Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (35267) > Сторінка 218 з 588
| Фото | Назва | Виробник | Інформація |
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SPC5668EK0MMG | NXP USA Inc. |
 Description: IC MCU 32BIT 2MB FLASH 208MAPBGAPackaging: Tray Package / Case: 208-BGA Mounting Type: Surface Mount Speed: 116MHz Program Memory Size: 2MB (2M x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z650 Data Converters: A/D 64x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 208-BGA (17x17) Part Status: Active Number of I/O: 155 DigiKey Programmable: Not Verified |
на замовлення 450 шт: термін постачання 21-31 дні (днів) |
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SPC5668GF1AMMG | NXP USA Inc. |
Description: IC MCU 32BIT 2MB FLASH 208MAPBGA Packaging: Tray Package / Case: 208-BGA Mounting Type: Surface Mount Speed: 116MHz Program Memory Size: 2MB (2M x 8) RAM Size: 592K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z650 Data Converters: A/D 36x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 208-BGA (17x17) Number of I/O: 155 DigiKey Programmable: Not Verified |
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SPC5668GK0VMG | NXP USA Inc. |
Description: IC MCU 32BIT 2MB FLASH 208MAPBGA |
на замовлення 450 шт: термін постачання 21-31 дні (днів) |
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SPC5674FF3MVR3 | NXP USA Inc. |
Description: IC MCU 32BIT 4MB FLASH 416PBGA Packaging: Tray Package / Case: 416-BBGA Mounting Type: Surface Mount Speed: 264MHz Program Memory Size: 4MB (4M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: e200z7 Data Converters: A/D 64x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.08V ~ 5.25V Connectivity: CANbus, SCI, SPI Peripherals: DMA, POR, PWM Supplier Device Package: 416-PBGA (27x27) Part Status: Active Number of I/O: 32 DigiKey Programmable: Not Verified |
на замовлення 200 шт: термін постачання 21-31 дні (днів) |
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SPC5674KF0VMS2 | NXP USA Inc. |
Description: IC MCU 32B 1.5MB FLASH 473MAPBGA Packaging: Tray Package / Case: 473-LFBGA Mounting Type: Surface Mount Speed: 180MHz Program Memory Size: 1.5MB (1.5M x 8) RAM Size: 384K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z7d Data Converters: A/D 34x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 473-MAPBGA (19x19) Part Status: Active DigiKey Programmable: Not Verified |
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SPC5674KF0VMS2R | NXP USA Inc. |
Description: IC MCU 32B 1.5MB FLASH 473MAPBGA Packaging: Tray Package / Case: 473-LFBGA Mounting Type: Surface Mount Speed: 180MHz Program Memory Size: 1.5MB (1.5M x 8) RAM Size: 384K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z7d Data Converters: A/D 34x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 473-MAPBGA (19x19) Part Status: Active DigiKey Programmable: Not Verified |
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SPC5674KFF0MMS2 | NXP USA Inc. |
Description: IC MCU 32B 1.5MB FLASH 473MAPBGA Packaging: Tray Package / Case: 473-LFBGA Mounting Type: Surface Mount Speed: 180MHz Program Memory Size: 1.5MB (1.5M x 8) RAM Size: 384K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z7d Data Converters: A/D 34x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 473-MAPBGA (19x19) DigiKey Programmable: Not Verified |
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SPC5674KFF0MMS2R | NXP USA Inc. |
Description: IC MCU 32B 1.5MB FLASH 473MAPBGA Packaging: Tray Package / Case: 473-LFBGA Mounting Type: Surface Mount Speed: 180MHz Program Memory Size: 1.5MB (1.5M x 8) RAM Size: 384K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z7d Data Converters: A/D 34x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 473-MAPBGA (19x19) DigiKey Programmable: Not Verified |
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SPC5674KFF0VMS2 | NXP USA Inc. |
Description: IC MCU 32B 1.5MB FLASH 473MAPBGA Packaging: Tray Package / Case: 473-LFBGA Mounting Type: Surface Mount Speed: 180MHz Program Memory Size: 1.5MB (1.5M x 8) RAM Size: 384K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z7d Data Converters: A/D 34x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 473-MAPBGA (19x19) DigiKey Programmable: Not Verified |
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SPC5674KFF0VMS2R | NXP USA Inc. |
Description: IC MCU 32B 1.5MB FLASH 473MAPBGA Packaging: Tray Package / Case: 473-LFBGA Mounting Type: Surface Mount Speed: 180MHz Program Memory Size: 1.5MB (1.5M x 8) RAM Size: 384K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z7d Data Converters: A/D 34x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 473-MAPBGA (19x19) DigiKey Programmable: Not Verified |
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SPC5675KFF0MMM2 | NXP USA Inc. |
Description: IC MCU 32BIT 2MB FLASH 257MAPBGA Packaging: Tray Package / Case: 257-LFBGA Mounting Type: Surface Mount Speed: 180MHz Program Memory Size: 2MB (2M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z7d Data Converters: A/D 22x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 257-LFBGA (14x14) Part Status: Active |
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SPC5675KFF0MMS2 | NXP USA Inc. |
