Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (35278) > Сторінка 417 з 588
| Фото | Назва | Виробник | Інформація |
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MCIMX537CVP8C2R2 | NXP USA Inc. |
Description: IC MPU I.MX53 800MHZ 529FBGA Packaging: Tape & Reel (TR) Package / Case: 529-FBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A8 Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V Supplier Device Package: 529-FBGA (19x19) Ethernet: 10/100Mbps (1) USB: USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR2, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD, LVDS Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection SATA: SATA 1.5Gbps (1) Part Status: Active Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART |
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74LVC573ADB,112 | NXP USA Inc. |
 Description: IC D-TYPE TRANSP SGL 8:8 20SSOPPackaging: Tube Package / Case: 20-SSOP (0.209", 5.30mm Width) Output Type: Tri-State Mounting Type: Surface Mount Circuit: 8:8 Logic Type: D-Type Transparent Latch Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.2V ~ 3.6V Independent Circuits: 1 Current - Output High, Low: 24mA, 24mA Delay Time - Propagation: 1.5ns Supplier Device Package: 20-SSOP |
на замовлення 85536 шт: термін постачання 21-31 дні (днів) |
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74LVC573ABXX | NXP USA Inc. |
Description: IC D-TYPE TRANSP SGL 8:8 20HXQFN Packaging: Bulk Package / Case: 20-XFQFN Exposed Pad Output Type: Tri-State Mounting Type: Surface Mount Circuit: 8:8 Logic Type: D-Type Transparent Latch Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.2V ~ 3.6V Independent Circuits: 1 Current - Output High, Low: 24mA, 24mA Delay Time - Propagation: 1.5ns Supplier Device Package: 20-DHXQFN (4.5x2.5) |
на замовлення 261900 шт: термін постачання 21-31 дні (днів) |
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| 74HCT7540N112 | NXP USA Inc. | Description: IC BUFFER INVERT 5.5V 20DIP |
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NX7002BKMB315 | NXP USA Inc. |
Description: SMALL SIGNAL N-CHANNEL MOSFET Packaging: Bulk |
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NX7002BKXB147 | NXP USA Inc. |
Description: SMALL SIGNAL N-CHANNEL MOSFET Packaging: Bulk |
на замовлення 1459345 шт: термін постачання 21-31 дні (днів) |
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NX7002BKS115 | NXP USA Inc. |
Description: MOSFET Packaging: Bulk |
на замовлення 18000 шт: термін постачання 21-31 дні (днів) |
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74AVC4T245PW-Q100118 | NXP USA Inc. |
Description: IC TRANSLATION TXRX 3.6V 16TSSOP Packaging: Bulk Package / Case: 16-TSSOP (0.173", 4.40mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 2 Logic Type: Translation Transceiver Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 0.8V ~ 3.6V Number of Bits per Element: 2 Current - Output High, Low: 12mA, 12mA Supplier Device Package: 16-TSSOP Part Status: Active |
на замовлення 968 шт: термін постачання 21-31 дні (днів) |
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TEA1998TS/1115 | NXP USA Inc. |
Description: GREENCHIP SYNCHRONOUS RECTIFIER |
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TEA1993TS/1 | NXP USA Inc. |
Description: GREENCHIP SYNCHRONOUS RECTIFIER |
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TEA1993TS/1125 | NXP USA Inc. |
Description: GREENCHIP SYNCHRONOUS RECTIFIER |
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TEA2208T/1J | NXP USA Inc. |
Description: BRIDGE RECTIFIER CONTROLLER S014 Packaging: Tape & Reel (TR) Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TJ) Voltage - Supply: 0V ~ 440V Applications: Desktop, Notebook PCs Current - Supply: 2mA Supplier Device Package: 14-SO |
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TEA2208T/1J | NXP USA Inc. |
Description: BRIDGE RECTIFIER CONTROLLER S014 Packaging: Cut Tape (CT) Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TJ) Voltage - Supply: 0V ~ 440V Applications: Desktop, Notebook PCs Current - Supply: 2mA Supplier Device Package: 14-SO |
на замовлення 2735 шт: термін постачання 21-31 дні (днів) |
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74AXP1G11GSH | NXP USA Inc. |
Description: IC GATE AND 1CH 3-INP 6XSON Packaging: Bulk Package / Case: 6-XFDFN Mounting Type: Surface Mount Logic Type: AND Gate Operating Temperature: -40°C ~ 85°C Voltage - Supply: 0.7V ~ 2.75V Current - Output High, Low: 8mA, 8mA Number of Inputs: 3 Supplier Device Package: 6-XSON, SOT1202 (1x1) Max Propagation Delay @ V, Max CL: 3.2ns @ 2.5V, 5pF Part Status: Active Number of Circuits: 1 Current - Quiescent (Max): 600 nA |
на замовлення 10000 шт: термін постачання 21-31 дні (днів) |
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IP3348CX20,135 | NXP USA Inc. |
Description: FILTER LC(PI) 15NH/25PF ESD SMD Packaging: Bulk Package / Case: 20-UFBGA, WLCSP Size / Dimension: 0.124" L x 0.042" W (3.16mm x 1.06mm) Mounting Type: Surface Mount Type: Low Pass Operating Temperature: -40°C ~ 85°C Values: L = 15nH (Total), C = 25pF (Total) Height: 0.026" (0.65mm) Attenuation Value: 40dB @ 1GHz ~ 3GHz Filter Order: 3rd Applications: Data Lines for Mobile Devices Technology: LC (Pi) Center / Cutoff Frequency: 350MHz (Cutoff) Resistance - Channel (Ohms): 10 ESD Protection: Yes Part Status: Obsolete Number of Channels: 8 Current: 20 mA |
на замовлення 4500 шт: термін постачання 21-31 дні (днів) |
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| IP3088CX20,135 | NXP USA Inc. |
Description: IP3088CX20 - CONSUMER CIRCUIT Packaging: Bulk Package / Case: 20-WFBGA, WLCSP Size / Dimension: 0.156" L x 0.050" W (3.96mm x 1.28mm) Mounting Type: Surface Mount Type: Low Pass Operating Temperature: -40°C ~ 85°C Values: L = 40nH (Total), C = 42pF (Total) Height: 0.028" (0.70mm) Attenuation Value: 40dB @ 800MHz ~ 1.5GHz Filter Order: 5th Applications: GSM, LAN, PCS, WAN Technology: LC (Pi) Center / Cutoff Frequency: 175MHz (Cutoff) Resistance - Channel (Ohms): 18 ESD Protection: Yes Part Status: Active Number of Channels: 8 Current: 30 mA |
на замовлення 19902 шт: термін постачання 21-31 дні (днів) |
