Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (35453) > Сторінка 418 з 591
| Фото | Назва | Виробник | Інформація |
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BLF7G10L-250,112 | NXP USA Inc. |
 Description: RF MOSFET LDMOS 30V LDMOSTPackaging: Tube Package / Case: SOT-502A Frequency: 920MHz ~ 960MHz Power - Output: 60W Gain: 19.5dB Technology: LDMOS Supplier Device Package: LDMOST Voltage - Rated: 65 V Voltage - Test: 30 V Current - Test: 1.8 A |
на замовлення 78 шт: термін постачання 21-31 дні (днів) |
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BLF7G10LS-250,112 | NXP USA Inc. |
Description: RF MOSFET LDMOS 30V SOT502B Packaging: Tube Package / Case: SOT-502B Current Rating (Amps): 5µA Mounting Type: Chassis Mount Frequency: 869MHz ~ 960MHz Power - Output: 250W Gain: 19.5dB Technology: LDMOS Supplier Device Package: SOT502B Part Status: Active Voltage - Rated: 65 V Voltage - Test: 30 V Current - Test: 1.8 A |
на замовлення 55 шт: термін постачання 21-31 дні (днів) |
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MC33FS4500LAER2 | NXP USA Inc. |
Description: SYSTEM BASIS CHIP LINEAR 0.5A V |
товар відсутній |
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| BSC9131NXN7KHKB | NXP USA Inc. |
Description: IC MPU QORIQ 800MHZ 520FCBGA Packaging: Tray Package / Case: 520-FBGA, FCBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: -40°C ~ 105°C Core Processor: PowerPC e500 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 520-FCBGA (21x21) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Signal Processing; SC3850, Security; SEC 4.4 RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Security Features: Boot Security, Cryptography, Random Number Generator Part Status: Obsolete Additional Interfaces: AIC, DUART, I2C, MMC/SD, SPI, USIM |
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| T1023NXE7PQA | NXP USA Inc. |
Description: QORIQ 2XCPU 64-BIT PWR ARCH 1. |
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SPC5606BF1MLQ6R | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 144LQFP Packaging: Tape & Reel (TR) Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 64MHz Program Memory Size: 1MB (1M x 8) RAM Size: 80K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0h Data Converters: A/D 15x10b, 5x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 121 DigiKey Programmable: Not Verified |
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MC9S08QA4CFQER | NXP USA Inc. |
Description: IC MCU 8BIT 4KB FLASH 8DFN Packaging: Tape & Reel (TR) Package / Case: 8-VDFN Exposed Pad Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 4KB (4K x 8) RAM Size: 256 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 4x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 8-DFN-EP (4x4) Number of I/O: 4 DigiKey Programmable: Not Verified |
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MRF24301HR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS NI780 Packaging: Bulk Package / Case: SOT-957A Mounting Type: Chassis Mount Frequency: 2.4GHz ~ 2.5GHz Power - Output: 300W Gain: 13.5dB Technology: LDMOS Supplier Device Package: NI-780H-2L |
на замовлення 123 шт: термін постачання 21-31 дні (днів) |
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A7102CHUK/T0BC2VAZ | NXP USA Inc. |
Description: SECURITY IC EXT TEMP WLCSP Packaging: Cut Tape (CT) Package / Case: 12-UFBGA, WLCSP Mounting Type: Surface Mount Interface: I2C Operating Temperature: -40°C ~ 90°C (TA) Voltage - Supply: 2.5V ~ 3.6V Applications: Authentication Core Processor: MX51 Supplier Device Package: 12-WLCSP (2.06x2.02) Part Status: Obsolete DigiKey Programmable: Not Verified |
на замовлення 1721 шт: термін постачання 21-31 дні (днів) |
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A7102CHTK2/T0BC2CJ | NXP USA Inc. |
Description: SECURITY IC EXT TEMP HVSON8 Packaging: Cut Tape (CT) Package / Case: 8-VDFN Exposed Pad Mounting Type: Surface Mount Interface: I2C Operating Temperature: -40°C ~ 90°C (TA) Voltage - Supply: 2.5V ~ 3.6V Applications: Authentication Core Processor: MX51 Supplier Device Package: 8-HVSON (4x4) Part Status: Last Time Buy DigiKey Programmable: Not Verified |
на замовлення 4834 шт: термін постачання 21-31 дні (днів) |
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| MIMXRT685SFAWBR | NXP USA Inc. |
Description: IC MCU 32BIT EXT MEM 114WLCSP Packaging: Tape & Reel (TR) Package / Case: 114-UFBGA, WLCSP Mounting Type: Surface Mount Speed: 300MHz RAM Size: 4.5M x 8 Operating Temperature: -20°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: External Program Memory Core Processor: ARM® Cortex®-M33 Data Converters: A/D 12x12b SAR Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: EBI/EMI, I2C, MMC/SD/SDIO, SPDIF, SPI, UART/USART, USB2.0 OTG Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 114-WLCSP (4.24x4.24) Part Status: Active Number of I/O: 65 DigiKey Programmable: Not Verified |
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| MIMXRT685SFAWBR | NXP USA Inc. |
Description: IC MCU 32BIT EXT MEM 114WLCSP Packaging: Cut Tape (CT) Package / Case: 114-UFBGA, WLCSP Mounting Type: Surface Mount Speed: 300MHz RAM Size: 4.5M x 8 Operating Temperature: -20°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: External Program Memory Core Processor: ARM® Cortex®-M33 Data Converters: A/D 12x12b SAR Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: EBI/EMI, I2C, MMC/SD/SDIO, SPDIF, SPI, UART/USART, USB2.0 OTG Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 114-WLCSP (4.24x4.24) Part Status: Active Number of I/O: 65 DigiKey Programmable: Not Verified |
на замовлення 5787 шт: термін постачання 21-31 дні (днів) |
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BAT74S135 | NXP USA Inc. |
