Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (35286) > Сторінка 311 з 589
| Фото | Назва | Виробник | Інформація |
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| TDA18256HN/C1K | NXP USA Inc. | Description: IC TELECOM INTERFACE |
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| TDA18264HB/C1,557 | NXP USA Inc. | Description: IC TELECOM INTERFACE |
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| TDA18267HB/C1,557 | NXP USA Inc. | Description: IC TELECOM INTERFACE |
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| TDA18280HN/C1K | NXP USA Inc. |
Description: IC TELECOM INTERFACE Packaging: Tray Part Status: Obsolete |
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| TEF5000EL/V1/S20K | NXP USA Inc. | Description: WISPA-ITS |
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| TEF5100EL/V1/S20K | NXP USA Inc. | Description: WISPA-ITS |
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| PMMA1210KEG | NXP USA Inc. |
 Description: IC ACCEL Z- AXIS 100GPackaging: Tube |
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| PMMA1220KEG | NXP USA Inc. |
Description: IC ACCEL LOW G Z-AXIS Packaging: Tube Part Status: Obsolete |
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| PMMA1251KEG | NXP USA Inc. | Description: IC ACCEL Z-AXIS |
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| PMMA1252KEG | NXP USA Inc. |
Description: IC ACCEL 5G Z-AXIS Packaging: Tube |
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| PMMA2204KEG | NXP USA Inc. |
Description: IC ACCEL X-AXIS 100G ROHS Packaging: Tube Part Status: Obsolete |
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| PMMA2244KEG | NXP USA Inc. |
Description: IC ACCEL 20G X-AXIS Packaging: Tube Part Status: Obsolete |
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| PMMA3201KEG | NXP USA Inc. | Description: IC ACCEL XY AXIS 40G ROHS |
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| PMMA3202KEG | NXP USA Inc. |
Description: IC ACCEL SMT LN XY SOIC-20 Packaging: Tube Part Status: Obsolete |
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| PMMA3204KEG | NXP USA Inc. |
Description: IC ACCEL XY 100 / 30G SOIC-20 Packaging: Tube Part Status: Obsolete |
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AFV10700HSR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS 50V NI780 Packaging: Cut Tape (CT) Package / Case: NI-780S-4L Current Rating (Amps): 10µA Mounting Type: Surface Mount Frequency: 1.03GHz ~ 1.09GHz Configuration: Dual Power - Output: 770W Gain: 19.2dB Technology: LDMOS Supplier Device Package: NI-780S-4L Part Status: Active Voltage - Rated: 105 V Voltage - Test: 50 V Current - Test: 100 mA |
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MPXM2102AT1 | NXP USA Inc. |
Description: SENSOR 14.5PSIA .04V 5MPAK Packaging: Cut Tape (CT) Features: Temperature Compensated Package / Case: 5-SMD Module Output Type: Wheatstone Bridge Mounting Type: Surface Mount Output: 0 mV ~ 40 mV (10V) Operating Pressure: 14.5PSI (100kPa) Pressure Type: Absolute Operating Temperature: -40°C ~ 125°C Termination Style: Gull Wing Voltage - Supply: 10V ~ 16V Applications: Board Mount Supplier Device Package: 5-MPAK Port Style: No Port Maximum Pressure: 58.02PSI (400kPa) |
на замовлення 640 шт: термін постачання 21-31 дні (днів) |
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MC13892DJVLR2 | NXP USA Inc. |
Description: IC PWR MGMT I.MX35/51 186BGA Packaging: Cut Tape (CT) Package / Case: 186-LFBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C Applications: Battery Management, Display (LED Drivers), Handheld/Mobile Devices, Power Supply Supplier Device Package: 186-PBGA (12x12) Part Status: Active |
на замовлення 561 шт: термін постачання 21-31 дні (днів) |
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PCA9510AD,118 | NXP USA Inc. |
Description: IC REDRIVER I2C HOTSWAP 1CH 8SO Packaging: Cut Tape (CT) Package / Case: 8-SOIC (0.154", 3.90mm Width) Number of Channels: 1 Mounting Type: Surface Mount Output: 2-Wire Bus Type: Buffer, ReDriver Input: 2-Wire Bus Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.7V ~ 5.5V Applications: I2C - Hotswap Current - Supply: 6mA Data Rate (Max): 400kHz Supplier Device Package: 8-SO Part Status: Active Capacitance - Input: 1.9 pF |
на замовлення 3276 шт: термін постачання 21-31 дні (днів) |
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BGU6101,147 | NXP USA Inc. |
Description: IC RF AMP GPS 40MHZ-4GHZ 6HXSON Packaging: Cut Tape (CT) Package / Case: 6-XFDFN Exposed Pad Mounting Type: Surface Mount Frequency: 40MHz ~ 4GHz RF Type: General Purpose Voltage - Supply: 1.5V ~ 5V Gain: 19.5dB Current - Supply: 10mA Noise Figure: 2.4dB P1dB: 3.5dBm Test Frequency: 3.5GHz Supplier Device Package: 6-HXSON (1.3x2) Part Status: Active |
на замовлення 3581 шт: термін постачання 21-31 дні (днів) |
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KMI15/1/V3PX | NXP USA Inc. |
Description: MAGNETIC SWITCH SPEC PURP 2SIP Packaging: Cut Tape (CT) Features: Temperature Compensated Package / Case: SOT-453B Output Type: Current Source Mounting Type: Through Hole Function: Special Purpose Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 12V Technology: Magnetoresistive Current - Output (Max): 14mA (Typ) Supplier Device Package: 2-SIP |
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SL3S1202FTB1,115 | NXP USA Inc. |
Description: IC RFID TRANSP 840-960MHZ 3XSON |
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PCAL6416AEX1Z | NXP USA Inc. |
Description: IC XPND 400KHZ I2C SMBUS 24X2QFN Packaging: Cut Tape (CT) Features: POR Package / Case: 24-XFLGA Output Type: Open Drain, Push-Pull Mounting Type: Surface Mount Interface: I2C, SMBus Number of I/O: 16 Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.65V ~ 5.5V Clock Frequency: 400 kHz Interrupt Output: Yes Supplier Device Package: 24-X2QFN (2x2) Current - Output Source/Sink: 10mA, 25mA Part Status: Active DigiKey Programmable: Not Verified |
на замовлення 7144 шт: термін постачання 21-31 дні (днів) |
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SC18IS600IPW/S8HP | NXP USA Inc. |
Description: IC I2C CONTROLLER SPI 16TSSOP Packaging: Cut Tape (CT) Package / Case: 16-TSSOP (0.173", 4.40mm Width) Function: Controller Interface: SPI Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.4V ~ 3.6V Current - Supply: 11mA Protocol: I²C Supplier Device Package: 16-TSSOP Part Status: Last Time Buy DigiKey Programmable: Not Verified |
на замовлення 13023 шт: термін постачання 21-31 дні (днів) |
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SC18IS602BIPW/S8HP | NXP USA Inc. |
