Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (35443) > Сторінка 310 з 591
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
LPC4337JET256Y | NXP USA Inc. |
 Description: IC MCU 32BIT 1MB FLASH 256LBGAPackaging: Tray Package / Case: 256-LBGA Mounting Type: Surface Mount Speed: 204MHz Program Memory Size: 1MB (1M x 8) RAM Size: 136K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 16K x 8 Core Processor: ARM® Cortex®-M4/M0 Data Converters: A/D 8x10b; D/A 1x10b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Supplier Device Package: 256-LBGA (17x17) Part Status: Active Number of I/O: 164 DigiKey Programmable: Not Verified |
товар відсутній |
|||||||||||||
 |
LPC844M201JHI33E | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 32HVQFN Packaging: Tray Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 30MHz Program Memory Size: 64KB (64K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 12x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 32-HVQFN (5x5) Number of I/O: 29 DigiKey Programmable: Not Verified |
на замовлення 490 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||
 |
LPC845M301JHI33E | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 32HVQFN Packaging: Tray Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 30MHz Program Memory Size: 64KB (64K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 12x12b; D/A 1x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I²C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 32-HVQFN (5x5) Number of I/O: 29 DigiKey Programmable: Not Verified |
товар відсутній |
|||||||||||||
 |
MC35FS4502CAE | NXP USA Inc. |
Description: FS4500 Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Part Status: Active |
товар відсутній |
|||||||||||||
 |
MC35FS4502CAER2 | NXP USA Inc. |
Description: FS4500 Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Grade: Automotive Qualification: AEC-Q100 |
товар відсутній |
|||||||||||||
|
|
MC35FS4502NAE | NXP USA Inc. |
Description: FS4500 |
товар відсутній |
|||||||||||||
|
|
MC35FS4502NAER2 | NXP USA Inc. |
Description: FS4500 Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Grade: Automotive Qualification: AEC-Q100 |
товар відсутній |
|||||||||||||
|
|
MC35FS4503NAER2 | NXP USA Inc. |
Description: FS4500 Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Grade: Automotive Qualification: AEC-Q100 |
товар відсутній |
|||||||||||||
|
|
MC35FS6510CAE | NXP USA Inc. |
Description: FS6500 Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Part Status: Active Grade: Automotive Qualification: AEC-Q100 |
товар відсутній |
|||||||||||||
|
|
MC35FS6510CAER2 | NXP USA Inc. |
Description: FS6500 Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Part Status: Active Grade: Automotive Qualification: AEC-Q100 |
товар відсутній |
|||||||||||||
| MCIMX6X1AVO08ACR | NXP USA Inc. |
Description: I.MX6SX AUTO ROM P ENHAN |
товар відсутній |
||||||||||||||
 |
MMRF5017HSR5 | NXP USA Inc. |
Description: RF MOSFET HEMT 50V NI400 Packaging: Tray Package / Case: NI-400S-2S Mounting Type: Surface Mount Frequency: 30MHz ~ 2.2GHz Power - Output: 125W Gain: 18.4dB Technology: HEMT Supplier Device Package: NI-400S-2S Part Status: Active Voltage - Rated: 150 V Voltage - Test: 50 V Current - Test: 200 mA |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||
 |
MRF13750H-915MHZ | NXP USA Inc. |
Description: MRF13750H REF BRD 915MHZ 750W Packaging: Bulk For Use With/Related Products: MRF13750H Frequency: 902MHz ~ 928MHz Type: Transistor Supplied Contents: Board(s) Part Status: Active |
товар відсутній |
|||||||||||||
 |
MRF13750HR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS 50V NI1230 Packaging: Tape & Reel (TR) Package / Case: SOT-979A Current Rating (Amps): 10µA Mounting Type: Chassis Mount Frequency: 700MHz ~ 1.3GHz Configuration: Dual Power - Output: 650W Gain: 20.6dB Technology: LDMOS Supplier Device Package: NI-1230-4H Part Status: Active Voltage - Rated: 105 V Voltage - Test: 50 V |
товар відсутній |
|||||||||||||
 |
MRF13750HSR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS 50V NI1230 Packaging: Tape & Reel (TR) Package / Case: NI-1230-4S Current Rating (Amps): 10µA Mounting Type: Chassis Mount Frequency: 700MHz ~ 1.3GHz Power - Output: 750W Gain: 20.4dB Technology: LDMOS Supplier Device Package: NI-1230-4S Part Status: Active Voltage - Rated: 105 V Voltage - Test: 50 V Current - Test: 200 mA |
товар відсутній |
|||||||||||||
| NX30P6093UKZ | NXP USA Inc. |
Description: IC PWR SWITCH P-CHAN 1:1 20WLCSP Packaging: Tape & Reel (TR) Features: Slew Rate Controlled Package / Case: 20-UFBGA, WLCSP Output Type: P-Channel Mounting Type: Surface Mount Number of Outputs: 1 Interface: I²C Switch Type: USB Switch Operating Temperature: -40°C ~ 85°C (TA) Rds On (Typ): 8.95mOhm Voltage - Load: 2.8V ~ 20V Voltage - Supply (Vcc/Vdd): 3V ~ 4.5V Current - Output (Max): 8A Ratio - Input:Output: 1:1 Supplier Device Package: 20-WLCSP (2.16x1.7) Fault Protection: Over Temperature, Over Voltage Part Status: Obsolete |