Description: IC MCU 32BIT 2MB FLASH 473MAPBGA Packaging: Tray Package / Case: 473-LFBGA Mounting Type: Surface Mount Speed: 180MHz Program Memory Size: 2MB (2M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z7d Data Converters: A/D 34x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 473-MAPBGA (19x19) Part Status: Active DigiKey Programmable: Not Verified |
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SPC5675KFF0MMS2R | NXP USA Inc. |
Description: IC MCU 32BIT 2MB FLASH 473MAPBGA Packaging: Tray Package / Case: 473-LFBGA Mounting Type: Surface Mount Speed: 180MHz Program Memory Size: 2MB (2M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z7d Data Converters: A/D 34x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 473-MAPBGA (19x19) DigiKey Programmable: Not Verified |
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SPC5675KFF0VMS2 | NXP USA Inc. |
Description: IC MCU 32BIT 2MB FLASH 473MAPBGA Packaging: Tray Package / Case: 473-LFBGA Mounting Type: Surface Mount Speed: 180MHz Program Memory Size: 2MB (2M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z7d Data Converters: A/D 34x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 473-MAPBGA (19x19) DigiKey Programmable: Not Verified |
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SPC5675KFF0VMS2R | NXP USA Inc. |
Description: IC MCU 32BIT 2MB FLASH 473MAPBGA Packaging: Tray Package / Case: 473-LFBGA Mounting Type: Surface Mount Speed: 180MHz Program Memory Size: 2MB (2M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z7d Data Converters: A/D 34x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 473-MAPBGA (19x19) DigiKey Programmable: Not Verified |
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MC33186HVW2 | NXP USA Inc. |
Description: IC HALF BRIDGE DRIVER 5A 20HSOP Features: Status Flag Packaging: Tube Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad Mounting Type: Surface Mount Interface: Logic Operating Temperature: -40°C ~ 150°C (TJ) Output Configuration: Half Bridge (2) Voltage - Supply: 5V ~ 28V Rds On (Typ): 150mOhm Applications: DC Motors, General Purpose, Solenoids Current - Output / Channel: 5A Technology: Bi-CMOS Voltage - Load: 5V ~ 28V Supplier Device Package: 20-HSOP Fault Protection: Current Limiting, Over Temperature, Over Voltage, Short Circuit, UVLO Load Type: Inductive Part Status: Obsolete |
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MC33689DPEW | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 32SOIC Packaging: Tube Package / Case: 32-BSSOP (0.295", 7.50mm Width) Mounting Type: Surface Mount Interface: SPI Serial Voltage - Supply: 5.5V ~ 18V Applications: Mirror Control Supplier Device Package: 32-SOIC Grade: Automotive |
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MC33880PEG | NXP USA Inc. |
Description: IC PWR SWITCH N-CHAN 1:8 28SOIC |
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MC33880PEW | NXP USA Inc. |
Description: IC PWR SWITCH N-CHAN 1:8 32SOIC |
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MC33899VW | NXP USA Inc. |
Description: IC MOTOR DRVR 4.75V-5.25V 30HSOP Packaging: Tube Package / Case: 30-BSOP (0.433", 11.00mm Width) Exposed Pad Mounting Type: Surface Mount Function: Driver - Fully Integrated, Control and Power Stage Interface: SPI Operating Temperature: -40°C ~ 150°C (TJ) Output Configuration: Half Bridge (2) Voltage - Supply: 4.75V ~ 5.25V Applications: General Purpose Technology: Power MOSFET Voltage - Load: 6V ~ 26.5V Supplier Device Package: 30-HSOP Motor Type - AC, DC: Brushed DC Part Status: Obsolete |
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MC33931EK | NXP USA Inc. |
Description: IC MOTOR DRIVER 5V-28V 32SOIC Packaging: Tube Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Mounting Type: Surface Mount Function: Driver - Fully Integrated, Control and Power Stage Current - Output: 5A Interface: Parallel Operating Temperature: -40°C ~ 125°C (TA) Output Configuration: Half Bridge (2) Voltage - Supply: 5V ~ 28V Technology: CMOS Voltage - Load: 5V ~ 28V Supplier Device Package: 32-SOIC-EP Motor Type - AC, DC: Brushed DC Grade: Automotive Part Status: Active |
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MC33932EK | NXP USA Inc. |
Description: IC MOTOR DRIVER 5V-28V 54SOIC |
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MCZ33812AEK | NXP USA Inc. |
Description: IC DVR IGNITION/INJECTOR 32SOIC |
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MCZ33903CP5EK | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 32SOIC |
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MCZ33903CS5EK | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 32SOIC |
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MCZ33904C3EK | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 32SOIC Packaging: Tube Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Mounting Type: Surface Mount Interface: CAN Voltage - Supply: 5.5V ~ 28V Applications: System Basis Chip Supplier Device Package: 32-SOIC-EP |
на замовлення 17 шт: термін постачання 21-31 дні (днів) |
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| MMA1210KEG | NXP USA Inc. |
Description: ACCEL 112.5G ANALOG 16SOIC |
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| MMA1211KEG | NXP USA Inc. |
Description: ACCELEROMETER 169G ANALOG 16SOIC Packaging: Tube Package / Case: 16-SOIC (0.295", 7.50mm Width) Output Type: Analog Voltage Mounting Type: Surface Mount Type: Analog Axis: Z Acceleration Range: ±169g Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 4.75V ~ 5.25V Bandwidth: 400Hz Supplier Device Package: 16-SOIC Sensitivity (mV/g): 13.33 Part Status: Active |