Description: IC BRIDGE SPI/I2C 16TSSOP Packaging: Cut Tape (CT) Package / Case: 16-TSSOP (0.173", 4.40mm Width) Function: Controller Interface: SPI Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.4V ~ 3.6V Current - Supply: 11mA Protocol: I2C Supplier Device Package: 16-TSSOP Part Status: Last Time Buy DigiKey Programmable: Not Verified |
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MRF13750HR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS 50V NI1230 Packaging: Cut Tape (CT) Package / Case: SOT-979A Current Rating (Amps): 10µA Mounting Type: Chassis Mount Frequency: 700MHz ~ 1.3GHz Configuration: Dual Power - Output: 650W Gain: 20.6dB Technology: LDMOS Supplier Device Package: NI-1230-4H Part Status: Active Voltage - Rated: 105 V Voltage - Test: 50 V |
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SJA1105ELY | NXP USA Inc. |
Description: IC ETHERNET SWITCH SPI 159LFBGA Packaging: Cut Tape (CT) Package / Case: 159-LFBGA Function: Switch Interface: SPI Operating Temperature: -40°C ~ 125°C (TJ) Voltage - Supply: 1.65V ~ 3.6V Current - Supply: 3.5mA Protocol: Ethernet Standards: IEEE 802.3 Supplier Device Package: 159-LFBGA (12x12) Part Status: Active DigiKey Programmable: Not Verified Grade: Automotive Qualification: AEC-Q100 |
на замовлення 3139 шт: термін постачання 21-31 дні (днів) |
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SJA1105TELY | NXP USA Inc. |
Description: IC ETHERNET SWITCH SPI 159LFBGA |
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TFA9892AUK/N1BZ | NXP USA Inc. |
Description: IC AMP CLASS D MONO 6.6W 49WLCSP Packaging: Cut Tape (CT) Features: Depop, Short-Circuit and Thermal Protection Package / Case: 49-UFBGA, WLCSP Output Type: 1-Channel (Mono) Mounting Type: Surface Mount Type: Class D Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.7V ~ 5.5V Max Output Power x Channels @ Load: 6.6W x 1 @ 8Ohm Supplier Device Package: 49-WLCSP (3.63x3.13) Part Status: Active |
на замовлення 973 шт: термін постачання 21-31 дні (днів) |
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TFA9896UK/N1Z | NXP USA Inc. |
Description: IC AMP CLASS D MONO 2.1W 30WLCSP Packaging: Cut Tape (CT) Features: Depop, Short-Circuit and Thermal Protection Package / Case: 30-UFBGA, WLCSP Output Type: 1-Channel (Mono) Mounting Type: Surface Mount Type: Class D Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.8V ~ 5.5V Max Output Power x Channels @ Load: 2.1W x 1 @ 8Ohm Supplier Device Package: 30-WLCSP (2.72x2.06) Part Status: Active |
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TFA9891UK/N1AZ | NXP USA Inc. |
Description: IC AMP CLASS D MONO 3.6W 49WLCSP Packaging: Cut Tape (CT) Features: Depop, Short-Circuit and Thermal Protection Package / Case: 49-UFBGA, WLCSP Output Type: 1-Channel (Mono) Mounting Type: Surface Mount Type: Class D Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.7V ~ 5.5V Max Output Power x Channels @ Load: 3.6W x 1 @ 8Ohm Supplier Device Package: 49-WLCSP (3.43x2.98) Part Status: Active |
на замовлення 4 шт: термін постачання 21-31 дні (днів) |
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| NX30P6093UKZ | NXP USA Inc. |
Description: IC PWR SWITCH P-CHAN 1:1 20WLCSP Packaging: Cut Tape (CT) Features: Slew Rate Controlled Package / Case: 20-UFBGA, WLCSP Output Type: P-Channel Mounting Type: Surface Mount Number of Outputs: 1 Interface: I²C Switch Type: USB Switch Operating Temperature: -40°C ~ 85°C (TA) Rds On (Typ): 8.95mOhm Voltage - Load: 2.8V ~ 20V Voltage - Supply (Vcc/Vdd): 3V ~ 4.5V Current - Output (Max): 8A Ratio - Input:Output: 1:1 Supplier Device Package: 20-WLCSP (2.16x1.7) Fault Protection: Over Temperature, Over Voltage Part Status: Obsolete |
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TEA1999TK/1J | NXP USA Inc. |
Description: FLYBACK SR Packaging: Cut Tape (CT) Package / Case: 8-VDFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 0V ~ 21V Applications: Active/Synchronous Rectification Controller Supplier Device Package: 8-HVSON (3x3) Current - Supply: 250 µA DigiKey Programmable: Not Verified |
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MCIMX8M-EVK | NXP USA Inc. |
Description: I.MX 8M EVAL BRD Packaging: Bulk Mounting Type: Fixed Type: MPU Contents: Board(s), Cable(s), Power Supply Core Processor: ARM® Cortex®-A53, Cortex®-M4 Board Type: Evaluation Platform Utilized IC / Part: i.MX 8M Part Status: Active |
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LPC8N04FHI24E | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 24HVQFN Packaging: Tray Package / Case: 24-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 32KB (32K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.72V ~ 3.6V Connectivity: I2C, SPI Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Supplier Device Package: 24-HVQFN (4x4) Part Status: Active Number of I/O: 12 DigiKey Programmable: Not Verified |
на замовлення 310 шт: термін постачання 21-31 дні (днів) |
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LPC8N04FHI24Z | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 24HVQFN Packaging: Tape & Reel (TR) Package / Case: 24-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 32KB (32K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.72V ~ 3.6V Connectivity: I2C, SPI Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Supplier Device Package: 24-HVQFN (4x4) Part Status: Active Number of I/O: 12 DigiKey Programmable: Not Verified |
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OM40002UL | NXP USA Inc. |
Description: LPC8N04 EVAL BRD Packaging: Bulk Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: ARM® Cortex®-M0+ Board Type: Evaluation Platform Utilized IC / Part: LPC8N04 Part Status: Active |
на замовлення 13 шт: термін постачання 21-31 дні (днів) |
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LPC8N04FHI24Z | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 24HVQFN Packaging: Cut Tape (CT) Package / Case: 24-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 32KB (32K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.72V ~ 3.6V Connectivity: I2C, SPI Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Supplier Device Package: 24-HVQFN (4x4) Part Status: Active Number of I/O: 12 DigiKey Programmable: Not Verified |
на замовлення 1460 шт: термін постачання 21-31 дні (днів) |
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MPXV7002GC6T1 | NXP USA Inc. |
Description: SENSOR PRESSURE 8SOP AXIAL PORT |
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MC33972ATEKR2 | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 32SOIC Packaging: Cut Tape (CT) Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Mounting Type: Surface Mount Interface: SPI Serial Voltage - Supply: 3.1V ~ 5.25V Applications: Switch Monitoring Supplier Device Package: 32-SSOP-EP Part Status: Active |
