
товар відсутній
74AUP1T45GS,132 74AUP1T45GS,132 NXP USA Inc. PHGLS25189-1.pdf?t.download=true&u=5oefqw Description: IC TXRX NON-INVERT 3.6V 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.1V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 6-XSON, SOT1202 (1x1)
Part Status: Active
на замовлення 102450 шт:
термін постачання 21-31 дні (днів)
2671+8.36 грн
Мінімальне замовлення: 2671
74HC574PW-Q100118 74HC574PW-Q100118 NXP USA Inc. 74HC_HCT574_Q100.pdf Description: IC FF D-TYPE SNGL 8BIT 20TSSOP
Packaging: Bulk
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 7.8mA, 7.8mA
Trigger Type: Positive Edge
Clock Frequency: 133 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 20-TSSOP
Max Propagation Delay @ V, Max CL: 26ns @ 6V, 50pF
Part Status: Active
Number of Bits per Element: 8
товар відсутній
FS32K148HAT0MLQT FS32K148HAT0MLQT NXP USA Inc. S32K-DS.pdf Description: IC MCU 32BIT 2MB FLASH 144LQFP
товар відсутній
BZX84-C4V3/LF1VL BZX84-C4V3/LF1VL NXP USA Inc. PHGLS29437-1.pdf?t.download=true&u=5oefqw Description: DIODE ZENER 4.3V 250MW TO236AB
товар відсутній
BZX84-C4V3/LF1R BZX84-C4V3/LF1R NXP USA Inc. PHGLS29437-1.pdf?t.download=true&u=5oefqw Description: DIODE ZENER 4.3V 250MW TO236AB
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 4.3 V
Impedance (Max) (Zzt): 90 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Grade: Automotive
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 3 µA @ 1 V
Qualification: AEC-Q101
товар відсутній
XC68C812A4PVE5-NXP XC68C812A4PVE5-NXP NXP USA Inc. FSCLS02683-1.pdf?t.download=true&u=5oefqw Description: MICROCONTROLLER, 16 BIT, EEPROM,
на замовлення 138 шт:
термін постачання 21-31 дні (днів)
9+2576.16 грн
Мінімальне замовлення: 9
LS1027ASN7HNA NXP USA Inc. Description: LS1027A-800 ST NO SEC
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Part Status: Active
товар відсутній
LS1017ASE7NQA NXP USA Inc. Description: LS1017A-1300 ST SEC
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1.3GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Part Status: Active
товар відсутній
LS1018AXN7HNA LS1018AXN7HNA NXP USA Inc. Description: IC MPU QORIQ 800MHZ 448FBGA
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Additional Interfaces: CANbus, I2C, SPI, UART
Part Status: Active
товар відсутній
LS1018AXN7KQA NXP USA Inc. Description: IC MPU QORIQ LAYER 1GHZ 448FBGA
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Part Status: Active
товар відсутній
LS1018AXN7NQA NXP USA Inc. Description: LS1018A-1300 XT NO SEC
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1.3GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Part Status: Active
товар відсутній
LS1017ASN7HNA NXP USA Inc. Description: LS1017A-800 ST NO SEC
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Part Status: Active
товар відсутній
LS1018AXE7NQA NXP USA Inc. Description: LS1018A-1300 XT SEC
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1.3GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Part Status: Active
товар відсутній
LS1027ASE7KQA NXP USA Inc. Description: LS1027A-1000 ST SEC
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Part Status: Active
товар відсутній
LS1018AXE7HNA NXP USA Inc. Description: LS1018A-800 XT SEC
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Part Status: Active
товар відсутній
LS1018ASN7NQA NXP USA Inc. Description: LS1018A-1300 ST NO SEC
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1.3GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Part Status: Active
товар відсутній
LS1027AXE7KQA NXP USA Inc. Description: LS1027A-1000 XT SEC
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Part Status: Active
товар відсутній
LS1017ASE7HNA NXP USA Inc. Description: LS1017A-800 ST SEC
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Part Status: Active
товар відсутній
LS1027ASE7HNA LS1027ASE7HNA NXP USA Inc. Description: IC MPU QORIQ 800MHZ 448FBGA
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Additional Interfaces: CANbus, I2C, SPI, UART
Part Status: Active
товар відсутній