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| MMA1251KEG | NXP USA Inc. |
Description: ACCELEROMETER 5G ANALOG 16SOIC |
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| MMA1254KEG | NXP USA Inc. |
Description: ACCELEROMETER 5G ANALOG 16SOIC Packaging: Tube Package / Case: 16-SOIC (0.295", 7.50mm Width) Output Type: Analog Voltage Mounting Type: Surface Mount Type: Analog Axis: Z Acceleration Range: ±5g Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 4.75V ~ 5.25V Bandwidth: 50Hz Supplier Device Package: 16-SOIC Sensitivity (mV/g): 400 Part Status: Obsolete |
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MMA2202KEG | NXP USA Inc. |
Description: ACCEL 56.3G ANALOG 16SOIC Packaging: Tube Package / Case: 16-SOIC (0.295", 7.50mm Width) Output Type: Analog Voltage Mounting Type: Surface Mount Type: Analog Axis: X Acceleration Range: ±56.3g Operating Temperature: -40°C ~ 125°C Voltage - Supply: 4.75V ~ 5.25V Bandwidth: 400Hz Supplier Device Package: 16-SOIC Sensitivity (mV/g): 40 Grade: Automotive Qualification: AEC-Q100 |
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| MMA2204KEG | NXP USA Inc. |
Description: ACCEL 112.5G ANALOG 16SOIC |
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| MMA2241KEG | NXP USA Inc. |
Description: ACCELEROMETER 10G ANALOG 16SOIC Packaging: Tube Package / Case: 16-SOIC (0.295", 7.50mm Width) Output Type: Analog Voltage Mounting Type: Surface Mount Type: Analog Axis: X Acceleration Range: ±10g Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 4.75V ~ 5.25V Bandwidth: 400Hz Supplier Device Package: 16-SOIC Sensitivity (mV/g): 200 Part Status: Obsolete |
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MMA3201KEG | NXP USA Inc. |
Description: ACCELEROMETER 45G ANALOG 20SOIC Packaging: Tube Package / Case: 20-SOIC (0.295", 7.50mm Width) Output Type: Analog Voltage Mounting Type: Surface Mount Type: Analog Axis: X, Y Acceleration Range: ±45g Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 4.75V ~ 5.25V Bandwidth: 400Hz Supplier Device Package: 20-SOIC Sensitivity (mV/g): 50 Grade: Automotive Qualification: AEC-Q100 |
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MMA3202KEG | NXP USA Inc. |
Description: ACCEL 112.5G/56.3G ANALOG 20SOIC |
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| MMA5106KW | NXP USA Inc. |
Description: ACCELEROMETER 60G PCM/SPI 16QFN Packaging: Tube Features: Selectable Low Pass Filter Package / Case: 16-QFN Exposed Pad Output Type: PCM, SPI Mounting Type: Surface Mount Type: Digital Axis: Z Acceleration Range: ±60g Operating Temperature: -40°C ~ 125°C Voltage - Supply: 4.2V ~ 17V Supplier Device Package: 16-QFN (6x6) Sensitivity (LSB/g): 8 Part Status: Active Grade: Automotive Qualification: AEC-Q100 |
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MMA6821BKW | NXP USA Inc. | Description: ACCELEROMETER 120G/25G SPI 16QFN |
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MMA6827BKW | NXP USA Inc. |
Description: ACCELEROMETER 120G SPI 16QFN Packaging: Tube Package / Case: 16-QFN Exposed Pad Output Type: SPI Mounting Type: Surface Mount Type: Digital Axis: X, Y Acceleration Range: ±120g Operating Temperature: -40°C ~ 105°C Voltage - Supply: 3.135V ~ 5.25V Supplier Device Package: 16-QFN (6x6) Sensitivity (LSB/g): 4.096 Grade: Automotive Qualification: AEC-Q100 |
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| MPXV6115V6U | NXP USA Inc. |
Description: SENSOR 16.68PSI 4.6V 8SOP Packaging: Tube Features: Temperature Compensated Package / Case: 8-SMD, Gull Wing Output Type: Analog Voltage Mounting Type: Surface Mount Output: 0.2 V ~ 4.6 V Operating Pressure: -16.68PSI (-115kPa) Pressure Type: Vacuum Accuracy: ±1.5% Operating Temperature: -40°C ~ 125°C Voltage - Supply: 4.75V ~ 5.25V Applications: Board Mount Supplier Device Package: 8-SOP Port Style: Barbless Maximum Pressure: -58.02PSI (-400kPa) |
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MRFE6VS25NR1 | NXP USA Inc. |
Description: RF MOSFET LDMOS 50V TO270-2 Packaging: Cut Tape (CT) Package / Case: TO-270AA Mounting Type: Surface Mount Frequency: 512MHz Power - Output: 25W Gain: 25.4dB Technology: LDMOS Supplier Device Package: TO-270-2 Voltage - Rated: 133 V Voltage - Test: 50 V Current - Test: 10 mA |
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MRFE6VP100HR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS 50V NI780 Packaging: Cut Tape (CT) Package / Case: NI-780-4 Mounting Type: Chassis Mount Frequency: 512MHz Power - Output: 100W Gain: 26dB Technology: LDMOS Supplier Device Package: NI-780-4 Part Status: Active Voltage - Rated: 133 V Voltage - Test: 50 V Current - Test: 100 mA |
на замовлення 27 шт: термін постачання 21-31 дні (днів) |
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PTN36241BBS,115 | NXP USA Inc. |
Description: IC REDRIVER USB 3.0 1CH 24HVQFN Packaging: Cut Tape (CT) Package / Case: 24-VFQFN Exposed Pad Delay Time: 1.0ns Number of Channels: 2 Mounting Type: Surface Mount Type: Buffer, ReDriver Operating Temperature: 0°C ~ 85°C Voltage - Supply: 3V ~ 3.6V Applications: USB 3.0 Current - Supply: 100mA Data Rate (Max): 5Gbps Supplier Device Package: 24-HVQFN (4x4) Signal Conditioning: Input Equalization, Output De-Emphasis Part Status: Active |