товар відсутній |
||||||||||||||
| OM11056UL | NXP USA Inc. |
Description: PCA8885 AND PCF8885 EVALUATION B Packaging: Bulk Interface: I2C, Serial Voltage - Supply: 3.3V or 5V Sensor Type: Touch, Capacitive Utilized IC / Part: PCx8885 Supplied Contents: Board(s) Part Status: Obsolete |
товар відсутній |
||||||||||||||
| OM11057AUL | NXP USA Inc. |
Description: ADD-ONBOARD 2X8885 DIRECT SENSIN Packaging: Bulk Sensor Type: Touch, Capacitive Utilized IC / Part: PCA8886, PCF8885 Supplied Contents: Board(s) Sensing Range: 4 Buttons/Keys, Scroll Wheel, Slider Part Status: Obsolete |
товар відсутній |
||||||||||||||
| OM11064UL | NXP USA Inc. |
Description: PTN3460 DP-LVDS DEMO BOARD Packaging: Bulk Function: Video Processing Type: Video Utilized IC / Part: PTN3460 Supplied Contents: Board(s) Primary Attributes: DisplayPort to LVDS |
товар відсутній |
||||||||||||||
| OM13257,598 | NXP USA Inc. |
Description: UNIVERSAL TEMPERATURE SENSOR DAU |
товар відсутній |
||||||||||||||
| OM13315,598 | NXP USA Inc. |
Description: NVT2001GM/2002DP DEMO BOARD Packaging: Bulk Function: Logic-Level Translator Type: Interface Utilized IC / Part: NVT2001 Supplied Contents: Board(s) Part Status: Active Contents: Board(s) |
товар відсутній |
||||||||||||||
| OM13316,598 | NXP USA Inc. |
Description: NVT2003DP/04TL/06PW DEMOBD Packaging: Bulk Function: Logic-Level Translator Type: Interface Utilized IC / Part: NVT2003 Supplied Contents: Board(s) |
товар відсутній |
||||||||||||||
| OM13317,598 | NXP USA Inc. |
Description: NVT2008PW/10PW DEMOBRD Packaging: Bulk Function: Logic-Level Translator Type: Interface Utilized IC / Part: NVT2008 Supplied Contents: Board(s) Contents: Board(s) |
товар відсутній |
||||||||||||||
| OM13318,598 | NXP USA Inc. |
Description: NVT2002DP DEMOBOARD Packaging: Bulk Function: Logic-Level Translator Type: Interface Utilized IC / Part: NVT2002 Supplied Contents: Board(s) Contents: Board(s) |
товар відсутній |
||||||||||||||
| OM13319,598 | NXP USA Inc. |
Description: NVT2003DP DEMOBOARD Packaging: Bulk Function: Logic-Level Translator Type: Interface Utilized IC / Part: NVT2003 Supplied Contents: Board(s) Contents: Board(s) |
товар відсутній |
||||||||||||||
| OM13323,598 | NXP USA Inc. |
Description: NVT2006PW DEMOBOARD Packaging: Bulk Function: Logic-Level Translator Type: Interface Utilized IC / Part: NVT2006 Supplied Contents: Board(s) Contents: Board(s) |
товар відсутній |
||||||||||||||
| OM13324,598 | NXP USA Inc. |
Description: NVT2010PW DEMOBOARD Packaging: Bulk Function: Logic-Level Translator Type: Interface Utilized IC / Part: NVT2010 Supplied Contents: Board(s) Contents: Board(s) |
товар відсутній |
||||||||||||||
| OM13327,598 | NXP USA Inc. |
Description: PCA9634 DEMO BOARD |
товар відсутній |
||||||||||||||
| OM13329,598 | NXP USA Inc. |
Description: PCA9952 LED DEMO BOARD Packaging: Bulk Features: Dimmable Utilized IC / Part: PCA9952 Supplied Contents: Board(s) Outputs and Type: 16, Non-Isolated Part Status: Active |
товар відсутній |
||||||||||||||
| OM13330,598 | NXP USA Inc. |
Description: PCA9955 LED DEMO BOARD |
товар відсутній |
||||||||||||||
| OM13332,598 | NXP USA Inc. |
Description: PCA9685 PWM DEMO BOARD Packaging: Bulk Features: Dimmable Utilized IC / Part: PCA9685 Supplied Contents: Board(s) Outputs and Type: 16 Non-Isolated Outputs Part Status: Active |
товар відсутній |
||||||||||||||
| OM13333,598 | NXP USA Inc. |
Description: PCA9635 PWM DEMO BOARD Packaging: Bulk Utilized IC / Part: PCA9635 Supplied Contents: Board(s) Outputs and Type: 16, Non-Isolated |
товар відсутній |
||||||||||||||
| OM13481UL | NXP USA Inc. |
Description: NVT4555BS SIM CARD LT/LDO HVQFN1 |
товар відсутній |
||||||||||||||
 |
OM13488UL | NXP USA Inc. |
Description: UNIVERSAL 8-BIT GPIO DAUGHTER CA Packaging: Bulk Function: GPIO Type: Interface Supplied Contents: Board(s) Part Status: Active |
товар відсутній |
|||||||||||||
 |
OM13489UL | NXP USA Inc. |
Description: UNIVERSAL 16-BIT GPIO DAUGHTER C Packaging: Bulk Function: GPIO Type: Interface Supplied Contents: Board(s) Part Status: Active |
товар відсутній |
|||||||||||||
 |
OM13491UL | NXP USA Inc. |
Description: SURFACE MOUNT TO DIP EVALUATION Packaging: Bulk Number of Positions: 8 Quantity: 42 Pieces (5 Values - Mixed Quantities) Kit Type: Adapter, Breakout Boards Specifications: SMD to DIP Package Accepted: HWSON, MSOP, SO, VSSOP, XQFN Part Status: Active |
товар відсутній |
|||||||||||||
 |
OM13492UL | NXP USA Inc. |