Description: NOW NEXPERIA BAT74S - RECTIFIER Packaging: Bulk Package / Case: 6-TSSOP, SC-88, SOT-363 Mounting Type: Surface Mount Speed: Small Signal =< 200mA (Io), Any Speed Reverse Recovery Time (trr): 5 ns Technology: Schottky Diode Configuration: 2 Independent Current - Average Rectified (Io) (per Diode): 200mA (DC) Supplier Device Package: 6-TSSOP Operating Temperature - Junction: 125°C (Max) Voltage - DC Reverse (Vr) (Max): 30 V Voltage - Forward (Vf) (Max) @ If: 800 mV @ 100 mA Current - Reverse Leakage @ Vr: 2 µA @ 25 V |
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BAT74V115 | NXP USA Inc. |
Description: NOW NEXPERIA BAT74V - RECTIFIER |
на замовлення 11400 шт: термін постачання 21-31 дні (днів) |
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MCIMX233CJM4B | NXP USA Inc. |
Description: MICROPROCESSOR, CMOS, PBGA169 |
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S9S12GA128F0MLF | NXP USA Inc. |
Description: IC MCU 16BIT 128KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 128KB (128K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: 12V1 Data Converters: A/D 12x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 40 DigiKey Programmable: Not Verified |
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TJA1441AT/0Z | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 8SO Packaging: Tape & Reel (TR) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 4.5V ~ 5.5V Number of Drivers/Receivers: 1/1 Data Rate: 5Mbps Protocol: CANbus Supplier Device Package: 8-SO Receiver Hysteresis: 50 mV Duplex: Half Part Status: Active Grade: Automotive Qualification: AEC-Q100 |
на замовлення 1880 шт: термін постачання 21-31 дні (днів) |
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| 74LVC1G17GX/S500125 | NXP USA Inc. |
Description: BUFFER, LVC/LCX/Z SERIES |
на замовлення 330000 шт: термін постачання 21-31 дні (днів) |
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PSMN3R3-80ES,127 | NXP USA Inc. |
Description: ELEMENT, NCHANNEL, SILICON, MOSF Packaging: Tube Package / Case: TO-262-3 Long Leads, I2PAK, TO-262AA Mounting Type: Through Hole Operating Temperature: -55°C ~ 175°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 120A (Tc) Rds On (Max) @ Id, Vgs: 3.3mOhm @ 25A, 10V Power Dissipation (Max): 338W (Tc) Vgs(th) (Max) @ Id: 4V @ 1mA Supplier Device Package: I2PAK Part Status: Active Drive Voltage (Max Rds On, Min Rds On): 10V Vgs (Max): ±20V Drain to Source Voltage (Vdss): 80 V Gate Charge (Qg) (Max) @ Vgs: 139 nC @ 10 V Input Capacitance (Ciss) (Max) @ Vds: 9961 pF @ 40 V |
на замовлення 1415 шт: термін постачання 21-31 дні (днів) |
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MKV31F512VLH12R | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 64LQFP Packaging: Tape & Reel (TR) Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 512KB (512K x 8) RAM Size: 96K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 2x16b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I²C, SPI, UART/USART Peripherals: DMA, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 46 DigiKey Programmable: Not Verified |
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MCIMX6Y0DVM05AB557 | NXP USA Inc. |
Description: IC MPU I.MX6 528MHZ 289MAPBGA Packaging: Bulk Package / Case: 289-LFBGA Mounting Type: Surface Mount Speed: 528MHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: ARM® Cortex®-A7 Voltage - I/O: 1.8V, 2.8V, 3.3V Supplier Device Package: 289-MAPBGA (14x14) Ethernet: 10/100Mbps (1) USB: USB 2.0 OTG + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: Electrophoretic, LCD Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS Part Status: Active |
на замовлення 152 шт: термін постачання 21-31 дні (днів) |
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MCIMX6Y7DVM09AA | NXP USA Inc. |
Description: PROCESSORS - APPLICATION SPECIAL |
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MC9S08PB16MTJ | NXP USA Inc. |
Description: IC MCU 8BIT 16KB FLASH 20TSSOP |
на замовлення 478 шт: термін постачання 21-31 дні (днів) |
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TDA8296HN/C1,557 | NXP USA Inc. |
Description: RF DEMODULATOR IC 40HVQFN Packaging: Tray Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Function: Demodulator Voltage - Supply: 1.1V ~ 3.6V Supplier Device Package: 40-HVQFN (6x6) Part Status: Obsolete Current - Supply: 65 mA |
на замовлення 14670 шт: термін постачання 21-31 дні (днів) |
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TDA18252HN/C1,557 | NXP USA Inc. |
Description: IC VIDEO SILICON TUNER 48HVQFN Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Function: Tuner Voltage - Supply: 3.3V ~ 3.6V Applications: Consumer Video Supplier Device Package: 48-HVQFN (7x7) Part Status: Obsolete Control Interface: I2C |
на замовлення 37784 шт: термін постачання 21-31 дні (днів) |
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TDA19998HL/C1,557 | NXP USA Inc. |
Description: IC VIDEO HDMI 1.4 100LQFP Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Function: Switch Voltage - Supply: 1.65V ~ 1.95, 3.13V ~ 3.47V Applications: Video Display Standards: CEA-861-D, DVI 1.0, HDCP 1.4, HDMI 1.4a Supplier Device Package: 100-LQFP (14x14) Part Status: Obsolete Control Interface: I2C |
на замовлення 16183 шт: термін постачання 21-31 дні (днів) |
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TDA18257HN/C1557 | NXP USA Inc. |
Description: SI TUNER LOWCOST FOR DTMB IN CHI Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
на замовлення 63700 шт: термін постачання 21-31 дні (днів) |
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MPC850DEVR50BU | NXP USA Inc. |