на замовлення 4091 шт: термін постачання 21-31 дні (днів) |
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OM11083,598 | NXP USA Inc. |
Description: BOARD BASE FOR LPCXPRESSO MBED Packaging: Box For Use With/Related Products: LPCXpresso Boards, mbed Module Accessory Type: Base Board Part Status: Obsolete |
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OM13038,598 | NXP USA Inc. |
Description: LPC4078 EVAL BRD Packaging: Box Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s), Cable(s), LCD Core Processor: ARM® Cortex®-M4 Board Type: Evaluation Platform Utilized IC / Part: LPC4078 Part Status: Obsolete |
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OM13028,598 | NXP USA Inc. |
Description: XPLORER LPC1830 EVAL BRD Packaging: Box Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s), Cable(s), ULINK-ME™ Programmer Core Processor: ARM® Cortex®-M3 Utilized IC / Part: LPC1830 Platform: Xplorer |
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OM13027,598 | NXP USA Inc. | Description: XPLORER LPC4330 EVAL BRD |
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OM13045,598 | NXP USA Inc. |
Description: LPCXPRESSO LPC1347 EVAL BRD Packaging: Box Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: ARM® Cortex®-M3 Utilized IC / Part: LPC1347 Platform: LPCXpresso™ Part Status: Obsolete |
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TWR-KL25Z48M | NXP USA Inc. |
Description: TOWER SYSTEM KL2X EVAL BRD Packaging: Box Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s), Cable(s) Core Processor: ARM® Cortex®-M0+ Board Type: Evaluation Platform Utilized IC / Part: KL2x Platform: Tower System Part Status: Active |
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MMA8491QR1 | NXP USA Inc. |
Description: ACCELEROMETER 8G I2C 12QFN Packaging: Tape & Reel (TR) Package / Case: 12-TQFN Exposed Pad Output Type: I²C Mounting Type: Surface Mount Type: Digital Axis: X, Y, Z Acceleration Range: ±8G Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.95V ~ 3.6V Bandwidth: 0.5Hz ~ 400Hz Supplier Device Package: 12-QFN (3x3) Sensitivity (LSB/g): 1024 Part Status: Obsolete |
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LFSTBEB865X | NXP USA Inc. |
Description: BOARD EVAL FOR MMA865XFC Packaging: Box Sensitivity: 1024 count/g, 512 count/g, 256 count/g, 128 count/g, 64 count/g Interface: I2C Voltage - Supply: 1.95V ~ 3.6V Sensor Type: Accelerometer, 3 Axis Utilized IC / Part: MMA8652FC, MMA8653FC Supplied Contents: Board(s) Sensing Range: ±2g, 4g, 8g Part Status: Active |
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MK10DX256VMC7 | NXP USA Inc. |
Description: IC MCU 32B 256KB FLASH 121MAPBGA Packaging: Tray Package / Case: 121-LFBGA Mounting Type: Surface Mount Speed: 72MHz Program Memory Size: 256KB (256K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 39x16b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 121-MAPBGA (8x8) Number of I/O: 74 DigiKey Programmable: Not Verified |
на замовлення 359 шт: термін постачання 21-31 дні (днів) |
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MK30DX64VMC7 | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLSH 121MAPBGA Packaging: Tray Package / Case: 121-LFBGA Mounting Type: Surface Mount Speed: 72MHz Program Memory Size: 64KB (64K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 38x16b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, I2C, IrDA, SPI, UART/USART Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT Supplier Device Package: 121-MAPBGA (8x8) Part Status: Active Number of I/O: 74 DigiKey Programmable: Not Verified |
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MK20DX256VMC7 | NXP USA Inc. |
Description: IC MCU 32B 256KB FLASH 121MAPBGA |
товар відсутній |
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MK30DX256VMC7 | NXP USA Inc. |
Description: IC MCU 32B 256KB FLASH 121MAPBGA Packaging: Tray Package / Case: 121-LFBGA Mounting Type: Surface Mount Speed: 72MHz Program Memory Size: 256KB (256K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 38x16b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, I2C, IrDA, SPI, UART/USART Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT Supplier Device Package: 121-MAPBGA (8x8) Number of I/O: 74 DigiKey Programmable: Not Verified |
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MK10DX128VMC7 | NXP USA Inc. |
Description: IC MCU 32B 128KB FLASH 121MAPBGA |
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MMA8652FCR1 | NXP USA Inc. |
Description: ACCELEROMETER 2-8G I2C 10DFN Packaging: Tape & Reel (TR) Features: Sleep Mode Package / Case: 10-VFDFN Output Type: I²C Mounting Type: Surface Mount Type: Digital Axis: X, Y, Z Acceleration Range: ±2g, 4g, 8g Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.95V ~ 3.6V Bandwidth: 0.78Hz ~ 400Hz Supplier Device Package: 10-DFN (2x2) Sensitivity (LSB/g): 1024 (±2g) ~ 256 (±8g) Part Status: Obsolete |
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MMA8652FCR1 | NXP USA Inc. |
Description: ACCELEROMETER 2-8G I2C 10DFN Packaging: Cut Tape (CT) Features: Sleep Mode Package / Case: 10-VFDFN Output Type: I²C Mounting Type: Surface Mount Type: Digital Axis: X, Y, Z Acceleration Range: ±2g, 4g, 8g Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.95V ~ 3.6V Bandwidth: 0.78Hz ~ 400Hz Supplier Device Package: 10-DFN (2x2) Sensitivity (LSB/g): 1024 (±2g) ~ 256 (±8g) Part Status: Obsolete |