LS1017ASE7KQA NXP USA Inc. Description: LS1017A-1000 ST SEC
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Part Status: Active
товар відсутній
LS1027AXE7HNA NXP USA Inc. Description: LS1027A-800 XT SEC
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Part Status: Active
товар відсутній
LS1017ASN7KQA NXP USA Inc. Description: LS1017A-1000 ST NO SEC
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Part Status: Active
товар відсутній
LS1018ASE7NQA NXP USA Inc. Description: LS1018A-1300 ST SEC
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1.3GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Part Status: Active
товар відсутній
LS1017AXE7NQA NXP USA Inc. Description: LS1017A-1300 XT SEC
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1.3GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Part Status: Active
товар відсутній
LS1018ASN7HNA NXP USA Inc. Description: LS1018A-800 ST NO SEC
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Part Status: Active
товар відсутній
LS1017AXE7KQA NXP USA Inc. Description: LS1017A-1000 XT SEC
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Part Status: Active
товар відсутній
LS1018AXE7KQA NXP USA Inc. Description: LS1018A-1000 XT SEC
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Part Status: Active
товар відсутній
LS1017ASN7NQA NXP USA Inc. Description: LS1017A-1300 ST NO SEC
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1.3GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Part Status: Active
товар відсутній
LS1018ASN7KQA NXP USA Inc. Description: LS1018A-1000 ST NO SEC
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Part Status: Active
товар відсутній
LS1017AXN7KQA NXP USA Inc. Description: LS1017A-1000 XT NO SEC
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Part Status: Active
товар відсутній
LS1027ASN7NQA NXP USA Inc. Description: LS1027A-1300 ST NO SEC
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1.3GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Part Status: Active
товар відсутній
LS1018ASE7KQA NXP USA Inc. Description: LS1018A-1000 ST SEC
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Part Status: Active
товар відсутній
BC847T,115 BC847T,115 NXP USA Inc. PHGLS25463-1.pdf?t.download=true&u=5oefqw Description: NEXPERIA BC847 - SMALL SIGNAL BI
Packaging: Bulk
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 400mV @ 5mA, 100mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 110 @ 2mA, 5V
Frequency - Transition: 100MHz
Supplier Device Package: SC-75
Grade: Automotive
Part Status: Active
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 45 V
Power - Max: 150 mW
Qualification: AEC-Q101
на замовлення 119205 шт:
термін постачання 21-31 дні (днів)
13172+1.42 грн
Мінімальне замовлення: 13172
BB181,335 BB181,335 NXP USA Inc. BB181.pdf Description: DIODE VHF VAR CAP 30V SOD523
Packaging: Bulk
Package / Case: SC-79, SOD-523
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 150°C (TJ)
Capacitance @ Vr, F: 1.055pF @ 28V, 1MHz
Capacitance Ratio Condition: C0.5/C28
Supplier Device Package: SOD-523
Voltage - Peak Reverse (Max): 30 V
Capacitance Ratio: 16.0
на замовлення 1419989 шт:
термін постачання 21-31 дні (днів)
3390+6.32 грн
Мінімальне замовлення: 3390
BGU8007,115 BGU8007,115 NXP USA Inc. BGU8007.pdf Description: IC AMP GPS 1.559-1.61GHZ 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 1.559GHz ~ 1.61GHz
RF Type: GPS/GNSS
Voltage - Supply: 1.5V ~ 2.2V
Gain: 20.5dB
Current - Supply: 11.9mA
Noise Figure: 1.1dB
P1dB: -7dBm
Test Frequency: 1.575GHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
на замовлення 232806 шт:
термін постачання 21-31 дні (днів)
747+28.08 грн
Мінімальне замовлення: 747
74AUP2G14GF NXP USA Inc. Description: IC INVERT SCHMITT 2CH 2-IN 6XSON
товар відсутній
74AUP2G14GF,132-NXP 74AUP2G14GF,132-NXP NXP USA Inc. Description: IC INVERT SCHMITT 2CH 2-IN 6XSON
товар відсутній
SPC5125YVN400R SPC5125YVN400R NXP USA Inc. MPC5125.pdf Description: IC MCU 32BIT ROMLESS 324PBGA
Packaging: Tape & Reel (TR)
Package / Case: 324-BBGA
Mounting Type: Surface Mount