Description: SURFACE MOUNT TO DIP EVALUATION Packaging: Bulk Number of Positions: 6, 8, 10 Quantity: 42 Pieces (7 Values - 6 Each) Kit Type: Adapter, Breakout Boards Specifications: SMD to DIP Package Accepted: HVSON, MSOP, PCT, TSOP, TSSOP, XSON, WLCSP |
товар відсутній |
|||||||||||||
 |
OM13493UL | NXP USA Inc. |
Description: SURFACE MOUNT TO DIP EVALUATION Packaging: Bulk Number of Positions: 14, 16, 20, 24 Quantity: 24 Pieces (4 Values - 6 Each) Kit Type: Adapter, Breakout Boards Specifications: SMD to DIP Package Accepted: DHVQFN |
товар відсутній |
|||||||||||||
| OM13494UL | NXP USA Inc. |
Description: SURFACE MOUNT TO DIP EVALUATION Packaging: Bulk Number of Positions: 16, 20, 24 Quantity: 24 Pieces (4 Values - 6 Each) Kit Type: Adapter, Breakout Boards Specifications: SMD to DIP Package Accepted: HVQFN |
товар відсутній |
||||||||||||||
| OM13495UL | NXP USA Inc. |
Description: SURFACE MOUNT TO DIP EVALUATION Packaging: Bulk Number of Positions: 14, 16, 20, 24 Quantity: 24 Pieces (4 Values - 6 Each) Kit Type: Adapter, Breakout Boards Specifications: SMD to DIP Package Accepted: TSSOP |
товар відсутній |
||||||||||||||
| OM13496UL | NXP USA Inc. |
Description: SURFACE MOUNT TO DIP EVALUATION Packaging: Bulk Number of Positions: 16, 28 Quantity: 23 Pieces (4 Values - Mixed Quantities) Kit Type: Adapter, Breakout Boards Specifications: SMD to DIP Package Accepted: QSOP, TSSOP28, XFBGA, XQFN Part Status: Active |
товар відсутній |
||||||||||||||
| OM13497UL | NXP USA Inc. |
Description: SURFACE MOUNT TO DIP EVALUATION Packaging: Bulk Number of Positions: 24 Quantity: 18 Pieces (3 Values - 6 Each) Kit Type: Adapter, Breakout Boards Specifications: SMD to DIP Package Accepted: HTSSOP, VFBGA, XFBGA |
товар відсутній |
||||||||||||||
| OM13506UL | NXP USA Inc. |
Description: PCF8553 LCD DEMO BOARD |
товар відсутній |
||||||||||||||
| OM13511UL | NXP USA Inc. |
Description: PCF8523 DEMOBOARD Packaging: Bulk Function: Real Time Clock (RTC) Type: Timing Utilized IC / Part: PCF8523 Supplied Contents: Board(s) Part Status: Active |
товар відсутній |
||||||||||||||
 |
OM13513UL | NXP USA Inc. |
Description: PCF2127 PCF2129AT DEMOBOARD Packaging: Bulk Function: Real Time Clock (RTC) Type: Timing Utilized IC / Part: PCF2127T, PCF2129AT Supplied Contents: Board(s) Contents: Board(s) |
товар відсутній |
|||||||||||||
| OM13516UL | NXP USA Inc. |
Description: PCF85263B EVALUATION BOARD Packaging: Bulk Function: Real Time Clock (RTC) Type: Timing Utilized IC / Part: PCF85263B Supplied Contents: Board(s) Contents: Board(s) |
товар відсутній |
||||||||||||||
| OM13517UL | NXP USA Inc. |
Description: PCA21125 DEMOBOARD Packaging: Bulk Function: Real Time Clock (RTC) Type: Timing Utilized IC / Part: PCA21125 Supplied Contents: Board(s) |
товар відсутній |
||||||||||||||
| OM13519UL | NXP USA Inc. |
Description: PCA8565 DEMOBOARD Packaging: Bulk Function: Real Time Clock (RTC) Type: Timing Utilized IC / Part: PCA8565 Supplied Contents: Board(s) Contents: Board(s) |
товар відсутній |
||||||||||||||
| OM13536UL | NXP USA Inc. |
Description: SA639DH DEMOBOARD Packaging: Bulk For Use With/Related Products: SA639 Type: Mixer Supplied Contents: Board(s) |
товар відсутній |
||||||||||||||
| OM13537UL | NXP USA Inc. |
Description: SA630D DEMOBOARD Packaging: Bulk For Use With/Related Products: SA630 Frequency: 0Hz ~ 1GHz Type: Switch, SPDT Supplied Contents: Board(s) |
товар відсутній |
||||||||||||||
 |
OM13561JP | NXP USA Inc. |
Description: DP-LVDS EVALUATION KIT FOR PTN34 Packaging: Bulk Function: Video Processing Type: Video Utilized IC / Part: PTN3460 Supplied Contents: Board(s) Primary Attributes: DisplayPort to LVDS Part Status: Active |
товар відсутній |
|||||||||||||
| OM40004UL | NXP USA Inc. |
Description: LPC845 CAPACITIVE TOUCH DEV. KIT Packaging: Bulk Sensor Type: Touch, Capacitive Utilized IC / Part: LPC845 Supplied Contents: Board(s) Part Status: Active |
на замовлення 25 шт: термін постачання 21-31 дні (днів) |
|
|||||||||||||
 |
PCAL6408AEX1Z | NXP USA Inc. |
Description: IC XPND 400KHZ I2C SMBUS 16X2QFN Packaging: Tape & Reel (TR) Features: POR Package / Case: 16-XFLGA Output Type: Open Drain, Push-Pull Mounting Type: Surface Mount Interface: I2C, SMBus Number of I/O: 8 Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.65V ~ 5.5V Clock Frequency: 400 kHz Interrupt Output: Yes Supplier Device Package: 16-X2QFN (1.6x1.6) Current - Output Source/Sink: 10mA, 25mA Part Status: Active DigiKey Programmable: Not Verified |
на замовлення 30000 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||
 |
S32K148EVB-Q176 | NXP USA Inc. |
Description: S32K148 EVAL BRD Packaging: Bulk Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: ARM® Cortex®-M4F Utilized IC / Part: S32K148 Part Status: Active |