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MCIMX6Q5EYM10AC | NXP USA Inc. |
Description: IC MPU I.MX6Q 1.0GHZ 624FCPBGA Packaging: Tray Package / Case: 624-LFBGA, FCBGA Mounting Type: Surface Mount Speed: 1.0GHz Operating Temperature: -20°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 624-FCPBGA (21x21) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (4) Number of Cores/Bus Width: 4 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection SATA: SATA 3Gbps (1) Part Status: Not For New Designs Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART |
на замовлення 119 шт: термін постачання 21-31 дні (днів) |
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MCIMX6S5DVM10AB | NXP USA Inc. |
Description: IC MPU I.MX6S 1.0GHZ 624MAPBGA Packaging: Tray Package / Case: 624-LFBGA Mounting Type: Surface Mount Speed: 1.0GHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 624-MAPBGA (21x21) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (4) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Part Status: Not For New Designs Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART |
на замовлення 190 шт: термін постачання 21-31 дні (днів) |
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MCIMX6U5DVM10AB | NXP USA Inc. |
Description: IC MPU I.MX6DL 1.0GHZ 624MAPBGA Packaging: Tray Package / Case: 624-LFBGA Mounting Type: Surface Mount Speed: 1.0GHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 624-MAPBGA (21x21) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (4) Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Part Status: Not For New Designs Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART |
на замовлення 898 шт: термін постачання 21-31 дні (днів) |
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| SPC5668EK0MMG |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 208MAPBGA
Packaging: Tray
Package / Case: 208-BGA
Mounting Type: Surface Mount
Speed: 116MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z650
Data Converters: A/D 64x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-BGA (17x17)
Part Status: Active
Number of I/O: 155
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 2MB FLASH 208MAPBGA
Packaging: Tray
Package / Case: 208-BGA
Mounting Type: Surface Mount
Speed: 116MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z650
Data Converters: A/D 64x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-BGA (17x17)
Part Status: Active
Number of I/O: 155
DigiKey Programmable: Not Verified
на замовлення 450 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 2572.1 грн |
| 10+ | 2118.16 грн |
| SPC5668GF1AMMG |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 208MAPBGA
Packaging: Tray
Package / Case: 208-BGA
Mounting Type: Surface Mount
Speed: 116MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 592K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z650
Data Converters: A/D 36x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-BGA (17x17)
Number of I/O: 155
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 2MB FLASH 208MAPBGA
Packaging: Tray
Package / Case: 208-BGA
Mounting Type: Surface Mount
Speed: 116MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 592K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z650
Data Converters: A/D 36x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-BGA (17x17)
Number of I/O: 155
DigiKey Programmable: Not Verified
товар відсутній
| SPC5668GK0VMG |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 208MAPBGA
Description: IC MCU 32BIT 2MB FLASH 208MAPBGA
на замовлення 450 шт:
термін постачання 21-31 дні (днів)| SPC5674FF3MVR3 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 416PBGA
Packaging: Tray
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 264MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z7
Data Converters: A/D 64x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.08V ~ 5.25V
Connectivity: CANbus, SCI, SPI
Peripherals: DMA, POR, PWM
Supplier Device Package: 416-PBGA (27x27)
Part Status: Active
Number of I/O: 32
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 4MB FLASH 416PBGA
Packaging: Tray
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 264MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z7
Data Converters: A/D 64x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.08V ~ 5.25V
Connectivity: CANbus, SCI, SPI
Peripherals: DMA, POR, PWM
Supplier Device Package: 416-PBGA (27x27)
Part Status: Active
Number of I/O: 32
DigiKey Programmable: Not Verified
на замовлення 200 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 4446.25 грн |
| 10+ | 4096.85 грн |
| SPC5674KF0VMS2 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32B 1.5MB FLASH 473MAPBGA
Packaging: Tray
Package / Case: 473-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 34x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 473-MAPBGA (19x19)
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC MCU 32B 1.5MB FLASH 473MAPBGA
Packaging: Tray
Package / Case: 473-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 34x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 473-MAPBGA (19x19)
Part Status: Active
DigiKey Programmable: Not Verified
товар відсутній
| SPC5674KF0VMS2R |
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Виробник: NXP USA Inc.