на замовлення 1943 шт: термін постачання 21-31 дні (днів) |
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S9KEAZN8AMTGR | NXP USA Inc. |
Description: IC MCU 32BIT 8KB FLASH 16TSSOP Packaging: Cut Tape (CT) Package / Case: 16-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 8KB (8K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 12x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 16-TSSOP Part Status: Active Number of I/O: 14 DigiKey Programmable: Not Verified |
на замовлення 4897 шт: термін постачання 21-31 дні (днів) |
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MC9S08SH8CWJR | NXP USA Inc. |
Description: IC MCU 8BIT 8KB FLASH 20SOIC Packaging: Cut Tape (CT) Package / Case: 20-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 8KB (8K x 8) RAM Size: 512 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 12x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I²C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 20-SOIC Part Status: Active Number of I/O: 17 DigiKey Programmable: Not Verified |
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MC34674DEPR2 | NXP USA Inc. |
Description: IC BATT CHG LI-ION 1CELL 8UDFN |
на замовлення 2649 шт: термін постачання 21-31 дні (днів) |
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MPXM2053GST1 | NXP USA Inc. |
Description: SENSOR 7.25PSIG 0.12" .04V 5MPAK Packaging: Cut Tape (CT) Features: Temperature Compensated Package / Case: 5-SMD Module, Top Port Output Type: Wheatstone Bridge Mounting Type: Surface Mount Output: 0 mV ~ 40 mV (10V) Operating Pressure: 7.25PSI (50kPa) Pressure Type: Vented Gauge Accuracy: -0.6% ~ 0.4% Operating Temperature: -40°C ~ 125°C Termination Style: Gull Wing Voltage - Supply: 10V ~ 16V Port Size: Male - 0.12" (2.97mm) Tube Applications: Board Mount Supplier Device Package: 5-MPAK Port Style: Barbless Maximum Pressure: 29.01PSI (200kPa) Part Status: Active |
на замовлення 4188 шт: термін постачання 21-31 дні (днів) |
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SC16C752BIB48,128 | NXP USA Inc. |
Description: IC DUAL UART 64BYTE 48LQFP Packaging: Cut Tape (CT) Package / Case: 48-LQFP Number of Channels: 2, DUART Mounting Type: Surface Mount Voltage - Supply: 2.5V, 3.3V, 5V FIFO's: 64 Byte Data Rate (Max): 5Mbps Supplier Device Package: 48-LQFP (7x7) With Auto Flow Control: Yes With False Start Bit Detection: Yes With Modem Control: Yes Part Status: Active |
на замовлення 5245 шт: термін постачання 21-31 дні (днів) |
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PCF8551BTT/AJ | NXP USA Inc. |
Description: IC DRVR 7 SEGMENT 48TSSOP Packaging: Cut Tape (CT) Package / Case: 48-TFSOP (0.240", 6.10mm Width) Display Type: LCD Mounting Type: Surface Mount Interface: SPI Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.8V ~ 5.5V Digits or Characters: 9 Characters, 18 Characters, 144 Elements Supplier Device Package: 48-TSSOP Current - Supply: 1.2 µA |
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TJA1027TK/20,118 | NXP USA Inc. |
Description: IC TRANSCEIVER 1/1 8HVSON Packaging: Cut Tape (CT) Package / Case: 8-VDFN Exposed Pad Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 5V ~ 18V Number of Drivers/Receivers: 1/1 Protocol: LINbus Supplier Device Package: 8-HVSON (3x3) Receiver Hysteresis: 175 mV Part Status: Active |
на замовлення 2863 шт: термін постачання 21-31 дні (днів) |
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BAP142LX,315 | NXP USA Inc. |
Description: RF DIODE PIN 50V 130MW SOD2 Packaging: Cut Tape (CT) Package / Case: SOD-882 Diode Type: PIN - Single Operating Temperature: -65°C ~ 150°C (TJ) Capacitance @ Vr, F: 0.26pF @ 20V, 1MHz Resistance @ If, F: 1.3Ohm @ 100mA, 100MHz Voltage - Peak Reverse (Max): 50V Supplier Device Package: SOD2 Current - Max: 100 mA Power Dissipation (Max): 130 mW |
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LPC11A04UK,118 | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 20WLCSP Packaging: Cut Tape (CT) Package / Case: 20-UFBGA, WLCSP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 32KB (32K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b; D/A 1x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.6V ~ 3.6V Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Supplier Device Package: 20-WLCSP (2.55x2.55) Part Status: Active Number of I/O: 18 DigiKey Programmable: Not Verified |
на замовлення 56081 шт: термін постачання 21-31 дні (днів) |
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TDA8551T/N1,118 | NXP USA Inc. |
Description: IC AMP CLASS AB MONO 1.4W 8SO Packaging: Cut Tape (CT) Features: Depop, Mute, Short-Circuit and Thermal Protection, Standby, Volume Control Package / Case: 8-SOIC (0.154", 3.90mm Width) Output Type: 1-Channel (Mono) Mounting Type: Surface Mount Type: Class AB Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.7V ~ 5.5V Max Output Power x Channels @ Load: 1.4W x 1 @ 8Ohm Supplier Device Package: 8-SO Part Status: Obsolete |
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S9KEAZN64AMLHR | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 64LQFP Packaging: Cut Tape (CT) Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 64KB (64K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 256 x 8 Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 57 DigiKey Programmable: Not Verified |
на замовлення 9967 шт: термін постачання 21-31 дні (днів) |
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LPC812M101JDH16J | NXP USA Inc. |
Description: IC MCU 32BIT 16KB FLASH 16TSSOP Packaging: Cut Tape (CT) Package / Case: 16-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 30MHz Program Memory Size: 16KB (16K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Supplier Device Package: 16-TSSOP Part Status: Active Number of I/O: 14 DigiKey Programmable: Verified |
на замовлення 4099 шт: термін постачання 21-31 дні (днів) |
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GTL2000DGG,118 | NXP USA Inc. |
Description: IC TRANSLATOR BIDIR 48TSSOP Features: Auto-Direction Sensing Packaging: Cut Tape (CT) Package / Case: 48-TFSOP (0.240", 6.10mm Width) Output Type: Open Drain Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Supplier Device Package: 48-TSSOP Channel Type: Bidirectional Translator Type: Voltage Level Channels per Circuit: 22 Voltage - VCCA: 1 V ~ 5.5 V Voltage - VCCB: 1 V ~ 5.5 V Part Status: Obsolete Number of Circuits: 1 |
товар відсутній |