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LPC1225FBD48/301EL | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 45MHz Program Memory Size: 64KB (64K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b SAR Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 39 DigiKey Programmable: Not Verified |
на замовлення 1240 шт: термін постачання 21-31 дні (днів) |
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LPC1225FBD48/301151 | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 48LQFP |
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LPC1225FBD48/321151 | NXP USA Inc. |
Description: IC MCU 32BIT 80KB FLASH 48LQFP |
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BLF7G10L-250,112 | NXP USA Inc. |
Description: RF MOSFET LDMOS 30V LDMOST Packaging: Tube Package / Case: SOT-502A Frequency: 920MHz ~ 960MHz Power - Output: 60W Gain: 19.5dB Technology: LDMOS Supplier Device Package: LDMOST Voltage - Rated: 65 V Voltage - Test: 30 V Current - Test: 1.8 A |
на замовлення 78 шт: термін постачання 21-31 дні (днів) |
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BLF7G10LS-250,112 | NXP USA Inc. |
Description: RF MOSFET LDMOS 30V SOT502B Packaging: Tube Package / Case: SOT-502B Current Rating (Amps): 5µA Mounting Type: Chassis Mount Frequency: 869MHz ~ 960MHz Power - Output: 250W Gain: 19.5dB Technology: LDMOS Supplier Device Package: SOT502B Part Status: Active Voltage - Rated: 65 V Voltage - Test: 30 V Current - Test: 1.8 A |
на замовлення 55 шт: термін постачання 21-31 дні (днів) |
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MC33FS4500LAER2 | NXP USA Inc. |
Description: SYSTEM BASIS CHIP LINEAR 0.5A V |
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| BSC9131NXN7KHKB | NXP USA Inc. |
Description: IC MPU QORIQ 800MHZ 520FCBGA Packaging: Tray Package / Case: 520-FBGA, FCBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: -40°C ~ 105°C Core Processor: PowerPC e500 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 520-FCBGA (21x21) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Signal Processing; SC3850, Security; SEC 4.4 RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Security Features: Boot Security, Cryptography, Random Number Generator Part Status: Obsolete Additional Interfaces: AIC, DUART, I2C, MMC/SD, SPI, USIM |
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| T1023NXE7PQA | NXP USA Inc. |
Description: QORIQ 2XCPU 64-BIT PWR ARCH 1. |
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SPC5606BF1MLQ6R | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 144LQFP Packaging: Tape & Reel (TR) Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 64MHz Program Memory Size: 1MB (1M x 8) RAM Size: 80K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0h Data Converters: A/D 15x10b, 5x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 121 DigiKey Programmable: Not Verified |
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MC9S08QA4CFQER | NXP USA Inc. |
Description: IC MCU 8BIT 4KB FLASH 8DFN Packaging: Tape & Reel (TR) Package / Case: 8-VDFN Exposed Pad Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 4KB (4K x 8) RAM Size: 256 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 4x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 8-DFN-EP (4x4) Number of I/O: 4 DigiKey Programmable: Not Verified |
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MRF24301HR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS NI780 Packaging: Bulk Package / Case: SOT-957A Mounting Type: Chassis Mount Frequency: 2.4GHz ~ 2.5GHz Power - Output: 300W Gain: 13.5dB Technology: LDMOS Supplier Device Package: NI-780H-2L |
на замовлення 123 шт: термін постачання 21-31 дні (днів) |
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A7102CHUK/T0BC2VAZ | NXP USA Inc. |
Description: SECURITY IC EXT TEMP WLCSP Packaging: Cut Tape (CT) Package / Case: 12-UFBGA, WLCSP Mounting Type: Surface Mount Interface: I2C Operating Temperature: -40°C ~ 90°C (TA) Voltage - Supply: 2.5V ~ 3.6V Applications: Authentication Core Processor: MX51 Supplier Device Package: 12-WLCSP (2.06x2.02) Part Status: Obsolete DigiKey Programmable: Not Verified |
на замовлення 1721 шт: термін постачання 21-31 дні (днів) |
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A7102CHTK2/T0BC2CJ | NXP USA Inc. |
Description: SECURITY IC EXT TEMP HVSON8 Packaging: Cut Tape (CT) Package / Case: 8-VDFN Exposed Pad Mounting Type: Surface Mount Interface: I2C Operating Temperature: -40°C ~ 90°C (TA) Voltage - Supply: 2.5V ~ 3.6V Applications: Authentication Core Processor: MX51 Supplier Device Package: 8-HVSON (4x4) Part Status: Last Time Buy DigiKey Programmable: Not Verified |
на замовлення 4834 шт: термін постачання 21-31 дні (днів) |
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| MIMXRT685SFAWBR | NXP USA Inc. |
Description: IC MCU 32BIT EXT MEM 114WLCSP Packaging: Tape & Reel (TR) Package / Case: 114-UFBGA, WLCSP Mounting Type: Surface Mount Speed: 300MHz RAM Size: 4.5M x 8 Operating Temperature: -20°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: External Program Memory Core Processor: ARM® Cortex®-M33 Data Converters: A/D 12x12b SAR Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: EBI/EMI, I2C, MMC/SD/SDIO, SPDIF, SPI, UART/USART, USB2.0 OTG Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 114-WLCSP (4.24x4.24) Part Status: Active Number of I/O: 65 DigiKey Programmable: Not Verified |
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| MIMXRT685SFAWBR | NXP USA Inc. |
Description: IC MCU 32BIT EXT MEM 114WLCSP Packaging: Cut Tape (CT) Package / Case: 114-UFBGA, WLCSP Mounting Type: Surface Mount Speed: 300MHz RAM Size: 4.5M x 8 Operating Temperature: -20°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: External Program Memory Core Processor: ARM® Cortex®-M33 Data Converters: A/D 12x12b SAR Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: EBI/EMI, I2C, MMC/SD/SDIO, SPDIF, SPI, UART/USART, USB2.0 OTG Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 114-WLCSP (4.24x4.24) Part Status: Active Number of I/O: 65 DigiKey Programmable: Not Verified |
на замовлення 5787 шт: термін постачання 21-31 дні (днів) |
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BAT74S135 | NXP USA Inc. |