на замовлення 6 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||
 |
S9S12G128ACLH | NXP USA Inc. |
Description: IC MCU 16BIT 128KB FLASH 64LQFP |
товар відсутній |
|||||||||||||
 |
S9S12G128ACLHR | NXP USA Inc. |
Description: IC MCU 16BIT 128KB FLASH 64LQFP Packaging: Tape & Reel (TR) Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 128KB (128K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: 12V1 Data Converters: A/D 12x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 54 |
товар відсутній |
|||||||||||||
 |
S9S12G96ACLHR | NXP USA Inc. |
Description: IC MCU 16BIT 96KB FLASH 64LQFP Packaging: Tape & Reel (TR) Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 96KB (96K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 3K x 8 Core Processor: 12V1 Data Converters: A/D 12x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 54 DigiKey Programmable: Not Verified |
товар відсутній |
|||||||||||||
 |
S9S12G96ACLL | NXP USA Inc. | Description: IC MCU 16BIT 96KB FLASH 100LQFP |
товар відсутній |
|||||||||||||
 |
S9S12GN32ACFT | NXP USA Inc. | Description: IC MCU 16BIT 32KB FLASH 48QFN |
товар відсутній |
|||||||||||||
 |
S9S12GN32ACFTR | NXP USA Inc. |
Description: IC MCU 16BIT 32KB FLASH 48QFN Packaging: Tape & Reel (TR) Package / Case: 48-TFQFN Exposed Pad Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 32KB (32K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 1K x 8 Core Processor: 12V1 Data Converters: A/D 8x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Connectivity: IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-QFN-EP (7x7) Number of I/O: 40 DigiKey Programmable: Not Verified |
товар відсутній |
| LPC4337JET256Y |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 256LBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 204MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 256-LBGA (17x17)
Part Status: Active
Number of I/O: 164
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 256LBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 204MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 256-LBGA (17x17)
Part Status: Active
Number of I/O: 164
DigiKey Programmable: Not Verified
товар відсутній
| LPC844M201JHI33E |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 29
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 29
DigiKey Programmable: Not Verified
на замовлення 490 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 264.56 грн |
| 10+ | 167.39 грн |
| 25+ | 144.59 грн |
| 80+ | 114.96 грн |
| 230+ | 100.93 грн |
| 490+ | 93.04 грн |
| LPC845M301JHI33E |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 29
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 29
DigiKey Programmable: Not Verified
товар відсутній
| MC35FS4502CAE |
|
Виробник: NXP USA Inc.
Description: FS4500
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
Description: FS4500
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
товар відсутній
| MC35FS4502CAER2 |
|
Виробник: NXP USA Inc.
Description: FS4500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: FS4500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
товар відсутній
| MC35FS4502NAER2 |
|
Виробник: NXP USA Inc.
Description: FS4500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: FS4500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
товар відсутній
| MC35FS4503NAER2 |
|
Виробник: NXP USA Inc.
Description: FS4500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: FS4500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
товар відсутній
| MC35FS6510CAE |
|
Виробник: NXP USA Inc.
Description: FS6500
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
Description: FS6500
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
товар відсутній
| MC35FS6510CAER2 |
|
Виробник: NXP USA Inc.
Description: FS6500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
Description: FS6500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
товар відсутній
| MMRF5017HSR5 |
|
Виробник: NXP USA Inc.
Description: RF MOSFET HEMT 50V NI400
Packaging: Tray
Package / Case: NI-400S-2S
Mounting Type: Surface Mount
Frequency: 30MHz ~ 2.2GHz
Power - Output: 125W
Gain: 18.4dB
Technology: HEMT
Supplier Device Package: NI-400S-2S
Part Status: Active
Voltage - Rated: 150 V
Voltage - Test: 50 V
Current - Test: 200 mA
Description: RF MOSFET HEMT 50V NI400
Packaging: Tray
Package / Case: NI-400S-2S
Mounting Type: Surface Mount
Frequency: 30MHz ~ 2.2GHz
Power - Output: 125W
Gain: 18.4dB
Technology: HEMT
Supplier Device Package: NI-400S-2S
Part Status: Active
Voltage - Rated: 150 V
Voltage - Test: 50 V
Current - Test: 200 mA
на замовлення 1 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 15317.39 грн |
| MRF13750H-915MHZ |
|
Виробник: NXP USA Inc.