Description: IC MPU MPC8XX 50MHZ 256BGA Packaging: Bulk Package / Case: 256-BBGA Mounting Type: Surface Mount Speed: 50MHz Operating Temperature: 0°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 256-PBGA (23x23) Ethernet: 10Mbps (1) USB: USB 1.x (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART |
на замовлення 50 шт: термін постачання 21-31 дні (днів) |
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MKV42F128VLH16 | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 64LQFP |
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| BUK7635-55A118 | NXP USA Inc. |
Description: NOW NEXPERIA BUK7635-55A 35A, 55 Packaging: Bulk |
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74HCT4002N,112 | NXP USA Inc. |
Description: IC GATE NOR 2CH 4-INP 14DIP Packaging: Tube Package / Case: 14-DIP (0.300", 7.62mm) Mounting Type: Through Hole Logic Type: NOR Gate Operating Temperature: -40°C ~ 125°C Voltage - Supply: 4.5V ~ 5.5V Current - Output High, Low: 4mA, 4mA Number of Inputs: 4 Supplier Device Package: 14-DIP Input Logic Level - High: 2V Input Logic Level - Low: 0.8V Max Propagation Delay @ V, Max CL: 22ns @ 4.5V, 50pF Number of Circuits: 2 Current - Quiescent (Max): 2 µA |
на замовлення 4659 шт: термін постачання 21-31 дні (днів) |
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MC9S08AW32CFUER | NXP USA Inc. |
Description: IC MCU 8BIT 32KB FLASH 64QFP Packaging: Bulk Package / Case: 64-QFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 32KB (32K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 16x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-QFP (14x14) Number of I/O: 54 DigiKey Programmable: Not Verified |
на замовлення 750 шт: термін постачання 21-31 дні (днів) |
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MC9S08AW32CPUE557 | NXP USA Inc. |
Description: MICROCONTROLLER, 8-BIT, HC08/S08 Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
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| BUK9Y41-80E/GFX | NXP USA Inc. | Description: MOSFET N-CH LFPAK |
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| BUK9Y43-60E/GFX | NXP USA Inc. | Description: MOSFET N-CH LFPAK |
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BUK9Y07-30B115 | NXP USA Inc. |
Description: NOW NEXPERIA BUK9Y07-30B - POWER |
на замовлення 6000 шт: термін постачання 21-31 дні (днів) |
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A3G26D055N-100 | NXP USA Inc. |
Description: RF MOSFET GAN 48V 6DFN Packaging: Bulk Package / Case: 6-LDFN Exposed Pad Mounting Type: Surface Mount Frequency: 100MHz ~ 2.69GHz Power - Output: 8W Gain: 13.9dB Technology: GaN Supplier Device Package: 6-PDFN (7x6.5) Part Status: Active Voltage - Rated: 125 V Voltage - Test: 48 V Current - Test: 40 mA |
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MIMXRT685SFFOB | NXP USA Inc. |
Description: IC MCU 32BIT EXT MEM 249FOWLP Packaging: Tray Package / Case: 249-WFBGA Mounting Type: Surface Mount Speed: 300MHz RAM Size: 4.5M x 8 Operating Temperature: -20°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: External Program Memory Core Processor: ARM® Cortex®-M33 Data Converters: A/D 12x12b SAR Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: EBI/EMI, I2C, MMC/SD/SDIO, SPDIF, SPI, UART/USART, USB2.0 OTG Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 249-FOWLP (7x7) Part Status: Active Number of I/O: 147 DigiKey Programmable: Not Verified |
на замовлення 821 шт: термін постачання 21-31 дні (днів) |
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LPC4076FET180,551 | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLSH 180TFBGA |
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| BC846B215 | NXP USA Inc. |
Description: 0.1A, 65V, NPN, TO 236AB Packaging: Bulk Part Status: Active |
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MKV30F128VLF10557 | NXP USA Inc. |
Description: KINETIS KV30: 100MHZ CORTEX-M4F |
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| NT3H1201W0FHK125 | NXP USA Inc. |
Description: NTAG I2C 1K - ENERGY HARVESTING Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
на замовлення 3400 шт: термін постачання 21-31 дні (днів) |
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| SL3S4021FHK125 | NXP USA Inc. |
Description: UCODE I2C UHF RFID Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
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| NT3H1101W0FHK125 | NXP USA Inc. |
Description: NTAG I2C 1K - ENERGY HARVESTING Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
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MCF51JF64VHS | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 64KB (64K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: Coldfire V1 Data Converters: A/D 9x12b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: EBI/EMI, I2C, SPI, UART/USART, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 31 DigiKey Programmable: Not Verified |
на замовлення 490 шт: термін постачання 21-31 дні (днів) |
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| SAF4000EL/101S233Y | NXP USA Inc. |
Description: SOFTWARE DEFINED RADIO Packaging: Tape & Reel (TR) Part Status: Active |
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| SAF4000EL/101S233K | NXP USA Inc. |
Description: SOFTWARE DEFINED RADIO Packaging: Tray Part Status: Active |
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MK66FN2M0VLQ18R,528 | NXP USA Inc. |
Description: KINETIS K66, RISC MICROCONTROLLE |
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CBTU02044HEJ | NXP USA Inc. |
Description: SWITCH 1-2 PCIE GEN4 HUQFN16 Packaging: Tape & Reel (TR) Package / Case: 16-UFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Applications: PCIe On-State Resistance (Max): 14Ohm -3db Bandwidth: 17GHz Supplier Device Package: 16-HUQFN (1.6x2.4) Voltage - Supply, Single (V+): 1.62V ~ 3.63V Switch Circuit: SPDT Multiplexer/Demultiplexer Circuit: 1:2 Part Status: Active Number of Channels: 2 |