Description: NOW NEXPERIA BAT74S - RECTIFIER Packaging: Bulk Package / Case: 6-TSSOP, SC-88, SOT-363 Mounting Type: Surface Mount Speed: Small Signal =< 200mA (Io), Any Speed Reverse Recovery Time (trr): 5 ns Technology: Schottky Diode Configuration: 2 Independent Current - Average Rectified (Io) (per Diode): 200mA (DC) Supplier Device Package: 6-TSSOP Operating Temperature - Junction: 125°C (Max) Voltage - DC Reverse (Vr) (Max): 30 V Voltage - Forward (Vf) (Max) @ If: 800 mV @ 100 mA Current - Reverse Leakage @ Vr: 2 µA @ 25 V |
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BAT74V115 | NXP USA Inc. |
Description: NOW NEXPERIA BAT74V - RECTIFIER |
на замовлення 11400 шт: термін постачання 21-31 дні (днів) |
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MCIMX233CJM4B | NXP USA Inc. |
Description: MICROPROCESSOR, CMOS, PBGA169 |
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S9S12GA128F0MLF | NXP USA Inc. |
Description: IC MCU 16BIT 128KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 128KB (128K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: 12V1 Data Converters: A/D 12x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 40 DigiKey Programmable: Not Verified |
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TJA1441AT/0Z | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 8SO Packaging: Tape & Reel (TR) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 4.5V ~ 5.5V Number of Drivers/Receivers: 1/1 Data Rate: 5Mbps Protocol: CANbus Supplier Device Package: 8-SO Receiver Hysteresis: 50 mV Duplex: Half Part Status: Active Grade: Automotive Qualification: AEC-Q100 |
на замовлення 1880 шт: термін постачання 21-31 дні (днів) |
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| 74LVC1G17GX/S500125 | NXP USA Inc. |
Description: BUFFER, LVC/LCX/Z SERIES |
на замовлення 330000 шт: термін постачання 21-31 дні (днів) |
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PSMN3R3-80ES,127 | NXP USA Inc. |
Description: ELEMENT, NCHANNEL, SILICON, MOSF Packaging: Tube Package / Case: TO-262-3 Long Leads, I2PAK, TO-262AA Mounting Type: Through Hole Operating Temperature: -55°C ~ 175°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 120A (Tc) Rds On (Max) @ Id, Vgs: 3.3mOhm @ 25A, 10V Power Dissipation (Max): 338W (Tc) Vgs(th) (Max) @ Id: 4V @ 1mA Supplier Device Package: I2PAK Part Status: Active Drive Voltage (Max Rds On, Min Rds On): 10V Vgs (Max): ±20V Drain to Source Voltage (Vdss): 80 V Gate Charge (Qg) (Max) @ Vgs: 139 nC @ 10 V Input Capacitance (Ciss) (Max) @ Vds: 9961 pF @ 40 V |
на замовлення 1415 шт: термін постачання 21-31 дні (днів) |
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MKV31F512VLH12R | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 64LQFP Packaging: Tape & Reel (TR) Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 512KB (512K x 8) RAM Size: 96K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 2x16b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I²C, SPI, UART/USART Peripherals: DMA, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 46 DigiKey Programmable: Not Verified |
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MCIMX6Y0DVM05AB557 | NXP USA Inc. |
Description: IC MPU I.MX6 528MHZ 289MAPBGA Packaging: Bulk Package / Case: 289-LFBGA Mounting Type: Surface Mount Speed: 528MHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: ARM® Cortex®-A7 Voltage - I/O: 1.8V, 2.8V, 3.3V Supplier Device Package: 289-MAPBGA (14x14) Ethernet: 10/100Mbps (1) USB: USB 2.0 OTG + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: Electrophoretic, LCD Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS Part Status: Active |
на замовлення 152 шт: термін постачання 21-31 дні (днів) |
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MCIMX6Y7DVM09AA | NXP USA Inc. |
Description: PROCESSORS - APPLICATION SPECIAL |
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MC9S08PB16MTJ | NXP USA Inc. |
Description: IC MCU 8BIT 16KB FLASH 20TSSOP |
на замовлення 478 шт: термін постачання 21-31 дні (днів) |
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TDA8296HN/C1,557 | NXP USA Inc. |
Description: RF DEMODULATOR IC 40HVQFN Packaging: Tray Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Function: Demodulator Voltage - Supply: 1.1V ~ 3.6V Supplier Device Package: 40-HVQFN (6x6) Part Status: Obsolete Current - Supply: 65 mA |
на замовлення 16251 шт: термін постачання 21-31 дні (днів) |
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TDA18252HN/C1,557 | NXP USA Inc. |
Description: IC VIDEO SILICON TUNER 48HVQFN Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Function: Tuner Voltage - Supply: 3.3V ~ 3.6V Applications: Consumer Video Supplier Device Package: 48-HVQFN (7x7) Part Status: Obsolete Control Interface: I2C |
на замовлення 37784 шт: термін постачання 21-31 дні (днів) |
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TDA19998HL/C1,557 | NXP USA Inc. |
Description: IC VIDEO HDMI 1.4 100LQFP Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Function: Switch Voltage - Supply: 1.65V ~ 1.95, 3.13V ~ 3.47V Applications: Video Display Standards: CEA-861-D, DVI 1.0, HDCP 1.4, HDMI 1.4a Supplier Device Package: 100-LQFP (14x14) Part Status: Obsolete Control Interface: I2C |
на замовлення 16183 шт: термін постачання 21-31 дні (днів) |
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TDA18257HN/C1557 | NXP USA Inc. |
Description: SI TUNER LOWCOST FOR DTMB IN CHI Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
на замовлення 63700 шт: термін постачання 21-31 дні (днів) |
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MPC850DEVR50BU | NXP USA Inc. |
Description: IC MPU MPC8XX 50MHZ 256BGA Packaging: Bulk Package / Case: 256-BBGA Mounting Type: Surface Mount Speed: 50MHz Operating Temperature: 0°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 256-PBGA (23x23) Ethernet: 10Mbps (1) USB: USB 1.x (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART |
на замовлення 50 шт: термін постачання 21-31 дні (днів) |
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MKV42F128VLH16 | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 64LQFP |
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| BUK7635-55A118 | NXP USA Inc. |