Speed: 400MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: e300
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.08V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 324-PBGA (23x23)
Number of I/O: 64
DigiKey Programmable: Not Verified
товар відсутній
SPC5125YVN400 SPC5125YVN400 NXP USA Inc. MPC5125PB.pdf Description: IC MCU 32BIT ROMLESS 324PBGA
Packaging: Tray
Package / Case: 324-BBGA
Mounting Type: Surface Mount
Speed: 400MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: e300
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.08V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 324-PBGA (23x23)
Number of I/O: 64
DigiKey Programmable: Not Verified
товар відсутній
PMN40UPEA115 PMN40UPEA115 NXP USA Inc. PHGLS25503-1.pdf?t.download=true&u=5oefqw Description: P-CHANNEL MOSFET
Packaging: Bulk
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: P-Channel
Current - Continuous Drain (Id) @ 25°C: 4.7A (Ta)
Rds On (Max) @ Id, Vgs: 43mOhm @ 3A, 4.5V
Power Dissipation (Max): 500mW (Ta), 8.33W (Tc)
Vgs(th) (Max) @ Id: 950mV @ 250µA
Supplier Device Package: 6-TSOP
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 20 V
Gate Charge (Qg) (Max) @ Vgs: 23 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 1820 pF @ 10 V
на замовлення 46497 шт:
термін постачання 21-31 дні (днів)
1202+19.01 грн
Мінімальне замовлення: 1202
74AHCT1G125GM,115 74AHCT1G125GM,115 NXP USA Inc. PHGLS25584-1.pdf?t.download=true&u=5oefqw Description: IC BUFFER NON-INVERT 5.5V 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 6-XSON (1.45x1)
Part Status: Active
на замовлення 9800 шт:
термін постачання 21-31 дні (днів)
4594+4.96 грн
Мінімальне замовлення: 4594
74AHCT1G125GF132 74AHCT1G125GF132 NXP USA Inc. 74AHC_AHCT1G125.pdf Description: NOW NEXPERIA 74AHCT1G125GF - BUS
Packaging: Bulk
Part Status: Active
товар відсутній
LPC1785FBD208,551 LPC178X_7X.pdf
LPC1785FBD208,551
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 208LQFP
Packaging: Bulk
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Number of I/O: 165
DigiKey Programmable: Not Verified
на замовлення 8761 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
22+991.81 грн
Мінімальне замовлення: 22
LPC1785FBD208557 LPC178X_7X.pdf
LPC1785FBD208557
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 208LQFP
товар відсутній
LPC2470FBD208,551 LPC2470.pdf
LPC2470FBD208,551
Виробник: NXP USA Inc.
Description: IC MCU 16/32BIT ROMLESS 208LQFP
Packaging: Bulk
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
RAM Size: 98K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM7®
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Number of I/O: 160
DigiKey Programmable: Not Verified
на замовлення 15810 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
22+988.36 грн
Мінімальне замовлення: 22
LPC2939FBD208551 LPC2939.pdf
LPC2939FBD208551
Виробник: NXP USA Inc.
Description: IC MCU 16/32B 768KB FLSH 208LQFP
Packaging: Bulk
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 125MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 56K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM9®
Data Converters: A/D 24x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, LINbus, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Number of I/O: 152
DigiKey Programmable: Not Verified
товар відсутній
LPC54607J256BD208551 PHGL-S-A0006515862-1.pdf?t.download=true&u=5oefqw
LPC54607J256BD208551
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 208LQFP
товар відсутній
LX2160SN71826B
LX2160SN71826B
Виробник: NXP USA Inc.
Description: IC MPU QORLQ 1.8GHZ 1517FCPBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A72
Voltage - I/O: 1.2V, 1.8V, 3.3V
Supplier Device Package: 1517-FCPBGA (40x40)
Ethernet: 100Gbps (2)
USB: USB 3.0 (2) + PHY (2)
Number of Cores/Bus Width: 16 Core, 64-Bit
RAM Controllers: DDR4
Graphics Acceleration: Yes
Security Features: Secure Boot, TrustZone®
SATA: SATA 3.0 (4)
Part Status: Active
товар відсутній
BZX84-C18/LF1R PHGLS29437-1.pdf?t.download=true&u=5oefqw
BZX84-C18/LF1R
Виробник: NXP USA Inc.