на замовлення 20000 шт: термін постачання 21-31 дні (днів) |
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CBTU02044HEJ | NXP USA Inc. |
Description: SWITCH 1-2 PCIE GEN4 HUQFN16 Packaging: Cut Tape (CT) Package / Case: 16-UFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Applications: PCIe On-State Resistance (Max): 14Ohm -3db Bandwidth: 17GHz Supplier Device Package: 16-HUQFN (1.6x2.4) Voltage - Supply, Single (V+): 1.62V ~ 3.63V Switch Circuit: SPDT Multiplexer/Demultiplexer Circuit: 1:2 Part Status: Active Number of Channels: 2 |
на замовлення 36866 шт: термін постачання 21-31 дні (днів) |
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LPC1311FHN33 | NXP USA Inc. |
Description: IC MCU 32BIT 8KB FLASH 32HVQFN |
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LPC1313FHN33/01551 | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 32HVQFN |
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| LPC1313FBD48/01 | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 48LQFP |
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| AFT09MS031NR1528 | NXP USA Inc. |
Description: RF POWER LDMOS TRANSISTOR |
на замовлення 1139 шт: термін постачання 21-31 дні (днів) |
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BTA330-800BT127 | NXP USA Inc. |
Description: 3 QUADRANT TRIAC TO 220AB Packaging: Bulk Part Status: Active |
на замовлення 3891 шт: термін постачання 21-31 дні (днів) |
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LPC1111FDH20/002518 | NXP USA Inc. |
Description: IC MCU 32BIT 8KB FLASH 20TSSOP |
товар відсутній |
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BAV99QA147 | NXP USA Inc. |
Description: RECTIFIER DIODE Packaging: Bulk Package / Case: 3-XDFN Exposed Pad Mounting Type: Surface Mount Speed: Small Signal =< 200mA (Io), Any Speed Reverse Recovery Time (trr): 4 ns Technology: Standard Diode Configuration: 1 Pair Series Connection Current - Average Rectified (Io) (per Diode): 170mA (DC) Supplier Device Package: DFN1010D-3 Operating Temperature - Junction: 150°C (Max) Part Status: Active Voltage - DC Reverse (Vr) (Max): 90 V Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 150 mA Current - Reverse Leakage @ Vr: 500 nA @ 80 V |
товар відсутній |
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LD6806CX4/20P,315 | NXP USA Inc. |
Description: IC REG LINEAR 2V 200MA 4WLCSP Packaging: Bulk Package / Case: 4-XFBGA, WLCSP Output Type: Fixed Mounting Type: Surface Mount Current - Output: 200mA Operating Temperature: -40°C ~ 85°C Output Configuration: Positive Current - Quiescent (Iq): 100 µA Voltage - Input (Max): 5.5V Number of Regulators: 1 Supplier Device Package: 4-WLCSP (0.76x0.76) Voltage - Output (Min/Fixed): 2V Control Features: Enable PSRR: 55dB (1kHz) Voltage Dropout (Max): 0.1V @ 200mA Protection Features: Over Current, Over Temperature Current - Supply (Max): 250 µA |
на замовлення 27000 шт: термін постачання 21-31 дні (днів) |
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LD6816CX4/20P,315 | NXP USA Inc. |
Description: IC REG LINEAR 2V 150MA 4WLCSP |
на замовлення 27000 шт: термін постачання 21-31 дні (днів) |
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LD6836CX4/20P,315 | NXP USA Inc. |
Description: IC REG LINEAR 2V 300MA 4WLCSP Packaging: Bulk Package / Case: 4-XFBGA, WLCSP Output Type: Fixed Mounting Type: Surface Mount Current - Output: 300mA Operating Temperature: -40°C ~ 85°C Output Configuration: Positive Current - Quiescent (Iq): 100 µA Voltage - Input (Max): 5.5V Number of Regulators: 1 Supplier Device Package: 4-WLCSP (0.76x0.76) Voltage - Output (Min/Fixed): 2V Control Features: Enable Part Status: Obsolete PSRR: 55dB (1kHz) Voltage Dropout (Max): 0.16V @ 300mA Protection Features: Over Current, Over Temperature Current - Supply (Max): 250 µA |
на замовлення 18000 шт: термін постачання 21-31 дні (днів) |
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| BLF7G10L-250,112 |
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Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 30V LDMOST
Packaging: Tube
Package / Case: SOT-502A
Frequency: 920MHz ~ 960MHz
Power - Output: 60W
Gain: 19.5dB
Technology: LDMOS
Supplier Device Package: LDMOST
Voltage - Rated: 65 V
Voltage - Test: 30 V
Current - Test: 1.8 A
Description: RF MOSFET LDMOS 30V LDMOST
Packaging: Tube
Package / Case: SOT-502A
Frequency: 920MHz ~ 960MHz
Power - Output: 60W
Gain: 19.5dB
Technology: LDMOS
Supplier Device Package: LDMOST
Voltage - Rated: 65 V
Voltage - Test: 30 V
Current - Test: 1.8 A
на замовлення 78 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 3+ | 7954.77 грн |
| BLF7G10LS-250,112 |
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Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 30V SOT502B
Packaging: Tube
Package / Case: SOT-502B
Current Rating (Amps): 5µA
Mounting Type: Chassis Mount
Frequency: 869MHz ~ 960MHz
Power - Output: 250W
Gain: 19.5dB
Technology: LDMOS
Supplier Device Package: SOT502B
Part Status: Active
Voltage - Rated: 65 V
Voltage - Test: 30 V
Current - Test: 1.8 A
Description: RF MOSFET LDMOS 30V SOT502B
Packaging: Tube
Package / Case: SOT-502B
Current Rating (Amps): 5µA
Mounting Type: Chassis Mount
Frequency: 869MHz ~ 960MHz
Power - Output: 250W
Gain: 19.5dB
Technology: LDMOS
Supplier Device Package: SOT502B
Part Status: Active
Voltage - Rated: 65 V
Voltage - Test: 30 V
Current - Test: 1.8 A
на замовлення 55 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 4+ | 6960.52 грн |
| BSC9131NXN7KHKB |
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Виробник: NXP USA Inc.