Description: NOW NEXPERIA BUK7635-55A 35A, 55 Packaging: Bulk |
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74HCT4002N,112 | NXP USA Inc. |
Description: IC GATE NOR 2CH 4-INP 14DIP Packaging: Tube Package / Case: 14-DIP (0.300", 7.62mm) Mounting Type: Through Hole Logic Type: NOR Gate Operating Temperature: -40°C ~ 125°C Voltage - Supply: 4.5V ~ 5.5V Current - Output High, Low: 4mA, 4mA Number of Inputs: 4 Supplier Device Package: 14-DIP Input Logic Level - High: 2V Input Logic Level - Low: 0.8V Max Propagation Delay @ V, Max CL: 22ns @ 4.5V, 50pF Number of Circuits: 2 Current - Quiescent (Max): 2 µA |
на замовлення 4659 шт: термін постачання 21-31 дні (днів) |
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MC9S08AW32CFUER | NXP USA Inc. |
Description: IC MCU 8BIT 32KB FLASH 64QFP Packaging: Bulk Package / Case: 64-QFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 32KB (32K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 16x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-QFP (14x14) Number of I/O: 54 DigiKey Programmable: Not Verified |
на замовлення 750 шт: термін постачання 21-31 дні (днів) |
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MC9S08AW32CPUE557 | NXP USA Inc. |
Description: MICROCONTROLLER, 8-BIT, HC08/S08 Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
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| BUK9Y41-80E/GFX | NXP USA Inc. | Description: MOSFET N-CH LFPAK |
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| BUK9Y43-60E/GFX | NXP USA Inc. | Description: MOSFET N-CH LFPAK |
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BUK9Y07-30B115 | NXP USA Inc. |
Description: NOW NEXPERIA BUK9Y07-30B - POWER |
на замовлення 6000 шт: термін постачання 21-31 дні (днів) |
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A3G26D055N-100 | NXP USA Inc. |
Description: RF MOSFET GAN 48V 6DFN Packaging: Bulk Package / Case: 6-LDFN Exposed Pad Mounting Type: Surface Mount Frequency: 100MHz ~ 2.69GHz Power - Output: 8W Gain: 13.9dB Technology: GaN Supplier Device Package: 6-PDFN (7x6.5) Part Status: Active Voltage - Rated: 125 V Voltage - Test: 48 V Current - Test: 40 mA |
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MIMXRT685SFFOB | NXP USA Inc. |
Description: IC MCU 32BIT EXT MEM 249FOWLP Packaging: Tray Package / Case: 249-WFBGA Mounting Type: Surface Mount Speed: 300MHz RAM Size: 4.5M x 8 Operating Temperature: -20°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: External Program Memory Core Processor: ARM® Cortex®-M33 Data Converters: A/D 12x12b SAR Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: EBI/EMI, I2C, MMC/SD/SDIO, SPDIF, SPI, UART/USART, USB2.0 OTG Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 249-FOWLP (7x7) Part Status: Active Number of I/O: 147 DigiKey Programmable: Not Verified |
на замовлення 851 шт: термін постачання 21-31 дні (днів) |
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LPC4076FET180,551 | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLSH 180TFBGA |
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| BC846B215 | NXP USA Inc. |
Description: 0.1A, 65V, NPN, TO 236AB Packaging: Bulk Part Status: Active |
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MKV30F128VLF10557 | NXP USA Inc. |
Description: KINETIS KV30: 100MHZ CORTEX-M4F |
товар відсутній |
| MCIMX537CVP8C2R2 |
Виробник: NXP USA Inc.
Description: IC MPU I.MX53 800MHZ 529FBGA
Packaging: Tape & Reel (TR)
Package / Case: 529-FBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Supplier Device Package: 529-FBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR2, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD, LVDS
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 1.5Gbps (1)
Part Status: Active
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
Description: IC MPU I.MX53 800MHZ 529FBGA
Packaging: Tape & Reel (TR)
Package / Case: 529-FBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Supplier Device Package: 529-FBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR2, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD, LVDS
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 1.5Gbps (1)
Part Status: Active
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
товар відсутній
| 74LVC573ADB,112 |
|
Виробник: NXP USA Inc.
Description: IC D-TYPE TRANSP SGL 8:8 20SSOP
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: Tri-State
Mounting Type: Surface Mount
Circuit: 8:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.2V ~ 3.6V
Independent Circuits: 1
Current - Output High, Low: 24mA, 24mA
Delay Time - Propagation: 1.5ns
Supplier Device Package: 20-SSOP
Description: IC D-TYPE TRANSP SGL 8:8 20SSOP
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: Tri-State
Mounting Type: Surface Mount
Circuit: 8:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.2V ~ 3.6V
Independent Circuits: 1
Current - Output High, Low: 24mA, 24mA
Delay Time - Propagation: 1.5ns
Supplier Device Package: 20-SSOP
на замовлення 85536 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1247+ | 16.79 грн |
| 74LVC573ABXX |
|
Виробник: NXP USA Inc.
Description: IC D-TYPE TRANSP SGL 8:8 20HXQFN
Packaging: Bulk
Package / Case: 20-XFQFN Exposed Pad
Output Type: Tri-State
Mounting Type: Surface Mount
Circuit: 8:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.2V ~ 3.6V
Independent Circuits: 1
Current - Output High, Low: 24mA, 24mA
Delay Time - Propagation: 1.5ns
Supplier Device Package: 20-DHXQFN (4.5x2.5)
Description: IC D-TYPE TRANSP SGL 8:8 20HXQFN
Packaging: Bulk
Package / Case: 20-XFQFN Exposed Pad
Output Type: Tri-State
Mounting Type: Surface Mount
Circuit: 8:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.2V ~ 3.6V
Independent Circuits: 1
Current - Output High, Low: 24mA, 24mA
Delay Time - Propagation: 1.5ns
Supplier Device Package: 20-DHXQFN (4.5x2.5)
на замовлення 261900 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1567+ | 13.29 грн |
| NX7002BKXB147 |
|
на замовлення 1459345 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 5495+ | 3.5 грн |
| NX7002BKS115 |
|
на замовлення 18000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 8242+ | 2.8 грн |
| 74AVC4T245PW-Q100118 |
|
Виробник: NXP USA Inc.