Description: MRF13750H REF BRD 915MHZ 750W
Packaging: Bulk
For Use With/Related Products: MRF13750H
Frequency: 902MHz ~ 928MHz
Type: Transistor
Supplied Contents: Board(s)
Part Status: Active
Description: MRF13750H REF BRD 915MHZ 750W
Packaging: Bulk
For Use With/Related Products: MRF13750H
Frequency: 902MHz ~ 928MHz
Type: Transistor
Supplied Contents: Board(s)
Part Status: Active
товар відсутній
| MRF13750HR5 |
|
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Tape & Reel (TR)
Package / Case: SOT-979A
Current Rating (Amps): 10µA
Mounting Type: Chassis Mount
Frequency: 700MHz ~ 1.3GHz
Configuration: Dual
Power - Output: 650W
Gain: 20.6dB
Technology: LDMOS
Supplier Device Package: NI-1230-4H
Part Status: Active
Voltage - Rated: 105 V
Voltage - Test: 50 V
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Tape & Reel (TR)
Package / Case: SOT-979A
Current Rating (Amps): 10µA
Mounting Type: Chassis Mount
Frequency: 700MHz ~ 1.3GHz
Configuration: Dual
Power - Output: 650W
Gain: 20.6dB
Technology: LDMOS
Supplier Device Package: NI-1230-4H
Part Status: Active
Voltage - Rated: 105 V
Voltage - Test: 50 V
товар відсутній
| MRF13750HSR5 |
|
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230-4S
Current Rating (Amps): 10µA
Mounting Type: Chassis Mount
Frequency: 700MHz ~ 1.3GHz
Power - Output: 750W
Gain: 20.4dB
Technology: LDMOS
Supplier Device Package: NI-1230-4S
Part Status: Active
Voltage - Rated: 105 V
Voltage - Test: 50 V
Current - Test: 200 mA
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230-4S
Current Rating (Amps): 10µA
Mounting Type: Chassis Mount
Frequency: 700MHz ~ 1.3GHz
Power - Output: 750W
Gain: 20.4dB
Technology: LDMOS
Supplier Device Package: NI-1230-4S
Part Status: Active
Voltage - Rated: 105 V
Voltage - Test: 50 V
Current - Test: 200 mA
товар відсутній
| NX30P6093UKZ |
|
Виробник: NXP USA Inc.
Description: IC PWR SWITCH P-CHAN 1:1 20WLCSP
Packaging: Tape & Reel (TR)
Features: Slew Rate Controlled
Package / Case: 20-UFBGA, WLCSP
Output Type: P-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: I²C
Switch Type: USB Switch
Operating Temperature: -40°C ~ 85°C (TA)
Rds On (Typ): 8.95mOhm
Voltage - Load: 2.8V ~ 20V
Voltage - Supply (Vcc/Vdd): 3V ~ 4.5V
Current - Output (Max): 8A
Ratio - Input:Output: 1:1
Supplier Device Package: 20-WLCSP (2.16x1.7)
Fault Protection: Over Temperature, Over Voltage
Part Status: Obsolete
Description: IC PWR SWITCH P-CHAN 1:1 20WLCSP
Packaging: Tape & Reel (TR)
Features: Slew Rate Controlled
Package / Case: 20-UFBGA, WLCSP
Output Type: P-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: I²C
Switch Type: USB Switch
Operating Temperature: -40°C ~ 85°C (TA)
Rds On (Typ): 8.95mOhm
Voltage - Load: 2.8V ~ 20V
Voltage - Supply (Vcc/Vdd): 3V ~ 4.5V
Current - Output (Max): 8A
Ratio - Input:Output: 1:1
Supplier Device Package: 20-WLCSP (2.16x1.7)
Fault Protection: Over Temperature, Over Voltage
Part Status: Obsolete
товар відсутній
| OM11056UL |
|
Виробник: NXP USA Inc.
Description: PCA8885 AND PCF8885 EVALUATION B
Packaging: Bulk
Interface: I2C, Serial
Voltage - Supply: 3.3V or 5V
Sensor Type: Touch, Capacitive
Utilized IC / Part: PCx8885
Supplied Contents: Board(s)
Part Status: Obsolete
Description: PCA8885 AND PCF8885 EVALUATION B
Packaging: Bulk
Interface: I2C, Serial
Voltage - Supply: 3.3V or 5V
Sensor Type: Touch, Capacitive
Utilized IC / Part: PCx8885
Supplied Contents: Board(s)
Part Status: Obsolete
товар відсутній
| OM11057AUL |
|
Виробник: NXP USA Inc.
Description: ADD-ONBOARD 2X8885 DIRECT SENSIN
Packaging: Bulk
Sensor Type: Touch, Capacitive
Utilized IC / Part: PCA8886, PCF8885
Supplied Contents: Board(s)
Sensing Range: 4 Buttons/Keys, Scroll Wheel, Slider
Part Status: Obsolete
Description: ADD-ONBOARD 2X8885 DIRECT SENSIN
Packaging: Bulk
Sensor Type: Touch, Capacitive
Utilized IC / Part: PCA8886, PCF8885
Supplied Contents: Board(s)
Sensing Range: 4 Buttons/Keys, Scroll Wheel, Slider
Part Status: Obsolete
товар відсутній
| OM11064UL |
Виробник: NXP USA Inc.
Description: PTN3460 DP-LVDS DEMO BOARD
Packaging: Bulk
Function: Video Processing
Type: Video
Utilized IC / Part: PTN3460
Supplied Contents: Board(s)
Primary Attributes: DisplayPort to LVDS
Description: PTN3460 DP-LVDS DEMO BOARD
Packaging: Bulk
Function: Video Processing
Type: Video
Utilized IC / Part: PTN3460
Supplied Contents: Board(s)
Primary Attributes: DisplayPort to LVDS
товар відсутній
| OM13315,598 |
|
Виробник: NXP USA Inc.
Description: NVT2001GM/2002DP DEMO BOARD
Packaging: Bulk
Function: Logic-Level Translator
Type: Interface
Utilized IC / Part: NVT2001
Supplied Contents: Board(s)
Part Status: Active
Contents: Board(s)
Description: NVT2001GM/2002DP DEMO BOARD
Packaging: Bulk
Function: Logic-Level Translator
Type: Interface
Utilized IC / Part: NVT2001
Supplied Contents: Board(s)
Part Status: Active
Contents: Board(s)
товар відсутній
| OM13316,598 |
|
Виробник: NXP USA Inc.