Description: DIODE ZENER 18V 250MW TO236AB
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 18 V
Impedance (Max) (Zzt): 45 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 12.6 V
Grade: Automotive
Qualification: AEC-Q101
товар відсутній
BZX84-C18/LF1VL PHGLS29437-1.pdf?t.download=true&u=5oefqw
BZX84-C18/LF1VL
Виробник: NXP USA Inc.
Description: DIODE ZENER 18V 250MW TO236AB
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 18 V
Impedance (Max) (Zzt): 45 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 12.6 V
товар відсутній
74ALVCH16244DL,118 PHGLS11539-1.pdf?t.download=true&u=5oefqw
74ALVCH16244DL,118
Виробник: NXP USA Inc.
Description: IC BUFFER NON-INVERT 3.6V 48SSOP
Packaging: Bulk
Package / Case: 48-BSSOP (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 48-SSOP
на замовлення 4819 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
494+43.42 грн
Мінімальне замовлення: 494
74ALVCH16244DL,112 PHGLS11539-1.pdf?t.download=true&u=5oefqw
74ALVCH16244DL,112
Виробник: NXP USA Inc.
Description: BUS DRIVER, ALVC/VCX/A SERIES, 4
на замовлення 1581 шт:
термін постачання 21-31 дні (днів)
74ALVCH16374DL,118 PHGLS25100-1.pdf?t.download=true&u=5oefqw
74ALVCH16374DL,118
Виробник: NXP USA Inc.
Description: IC FF D-TYPE DUAL 8BIT 48SSOP
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
466+46.93 грн
Мінімальне замовлення: 466
74ALVC574D,112 PHGLS14966-1.pdf?t.download=true&u=5oefqw
74ALVC574D,112
Виробник: NXP USA Inc.
Description: IC FF D-TYPE SNGL 8BIT 20SO
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Current - Quiescent (Iq): 10 µA
Current - Output High, Low: 24mA, 24mA
Trigger Type: Positive Edge
Clock Frequency: 300 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 20-SO
Max Propagation Delay @ V, Max CL: 3.6ns @ 3.3V, 50pF
Part Status: Active
Number of Bits per Element: 8
на замовлення 2790 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1135+19.77 грн
Мінімальне замовлення: 1135
NX3L1T53GT,115 NX3L1T53.pdf
NX3L1T53GT,115
Виробник: NXP USA Inc.
Description: IC SWITCH SPDT X 1 750MOHM 8XSON
Packaging: Cut Tape (CT)
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 20mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Active
Number of Circuits: 1
на замовлення 579 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
6+58.54 грн
10+ 50.37 грн
25+ 47.79 грн
100+ 36.84 грн
250+ 34.44 грн
500+ 30.43 грн
Мінімальне замовлення: 6
NX3V1G66GM,132 NX3V1G66.pdf
NX3V1G66GM,132
Виробник: NXP USA Inc.
Description: IC SW SPST-NOX1 450MOHM 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 450mOhm
-3db Bandwidth: 25MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 12pC
Switch Circuit: SPST - NO
Multiplexer/Demultiplexer Circuit: 1:1
Switch Time (Ton, Toff) (Max): 24ns, 9ns
Channel Capacitance (CS(off), CD(off)): 70pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 1
товар відсутній
NX3V1G384GM,132 NX3V1G384.pdf
NX3V1G384GM,132
Виробник: NXP USA Inc.
Description: IC SW SPST-NCX1 450MOHM 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 450mOhm
-3db Bandwidth: 25MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 12pC
Switch Circuit: SPST - NC
Multiplexer/Demultiplexer Circuit: 1:1
Switch Time (Ton, Toff) (Max): 26ns, 10ns
Channel Capacitance (CS(off), CD(off)): 70pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 1
товар відсутній
NX3V1G384GM,132 NX3V1G384.pdf
NX3V1G384GM,132
Виробник: NXP USA Inc.