Description: IC TRANSLATION TXRX 3.6V 16TSSOP
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Translation Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 2
Current - Output High, Low: 12mA, 12mA
Supplier Device Package: 16-TSSOP
Part Status: Active
Description: IC TRANSLATION TXRX 3.6V 16TSSOP
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Translation Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 2
Current - Output High, Low: 12mA, 12mA
Supplier Device Package: 16-TSSOP
Part Status: Active
на замовлення 968 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 968+ | 27.4 грн |
| TEA2208T/1J |
|
Виробник: NXP USA Inc.
Description: BRIDGE RECTIFIER CONTROLLER S014
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0V ~ 440V
Applications: Desktop, Notebook PCs
Current - Supply: 2mA
Supplier Device Package: 14-SO
Description: BRIDGE RECTIFIER CONTROLLER S014
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0V ~ 440V
Applications: Desktop, Notebook PCs
Current - Supply: 2mA
Supplier Device Package: 14-SO
товар відсутній
| TEA2208T/1J |
|
Виробник: NXP USA Inc.
Description: BRIDGE RECTIFIER CONTROLLER S014
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0V ~ 440V
Applications: Desktop, Notebook PCs
Current - Supply: 2mA
Supplier Device Package: 14-SO
Description: BRIDGE RECTIFIER CONTROLLER S014
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0V ~ 440V
Applications: Desktop, Notebook PCs
Current - Supply: 2mA
Supplier Device Package: 14-SO
на замовлення 2735 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 459.22 грн |
| 10+ | 399.16 грн |
| 25+ | 380.63 грн |
| 100+ | 310.16 грн |
| 250+ | 296.21 грн |
| 500+ | 270.08 грн |
| 1000+ | 231.37 грн |
| 74AXP1G11GSH |
|
Виробник: NXP USA Inc.
Description: IC GATE AND 1CH 3-INP 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: AND Gate
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 0.7V ~ 2.75V
Current - Output High, Low: 8mA, 8mA
Number of Inputs: 3
Supplier Device Package: 6-XSON, SOT1202 (1x1)
Max Propagation Delay @ V, Max CL: 3.2ns @ 2.5V, 5pF
Part Status: Active
Number of Circuits: 1
Current - Quiescent (Max): 600 nA
Description: IC GATE AND 1CH 3-INP 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: AND Gate
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 0.7V ~ 2.75V
Current - Output High, Low: 8mA, 8mA
Number of Inputs: 3
Supplier Device Package: 6-XSON, SOT1202 (1x1)
Max Propagation Delay @ V, Max CL: 3.2ns @ 2.5V, 5pF
Part Status: Active
Number of Circuits: 1
Current - Quiescent (Max): 600 nA
на замовлення 10000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 3249+ | 6.4 грн |
| IP3348CX20,135 |
|
Виробник: NXP USA Inc.
Description: FILTER LC(PI) 15NH/25PF ESD SMD
Packaging: Bulk
Package / Case: 20-UFBGA, WLCSP
Size / Dimension: 0.124" L x 0.042" W (3.16mm x 1.06mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: L = 15nH (Total), C = 25pF (Total)
Height: 0.026" (0.65mm)
Attenuation Value: 40dB @ 1GHz ~ 3GHz
Filter Order: 3rd
Applications: Data Lines for Mobile Devices
Technology: LC (Pi)
Center / Cutoff Frequency: 350MHz (Cutoff)
Resistance - Channel (Ohms): 10
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 8
Current: 20 mA
Description: FILTER LC(PI) 15NH/25PF ESD SMD
Packaging: Bulk
Package / Case: 20-UFBGA, WLCSP
Size / Dimension: 0.124" L x 0.042" W (3.16mm x 1.06mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: L = 15nH (Total), C = 25pF (Total)
Height: 0.026" (0.65mm)
Attenuation Value: 40dB @ 1GHz ~ 3GHz
Filter Order: 3rd
Applications: Data Lines for Mobile Devices
Technology: LC (Pi)
Center / Cutoff Frequency: 350MHz (Cutoff)
Resistance - Channel (Ohms): 10
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 8
Current: 20 mA
на замовлення 4500 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2049+ | 10.68 грн |
| IP3088CX20,135 |
|
Виробник: NXP USA Inc.