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LPC824M201JHI33Y | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 32HVQFN Packaging: Cut Tape (CT) Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 30MHz Program Memory Size: 32KB (32K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 12x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 32-HVQFN (5x5) Part Status: Active Number of I/O: 29 DigiKey Programmable: Not Verified |
на замовлення 18683 шт: термін постачання 21-31 дні (днів) |
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TDA8037TT/C1J | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 16TSSOP Packaging: Cut Tape (CT) Package / Case: 16-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Voltage - Supply: 3.3V Applications: Smart Card Supplier Device Package: 16-TSSOP Part Status: Active |
товар відсутній |
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LPC1111FHN33/102'5 | NXP USA Inc. |
Description: IC MCU 32BIT 8KB FLASH 32HVQFN Packaging: Cut Tape (CT) Package / Case: 32-VQFN Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 8KB (8K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Supplier Device Package: 32-HVQFN (7x7) Part Status: Active Number of I/O: 28 DigiKey Programmable: Not Verified |
на замовлення 12200 шт: термін постачання 21-31 дні (днів) |
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| A2V07H400-04NR3 | NXP USA Inc. |
Description: RF MOSFET LDMOS 48V OM780G-4 Packaging: Tape & Reel (TR) Package / Case: OM-780G-4L Current Rating (Amps): 10µA Mounting Type: Surface Mount Frequency: 595MHz ~ 851MHz Configuration: Dual Power - Output: 267W Gain: 19.9dB Technology: LDMOS Supplier Device Package: OM-780G-4L Part Status: Active Voltage - Rated: 105 V Voltage - Test: 48 V Current - Test: 700 mA |
товар відсутній |
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| A3T18H455W23SR6 | NXP USA Inc. |
Description: RF MOSFET LDMOS 30V ACP1230S-4 Packaging: Tape & Reel (TR) Package / Case: ACP-1230S-4L2S Current Rating (Amps): 10µA Mounting Type: Chassis Mount Frequency: 1.805GHz ~ 1.88GHz Configuration: Dual Power - Output: 192W Gain: 16.7dB Technology: LDMOS Supplier Device Package: ACP-1230S-4L2S Voltage - Rated: 65 V Voltage - Test: 30 V Current - Test: 600 mA |
товар відсутній |
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| A3T21H360W23SR6 | NXP USA Inc. |
Description: AIRFAST RF POWER LDMOS TRANSISTO |
товар відсутній |
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FS32K142HAT0MLHT | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 256KB (256K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M4F Data Converters: A/D 16x12b SAR; D/A1x8b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 58 DigiKey Programmable: Not Verified |
на замовлення 74 шт: термін постачання 21-31 дні (днів) |
|
| TDA18280HN/C1K |
товар відсутній
| PMMA1220KEG |
|
товар відсутній
| PMMA2204KEG |
товар відсутній
| PMMA2244KEG |
товар відсутній
| PMMA3202KEG |
товар відсутній
| PMMA3204KEG |
Виробник: NXP USA Inc.
Description: IC ACCEL XY 100 / 30G SOIC-20
Packaging: Tube
Part Status: Obsolete
Description: IC ACCEL XY 100 / 30G SOIC-20
Packaging: Tube
Part Status: Obsolete
товар відсутній
| AFV10700HSR5 |
|
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI780
Packaging: Cut Tape (CT)
Package / Case: NI-780S-4L
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 1.03GHz ~ 1.09GHz
Configuration: Dual
Power - Output: 770W
Gain: 19.2dB
Technology: LDMOS
Supplier Device Package: NI-780S-4L
Part Status: Active
Voltage - Rated: 105 V
Voltage - Test: 50 V
Current - Test: 100 mA
Description: RF MOSFET LDMOS 50V NI780
Packaging: Cut Tape (CT)
Package / Case: NI-780S-4L
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 1.03GHz ~ 1.09GHz
Configuration: Dual
Power - Output: 770W
Gain: 19.2dB
Technology: LDMOS
Supplier Device Package: NI-780S-4L
Part Status: Active
Voltage - Rated: 105 V
Voltage - Test: 50 V
Current - Test: 100 mA
товар відсутній
| MPXM2102AT1 |
|
Виробник: NXP USA Inc.
Description: SENSOR 14.5PSIA .04V 5MPAK
Packaging: Cut Tape (CT)
Features: Temperature Compensated
Package / Case: 5-SMD Module
Output Type: Wheatstone Bridge
Mounting Type: Surface Mount
Output: 0 mV ~ 40 mV (10V)
Operating Pressure: 14.5PSI (100kPa)
Pressure Type: Absolute
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 10V ~ 16V
Applications: Board Mount
Supplier Device Package: 5-MPAK
Port Style: No Port
Maximum Pressure: 58.02PSI (400kPa)
Description: SENSOR 14.5PSIA .04V 5MPAK
Packaging: Cut Tape (CT)
Features: Temperature Compensated
Package / Case: 5-SMD Module
Output Type: Wheatstone Bridge
Mounting Type: Surface Mount
Output: 0 mV ~ 40 mV (10V)
Operating Pressure: 14.5PSI (100kPa)
Pressure Type: Absolute
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 10V ~ 16V
Applications: Board Mount
Supplier Device Package: 5-MPAK
Port Style: No Port
Maximum Pressure: 58.02PSI (400kPa)
на замовлення 640 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 859.9 грн |
| 10+ | 655.05 грн |
| 25+ | 620.59 грн |
| 100+ | 501.51 грн |
| 500+ | 469.16 грн |
| MC13892DJVLR2 |
|
Виробник: NXP USA Inc.
Description: IC PWR MGMT I.MX35/51 186BGA
Packaging: Cut Tape (CT)
Package / Case: 186-LFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Applications: Battery Management, Display (LED Drivers), Handheld/Mobile Devices, Power Supply
Supplier Device Package: 186-PBGA (12x12)
Part Status: Active
Description: IC PWR MGMT I.MX35/51 186BGA
Packaging: Cut Tape (CT)
Package / Case: 186-LFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Applications: Battery Management, Display (LED Drivers), Handheld/Mobile Devices, Power Supply
Supplier Device Package: 186-PBGA (12x12)
Part Status: Active
на замовлення 561 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 818.09 грн |
| 10+ | 711.94 грн |
| 25+ | 678.81 грн |
| 100+ | 553.14 грн |
| 250+ | 528.28 грн |
| 500+ | 481.67 грн |
| PCA9510AD,118 |
|
Виробник: NXP USA Inc.
Description: IC REDRIVER I2C HOTSWAP 1CH 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Number of Channels: 1
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: I2C - Hotswap
Current - Supply: 6mA
Data Rate (Max): 400kHz
Supplier Device Package: 8-SO
Part Status: Active
Capacitance - Input: 1.9 pF
Description: IC REDRIVER I2C HOTSWAP 1CH 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Number of Channels: 1
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: I2C - Hotswap
Current - Supply: 6mA
Data Rate (Max): 400kHz
Supplier Device Package: 8-SO
Part Status: Active
Capacitance - Input: 1.9 pF
на замовлення 3276 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 203.76 грн |
| 10+ | 176.08 грн |
| 25+ | 166.43 грн |
| 100+ | 135.36 грн |
| 250+ | 128.41 грн |
| 500+ | 115.22 грн |
| 1000+ | 95.58 грн |
| BGU6101,147 |
|
Виробник: NXP USA Inc.