Description: NVT2003DP/04TL/06PW DEMOBD
Packaging: Bulk
Function: Logic-Level Translator
Type: Interface
Utilized IC / Part: NVT2003
Supplied Contents: Board(s)
Description: NVT2003DP/04TL/06PW DEMOBD
Packaging: Bulk
Function: Logic-Level Translator
Type: Interface
Utilized IC / Part: NVT2003
Supplied Contents: Board(s)
товар відсутній
| OM13317,598 |
|
Виробник: NXP USA Inc.
Description: NVT2008PW/10PW DEMOBRD
Packaging: Bulk
Function: Logic-Level Translator
Type: Interface
Utilized IC / Part: NVT2008
Supplied Contents: Board(s)
Contents: Board(s)
Description: NVT2008PW/10PW DEMOBRD
Packaging: Bulk
Function: Logic-Level Translator
Type: Interface
Utilized IC / Part: NVT2008
Supplied Contents: Board(s)
Contents: Board(s)
товар відсутній
| OM13318,598 |
|
Виробник: NXP USA Inc.
Description: NVT2002DP DEMOBOARD
Packaging: Bulk
Function: Logic-Level Translator
Type: Interface
Utilized IC / Part: NVT2002
Supplied Contents: Board(s)
Contents: Board(s)
Description: NVT2002DP DEMOBOARD
Packaging: Bulk
Function: Logic-Level Translator
Type: Interface
Utilized IC / Part: NVT2002
Supplied Contents: Board(s)
Contents: Board(s)
товар відсутній
| OM13319,598 |
|
Виробник: NXP USA Inc.
Description: NVT2003DP DEMOBOARD
Packaging: Bulk
Function: Logic-Level Translator
Type: Interface
Utilized IC / Part: NVT2003
Supplied Contents: Board(s)
Contents: Board(s)
Description: NVT2003DP DEMOBOARD
Packaging: Bulk
Function: Logic-Level Translator
Type: Interface
Utilized IC / Part: NVT2003
Supplied Contents: Board(s)
Contents: Board(s)
товар відсутній
| OM13323,598 |
|
Виробник: NXP USA Inc.
Description: NVT2006PW DEMOBOARD
Packaging: Bulk
Function: Logic-Level Translator
Type: Interface
Utilized IC / Part: NVT2006
Supplied Contents: Board(s)
Contents: Board(s)
Description: NVT2006PW DEMOBOARD
Packaging: Bulk
Function: Logic-Level Translator
Type: Interface
Utilized IC / Part: NVT2006
Supplied Contents: Board(s)
Contents: Board(s)
товар відсутній
| OM13324,598 |
|
Виробник: NXP USA Inc.
Description: NVT2010PW DEMOBOARD
Packaging: Bulk
Function: Logic-Level Translator
Type: Interface
Utilized IC / Part: NVT2010
Supplied Contents: Board(s)
Contents: Board(s)
Description: NVT2010PW DEMOBOARD
Packaging: Bulk
Function: Logic-Level Translator
Type: Interface
Utilized IC / Part: NVT2010
Supplied Contents: Board(s)
Contents: Board(s)
товар відсутній
| OM13329,598 |
|
Виробник: NXP USA Inc.
Description: PCA9952 LED DEMO BOARD
Packaging: Bulk
Features: Dimmable
Utilized IC / Part: PCA9952
Supplied Contents: Board(s)
Outputs and Type: 16, Non-Isolated
Part Status: Active
Description: PCA9952 LED DEMO BOARD
Packaging: Bulk
Features: Dimmable
Utilized IC / Part: PCA9952
Supplied Contents: Board(s)
Outputs and Type: 16, Non-Isolated
Part Status: Active
товар відсутній
| OM13332,598 |
|
Виробник: NXP USA Inc.
Description: PCA9685 PWM DEMO BOARD
Packaging: Bulk
Features: Dimmable
Utilized IC / Part: PCA9685
Supplied Contents: Board(s)
Outputs and Type: 16 Non-Isolated Outputs
Part Status: Active
Description: PCA9685 PWM DEMO BOARD
Packaging: Bulk
Features: Dimmable
Utilized IC / Part: PCA9685
Supplied Contents: Board(s)
Outputs and Type: 16 Non-Isolated Outputs
Part Status: Active
товар відсутній
| OM13333,598 |
|
Виробник: NXP USA Inc.
Description: PCA9635 PWM DEMO BOARD
Packaging: Bulk
Utilized IC / Part: PCA9635
Supplied Contents: Board(s)
Outputs and Type: 16, Non-Isolated
Description: PCA9635 PWM DEMO BOARD
Packaging: Bulk
Utilized IC / Part: PCA9635
Supplied Contents: Board(s)
Outputs and Type: 16, Non-Isolated
товар відсутній
| OM13488UL |
|
Виробник: NXP USA Inc.
Description: UNIVERSAL 8-BIT GPIO DAUGHTER CA
Packaging: Bulk
Function: GPIO
Type: Interface
Supplied Contents: Board(s)
Part Status: Active
Description: UNIVERSAL 8-BIT GPIO DAUGHTER CA
Packaging: Bulk
Function: GPIO
Type: Interface
Supplied Contents: Board(s)
Part Status: Active
товар відсутній
| OM13489UL |
|
Виробник: NXP USA Inc.
Description: UNIVERSAL 16-BIT GPIO DAUGHTER C
Packaging: Bulk
Function: GPIO
Type: Interface
Supplied Contents: Board(s)
Part Status: Active
Description: UNIVERSAL 16-BIT GPIO DAUGHTER C
Packaging: Bulk
Function: GPIO
Type: Interface
Supplied Contents: Board(s)
Part Status: Active
товар відсутній
| OM13491UL |
|
Виробник: NXP USA Inc.