Description: IP3088CX20 - CONSUMER CIRCUIT
Packaging: Bulk
Package / Case: 20-WFBGA, WLCSP
Size / Dimension: 0.156" L x 0.050" W (3.96mm x 1.28mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: L = 40nH (Total), C = 42pF (Total)
Height: 0.028" (0.70mm)
Attenuation Value: 40dB @ 800MHz ~ 1.5GHz
Filter Order: 5th
Applications: GSM, LAN, PCS, WAN
Technology: LC (Pi)
Center / Cutoff Frequency: 175MHz (Cutoff)
Resistance - Channel (Ohms): 18
ESD Protection: Yes
Part Status: Active
Number of Channels: 8
Current: 30 mA
Description: IP3088CX20 - CONSUMER CIRCUIT
Packaging: Bulk
Package / Case: 20-WFBGA, WLCSP
Size / Dimension: 0.156" L x 0.050" W (3.96mm x 1.28mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: L = 40nH (Total), C = 42pF (Total)
Height: 0.028" (0.70mm)
Attenuation Value: 40dB @ 800MHz ~ 1.5GHz
Filter Order: 5th
Applications: GSM, LAN, PCS, WAN
Technology: LC (Pi)
Center / Cutoff Frequency: 175MHz (Cutoff)
Resistance - Channel (Ohms): 18
ESD Protection: Yes
Part Status: Active
Number of Channels: 8
Current: 30 mA
на замовлення 19902 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 807+ | 25.71 грн |
| LPC1225FBD48/301EL |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 45MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 45MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
на замовлення 1240 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 524.61 грн |
| 10+ | 394.77 грн |
| 80+ | 323.47 грн |
| 500+ | 297.18 грн |
| 1000+ | 250.64 грн |
| LPC1225FBD48/301151 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Description: IC MCU 32BIT 64KB FLASH 48LQFP
товар відсутній
| LPC1225FBD48/321151 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 80KB FLASH 48LQFP
Description: IC MCU 32BIT 80KB FLASH 48LQFP
товар відсутній
| BLF7G10L-250,112 |
|
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 30V LDMOST
Packaging: Tube
Package / Case: SOT-502A
Frequency: 920MHz ~ 960MHz
Power - Output: 60W
Gain: 19.5dB
Technology: LDMOS
Supplier Device Package: LDMOST
Voltage - Rated: 65 V
Voltage - Test: 30 V
Current - Test: 1.8 A
Description: RF MOSFET LDMOS 30V LDMOST
Packaging: Tube
Package / Case: SOT-502A
Frequency: 920MHz ~ 960MHz
Power - Output: 60W
Gain: 19.5dB
Technology: LDMOS
Supplier Device Package: LDMOST
Voltage - Rated: 65 V
Voltage - Test: 30 V
Current - Test: 1.8 A
на замовлення 78 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 3+ | 7772.57 грн |
| BLF7G10LS-250,112 |
|
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 30V SOT502B
Packaging: Tube
Package / Case: SOT-502B
Current Rating (Amps): 5µA
Mounting Type: Chassis Mount
Frequency: 869MHz ~ 960MHz
Power - Output: 250W
Gain: 19.5dB
Technology: LDMOS
Supplier Device Package: SOT502B
Part Status: Active
Voltage - Rated: 65 V
Voltage - Test: 30 V
Current - Test: 1.8 A
Description: RF MOSFET LDMOS 30V SOT502B
Packaging: Tube
Package / Case: SOT-502B
Current Rating (Amps): 5µA
Mounting Type: Chassis Mount
Frequency: 869MHz ~ 960MHz
Power - Output: 250W
Gain: 19.5dB
Technology: LDMOS
Supplier Device Package: SOT502B
Part Status: Active
Voltage - Rated: 65 V
Voltage - Test: 30 V
Current - Test: 1.8 A
на замовлення 55 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 4+ | 6801.09 грн |
| BSC9131NXN7KHKB |
|
Виробник: NXP USA Inc.
Description: IC MPU QORIQ 800MHZ 520FCBGA
Packaging: Tray
Package / Case: 520-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 520-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SC3850, Security; SEC 4.4
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Random Number Generator
Part Status: Obsolete
Additional Interfaces: AIC, DUART, I2C, MMC/SD, SPI, USIM
Description: IC MPU QORIQ 800MHZ 520FCBGA
Packaging: Tray
Package / Case: 520-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 520-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SC3850, Security; SEC 4.4
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Random Number Generator
Part Status: Obsolete
Additional Interfaces: AIC, DUART, I2C, MMC/SD, SPI, USIM
товар відсутній
| SPC5606BF1MLQ6R |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 121
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 121
DigiKey Programmable: Not Verified
товар відсутній
| MC9S08QA4CFQER |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 8DFN
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-DFN-EP (4x4)
Number of I/O: 4
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 4KB FLASH 8DFN
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-DFN-EP (4x4)
Number of I/O: 4
DigiKey Programmable: Not Verified
товар відсутній
| MRF24301HR5 |
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS NI780
Packaging: Bulk
Package / Case: SOT-957A
Mounting Type: Chassis Mount
Frequency: 2.4GHz ~ 2.5GHz
Power - Output: 300W
Gain: 13.5dB
Technology: LDMOS
Supplier Device Package: NI-780H-2L
Description: RF MOSFET LDMOS NI780
Packaging: Bulk
Package / Case: SOT-957A
Mounting Type: Chassis Mount
Frequency: 2.4GHz ~ 2.5GHz
Power - Output: 300W
Gain: 13.5dB
Technology: LDMOS
Supplier Device Package: NI-780H-2L
на замовлення 123 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 4+ | 6845.95 грн |
| A7102CHUK/T0BC2VAZ |
|
Виробник: NXP USA Inc.
Description: SECURITY IC EXT TEMP WLCSP
Packaging: Cut Tape (CT)
Package / Case: 12-UFBGA, WLCSP
Mounting Type: Surface Mount
Interface: I2C
Operating Temperature: -40°C ~ 90°C (TA)
Voltage - Supply: 2.5V ~ 3.6V
Applications: Authentication
Core Processor: MX51
Supplier Device Package: 12-WLCSP (2.06x2.02)
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: SECURITY IC EXT TEMP WLCSP
Packaging: Cut Tape (CT)
Package / Case: 12-UFBGA, WLCSP
Mounting Type: Surface Mount
Interface: I2C
Operating Temperature: -40°C ~ 90°C (TA)
Voltage - Supply: 2.5V ~ 3.6V
Applications: Authentication
Core Processor: MX51
Supplier Device Package: 12-WLCSP (2.06x2.02)
Part Status: Obsolete
DigiKey Programmable: Not Verified
на замовлення 1721 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 257.74 грн |
| 10+ | 222.64 грн |
| 25+ | 210.45 грн |
| 100+ | 171.17 грн |
| 250+ | 162.4 грн |
| 500+ | 145.72 грн |
| 1000+ | 120.88 грн |
| A7102CHTK2/T0BC2CJ |
|
Виробник: NXP USA Inc.