Description: IC MCU 32B 1.5MB FLASH 473MAPBGA
Packaging: Tray
Package / Case: 473-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 34x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 473-MAPBGA (19x19)
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC MCU 32B 1.5MB FLASH 473MAPBGA
Packaging: Tray
Package / Case: 473-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 34x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 473-MAPBGA (19x19)
Part Status: Active
DigiKey Programmable: Not Verified
товар відсутній
| SPC5674KFF0MMS2 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32B 1.5MB FLASH 473MAPBGA
Packaging: Tray
Package / Case: 473-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 34x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 473-MAPBGA (19x19)
DigiKey Programmable: Not Verified
Description: IC MCU 32B 1.5MB FLASH 473MAPBGA
Packaging: Tray
Package / Case: 473-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 34x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 473-MAPBGA (19x19)
DigiKey Programmable: Not Verified
товар відсутній
| SPC5674KFF0MMS2R |
|
Виробник: NXP USA Inc.
Description: IC MCU 32B 1.5MB FLASH 473MAPBGA
Packaging: Tray
Package / Case: 473-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 34x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 473-MAPBGA (19x19)
DigiKey Programmable: Not Verified
Description: IC MCU 32B 1.5MB FLASH 473MAPBGA
Packaging: Tray
Package / Case: 473-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 34x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 473-MAPBGA (19x19)
DigiKey Programmable: Not Verified
товар відсутній
| SPC5674KFF0VMS2 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32B 1.5MB FLASH 473MAPBGA
Packaging: Tray
Package / Case: 473-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 34x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 473-MAPBGA (19x19)
DigiKey Programmable: Not Verified
Description: IC MCU 32B 1.5MB FLASH 473MAPBGA
Packaging: Tray
Package / Case: 473-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 34x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 473-MAPBGA (19x19)
DigiKey Programmable: Not Verified
товар відсутній
| SPC5674KFF0VMS2R |
|
Виробник: NXP USA Inc.
Description: IC MCU 32B 1.5MB FLASH 473MAPBGA
Packaging: Tray
Package / Case: 473-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 34x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 473-MAPBGA (19x19)
DigiKey Programmable: Not Verified
Description: IC MCU 32B 1.5MB FLASH 473MAPBGA
Packaging: Tray
Package / Case: 473-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 34x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 473-MAPBGA (19x19)
DigiKey Programmable: Not Verified
товар відсутній
| SPC5675KFF0MMM2 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 257MAPBGA
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 22x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 257-LFBGA (14x14)
Part Status: Active
Description: IC MCU 32BIT 2MB FLASH 257MAPBGA
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 22x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 257-LFBGA (14x14)
Part Status: Active
товар відсутній
| SPC5675KFF0MMS2 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 473MAPBGA
Packaging: Tray
Package / Case: 473-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 34x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 473-MAPBGA (19x19)
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 2MB FLASH 473MAPBGA
Packaging: Tray
Package / Case: 473-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 34x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 473-MAPBGA (19x19)
Part Status: Active
DigiKey Programmable: Not Verified
товар відсутній
| SPC5675KFF0MMS2R |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 473MAPBGA
Packaging: Tray
Package / Case: 473-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 34x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 473-MAPBGA (19x19)
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 2MB FLASH 473MAPBGA
Packaging: Tray
Package / Case: 473-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 34x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 473-MAPBGA (19x19)
DigiKey Programmable: Not Verified
товар відсутній
| SPC5675KFF0VMS2 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 473MAPBGA
Packaging: Tray
Package / Case: 473-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 34x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 473-MAPBGA (19x19)
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 2MB FLASH 473MAPBGA
Packaging: Tray
Package / Case: 473-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 34x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 473-MAPBGA (19x19)
DigiKey Programmable: Not Verified
товар відсутній
| SPC5675KFF0VMS2R |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 473MAPBGA
Packaging: Tray
Package / Case: 473-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 34x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 473-MAPBGA (19x19)
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 2MB FLASH 473MAPBGA
Packaging: Tray
Package / Case: 473-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 34x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 473-MAPBGA (19x19)
DigiKey Programmable: Not Verified
товар відсутній
| MC33186HVW2 |
|
Виробник: NXP USA Inc.
Description: IC HALF BRIDGE DRIVER 5A 20HSOP
Features: Status Flag
Packaging: Tube
Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: Logic
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Half Bridge (2)
Voltage - Supply: 5V ~ 28V
Rds On (Typ): 150mOhm
Applications: DC Motors, General Purpose, Solenoids
Current - Output / Channel: 5A
Technology: Bi-CMOS
Voltage - Load: 5V ~ 28V
Supplier Device Package: 20-HSOP
Fault Protection: Current Limiting, Over Temperature, Over Voltage, Short Circuit, UVLO
Load Type: Inductive
Part Status: Obsolete
Description: IC HALF BRIDGE DRIVER 5A 20HSOP
Features: Status Flag
Packaging: Tube
Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: Logic
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Half Bridge (2)
Voltage - Supply: 5V ~ 28V
Rds On (Typ): 150mOhm
Applications: DC Motors, General Purpose, Solenoids
Current - Output / Channel: 5A
Technology: Bi-CMOS
Voltage - Load: 5V ~ 28V
Supplier Device Package: 20-HSOP
Fault Protection: Current Limiting, Over Temperature, Over Voltage, Short Circuit, UVLO
Load Type: Inductive
Part Status: Obsolete
товар відсутній
| MC33689DPEW |
|
Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tube
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 5.5V ~ 18V
Applications: Mirror Control
Supplier Device Package: 32-SOIC
Grade: Automotive
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tube
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 5.5V ~ 18V
Applications: Mirror Control
Supplier Device Package: 32-SOIC
Grade: Automotive
товар відсутній
| MC33899VW |
|
Виробник: NXP USA Inc.