Description: IC RF AMP GPS 40MHZ-4GHZ 6HXSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 40MHz ~ 4GHz
RF Type: General Purpose
Voltage - Supply: 1.5V ~ 5V
Gain: 19.5dB
Current - Supply: 10mA
Noise Figure: 2.4dB
P1dB: 3.5dBm
Test Frequency: 3.5GHz
Supplier Device Package: 6-HXSON (1.3x2)
Part Status: Active
Description: IC RF AMP GPS 40MHZ-4GHZ 6HXSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 40MHz ~ 4GHz
RF Type: General Purpose
Voltage - Supply: 1.5V ~ 5V
Gain: 19.5dB
Current - Supply: 10mA
Noise Figure: 2.4dB
P1dB: 3.5dBm
Test Frequency: 3.5GHz
Supplier Device Package: 6-HXSON (1.3x2)
Part Status: Active
на замовлення 3581 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 5+ | 70.71 грн |
| 10+ | 60.62 грн |
| 25+ | 54.74 грн |
| 100+ | 44.94 грн |
| 250+ | 39.44 грн |
| 500+ | 34.86 грн |
| 1000+ | 31.77 грн |
| KMI15/1/V3PX |
|
Виробник: NXP USA Inc.
Description: MAGNETIC SWITCH SPEC PURP 2SIP
Packaging: Cut Tape (CT)
Features: Temperature Compensated
Package / Case: SOT-453B
Output Type: Current Source
Mounting Type: Through Hole
Function: Special Purpose
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 12V
Technology: Magnetoresistive
Current - Output (Max): 14mA (Typ)
Supplier Device Package: 2-SIP
Description: MAGNETIC SWITCH SPEC PURP 2SIP
Packaging: Cut Tape (CT)
Features: Temperature Compensated
Package / Case: SOT-453B
Output Type: Current Source
Mounting Type: Through Hole
Function: Special Purpose
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 12V
Technology: Magnetoresistive
Current - Output (Max): 14mA (Typ)
Supplier Device Package: 2-SIP
товар відсутній
| PCAL6416AEX1Z |
|
Виробник: NXP USA Inc.
Description: IC XPND 400KHZ I2C SMBUS 24X2QFN
Packaging: Cut Tape (CT)
Features: POR
Package / Case: 24-XFLGA
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-X2QFN (2x2)
Current - Output Source/Sink: 10mA, 25mA
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC XPND 400KHZ I2C SMBUS 24X2QFN
Packaging: Cut Tape (CT)
Features: POR
Package / Case: 24-XFLGA
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-X2QFN (2x2)
Current - Output Source/Sink: 10mA, 25mA
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 7144 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 3+ | 115.57 грн |
| 10+ | 99.35 грн |
| 25+ | 94.3 грн |
| 100+ | 72.69 грн |
| 250+ | 67.94 грн |
| 500+ | 60.04 грн |
| 1000+ | 46.63 грн |
| 2500+ | 43.52 грн |
| SC18IS600IPW/S8HP |
|
Виробник: NXP USA Inc.
Description: IC I2C CONTROLLER SPI 16TSSOP
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Function: Controller
Interface: SPI
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.4V ~ 3.6V
Current - Supply: 11mA
Protocol: I²C
Supplier Device Package: 16-TSSOP
Part Status: Last Time Buy
DigiKey Programmable: Not Verified
Description: IC I2C CONTROLLER SPI 16TSSOP
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Function: Controller
Interface: SPI
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.4V ~ 3.6V
Current - Supply: 11mA
Protocol: I²C
Supplier Device Package: 16-TSSOP
Part Status: Last Time Buy
DigiKey Programmable: Not Verified
на замовлення 13023 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 350.5 грн |
| 10+ | 303.18 грн |
| 25+ | 286.62 грн |
| 100+ | 233.12 грн |
| 250+ | 221.16 грн |
| 500+ | 198.44 грн |
| 1000+ | 164.62 грн |
| SC18IS602BIPW/S8HP |
|
Виробник: NXP USA Inc.
Description: IC BRIDGE SPI/I2C 16TSSOP
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Function: Controller
Interface: SPI
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.4V ~ 3.6V
Current - Supply: 11mA
Protocol: I2C
Supplier Device Package: 16-TSSOP
Part Status: Last Time Buy
DigiKey Programmable: Not Verified
Description: IC BRIDGE SPI/I2C 16TSSOP
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Function: Controller
Interface: SPI
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.4V ~ 3.6V
Current - Supply: 11mA
Protocol: I2C
Supplier Device Package: 16-TSSOP
Part Status: Last Time Buy
DigiKey Programmable: Not Verified
товар відсутній
| MRF13750HR5 |
|
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Cut Tape (CT)
Package / Case: SOT-979A
Current Rating (Amps): 10µA
Mounting Type: Chassis Mount
Frequency: 700MHz ~ 1.3GHz
Configuration: Dual
Power - Output: 650W
Gain: 20.6dB
Technology: LDMOS
Supplier Device Package: NI-1230-4H
Part Status: Active
Voltage - Rated: 105 V
Voltage - Test: 50 V
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Cut Tape (CT)
Package / Case: SOT-979A
Current Rating (Amps): 10µA
Mounting Type: Chassis Mount
Frequency: 700MHz ~ 1.3GHz
Configuration: Dual
Power - Output: 650W
Gain: 20.6dB
Technology: LDMOS
Supplier Device Package: NI-1230-4H
Part Status: Active
Voltage - Rated: 105 V
Voltage - Test: 50 V
товар відсутній
| SJA1105ELY |
|
Виробник: NXP USA Inc.
Description: IC ETHERNET SWITCH SPI 159LFBGA
Packaging: Cut Tape (CT)
Package / Case: 159-LFBGA
Function: Switch
Interface: SPI
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 1.65V ~ 3.6V
Current - Supply: 3.5mA
Protocol: Ethernet
Standards: IEEE 802.3
Supplier Device Package: 159-LFBGA (12x12)
Part Status: Active
DigiKey Programmable: Not Verified
Grade: Automotive
Qualification: AEC-Q100
Description: IC ETHERNET SWITCH SPI 159LFBGA
Packaging: Cut Tape (CT)
Package / Case: 159-LFBGA
Function: Switch
Interface: SPI
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 1.65V ~ 3.6V
Current - Supply: 3.5mA
Protocol: Ethernet
Standards: IEEE 802.3
Supplier Device Package: 159-LFBGA (12x12)
Part Status: Active
DigiKey Programmable: Not Verified
Grade: Automotive
Qualification: AEC-Q100
на замовлення 3139 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 617.37 грн |
| 10+ | 536.88 грн |
| 25+ | 511.88 грн |
| 100+ | 417.12 грн |
| 250+ | 398.37 грн |
| 500+ | 363.22 грн |
| TFA9892AUK/N1BZ |
Виробник: NXP USA Inc.