Description: SECURITY IC EXT TEMP HVSON8
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: I2C
Operating Temperature: -40°C ~ 90°C (TA)
Voltage - Supply: 2.5V ~ 3.6V
Applications: Authentication
Core Processor: MX51
Supplier Device Package: 8-HVSON (4x4)
Part Status: Last Time Buy
DigiKey Programmable: Not Verified
Description: SECURITY IC EXT TEMP HVSON8
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: I2C
Operating Temperature: -40°C ~ 90°C (TA)
Voltage - Supply: 2.5V ~ 3.6V
Applications: Authentication
Core Processor: MX51
Supplier Device Package: 8-HVSON (4x4)
Part Status: Last Time Buy
DigiKey Programmable: Not Verified
на замовлення 4834 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 268.39 грн |
| 10+ | 232.24 грн |
| 25+ | 219.5 грн |
| 100+ | 178.52 грн |
| 250+ | 169.37 грн |
| 500+ | 151.97 грн |
| 1000+ | 126.07 грн |
| 2500+ | 119.76 грн |
| MIMXRT685SFAWBR |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 114WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 114-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 300MHz
RAM Size: 4.5M x 8
Operating Temperature: -20°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, MMC/SD/SDIO, SPDIF, SPI, UART/USART, USB2.0 OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 114-WLCSP (4.24x4.24)
Part Status: Active
Number of I/O: 65
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT EXT MEM 114WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 114-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 300MHz
RAM Size: 4.5M x 8
Operating Temperature: -20°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, MMC/SD/SDIO, SPDIF, SPI, UART/USART, USB2.0 OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 114-WLCSP (4.24x4.24)
Part Status: Active
Number of I/O: 65
DigiKey Programmable: Not Verified
товар відсутній
| MIMXRT685SFAWBR |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 114WLCSP
Packaging: Cut Tape (CT)
Package / Case: 114-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 300MHz
RAM Size: 4.5M x 8
Operating Temperature: -20°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, MMC/SD/SDIO, SPDIF, SPI, UART/USART, USB2.0 OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 114-WLCSP (4.24x4.24)
Part Status: Active
Number of I/O: 65
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT EXT MEM 114WLCSP
Packaging: Cut Tape (CT)
Package / Case: 114-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 300MHz
RAM Size: 4.5M x 8
Operating Temperature: -20°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, MMC/SD/SDIO, SPDIF, SPI, UART/USART, USB2.0 OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 114-WLCSP (4.24x4.24)
Part Status: Active
Number of I/O: 65
DigiKey Programmable: Not Verified
на замовлення 5787 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1554.82 грн |
| 10+ | 1196.83 грн |
| 100+ | 1010.75 грн |
| 500+ | 942.73 грн |
| BAT74S135 |
|
Виробник: NXP USA Inc.
Description: NOW NEXPERIA BAT74S - RECTIFIER
Packaging: Bulk
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 5 ns
Technology: Schottky
Diode Configuration: 2 Independent
Current - Average Rectified (Io) (per Diode): 200mA (DC)
Supplier Device Package: 6-TSSOP
Operating Temperature - Junction: 125°C (Max)
Voltage - DC Reverse (Vr) (Max): 30 V
Voltage - Forward (Vf) (Max) @ If: 800 mV @ 100 mA
Current - Reverse Leakage @ Vr: 2 µA @ 25 V
Description: NOW NEXPERIA BAT74S - RECTIFIER
Packaging: Bulk
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 5 ns
Technology: Schottky
Diode Configuration: 2 Independent
Current - Average Rectified (Io) (per Diode): 200mA (DC)
Supplier Device Package: 6-TSSOP
Operating Temperature - Junction: 125°C (Max)
Voltage - DC Reverse (Vr) (Max): 30 V
Voltage - Forward (Vf) (Max) @ If: 800 mV @ 100 mA
Current - Reverse Leakage @ Vr: 2 µA @ 25 V
товар відсутній
| BAT74V115 |
|
Виробник: NXP USA Inc.
Description: NOW NEXPERIA BAT74V - RECTIFIER
Description: NOW NEXPERIA BAT74V - RECTIFIER
на замовлення 11400 шт:
термін постачання 21-31 дні (днів)| S9S12GA128F0MLF |
|
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: 12V1
Data Converters: A/D 12x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: 12V1
Data Converters: A/D 12x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
товар відсутній
| TJA1441AT/0Z |
|
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 50 mV
Duplex: Half
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 50 mV
Duplex: Half
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
на замовлення 1880 шт:
термін постачання 21-31 дні (днів)| 74LVC1G17GX/S500125 |
|
Виробник: NXP USA Inc.
Description: BUFFER, LVC/LCX/Z SERIES
Description: BUFFER, LVC/LCX/Z SERIES
на замовлення 330000 шт:
термін постачання 21-31 дні (днів)| PSMN3R3-80ES,127 |
|
Виробник: NXP USA Inc.
Description: ELEMENT, NCHANNEL, SILICON, MOSF
Packaging: Tube
Package / Case: TO-262-3 Long Leads, I2PAK, TO-262AA
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 120A (Tc)
Rds On (Max) @ Id, Vgs: 3.3mOhm @ 25A, 10V
Power Dissipation (Max): 338W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: I2PAK
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 80 V
Gate Charge (Qg) (Max) @ Vgs: 139 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 9961 pF @ 40 V
Description: ELEMENT, NCHANNEL, SILICON, MOSF
Packaging: Tube
Package / Case: TO-262-3 Long Leads, I2PAK, TO-262AA
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 120A (Tc)
Rds On (Max) @ Id, Vgs: 3.3mOhm @ 25A, 10V
Power Dissipation (Max): 338W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: I2PAK
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 80 V
Gate Charge (Qg) (Max) @ Vgs: 139 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 9961 pF @ 40 V
на замовлення 1415 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 205+ | 104.22 грн |
| MKV31F512VLH12R |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 2x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 46
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 2x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 46
DigiKey Programmable: Not Verified
товар відсутній
| MCIMX6Y0DVM05AB557 |
|
Виробник: NXP USA Inc.
Description: IC MPU I.MX6 528MHZ 289MAPBGA
Packaging: Bulk
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.8V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Electrophoretic, LCD
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Part Status: Active
Description: IC MPU I.MX6 528MHZ 289MAPBGA
Packaging: Bulk
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.8V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Electrophoretic, LCD
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Part Status: Active
на замовлення 152 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 32+ | 689.4 грн |
| MC9S08PB16MTJ |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 20TSSOP
Description: IC MCU 8BIT 16KB FLASH 20TSSOP
на замовлення 478 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 220.49 грн |
| 10+ | 165.76 грн |
| 150+ | 133.22 грн |
| 450+ | 118.13 грн |
| TDA8296HN/C1,557 |
|
Виробник: NXP USA Inc.