Description: IC MOTOR DRVR 4.75V-5.25V 30HSOP
Packaging: Tube
Package / Case: 30-BSOP (0.433", 11.00mm Width) Exposed Pad
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Interface: SPI
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Half Bridge (2)
Voltage - Supply: 4.75V ~ 5.25V
Applications: General Purpose
Technology: Power MOSFET
Voltage - Load: 6V ~ 26.5V
Supplier Device Package: 30-HSOP
Motor Type - AC, DC: Brushed DC
Part Status: Obsolete
Description: IC MOTOR DRVR 4.75V-5.25V 30HSOP
Packaging: Tube
Package / Case: 30-BSOP (0.433", 11.00mm Width) Exposed Pad
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Interface: SPI
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Half Bridge (2)
Voltage - Supply: 4.75V ~ 5.25V
Applications: General Purpose
Technology: Power MOSFET
Voltage - Load: 6V ~ 26.5V
Supplier Device Package: 30-HSOP
Motor Type - AC, DC: Brushed DC
Part Status: Obsolete
товар відсутній
| MC33931EK |
|
Виробник: NXP USA Inc.
Description: IC MOTOR DRIVER 5V-28V 32SOIC
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 5A
Interface: Parallel
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Half Bridge (2)
Voltage - Supply: 5V ~ 28V
Technology: CMOS
Voltage - Load: 5V ~ 28V
Supplier Device Package: 32-SOIC-EP
Motor Type - AC, DC: Brushed DC
Grade: Automotive
Part Status: Active
Description: IC MOTOR DRIVER 5V-28V 32SOIC
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 5A
Interface: Parallel
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Half Bridge (2)
Voltage - Supply: 5V ~ 28V
Technology: CMOS
Voltage - Load: 5V ~ 28V
Supplier Device Package: 32-SOIC-EP
Motor Type - AC, DC: Brushed DC
Grade: Automotive
Part Status: Active
товар відсутній
| MCZ33904C3EK |
|
Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 32-SOIC-EP
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 32-SOIC-EP
на замовлення 17 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 525.37 грн |
| 10+ | 457.22 грн |
| MMA1211KEG |
|
Виробник: NXP USA Inc.
Description: ACCELEROMETER 169G ANALOG 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: Z
Acceleration Range: ±169g
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.75V ~ 5.25V
Bandwidth: 400Hz
Supplier Device Package: 16-SOIC
Sensitivity (mV/g): 13.33
Part Status: Active
Description: ACCELEROMETER 169G ANALOG 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: Z
Acceleration Range: ±169g
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.75V ~ 5.25V
Bandwidth: 400Hz
Supplier Device Package: 16-SOIC
Sensitivity (mV/g): 13.33
Part Status: Active
товар відсутній
| MMA1254KEG |
|
Виробник: NXP USA Inc.
Description: ACCELEROMETER 5G ANALOG 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: Z
Acceleration Range: ±5g
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 4.75V ~ 5.25V
Bandwidth: 50Hz
Supplier Device Package: 16-SOIC
Sensitivity (mV/g): 400
Part Status: Obsolete
Description: ACCELEROMETER 5G ANALOG 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: Z
Acceleration Range: ±5g
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 4.75V ~ 5.25V
Bandwidth: 50Hz
Supplier Device Package: 16-SOIC
Sensitivity (mV/g): 400
Part Status: Obsolete
товар відсутній
| MMA2202KEG |
|
Виробник: NXP USA Inc.
Description: ACCEL 56.3G ANALOG 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: X
Acceleration Range: ±56.3g
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.75V ~ 5.25V
Bandwidth: 400Hz
Supplier Device Package: 16-SOIC
Sensitivity (mV/g): 40
Grade: Automotive
Qualification: AEC-Q100
Description: ACCEL 56.3G ANALOG 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: X
Acceleration Range: ±56.3g
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.75V ~ 5.25V
Bandwidth: 400Hz
Supplier Device Package: 16-SOIC
Sensitivity (mV/g): 40
Grade: Automotive
Qualification: AEC-Q100
товар відсутній
| MMA2241KEG |
|
Виробник: NXP USA Inc.
Description: ACCELEROMETER 10G ANALOG 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: X
Acceleration Range: ±10g
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.75V ~ 5.25V
Bandwidth: 400Hz
Supplier Device Package: 16-SOIC
Sensitivity (mV/g): 200
Part Status: Obsolete
Description: ACCELEROMETER 10G ANALOG 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: X
Acceleration Range: ±10g
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.75V ~ 5.25V
Bandwidth: 400Hz
Supplier Device Package: 16-SOIC
Sensitivity (mV/g): 200
Part Status: Obsolete
товар відсутній
| MMA3201KEG |
|
Виробник: NXP USA Inc.