Description: IC MPU QORIQ 800MHZ 520FCBGA
Packaging: Tray
Package / Case: 520-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 520-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SC3850, Security; SEC 4.4
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Random Number Generator
Part Status: Obsolete
Additional Interfaces: AIC, DUART, I2C, MMC/SD, SPI, USIM
Description: IC MPU QORIQ 800MHZ 520FCBGA
Packaging: Tray
Package / Case: 520-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 520-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SC3850, Security; SEC 4.4
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Random Number Generator
Part Status: Obsolete
Additional Interfaces: AIC, DUART, I2C, MMC/SD, SPI, USIM
товар відсутній
| SPC5606BF1MLQ6R |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 121
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 121
DigiKey Programmable: Not Verified
товар відсутній
| MC9S08QA4CFQER |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 8DFN
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-DFN-EP (4x4)
Number of I/O: 4
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 4KB FLASH 8DFN
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-DFN-EP (4x4)
Number of I/O: 4
DigiKey Programmable: Not Verified
товар відсутній
| MRF24301HR5 |
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS NI780
Packaging: Bulk
Package / Case: SOT-957A
Mounting Type: Chassis Mount
Frequency: 2.4GHz ~ 2.5GHz
Power - Output: 300W
Gain: 13.5dB
Technology: LDMOS
Supplier Device Package: NI-780H-2L
Description: RF MOSFET LDMOS NI780
Packaging: Bulk
Package / Case: SOT-957A
Mounting Type: Chassis Mount
Frequency: 2.4GHz ~ 2.5GHz
Power - Output: 300W
Gain: 13.5dB
Technology: LDMOS
Supplier Device Package: NI-780H-2L
на замовлення 123 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 4+ | 6748.68 грн |
| A7102CHUK/T0BC2VAZ |
|
Виробник: NXP USA Inc.
Description: SECURITY IC EXT TEMP WLCSP
Packaging: Cut Tape (CT)
Package / Case: 12-UFBGA, WLCSP
Mounting Type: Surface Mount
Interface: I2C
Operating Temperature: -40°C ~ 90°C (TA)
Voltage - Supply: 2.5V ~ 3.6V
Applications: Authentication
Core Processor: MX51
Supplier Device Package: 12-WLCSP (2.06x2.02)
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: SECURITY IC EXT TEMP WLCSP
Packaging: Cut Tape (CT)
Package / Case: 12-UFBGA, WLCSP
Mounting Type: Surface Mount
Interface: I2C
Operating Temperature: -40°C ~ 90°C (TA)
Voltage - Supply: 2.5V ~ 3.6V
Applications: Authentication
Core Processor: MX51
Supplier Device Package: 12-WLCSP (2.06x2.02)
Part Status: Obsolete
DigiKey Programmable: Not Verified
на замовлення 1721 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 263.78 грн |
| 10+ | 227.86 грн |
| 25+ | 215.38 грн |
| 100+ | 175.19 грн |
| 250+ | 166.2 грн |
| 500+ | 149.13 грн |
| 1000+ | 123.71 грн |
| A7102CHTK2/T0BC2CJ |
|
Виробник: NXP USA Inc.
Description: SECURITY IC EXT TEMP HVSON8
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: I2C
Operating Temperature: -40°C ~ 90°C (TA)
Voltage - Supply: 2.5V ~ 3.6V
Applications: Authentication
Core Processor: MX51
Supplier Device Package: 8-HVSON (4x4)
Part Status: Last Time Buy
DigiKey Programmable: Not Verified
Description: SECURITY IC EXT TEMP HVSON8
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: I2C
Operating Temperature: -40°C ~ 90°C (TA)
Voltage - Supply: 2.5V ~ 3.6V
Applications: Authentication
Core Processor: MX51
Supplier Device Package: 8-HVSON (4x4)
Part Status: Last Time Buy
DigiKey Programmable: Not Verified
на замовлення 4834 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 274.68 грн |
| 10+ | 237.68 грн |
| 25+ | 224.64 грн |
| 100+ | 182.7 грн |
| 250+ | 173.34 грн |
| 500+ | 155.53 грн |
| 1000+ | 129.02 грн |
| 2500+ | 122.57 грн |
| MIMXRT685SFAWBR |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 114WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 114-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 300MHz
RAM Size: 4.5M x 8
Operating Temperature: -20°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, MMC/SD/SDIO, SPDIF, SPI, UART/USART, USB2.0 OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 114-WLCSP (4.24x4.24)
Part Status: Active
Number of I/O: 65
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT EXT MEM 114WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 114-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 300MHz
RAM Size: 4.5M x 8
Operating Temperature: -20°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, MMC/SD/SDIO, SPDIF, SPI, UART/USART, USB2.0 OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 114-WLCSP (4.24x4.24)
Part Status: Active
Number of I/O: 65
DigiKey Programmable: Not Verified
товар відсутній
| MIMXRT685SFAWBR |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 114WLCSP
Packaging: Cut Tape (CT)
Package / Case: 114-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 300MHz
RAM Size: 4.5M x 8
Operating Temperature: -20°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, MMC/SD/SDIO, SPDIF, SPI, UART/USART, USB2.0 OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 114-WLCSP (4.24x4.24)
Part Status: Active
Number of I/O: 65
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT EXT MEM 114WLCSP
Packaging: Cut Tape (CT)
Package / Case: 114-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 300MHz
RAM Size: 4.5M x 8
Operating Temperature: -20°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, MMC/SD/SDIO, SPDIF, SPI, UART/USART, USB2.0 OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 114-WLCSP (4.24x4.24)
Part Status: Active
Number of I/O: 65
DigiKey Programmable: Not Verified
на замовлення 5787 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1494.78 грн |
| 10+ | 1051.13 грн |
| 25+ | 951.38 грн |
| 100+ | 788.37 грн |
| 250+ | 737.85 грн |
| 500+ | 719.63 грн |
| BAT74S135 |
|
Виробник: NXP USA Inc.