Description: IC AMP CLASS D MONO 6.6W 49WLCSP
Packaging: Cut Tape (CT)
Features: Depop, Short-Circuit and Thermal Protection
Package / Case: 49-UFBGA, WLCSP
Output Type: 1-Channel (Mono)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Max Output Power x Channels @ Load: 6.6W x 1 @ 8Ohm
Supplier Device Package: 49-WLCSP (3.63x3.13)
Part Status: Active
Description: IC AMP CLASS D MONO 6.6W 49WLCSP
Packaging: Cut Tape (CT)
Features: Depop, Short-Circuit and Thermal Protection
Package / Case: 49-UFBGA, WLCSP
Output Type: 1-Channel (Mono)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Max Output Power x Channels @ Load: 6.6W x 1 @ 8Ohm
Supplier Device Package: 49-WLCSP (3.63x3.13)
Part Status: Active
на замовлення 973 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 197.68 грн |
| 10+ | 171.39 грн |
| 25+ | 162.01 грн |
| 100+ | 131.77 грн |
| 250+ | 125.01 грн |
| 500+ | 112.17 грн |
| TFA9896UK/N1Z |
Виробник: NXP USA Inc.
Description: IC AMP CLASS D MONO 2.1W 30WLCSP
Packaging: Cut Tape (CT)
Features: Depop, Short-Circuit and Thermal Protection
Package / Case: 30-UFBGA, WLCSP
Output Type: 1-Channel (Mono)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.8V ~ 5.5V
Max Output Power x Channels @ Load: 2.1W x 1 @ 8Ohm
Supplier Device Package: 30-WLCSP (2.72x2.06)
Part Status: Active
Description: IC AMP CLASS D MONO 2.1W 30WLCSP
Packaging: Cut Tape (CT)
Features: Depop, Short-Circuit and Thermal Protection
Package / Case: 30-UFBGA, WLCSP
Output Type: 1-Channel (Mono)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.8V ~ 5.5V
Max Output Power x Channels @ Load: 2.1W x 1 @ 8Ohm
Supplier Device Package: 30-WLCSP (2.72x2.06)
Part Status: Active
товар відсутній
| TFA9891UK/N1AZ |
Виробник: NXP USA Inc.
Description: IC AMP CLASS D MONO 3.6W 49WLCSP
Packaging: Cut Tape (CT)
Features: Depop, Short-Circuit and Thermal Protection
Package / Case: 49-UFBGA, WLCSP
Output Type: 1-Channel (Mono)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Max Output Power x Channels @ Load: 3.6W x 1 @ 8Ohm
Supplier Device Package: 49-WLCSP (3.43x2.98)
Part Status: Active
Description: IC AMP CLASS D MONO 3.6W 49WLCSP
Packaging: Cut Tape (CT)
Features: Depop, Short-Circuit and Thermal Protection
Package / Case: 49-UFBGA, WLCSP
Output Type: 1-Channel (Mono)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Max Output Power x Channels @ Load: 3.6W x 1 @ 8Ohm
Supplier Device Package: 49-WLCSP (3.43x2.98)
Part Status: Active
на замовлення 4 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 180.95 грн |
| NX30P6093UKZ |
|
Виробник: NXP USA Inc.
Description: IC PWR SWITCH P-CHAN 1:1 20WLCSP
Packaging: Cut Tape (CT)
Features: Slew Rate Controlled
Package / Case: 20-UFBGA, WLCSP
Output Type: P-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: I²C
Switch Type: USB Switch
Operating Temperature: -40°C ~ 85°C (TA)
Rds On (Typ): 8.95mOhm
Voltage - Load: 2.8V ~ 20V
Voltage - Supply (Vcc/Vdd): 3V ~ 4.5V
Current - Output (Max): 8A
Ratio - Input:Output: 1:1
Supplier Device Package: 20-WLCSP (2.16x1.7)
Fault Protection: Over Temperature, Over Voltage
Part Status: Obsolete
Description: IC PWR SWITCH P-CHAN 1:1 20WLCSP
Packaging: Cut Tape (CT)
Features: Slew Rate Controlled
Package / Case: 20-UFBGA, WLCSP
Output Type: P-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: I²C
Switch Type: USB Switch
Operating Temperature: -40°C ~ 85°C (TA)
Rds On (Typ): 8.95mOhm
Voltage - Load: 2.8V ~ 20V
Voltage - Supply (Vcc/Vdd): 3V ~ 4.5V
Current - Output (Max): 8A
Ratio - Input:Output: 1:1
Supplier Device Package: 20-WLCSP (2.16x1.7)
Fault Protection: Over Temperature, Over Voltage
Part Status: Obsolete
товар відсутній
| TEA1999TK/1J |
|
Виробник: NXP USA Inc.
Description: FLYBACK SR
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 0V ~ 21V
Applications: Active/Synchronous Rectification Controller
Supplier Device Package: 8-HVSON (3x3)
Current - Supply: 250 µA
DigiKey Programmable: Not Verified
Description: FLYBACK SR
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 0V ~ 21V
Applications: Active/Synchronous Rectification Controller
Supplier Device Package: 8-HVSON (3x3)
Current - Supply: 250 µA
DigiKey Programmable: Not Verified
товар відсутній
| MCIMX8M-EVK |
|
Виробник: NXP USA Inc.
Description: I.MX 8M EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s), Cable(s), Power Supply
Core Processor: ARM® Cortex®-A53, Cortex®-M4
Board Type: Evaluation Platform
Utilized IC / Part: i.MX 8M
Part Status: Active
Description: I.MX 8M EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s), Cable(s), Power Supply
Core Processor: ARM® Cortex®-A53, Cortex®-M4
Board Type: Evaluation Platform
Utilized IC / Part: i.MX 8M
Part Status: Active
товар відсутній
| LPC8N04FHI24E |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 24HVQFN
Packaging: Tray
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.72V ~ 3.6V
Connectivity: I2C, SPI
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 24-HVQFN (4x4)
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 24HVQFN
Packaging: Tray
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.72V ~ 3.6V
Connectivity: I2C, SPI
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 24-HVQFN (4x4)
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
на замовлення 310 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 229.61 грн |
| 10+ | 173.01 грн |
| 80+ | 141.76 грн |
| LPC8N04FHI24Z |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 24HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.72V ~ 3.6V
Connectivity: I2C, SPI
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 24-HVQFN (4x4)
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 24HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.72V ~ 3.6V
Connectivity: I2C, SPI
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 24-HVQFN (4x4)
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
товар відсутній
| OM40002UL |
|
Виробник: NXP USA Inc.