Description: SURFACE MOUNT TO DIP EVALUATION
Packaging: Bulk
Number of Positions: 8
Quantity: 42 Pieces (5 Values - Mixed Quantities)
Kit Type: Adapter, Breakout Boards
Specifications: SMD to DIP
Package Accepted: HWSON, MSOP, SO, VSSOP, XQFN
Part Status: Active
Description: SURFACE MOUNT TO DIP EVALUATION
Packaging: Bulk
Number of Positions: 8
Quantity: 42 Pieces (5 Values - Mixed Quantities)
Kit Type: Adapter, Breakout Boards
Specifications: SMD to DIP
Package Accepted: HWSON, MSOP, SO, VSSOP, XQFN
Part Status: Active
товар відсутній
| OM13492UL |
|
Виробник: NXP USA Inc.
Description: SURFACE MOUNT TO DIP EVALUATION
Packaging: Bulk
Number of Positions: 6, 8, 10
Quantity: 42 Pieces (7 Values - 6 Each)
Kit Type: Adapter, Breakout Boards
Specifications: SMD to DIP
Package Accepted: HVSON, MSOP, PCT, TSOP, TSSOP, XSON, WLCSP
Description: SURFACE MOUNT TO DIP EVALUATION
Packaging: Bulk
Number of Positions: 6, 8, 10
Quantity: 42 Pieces (7 Values - 6 Each)
Kit Type: Adapter, Breakout Boards
Specifications: SMD to DIP
Package Accepted: HVSON, MSOP, PCT, TSOP, TSSOP, XSON, WLCSP
товар відсутній
| OM13493UL |
|
Виробник: NXP USA Inc.
Description: SURFACE MOUNT TO DIP EVALUATION
Packaging: Bulk
Number of Positions: 14, 16, 20, 24
Quantity: 24 Pieces (4 Values - 6 Each)
Kit Type: Adapter, Breakout Boards
Specifications: SMD to DIP
Package Accepted: DHVQFN
Description: SURFACE MOUNT TO DIP EVALUATION
Packaging: Bulk
Number of Positions: 14, 16, 20, 24
Quantity: 24 Pieces (4 Values - 6 Each)
Kit Type: Adapter, Breakout Boards
Specifications: SMD to DIP
Package Accepted: DHVQFN
товар відсутній
| OM13494UL |
|
Виробник: NXP USA Inc.
Description: SURFACE MOUNT TO DIP EVALUATION
Packaging: Bulk
Number of Positions: 16, 20, 24
Quantity: 24 Pieces (4 Values - 6 Each)
Kit Type: Adapter, Breakout Boards
Specifications: SMD to DIP
Package Accepted: HVQFN
Description: SURFACE MOUNT TO DIP EVALUATION
Packaging: Bulk
Number of Positions: 16, 20, 24
Quantity: 24 Pieces (4 Values - 6 Each)
Kit Type: Adapter, Breakout Boards
Specifications: SMD to DIP
Package Accepted: HVQFN
товар відсутній
| OM13495UL |
|
Виробник: NXP USA Inc.
Description: SURFACE MOUNT TO DIP EVALUATION
Packaging: Bulk
Number of Positions: 14, 16, 20, 24
Quantity: 24 Pieces (4 Values - 6 Each)
Kit Type: Adapter, Breakout Boards
Specifications: SMD to DIP
Package Accepted: TSSOP
Description: SURFACE MOUNT TO DIP EVALUATION
Packaging: Bulk
Number of Positions: 14, 16, 20, 24
Quantity: 24 Pieces (4 Values - 6 Each)
Kit Type: Adapter, Breakout Boards
Specifications: SMD to DIP
Package Accepted: TSSOP
товар відсутній
| OM13496UL |
|
Виробник: NXP USA Inc.
Description: SURFACE MOUNT TO DIP EVALUATION
Packaging: Bulk
Number of Positions: 16, 28
Quantity: 23 Pieces (4 Values - Mixed Quantities)
Kit Type: Adapter, Breakout Boards
Specifications: SMD to DIP
Package Accepted: QSOP, TSSOP28, XFBGA, XQFN
Part Status: Active
Description: SURFACE MOUNT TO DIP EVALUATION
Packaging: Bulk
Number of Positions: 16, 28
Quantity: 23 Pieces (4 Values - Mixed Quantities)
Kit Type: Adapter, Breakout Boards
Specifications: SMD to DIP
Package Accepted: QSOP, TSSOP28, XFBGA, XQFN
Part Status: Active
товар відсутній
| OM13497UL |
|
Виробник: NXP USA Inc.
Description: SURFACE MOUNT TO DIP EVALUATION
Packaging: Bulk
Number of Positions: 24
Quantity: 18 Pieces (3 Values - 6 Each)
Kit Type: Adapter, Breakout Boards
Specifications: SMD to DIP
Package Accepted: HTSSOP, VFBGA, XFBGA
Description: SURFACE MOUNT TO DIP EVALUATION
Packaging: Bulk
Number of Positions: 24
Quantity: 18 Pieces (3 Values - 6 Each)
Kit Type: Adapter, Breakout Boards
Specifications: SMD to DIP
Package Accepted: HTSSOP, VFBGA, XFBGA
товар відсутній
| OM13511UL |
|
Виробник: NXP USA Inc.
Description: PCF8523 DEMOBOARD
Packaging: Bulk
Function: Real Time Clock (RTC)
Type: Timing
Utilized IC / Part: PCF8523
Supplied Contents: Board(s)
Part Status: Active
Description: PCF8523 DEMOBOARD
Packaging: Bulk
Function: Real Time Clock (RTC)
Type: Timing
Utilized IC / Part: PCF8523
Supplied Contents: Board(s)
Part Status: Active
товар відсутній
| OM13513UL |
|
Виробник: NXP USA Inc.