Description: NOW NEXPERIA BAT74S - RECTIFIER
Packaging: Bulk
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 5 ns
Technology: Schottky
Diode Configuration: 2 Independent
Current - Average Rectified (Io) (per Diode): 200mA (DC)
Supplier Device Package: 6-TSSOP
Operating Temperature - Junction: 125°C (Max)
Voltage - DC Reverse (Vr) (Max): 30 V
Voltage - Forward (Vf) (Max) @ If: 800 mV @ 100 mA
Current - Reverse Leakage @ Vr: 2 µA @ 25 V
Description: NOW NEXPERIA BAT74S - RECTIFIER
Packaging: Bulk
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 5 ns
Technology: Schottky
Diode Configuration: 2 Independent
Current - Average Rectified (Io) (per Diode): 200mA (DC)
Supplier Device Package: 6-TSSOP
Operating Temperature - Junction: 125°C (Max)
Voltage - DC Reverse (Vr) (Max): 30 V
Voltage - Forward (Vf) (Max) @ If: 800 mV @ 100 mA
Current - Reverse Leakage @ Vr: 2 µA @ 25 V
товар відсутній
| BAT74V115 |
|
Виробник: NXP USA Inc.
Description: NOW NEXPERIA BAT74V - RECTIFIER
Description: NOW NEXPERIA BAT74V - RECTIFIER
на замовлення 11400 шт:
термін постачання 21-31 дні (днів)| S9S12GA128F0MLF |
|
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: 12V1
Data Converters: A/D 12x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: 12V1
Data Converters: A/D 12x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
товар відсутній
| TJA1441AT/0Z |
|
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 50 mV
Duplex: Half
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 50 mV
Duplex: Half
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
на замовлення 1880 шт:
термін постачання 21-31 дні (днів)| 74LVC1G17GX/S500125 |
|
Виробник: NXP USA Inc.
Description: BUFFER, LVC/LCX/Z SERIES
Description: BUFFER, LVC/LCX/Z SERIES
на замовлення 330000 шт:
термін постачання 21-31 дні (днів)| PSMN3R3-80ES,127 |
|
Виробник: NXP USA Inc.
Description: ELEMENT, NCHANNEL, SILICON, MOSF
Packaging: Tube
Package / Case: TO-262-3 Long Leads, I2PAK, TO-262AA
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 120A (Tc)
Rds On (Max) @ Id, Vgs: 3.3mOhm @ 25A, 10V
Power Dissipation (Max): 338W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: I2PAK
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 80 V
Gate Charge (Qg) (Max) @ Vgs: 139 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 9961 pF @ 40 V
Description: ELEMENT, NCHANNEL, SILICON, MOSF
Packaging: Tube
Package / Case: TO-262-3 Long Leads, I2PAK, TO-262AA
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 120A (Tc)
Rds On (Max) @ Id, Vgs: 3.3mOhm @ 25A, 10V
Power Dissipation (Max): 338W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: I2PAK
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 80 V
Gate Charge (Qg) (Max) @ Vgs: 139 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 9961 pF @ 40 V
на замовлення 1415 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 205+ | 106.66 грн |
| MKV31F512VLH12R |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 2x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 46
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 2x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 46
DigiKey Programmable: Not Verified
товар відсутній
| MCIMX6Y0DVM05AB557 |
|
Виробник: NXP USA Inc.
Description: IC MPU I.MX6 528MHZ 289MAPBGA
Packaging: Bulk
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.8V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Electrophoretic, LCD
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Part Status: Active
Description: IC MPU I.MX6 528MHZ 289MAPBGA
Packaging: Bulk
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.8V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Electrophoretic, LCD
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Part Status: Active
на замовлення 152 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 32+ | 705.56 грн |
| MC9S08PB16MTJ |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 20TSSOP
Description: IC MCU 8BIT 16KB FLASH 20TSSOP
на замовлення 478 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 225.66 грн |
| 10+ | 169.64 грн |
| 150+ | 136.34 грн |
| 450+ | 120.89 грн |
| TDA8296HN/C1,557 |
|
Виробник: NXP USA Inc.
Description: RF DEMODULATOR IC 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Demodulator
Voltage - Supply: 1.1V ~ 3.6V
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Obsolete
Current - Supply: 65 mA
Description: RF DEMODULATOR IC 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Demodulator
Voltage - Supply: 1.1V ~ 3.6V
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Obsolete
Current - Supply: 65 mA
на замовлення 14670 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 239+ | 88.06 грн |
| TDA18252HN/C1,557 |
|
Виробник: NXP USA Inc.
Description: IC VIDEO SILICON TUNER 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Tuner
Voltage - Supply: 3.3V ~ 3.6V
Applications: Consumer Video
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Obsolete
Control Interface: I2C
Description: IC VIDEO SILICON TUNER 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Tuner
Voltage - Supply: 3.3V ~ 3.6V
Applications: Consumer Video
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Obsolete
Control Interface: I2C
на замовлення 37784 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 204+ | 107.39 грн |
| TDA19998HL/C1,557 |
|
Виробник: NXP USA Inc.