Description: RF DEMODULATOR IC 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Demodulator
Voltage - Supply: 1.1V ~ 3.6V
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Obsolete
Current - Supply: 65 mA
Description: RF DEMODULATOR IC 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Demodulator
Voltage - Supply: 1.1V ~ 3.6V
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Obsolete
Current - Supply: 65 mA
на замовлення 16251 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 217+ | 97.84 грн |
| TDA18252HN/C1,557 |
|
Виробник: NXP USA Inc.
Description: IC VIDEO SILICON TUNER 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Tuner
Voltage - Supply: 3.3V ~ 3.6V
Applications: Consumer Video
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Obsolete
Control Interface: I2C
Description: IC VIDEO SILICON TUNER 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Tuner
Voltage - Supply: 3.3V ~ 3.6V
Applications: Consumer Video
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Obsolete
Control Interface: I2C
на замовлення 37784 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 204+ | 104.93 грн |
| TDA19998HL/C1,557 |
|
Виробник: NXP USA Inc.
Description: IC VIDEO HDMI 1.4 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Function: Switch
Voltage - Supply: 1.65V ~ 1.95, 3.13V ~ 3.47V
Applications: Video Display
Standards: CEA-861-D, DVI 1.0, HDCP 1.4, HDMI 1.4a
Supplier Device Package: 100-LQFP (14x14)
Part Status: Obsolete
Control Interface: I2C
Description: IC VIDEO HDMI 1.4 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Function: Switch
Voltage - Supply: 1.65V ~ 1.95, 3.13V ~ 3.47V
Applications: Video Display
Standards: CEA-861-D, DVI 1.0, HDCP 1.4, HDMI 1.4a
Supplier Device Package: 100-LQFP (14x14)
Part Status: Obsolete
Control Interface: I2C
на замовлення 16183 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 102+ | 209.86 грн |
| TDA18257HN/C1557 |
Виробник: NXP USA Inc.
Description: SI TUNER LOWCOST FOR DTMB IN CHI
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: SI TUNER LOWCOST FOR DTMB IN CHI
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 63700 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 357+ | 58.23 грн |
| MPC850DEVR50BU |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 256BGA
Packaging: Bulk
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART
Description: IC MPU MPC8XX 50MHZ 256BGA
Packaging: Bulk
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART
на замовлення 50 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 6+ | 3965.99 грн |
| BUK7635-55A118 |
|
товар відсутній
| 74HCT4002N,112 |
|
Виробник: NXP USA Inc.
Description: IC GATE NOR 2CH 4-INP 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: NOR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 4
Supplier Device Package: 14-DIP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 22ns @ 4.5V, 50pF
Number of Circuits: 2
Current - Quiescent (Max): 2 µA
Description: IC GATE NOR 2CH 4-INP 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: NOR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 4
Supplier Device Package: 14-DIP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 22ns @ 4.5V, 50pF
Number of Circuits: 2
Current - Quiescent (Max): 2 µA
на замовлення 4659 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 666+ | 32.03 грн |
| MC9S08AW32CFUER |
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 64QFP
Packaging: Bulk
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 54
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 32KB FLASH 64QFP
Packaging: Bulk
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 54
DigiKey Programmable: Not Verified
на замовлення 750 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 44+ | 488.63 грн |
| MC9S08AW32CPUE557 |
|
Виробник: NXP USA Inc.
Description: MICROCONTROLLER, 8-BIT, HC08/S08
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: MICROCONTROLLER, 8-BIT, HC08/S08
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
товар відсутній
| BUK9Y07-30B115 |
|
Виробник: NXP USA Inc.
Description: NOW NEXPERIA BUK9Y07-30B - POWER
Description: NOW NEXPERIA BUK9Y07-30B - POWER
на замовлення 6000 шт:
термін постачання 21-31 дні (днів)| A3G26D055N-100 |
|
Виробник: NXP USA Inc.
Description: RF MOSFET GAN 48V 6DFN
Packaging: Bulk
Package / Case: 6-LDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 100MHz ~ 2.69GHz
Power - Output: 8W
Gain: 13.9dB
Technology: GaN
Supplier Device Package: 6-PDFN (7x6.5)
Part Status: Active
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 40 mA
Description: RF MOSFET GAN 48V 6DFN
Packaging: Bulk
Package / Case: 6-LDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 100MHz ~ 2.69GHz
Power - Output: 8W
Gain: 13.9dB
Technology: GaN
Supplier Device Package: 6-PDFN (7x6.5)
Part Status: Active
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 40 mA
товар відсутній
| MIMXRT685SFFOB |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 249FOWLP
Packaging: Tray
Package / Case: 249-WFBGA
Mounting Type: Surface Mount
Speed: 300MHz
RAM Size: 4.5M x 8
Operating Temperature: -20°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, MMC/SD/SDIO, SPDIF, SPI, UART/USART, USB2.0 OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 249-FOWLP (7x7)
Part Status: Active
Number of I/O: 147
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT EXT MEM 249FOWLP
Packaging: Tray
Package / Case: 249-WFBGA
Mounting Type: Surface Mount
Speed: 300MHz
RAM Size: 4.5M x 8
Operating Temperature: -20°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, MMC/SD/SDIO, SPDIF, SPI, UART/USART, USB2.0 OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 249-FOWLP (7x7)
Part Status: Active
Number of I/O: 147
DigiKey Programmable: Not Verified
на замовлення 851 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1880.23 грн |
| 10+ | 1452.21 грн |
| 80+ | 1240.07 грн |
| 440+ | 1148.45 грн |
| LPC4076FET180,551 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 180TFBGA
Description: IC MCU 32BIT 256KB FLSH 180TFBGA
товар відсутній
| BC846B215 |
|
товар відсутній
| MKV30F128VLF10557 |
|
Виробник: NXP USA Inc.
Description: KINETIS KV30: 100MHZ CORTEX-M4F
Description: KINETIS KV30: 100MHZ CORTEX-M4F
товар відсутній