Description: LPC8N04 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Board Type: Evaluation Platform
Utilized IC / Part: LPC8N04
Part Status: Active
Description: LPC8N04 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Board Type: Evaluation Platform
Utilized IC / Part: LPC8N04
Part Status: Active
на замовлення 13 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1820.92 грн |
| LPC8N04FHI24Z |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 24HVQFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.72V ~ 3.6V
Connectivity: I2C, SPI
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 24-HVQFN (4x4)
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 24HVQFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.72V ~ 3.6V
Connectivity: I2C, SPI
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 24-HVQFN (4x4)
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
на замовлення 1460 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 225.81 грн |
| 10+ | 170 грн |
| 100+ | 139.3 грн |
| 500+ | 127.97 грн |
| MC33972ATEKR2 |
Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Cut Tape (CT)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 3.1V ~ 5.25V
Applications: Switch Monitoring
Supplier Device Package: 32-SSOP-EP
Part Status: Active
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Cut Tape (CT)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 3.1V ~ 5.25V
Applications: Switch Monitoring
Supplier Device Package: 32-SSOP-EP
Part Status: Active
на замовлення 1943 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 421.21 грн |
| 10+ | 364.39 грн |
| 25+ | 344.49 грн |
| 100+ | 280.18 грн |
| 250+ | 265.81 грн |
| 500+ | 238.51 грн |
| S9KEAZN8AMTGR |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 16TSSOP
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Part Status: Active
Number of I/O: 14
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 8KB FLASH 16TSSOP
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Part Status: Active
Number of I/O: 14
DigiKey Programmable: Not Verified
на замовлення 4897 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 190.08 грн |
| 10+ | 143.06 грн |
| 100+ | 114.98 грн |
| 500+ | 101.95 грн |
| 1000+ | 84.48 грн |
| MC9S08SH8CWJR |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 20SOIC
Packaging: Cut Tape (CT)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-SOIC
Part Status: Active
Number of I/O: 17
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 8KB FLASH 20SOIC
Packaging: Cut Tape (CT)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-SOIC
Part Status: Active
Number of I/O: 17
DigiKey Programmable: Not Verified
товар відсутній
| MC34674DEPR2 |
|
Виробник: NXP USA Inc.
Description: IC BATT CHG LI-ION 1CELL 8UDFN
Description: IC BATT CHG LI-ION 1CELL 8UDFN
на замовлення 2649 шт:
термін постачання 21-31 дні (днів)| MPXM2053GST1 |
|
Виробник: NXP USA Inc.
Description: SENSOR 7.25PSIG 0.12" .04V 5MPAK
Packaging: Cut Tape (CT)
Features: Temperature Compensated
Package / Case: 5-SMD Module, Top Port
Output Type: Wheatstone Bridge
Mounting Type: Surface Mount
Output: 0 mV ~ 40 mV (10V)
Operating Pressure: 7.25PSI (50kPa)
Pressure Type: Vented Gauge
Accuracy: -0.6% ~ 0.4%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 10V ~ 16V
Port Size: Male - 0.12" (2.97mm) Tube
Applications: Board Mount
Supplier Device Package: 5-MPAK
Port Style: Barbless
Maximum Pressure: 29.01PSI (200kPa)
Part Status: Active
Description: SENSOR 7.25PSIG 0.12" .04V 5MPAK
Packaging: Cut Tape (CT)
Features: Temperature Compensated
Package / Case: 5-SMD Module, Top Port
Output Type: Wheatstone Bridge
Mounting Type: Surface Mount
Output: 0 mV ~ 40 mV (10V)
Operating Pressure: 7.25PSI (50kPa)
Pressure Type: Vented Gauge
Accuracy: -0.6% ~ 0.4%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 10V ~ 16V
Port Size: Male - 0.12" (2.97mm) Tube
Applications: Board Mount
Supplier Device Package: 5-MPAK
Port Style: Barbless
Maximum Pressure: 29.01PSI (200kPa)
Part Status: Active
на замовлення 4188 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 916.16 грн |
| 10+ | 698.83 грн |
| 25+ | 662.03 грн |
| 100+ | 535 грн |
| SC16C752BIB48,128 |
|
Виробник: NXP USA Inc.
Description: IC DUAL UART 64BYTE 48LQFP
Packaging: Cut Tape (CT)
Package / Case: 48-LQFP
Number of Channels: 2, DUART
Mounting Type: Surface Mount
Voltage - Supply: 2.5V, 3.3V, 5V
FIFO's: 64 Byte
Data Rate (Max): 5Mbps
Supplier Device Package: 48-LQFP (7x7)
With Auto Flow Control: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
Part Status: Active
Description: IC DUAL UART 64BYTE 48LQFP
Packaging: Cut Tape (CT)
Package / Case: 48-LQFP
Number of Channels: 2, DUART
Mounting Type: Surface Mount
Voltage - Supply: 2.5V, 3.3V, 5V
FIFO's: 64 Byte
Data Rate (Max): 5Mbps
Supplier Device Package: 48-LQFP (7x7)
With Auto Flow Control: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
Part Status: Active
на замовлення 5245 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 596.08 грн |
| 10+ | 394.77 грн |
| 25+ | 348.53 грн |
| 100+ | 278.54 грн |
| 250+ | 255 грн |
| 500+ | 240.66 грн |
| 1000+ | 225.01 грн |
| PCF8551BTT/AJ |
|
Виробник: NXP USA Inc.
Description: IC DRVR 7 SEGMENT 48TSSOP
Packaging: Cut Tape (CT)
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Display Type: LCD
Mounting Type: Surface Mount
Interface: SPI
Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: 9 Characters, 18 Characters, 144 Elements
Supplier Device Package: 48-TSSOP
Current - Supply: 1.2 µA
Description: IC DRVR 7 SEGMENT 48TSSOP
Packaging: Cut Tape (CT)
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Display Type: LCD
Mounting Type: Surface Mount
Interface: SPI
Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: 9 Characters, 18 Characters, 144 Elements
Supplier Device Package: 48-TSSOP
Current - Supply: 1.2 µA
товар відсутній
| TJA1027TK/20,118 |
|
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER 1/1 8HVSON
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 18V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 175 mV
Part Status: Active
Description: IC TRANSCEIVER 1/1 8HVSON
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 18V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 175 mV
Part Status: Active
на замовлення 2863 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 4+ | 88.96 грн |
| 10+ | 76.29 грн |
| 25+ | 72.39 грн |
| 100+ | 55.8 грн |
| 250+ | 52.16 грн |
| 500+ | 46.1 грн |
| 1000+ | 35.79 грн |
| 2500+ | 33.41 грн |
| BAP142LX,315 |
|
Виробник: NXP USA Inc.