Description: IC VIDEO HDMI 1.4 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Function: Switch
Voltage - Supply: 1.65V ~ 1.95, 3.13V ~ 3.47V
Applications: Video Display
Standards: CEA-861-D, DVI 1.0, HDCP 1.4, HDMI 1.4a
Supplier Device Package: 100-LQFP (14x14)
Part Status: Obsolete
Control Interface: I2C
Description: IC VIDEO HDMI 1.4 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Function: Switch
Voltage - Supply: 1.65V ~ 1.95, 3.13V ~ 3.47V
Applications: Video Display
Standards: CEA-861-D, DVI 1.0, HDCP 1.4, HDMI 1.4a
Supplier Device Package: 100-LQFP (14x14)
Part Status: Obsolete
Control Interface: I2C
на замовлення 16183 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 102+ | 214.78 грн |
| TDA18257HN/C1557 |
Виробник: NXP USA Inc.
Description: SI TUNER LOWCOST FOR DTMB IN CHI
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: SI TUNER LOWCOST FOR DTMB IN CHI
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 63700 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 357+ | 59.59 грн |
| MPC850DEVR50BU |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 256BGA
Packaging: Bulk
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART
Description: IC MPU MPC8XX 50MHZ 256BGA
Packaging: Bulk
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART
на замовлення 50 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 6+ | 4058.96 грн |
| BUK7635-55A118 |
|
товар відсутній
| 74HCT4002N,112 |
|
Виробник: NXP USA Inc.
Description: IC GATE NOR 2CH 4-INP 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: NOR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 4
Supplier Device Package: 14-DIP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 22ns @ 4.5V, 50pF
Number of Circuits: 2
Current - Quiescent (Max): 2 µA
Description: IC GATE NOR 2CH 4-INP 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: NOR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 4
Supplier Device Package: 14-DIP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 22ns @ 4.5V, 50pF
Number of Circuits: 2
Current - Quiescent (Max): 2 µA
на замовлення 4659 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 666+ | 32.79 грн |
| MC9S08AW32CFUER |
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 64QFP
Packaging: Bulk
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 54
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 32KB FLASH 64QFP
Packaging: Bulk
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 54
DigiKey Programmable: Not Verified
на замовлення 750 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 44+ | 500.09 грн |
| MC9S08AW32CPUE557 |
|
Виробник: NXP USA Inc.
Description: MICROCONTROLLER, 8-BIT, HC08/S08
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: MICROCONTROLLER, 8-BIT, HC08/S08
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
товар відсутній
| BUK9Y07-30B115 |
|
Виробник: NXP USA Inc.
Description: NOW NEXPERIA BUK9Y07-30B - POWER
Description: NOW NEXPERIA BUK9Y07-30B - POWER
на замовлення 6000 шт:
термін постачання 21-31 дні (днів)| A3G26D055N-100 |
|
Виробник: NXP USA Inc.
Description: RF MOSFET GAN 48V 6DFN
Packaging: Bulk
Package / Case: 6-LDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 100MHz ~ 2.69GHz
Power - Output: 8W
Gain: 13.9dB
Technology: GaN
Supplier Device Package: 6-PDFN (7x6.5)
Part Status: Active
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 40 mA
Description: RF MOSFET GAN 48V 6DFN
Packaging: Bulk
Package / Case: 6-LDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 100MHz ~ 2.69GHz
Power - Output: 8W
Gain: 13.9dB
Technology: GaN
Supplier Device Package: 6-PDFN (7x6.5)
Part Status: Active
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 40 mA
товар відсутній
| MIMXRT685SFFOB |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 249FOWLP
Packaging: Tray
Package / Case: 249-WFBGA
Mounting Type: Surface Mount
Speed: 300MHz
RAM Size: 4.5M x 8
Operating Temperature: -20°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, MMC/SD/SDIO, SPDIF, SPI, UART/USART, USB2.0 OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 249-FOWLP (7x7)
Part Status: Active
Number of I/O: 147
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT EXT MEM 249FOWLP
Packaging: Tray
Package / Case: 249-WFBGA
Mounting Type: Surface Mount
Speed: 300MHz
RAM Size: 4.5M x 8
Operating Temperature: -20°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, MMC/SD/SDIO, SPDIF, SPI, UART/USART, USB2.0 OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 249-FOWLP (7x7)
Part Status: Active
Number of I/O: 147
DigiKey Programmable: Not Verified
на замовлення 821 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1861.28 грн |
| 10+ | 1327.24 грн |
| 25+ | 1208.06 грн |
| 80+ | 1026.09 грн |
| 230+ | 953.59 грн |
| 440+ | 946.8 грн |
| LPC4076FET180,551 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 180TFBGA
Description: IC MCU 32BIT 256KB FLSH 180TFBGA
товар відсутній
| BC846B215 |
|
товар відсутній
| MKV30F128VLF10557 |
|
Виробник: NXP USA Inc.
Description: KINETIS KV30: 100MHZ CORTEX-M4F
Description: KINETIS KV30: 100MHZ CORTEX-M4F
товар відсутній
| NT3H1201W0FHK125 |
|
Виробник: NXP USA Inc.
Description: NTAG I2C 1K - ENERGY HARVESTING
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: NTAG I2C 1K - ENERGY HARVESTING
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 3400 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 384+ | 60.69 грн |
| SL3S4021FHK125 |
Виробник: NXP USA Inc.
Description: UCODE I2C UHF RFID
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: UCODE I2C UHF RFID
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
товар відсутній
| NT3H1101W0FHK125 |
Виробник: NXP USA Inc.
Description: NTAG I2C 1K - ENERGY HARVESTING
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: NTAG I2C 1K - ENERGY HARVESTING
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
товар відсутній
| MCF51JF64VHS |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 9x12b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, SPI, UART/USART, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 31
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 9x12b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, SPI, UART/USART, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 31
DigiKey Programmable: Not Verified
на замовлення 490 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 583.59 грн |
| 10+ | 441.34 грн |
| 80+ | 365.41 грн |
| SAF4000EL/101S233Y |
Виробник: NXP USA Inc.