Description: PCF2127 PCF2129AT DEMOBOARD
Packaging: Bulk
Function: Real Time Clock (RTC)
Type: Timing
Utilized IC / Part: PCF2127T, PCF2129AT
Supplied Contents: Board(s)
Contents: Board(s)
Description: PCF2127 PCF2129AT DEMOBOARD
Packaging: Bulk
Function: Real Time Clock (RTC)
Type: Timing
Utilized IC / Part: PCF2127T, PCF2129AT
Supplied Contents: Board(s)
Contents: Board(s)
товар відсутній
| OM13516UL |
|
Виробник: NXP USA Inc.
Description: PCF85263B EVALUATION BOARD
Packaging: Bulk
Function: Real Time Clock (RTC)
Type: Timing
Utilized IC / Part: PCF85263B
Supplied Contents: Board(s)
Contents: Board(s)
Description: PCF85263B EVALUATION BOARD
Packaging: Bulk
Function: Real Time Clock (RTC)
Type: Timing
Utilized IC / Part: PCF85263B
Supplied Contents: Board(s)
Contents: Board(s)
товар відсутній
| OM13517UL |
Виробник: NXP USA Inc.
Description: PCA21125 DEMOBOARD
Packaging: Bulk
Function: Real Time Clock (RTC)
Type: Timing
Utilized IC / Part: PCA21125
Supplied Contents: Board(s)
Description: PCA21125 DEMOBOARD
Packaging: Bulk
Function: Real Time Clock (RTC)
Type: Timing
Utilized IC / Part: PCA21125
Supplied Contents: Board(s)
товар відсутній
| OM13519UL |
|
Виробник: NXP USA Inc.
Description: PCA8565 DEMOBOARD
Packaging: Bulk
Function: Real Time Clock (RTC)
Type: Timing
Utilized IC / Part: PCA8565
Supplied Contents: Board(s)
Contents: Board(s)
Description: PCA8565 DEMOBOARD
Packaging: Bulk
Function: Real Time Clock (RTC)
Type: Timing
Utilized IC / Part: PCA8565
Supplied Contents: Board(s)
Contents: Board(s)
товар відсутній
| OM13536UL |
|
Виробник: NXP USA Inc.
Description: SA639DH DEMOBOARD
Packaging: Bulk
For Use With/Related Products: SA639
Type: Mixer
Supplied Contents: Board(s)
Description: SA639DH DEMOBOARD
Packaging: Bulk
For Use With/Related Products: SA639
Type: Mixer
Supplied Contents: Board(s)
товар відсутній
| OM13537UL |
|
Виробник: NXP USA Inc.
Description: SA630D DEMOBOARD
Packaging: Bulk
For Use With/Related Products: SA630
Frequency: 0Hz ~ 1GHz
Type: Switch, SPDT
Supplied Contents: Board(s)
Description: SA630D DEMOBOARD
Packaging: Bulk
For Use With/Related Products: SA630
Frequency: 0Hz ~ 1GHz
Type: Switch, SPDT
Supplied Contents: Board(s)
товар відсутній
| OM13561JP |
Виробник: NXP USA Inc.
Description: DP-LVDS EVALUATION KIT FOR PTN34
Packaging: Bulk
Function: Video Processing
Type: Video
Utilized IC / Part: PTN3460
Supplied Contents: Board(s)
Primary Attributes: DisplayPort to LVDS
Part Status: Active
Description: DP-LVDS EVALUATION KIT FOR PTN34
Packaging: Bulk
Function: Video Processing
Type: Video
Utilized IC / Part: PTN3460
Supplied Contents: Board(s)
Primary Attributes: DisplayPort to LVDS
Part Status: Active
товар відсутній
| OM40004UL |
|
Виробник: NXP USA Inc.
Description: LPC845 CAPACITIVE TOUCH DEV. KIT
Packaging: Bulk
Sensor Type: Touch, Capacitive
Utilized IC / Part: LPC845
Supplied Contents: Board(s)
Part Status: Active
Description: LPC845 CAPACITIVE TOUCH DEV. KIT
Packaging: Bulk
Sensor Type: Touch, Capacitive
Utilized IC / Part: LPC845
Supplied Contents: Board(s)
Part Status: Active
на замовлення 25 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 5786.14 грн |
| PCAL6408AEX1Z |
|
Виробник: NXP USA Inc.
Description: IC XPND 400KHZ I2C SMBUS 16X2QFN
Packaging: Tape & Reel (TR)
Features: POR
Package / Case: 16-XFLGA
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-X2QFN (1.6x1.6)
Current - Output Source/Sink: 10mA, 25mA
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC XPND 400KHZ I2C SMBUS 16X2QFN
Packaging: Tape & Reel (TR)
Features: POR
Package / Case: 16-XFLGA
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-X2QFN (1.6x1.6)
Current - Output Source/Sink: 10mA, 25mA
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 30000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 5000+ | 39.65 грн |
| S32K148EVB-Q176 |
|
Виробник: NXP USA Inc.
Description: S32K148 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M4F
Utilized IC / Part: S32K148
Part Status: Active
Description: S32K148 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M4F
Utilized IC / Part: S32K148
Part Status: Active
на замовлення 6 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 15189 грн |
| S9S12G128ACLHR |
|
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 54
Description: IC MCU 16BIT 128KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 54
товар відсутній
| S9S12G96ACLHR |
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 96KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 3K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 96KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 3K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
товар відсутній
| S9S12GN32ACFTR |
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 48QFN
Packaging: Tape & Reel (TR)
Package / Case: 48-TFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: 12V1
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 32KB FLASH 48QFN
Packaging: Tape & Reel (TR)
Package / Case: 48-TFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: 12V1
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
товар відсутній