Description: RF DIODE PIN 50V 130MW SOD2
Packaging: Cut Tape (CT)
Package / Case: SOD-882
Diode Type: PIN - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.26pF @ 20V, 1MHz
Resistance @ If, F: 1.3Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: SOD2
Current - Max: 100 mA
Power Dissipation (Max): 130 mW
Description: RF DIODE PIN 50V 130MW SOD2
Packaging: Cut Tape (CT)
Package / Case: SOD-882
Diode Type: PIN - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.26pF @ 20V, 1MHz
Resistance @ If, F: 1.3Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: SOD2
Current - Max: 100 mA
Power Dissipation (Max): 130 mW
товар відсутній
| LPC11A04UK,118 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 20WLCSP
Packaging: Cut Tape (CT)
Package / Case: 20-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.6V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 20-WLCSP (2.55x2.55)
Part Status: Active
Number of I/O: 18
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 20WLCSP
Packaging: Cut Tape (CT)
Package / Case: 20-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.6V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 20-WLCSP (2.55x2.55)
Part Status: Active
Number of I/O: 18
DigiKey Programmable: Not Verified
на замовлення 56081 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 330.73 грн |
| 10+ | 248.86 грн |
| 100+ | 203.87 грн |
| 500+ | 187.29 грн |
| 1000+ | 172.73 грн |
| TDA8551T/N1,118 |
|
Виробник: NXP USA Inc.
Description: IC AMP CLASS AB MONO 1.4W 8SO
Packaging: Cut Tape (CT)
Features: Depop, Mute, Short-Circuit and Thermal Protection, Standby, Volume Control
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: 1-Channel (Mono)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Max Output Power x Channels @ Load: 1.4W x 1 @ 8Ohm
Supplier Device Package: 8-SO
Part Status: Obsolete
Description: IC AMP CLASS AB MONO 1.4W 8SO
Packaging: Cut Tape (CT)
Features: Depop, Mute, Short-Circuit and Thermal Protection, Standby, Volume Control
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: 1-Channel (Mono)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Max Output Power x Channels @ Load: 1.4W x 1 @ 8Ohm
Supplier Device Package: 8-SO
Part Status: Obsolete
товар відсутній
| S9KEAZN64AMLHR |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 57
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 57
DigiKey Programmable: Not Verified
на замовлення 9967 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 356.58 грн |
| 10+ | 268.18 грн |
| 100+ | 219.69 грн |
| 500+ | 201.83 грн |
| LPC812M101JDH16J |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 16TSSOP
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Part Status: Active
Number of I/O: 14
DigiKey Programmable: Verified
Description: IC MCU 32BIT 16KB FLASH 16TSSOP
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Part Status: Active
Number of I/O: 14
DigiKey Programmable: Verified
на замовлення 4099 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 3+ | 141.42 грн |
| 10+ | 106.53 грн |
| 100+ | 85.61 грн |
| 500+ | 75.91 грн |
| 1000+ | 62.9 грн |
| GTL2000DGG,118 |
|
Виробник: NXP USA Inc.
Description: IC TRANSLATOR BIDIR 48TSSOP
Features: Auto-Direction Sensing
Packaging: Cut Tape (CT)
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 48-TSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 22
Voltage - VCCA: 1 V ~ 5.5 V
Voltage - VCCB: 1 V ~ 5.5 V
Part Status: Obsolete
Number of Circuits: 1
Description: IC TRANSLATOR BIDIR 48TSSOP
Features: Auto-Direction Sensing
Packaging: Cut Tape (CT)
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 48-TSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 22
Voltage - VCCA: 1 V ~ 5.5 V
Voltage - VCCB: 1 V ~ 5.5 V
Part Status: Obsolete
Number of Circuits: 1
товар відсутній
| LPC824M201JHI33Y |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 29
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 29
DigiKey Programmable: Not Verified
на замовлення 18683 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 206.8 грн |
| 10+ | 156.02 грн |
| 100+ | 125.39 грн |
| 500+ | 111.18 грн |
| 1000+ | 92.12 грн |
| 2500+ | 85.77 грн |
| TDA8037TT/C1J |
|
Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 16TSSOP
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Voltage - Supply: 3.3V
Applications: Smart Card
Supplier Device Package: 16-TSSOP
Part Status: Active
Description: IC INTERFACE SPECIALIZED 16TSSOP
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Voltage - Supply: 3.3V
Applications: Smart Card
Supplier Device Package: 16-TSSOP
Part Status: Active
товар відсутній
| LPC1111FHN33/102'5 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 8KB FLASH 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
на замовлення 12200 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 162.7 грн |
| 10+ | 122.49 грн |
| 100+ | 98.49 грн |
| 500+ | 87.33 грн |
| 1000+ | 76.39 грн |
| A2V07H400-04NR3 |
|
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 48V OM780G-4
Packaging: Tape & Reel (TR)
Package / Case: OM-780G-4L
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 595MHz ~ 851MHz
Configuration: Dual
Power - Output: 267W
Gain: 19.9dB
Technology: LDMOS
Supplier Device Package: OM-780G-4L
Part Status: Active
Voltage - Rated: 105 V
Voltage - Test: 48 V
Current - Test: 700 mA
Description: RF MOSFET LDMOS 48V OM780G-4
Packaging: Tape & Reel (TR)
Package / Case: OM-780G-4L
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 595MHz ~ 851MHz
Configuration: Dual
Power - Output: 267W
Gain: 19.9dB
Technology: LDMOS
Supplier Device Package: OM-780G-4L
Part Status: Active
Voltage - Rated: 105 V
Voltage - Test: 48 V
Current - Test: 700 mA
товар відсутній
| A3T18H455W23SR6 |
|
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 30V ACP1230S-4
Packaging: Tape & Reel (TR)
Package / Case: ACP-1230S-4L2S
Current Rating (Amps): 10µA
Mounting Type: Chassis Mount
Frequency: 1.805GHz ~ 1.88GHz
Configuration: Dual
Power - Output: 192W
Gain: 16.7dB
Technology: LDMOS
Supplier Device Package: ACP-1230S-4L2S
Voltage - Rated: 65 V
Voltage - Test: 30 V
Current - Test: 600 mA
Description: RF MOSFET LDMOS 30V ACP1230S-4
Packaging: Tape & Reel (TR)
Package / Case: ACP-1230S-4L2S
Current Rating (Amps): 10µA
Mounting Type: Chassis Mount
Frequency: 1.805GHz ~ 1.88GHz
Configuration: Dual
Power - Output: 192W
Gain: 16.7dB
Technology: LDMOS
Supplier Device Package: ACP-1230S-4L2S
Voltage - Rated: 65 V
Voltage - Test: 30 V
Current - Test: 600 mA
товар відсутній
| FS32K142HAT0MLHT |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 58
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 58
DigiKey Programmable: Not Verified
на замовлення 74 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 781.59 грн |
| 10+ | 590.91 грн |