Description: SOFTWARE DEFINED RADIO
Packaging: Tape & Reel (TR)
Part Status: Active
Description: SOFTWARE DEFINED RADIO
Packaging: Tape & Reel (TR)
Part Status: Active
товар відсутній
| SAF4000EL/101S233K |
товар відсутній
| MK66FN2M0VLQ18R,528 |
|
Виробник: NXP USA Inc.
Description: KINETIS K66, RISC MICROCONTROLLE
Description: KINETIS K66, RISC MICROCONTROLLE
товар відсутній
| CBTU02044HEJ |
|
Виробник: NXP USA Inc.
Description: SWITCH 1-2 PCIE GEN4 HUQFN16
Packaging: Tape & Reel (TR)
Package / Case: 16-UFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: PCIe
On-State Resistance (Max): 14Ohm
-3db Bandwidth: 17GHz
Supplier Device Package: 16-HUQFN (1.6x2.4)
Voltage - Supply, Single (V+): 1.62V ~ 3.63V
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 1:2
Part Status: Active
Number of Channels: 2
Description: SWITCH 1-2 PCIE GEN4 HUQFN16
Packaging: Tape & Reel (TR)
Package / Case: 16-UFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: PCIe
On-State Resistance (Max): 14Ohm
-3db Bandwidth: 17GHz
Supplier Device Package: 16-HUQFN (1.6x2.4)
Voltage - Supply, Single (V+): 1.62V ~ 3.63V
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 1:2
Part Status: Active
Number of Channels: 2
на замовлення 20000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 10000+ | 60.54 грн |
| CBTU02044HEJ |
|
Виробник: NXP USA Inc.
Description: SWITCH 1-2 PCIE GEN4 HUQFN16
Packaging: Cut Tape (CT)
Package / Case: 16-UFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: PCIe
On-State Resistance (Max): 14Ohm
-3db Bandwidth: 17GHz
Supplier Device Package: 16-HUQFN (1.6x2.4)
Voltage - Supply, Single (V+): 1.62V ~ 3.63V
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 1:2
Part Status: Active
Number of Channels: 2
Description: SWITCH 1-2 PCIE GEN4 HUQFN16
Packaging: Cut Tape (CT)
Package / Case: 16-UFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: PCIe
On-State Resistance (Max): 14Ohm
-3db Bandwidth: 17GHz
Supplier Device Package: 16-HUQFN (1.6x2.4)
Voltage - Supply, Single (V+): 1.62V ~ 3.63V
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 1:2
Part Status: Active
Number of Channels: 2
на замовлення 36866 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 4+ | 101.16 грн |
| 10+ | 87.74 грн |
| 25+ | 82.78 грн |
| 100+ | 66.19 грн |
| 250+ | 62.16 грн |
| 500+ | 54.71 грн |
| LPC1313FHN33/01551 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
товар відсутній
| AFT09MS031NR1528 |
|
Виробник: NXP USA Inc.
Description: RF POWER LDMOS TRANSISTOR
Description: RF POWER LDMOS TRANSISTOR
на замовлення 1139 шт:
термін постачання 21-31 дні (днів)| BTA330-800BT127 |
|
на замовлення 3891 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 407+ | 53.86 грн |
| LPC1111FDH20/002518 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 20TSSOP
Description: IC MCU 32BIT 8KB FLASH 20TSSOP
товар відсутній
| BAV99QA147 |
|
Виробник: NXP USA Inc.
Description: RECTIFIER DIODE
Packaging: Bulk
Package / Case: 3-XDFN Exposed Pad
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 4 ns
Technology: Standard
Diode Configuration: 1 Pair Series Connection
Current - Average Rectified (Io) (per Diode): 170mA (DC)
Supplier Device Package: DFN1010D-3
Operating Temperature - Junction: 150°C (Max)
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 90 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 150 mA
Current - Reverse Leakage @ Vr: 500 nA @ 80 V
Description: RECTIFIER DIODE
Packaging: Bulk
Package / Case: 3-XDFN Exposed Pad
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 4 ns
Technology: Standard
Diode Configuration: 1 Pair Series Connection
Current - Average Rectified (Io) (per Diode): 170mA (DC)
Supplier Device Package: DFN1010D-3
Operating Temperature - Junction: 150°C (Max)
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 90 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 150 mA
Current - Reverse Leakage @ Vr: 500 nA @ 80 V
товар відсутній
| LD6806CX4/20P,315 |
|
Виробник: NXP USA Inc.
Description: IC REG LINEAR 2V 200MA 4WLCSP
Packaging: Bulk
Package / Case: 4-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 200mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 2V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.1V @ 200mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
Description: IC REG LINEAR 2V 200MA 4WLCSP
Packaging: Bulk
Package / Case: 4-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 200mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 2V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.1V @ 200mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
на замовлення 27000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 3328+ | 6.29 грн |
| LD6816CX4/20P,315 |
|
Виробник: NXP USA Inc.
Description: IC REG LINEAR 2V 150MA 4WLCSP
Description: IC REG LINEAR 2V 150MA 4WLCSP
на замовлення 27000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 3606+ | 6.49 грн |
| LD6836CX4/20P,315 |
|
Виробник: NXP USA Inc.
Description: IC REG LINEAR 2V 300MA 4WLCSP
Packaging: Bulk
Package / Case: 4-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 300mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 2V
Control Features: Enable
Part Status: Obsolete
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.16V @ 300mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
Description: IC REG LINEAR 2V 300MA 4WLCSP
Packaging: Bulk
Package / Case: 4-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 300mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 2V
Control Features: Enable
Part Status: Obsolete
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.16V @ 300mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
на замовлення 18000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2885+ | 7.3 грн |