Description: IC SW SPST-NCX1 450MOHM 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 450mOhm
-3db Bandwidth: 25MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 12pC
Switch Circuit: SPST - NC
Multiplexer/Demultiplexer Circuit: 1:1
Switch Time (Ton, Toff) (Max): 26ns, 10ns
Channel Capacitance (CS(off), CD(off)): 70pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 1
на замовлення 6211 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
2219+9.83 грн
Мінімальне замовлення: 2219
NX3V1G384GM,115 NX3V1G384.pdf
NX3V1G384GM,115
Виробник: NXP USA Inc.
Description: IC SW SPST-NCX1 450MOHM 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 450mOhm
-3db Bandwidth: 25MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 12pC
Switch Circuit: SPST - NC
Multiplexer/Demultiplexer Circuit: 1:1
Switch Time (Ton, Toff) (Max): 26ns, 10ns
Channel Capacitance (CS(off), CD(off)): 70pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 1
на замовлення 14539 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
2219+9.83 грн
Мінімальне замовлення: 2219
NX3V1G66GM,115 NX3V1G66.pdf
NX3V1G66GM,115
Виробник: NXP USA Inc.
Description: IC SW SPST-NOX1 450MOHM 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 450mOhm
-3db Bandwidth: 25MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 12pC
Switch Circuit: SPST - NO
Multiplexer/Demultiplexer Circuit: 1:1
Switch Time (Ton, Toff) (Max): 24ns, 9ns
Channel Capacitance (CS(off), CD(off)): 70pF
Current - Leakage (IS(off)) (Max): 10nA
Number of Circuits: 1
товар відсутній
74AUP1T45GS,132 PHGLS25189-1.pdf?t.download=true&u=5oefqw
74AUP1T45GS,132
Виробник: NXP USA Inc.
Description: IC TXRX NON-INVERT 3.6V 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.1V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 6-XSON, SOT1202 (1x1)
Part Status: Active
на замовлення 102450 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
2671+8.36 грн
Мінімальне замовлення: 2671
74HC574PW-Q100118 74HC_HCT574_Q100.pdf
74HC574PW-Q100118
Виробник: NXP USA Inc.
Description: IC FF D-TYPE SNGL 8BIT 20TSSOP
Packaging: Bulk
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 7.8mA, 7.8mA
Trigger Type: Positive Edge
Clock Frequency: 133 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 20-TSSOP
Max Propagation Delay @ V, Max CL: 26ns @ 6V, 50pF
Part Status: Active
Number of Bits per Element: 8
товар відсутній
FS32K148HAT0MLQT S32K-DS.pdf
FS32K148HAT0MLQT
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 144LQFP
товар відсутній
BZX84-C4V3/LF1VL PHGLS29437-1.pdf?t.download=true&u=5oefqw
BZX84-C4V3/LF1VL
Виробник: NXP USA Inc.
Description: DIODE ZENER 4.3V 250MW TO236AB
товар відсутній
BZX84-C4V3/LF1R PHGLS29437-1.pdf?t.download=true&u=5oefqw
BZX84-C4V3/LF1R
Виробник: NXP USA Inc.
Description: DIODE ZENER 4.3V 250MW TO236AB
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 4.3 V
Impedance (Max) (Zzt): 90 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Grade: Automotive
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 3 µA @ 1 V
Qualification: AEC-Q101
товар відсутній
XC68C812A4PVE5-NXP FSCLS02683-1.pdf?t.download=true&u=5oefqw
XC68C812A4PVE5-NXP
Виробник: NXP USA Inc.
Description: MICROCONTROLLER, 16 BIT, EEPROM,
на замовлення 138 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
9+2576.16 грн
Мінімальне замовлення: 9
LS1027ASN7HNA
Виробник: NXP USA Inc.
Description: LS1027A-800 ST NO SEC
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Part Status: Active
товар відсутній
LS1017ASE7NQA
Виробник: NXP USA Inc.
Description: LS1017A-1300 ST SEC
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1.3GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Part Status: Active
товар відсутній
LS1018AXN7HNA
LS1018AXN7HNA
Виробник: NXP USA Inc.
Description: IC MPU QORIQ 800MHZ 448FBGA
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Additional Interfaces: CANbus, I2C, SPI, UART
Part Status: Active
товар відсутній
LS1018AXN7KQA
Виробник: NXP USA Inc.
Description: IC MPU QORIQ LAYER 1GHZ 448FBGA
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Part Status: Active
товар відсутній
LS1018AXN7NQA
Виробник: NXP USA Inc.
Description: LS1018A-1300 XT NO SEC
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1.3GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Part Status: Active
товар відсутній
LS1017ASN7HNA
Виробник: NXP USA Inc.
Description: LS1017A-800 ST NO SEC
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Part Status: Active
товар відсутній
LS1018AXE7NQA
Виробник: NXP USA Inc.
Description: LS1018A-1300 XT SEC
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1.3GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Part Status: Active
товар відсутній
LS1027ASE7KQA
Виробник: NXP USA Inc.
Description: LS1027A-1000 ST SEC
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Part Status: Active
товар відсутній
LS1018AXE7HNA
Виробник: NXP USA Inc.
Description: LS1018A-800 XT SEC
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Part Status: Active
товар відсутній
LS1018ASN7NQA
Виробник: NXP USA Inc.
Description: LS1018A-1300 ST NO SEC
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1.3GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Part Status: Active
товар відсутній
LS1027AXE7KQA
Виробник: NXP USA Inc.
Description: LS1027A-1000 XT SEC
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Part Status: Active
товар відсутній
LS1017ASE7HNA
Виробник: NXP USA Inc.
Description: LS1017A-800 ST SEC
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Part Status: Active
товар відсутній
LS1027ASE7HNA
LS1027ASE7HNA
Виробник: NXP USA Inc.
Description: IC MPU QORIQ 800MHZ 448FBGA
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Additional Interfaces: CANbus, I2C, SPI, UART
Part Status: Active
товар відсутній
LS1017ASE7KQA
Виробник: NXP USA Inc.
Description: LS1017A-1000 ST SEC
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Part Status: Active
товар відсутній
LS1027AXE7HNA
Виробник: NXP USA Inc.
Description: LS1027A-800 XT SEC
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Part Status: Active
товар відсутній
LS1017ASN7KQA
Виробник: NXP USA Inc.
Description: LS1017A-1000 ST NO SEC
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Part Status: Active
товар відсутній
LS1018ASE7NQA
Виробник: NXP USA Inc.
Description: LS1018A-1300 ST SEC
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1.3GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Part Status: Active
товар відсутній
LS1017AXE7NQA
Виробник: NXP USA Inc.
Description: LS1017A-1300 XT SEC
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1.3GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Part Status: Active
товар відсутній
LS1018ASN7HNA
Виробник: NXP USA Inc.
Description: LS1018A-800 ST NO SEC
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Part Status: Active
товар відсутній
LS1017AXE7KQA
Виробник: NXP USA Inc.
Description: LS1017A-1000 XT SEC
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Part Status: Active
товар відсутній
LS1018AXE7KQA
Виробник: NXP USA Inc.
Description: LS1018A-1000 XT SEC
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Part Status: Active
товар відсутній
LS1017ASN7NQA
Виробник: NXP USA Inc.
Description: LS1017A-1300 ST NO SEC
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1.3GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Part Status: Active
товар відсутній
LS1018ASN7KQA
Виробник: NXP USA Inc.
Description: LS1018A-1000 ST NO SEC
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Part Status: Active
товар відсутній
LS1017AXN7KQA
Виробник: NXP USA Inc.
Description: LS1017A-1000 XT NO SEC
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Part Status: Active
товар відсутній
LS1027ASN7NQA
Виробник: NXP USA Inc.
Description: LS1027A-1300 ST NO SEC
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1.3GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Part Status: Active
товар відсутній
LS1018ASE7KQA
Виробник: NXP USA Inc.
Description: LS1018A-1000 ST SEC
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Part Status: Active
товар відсутній
BC847T,115 PHGLS25463-1.pdf?t.download=true&u=5oefqw
BC847T,115
Виробник: NXP USA Inc.
Description: NEXPERIA BC847 - SMALL SIGNAL BI
Packaging: Bulk
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 400mV @ 5mA, 100mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 110 @ 2mA, 5V
Frequency - Transition: 100MHz
Supplier Device Package: SC-75
Grade: Automotive
Part Status: Active
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 45 V
Power - Max: 150 mW
Qualification: AEC-Q101
на замовлення 119205 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
13172+1.42 грн
Мінімальне замовлення: 13172
BB181,335 BB181.pdf
BB181,335
Виробник: NXP USA Inc.
Description: DIODE VHF VAR CAP 30V SOD523
Packaging: Bulk
Package / Case: SC-79, SOD-523
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 150°C (TJ)
Capacitance @ Vr, F: 1.055pF @ 28V, 1MHz
Capacitance Ratio Condition: C0.5/C28
Supplier Device Package: SOD-523
Voltage - Peak Reverse (Max): 30 V
Capacitance Ratio: 16.0
на замовлення 1419989 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
3390+6.32 грн
Мінімальне замовлення: 3390
BGU8007,115 BGU8007.pdf
BGU8007,115
Виробник: NXP USA Inc.
Description: IC AMP GPS 1.559-1.61GHZ 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 1.559GHz ~ 1.61GHz
RF Type: GPS/GNSS
Voltage - Supply: 1.5V ~ 2.2V
Gain: 20.5dB
Current - Supply: 11.9mA
Noise Figure: 1.1dB
P1dB: -7dBm
Test Frequency: 1.575GHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
на замовлення 232806 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
747+28.08 грн
Мінімальне замовлення: 747
74AUP2G14GF
Виробник: NXP USA Inc.
Description: IC INVERT SCHMITT 2CH 2-IN 6XSON
товар відсутній
74AUP2G14GF,132-NXP
74AUP2G14GF,132-NXP
Виробник: NXP USA Inc.
Description: IC INVERT SCHMITT 2CH 2-IN 6XSON
товар відсутній
SPC5125YVN400R MPC5125.pdf
SPC5125YVN400R
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 324PBGA
Packaging: Tape & Reel (TR)
Package / Case: 324-BBGA
Mounting Type: Surface Mount
Speed: 400MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: e300
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.08V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 324-PBGA (23x23)
Number of I/O: 64
DigiKey Programmable: Not Verified
товар відсутній
SPC5125YVN400 MPC5125PB.pdf
SPC5125YVN400
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 324PBGA
Packaging: Tray
Package / Case: 324-BBGA
Mounting Type: Surface Mount
Speed: 400MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: e300
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.08V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 324-PBGA (23x23)
Number of I/O: 64
DigiKey Programmable: Not Verified
товар відсутній
PMN40UPEA115 PHGLS25503-1.pdf?t.download=true&u=5oefqw
PMN40UPEA115
Виробник: NXP USA Inc.
Description: P-CHANNEL MOSFET
Packaging: Bulk
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: P-Channel
Current - Continuous Drain (Id) @ 25°C: 4.7A (Ta)
Rds On (Max) @ Id, Vgs: 43mOhm @ 3A, 4.5V
Power Dissipation (Max): 500mW (Ta), 8.33W (Tc)
Vgs(th) (Max) @ Id: 950mV @ 250µA
Supplier Device Package: 6-TSOP
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 20 V
Gate Charge (Qg) (Max) @ Vgs: 23 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 1820 pF @ 10 V
на замовлення 46497 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1202+19.01 грн
Мінімальне замовлення: 1202
74AHCT1G125GM,115 PHGLS25584-1.pdf?t.download=true&u=5oefqw
74AHCT1G125GM,115
Виробник: NXP USA Inc.
Description: IC BUFFER NON-INVERT 5.5V 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 6-XSON (1.45x1)
Part Status: Active
на замовлення 9800 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
4594+4.96 грн
Мінімальне замовлення: 4594
74AHCT1G125GF132 74AHC_AHCT1G125.pdf
74AHCT1G125GF132
Виробник: NXP USA Inc.
Description: NOW NEXPERIA 74AHCT1G125GF - BUS
Packaging: Bulk
Part Status: Active
товар відсутній
Обрати Сторінку:   [  << Попередня Сторінка ]  1 58 116 174 232 290 348 406 429 430 431 432 433 434 435 436 437 438 439 464 522 580 588  [ Наступна Сторінка >> ]