Description: ACCELEROMETER 45G ANALOG 20SOIC
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: X, Y
Acceleration Range: ±45g
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.75V ~ 5.25V
Bandwidth: 400Hz
Supplier Device Package: 20-SOIC
Sensitivity (mV/g): 50
Grade: Automotive
Qualification: AEC-Q100
Description: ACCELEROMETER 45G ANALOG 20SOIC
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: X, Y
Acceleration Range: ±45g
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.75V ~ 5.25V
Bandwidth: 400Hz
Supplier Device Package: 20-SOIC
Sensitivity (mV/g): 50
Grade: Automotive
Qualification: AEC-Q100
товар відсутній
| MMA5106KW |
|
Виробник: NXP USA Inc.
Description: ACCELEROMETER 60G PCM/SPI 16QFN
Packaging: Tube
Features: Selectable Low Pass Filter
Package / Case: 16-QFN Exposed Pad
Output Type: PCM, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: Z
Acceleration Range: ±60g
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.2V ~ 17V
Supplier Device Package: 16-QFN (6x6)
Sensitivity (LSB/g): 8
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
Description: ACCELEROMETER 60G PCM/SPI 16QFN
Packaging: Tube
Features: Selectable Low Pass Filter
Package / Case: 16-QFN Exposed Pad
Output Type: PCM, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: Z
Acceleration Range: ±60g
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.2V ~ 17V
Supplier Device Package: 16-QFN (6x6)
Sensitivity (LSB/g): 8
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
товар відсутній
| MMA6827BKW |
|
Виробник: NXP USA Inc.
Description: ACCELEROMETER 120G SPI 16QFN
Packaging: Tube
Package / Case: 16-QFN Exposed Pad
Output Type: SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y
Acceleration Range: ±120g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.135V ~ 5.25V
Supplier Device Package: 16-QFN (6x6)
Sensitivity (LSB/g): 4.096
Grade: Automotive
Qualification: AEC-Q100
Description: ACCELEROMETER 120G SPI 16QFN
Packaging: Tube
Package / Case: 16-QFN Exposed Pad
Output Type: SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y
Acceleration Range: ±120g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.135V ~ 5.25V
Supplier Device Package: 16-QFN (6x6)
Sensitivity (LSB/g): 4.096
Grade: Automotive
Qualification: AEC-Q100
товар відсутній
| MPXV6115V6U |
|
Виробник: NXP USA Inc.
Description: SENSOR 16.68PSI 4.6V 8SOP
Packaging: Tube
Features: Temperature Compensated
Package / Case: 8-SMD, Gull Wing
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.2 V ~ 4.6 V
Operating Pressure: -16.68PSI (-115kPa)
Pressure Type: Vacuum
Accuracy: ±1.5%
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.75V ~ 5.25V
Applications: Board Mount
Supplier Device Package: 8-SOP
Port Style: Barbless
Maximum Pressure: -58.02PSI (-400kPa)
Description: SENSOR 16.68PSI 4.6V 8SOP
Packaging: Tube
Features: Temperature Compensated
Package / Case: 8-SMD, Gull Wing
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.2 V ~ 4.6 V
Operating Pressure: -16.68PSI (-115kPa)
Pressure Type: Vacuum
Accuracy: ±1.5%
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.75V ~ 5.25V
Applications: Board Mount
Supplier Device Package: 8-SOP
Port Style: Barbless
Maximum Pressure: -58.02PSI (-400kPa)
товар відсутній
| MRFE6VS25NR1 |
|
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 50V TO270-2
Packaging: Cut Tape (CT)
Package / Case: TO-270AA
Mounting Type: Surface Mount
Frequency: 512MHz
Power - Output: 25W
Gain: 25.4dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 10 mA
Description: RF MOSFET LDMOS 50V TO270-2
Packaging: Cut Tape (CT)
Package / Case: TO-270AA
Mounting Type: Surface Mount
Frequency: 512MHz
Power - Output: 25W
Gain: 25.4dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 10 mA
товар відсутній
| MRFE6VP100HR5 |
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI780
Packaging: Cut Tape (CT)
Package / Case: NI-780-4
Mounting Type: Chassis Mount
Frequency: 512MHz
Power - Output: 100W
Gain: 26dB
Technology: LDMOS
Supplier Device Package: NI-780-4
Part Status: Active
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
Description: RF MOSFET LDMOS 50V NI780
Packaging: Cut Tape (CT)
Package / Case: NI-780-4
Mounting Type: Chassis Mount
Frequency: 512MHz
Power - Output: 100W
Gain: 26dB
Technology: LDMOS
Supplier Device Package: NI-780-4
Part Status: Active
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
на замовлення 27 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 9461.96 грн |
| 10+ | 8681.02 грн |
| 25+ | 8496.34 грн |
| PTN36241BBS,115 |
|
Виробник: NXP USA Inc.
Description: IC REDRIVER USB 3.0 1CH 24HVQFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Delay Time: 1.0ns
Number of Channels: 2
Mounting Type: Surface Mount
Type: Buffer, ReDriver
Operating Temperature: 0°C ~ 85°C
Voltage - Supply: 3V ~ 3.6V
Applications: USB 3.0
Current - Supply: 100mA
Data Rate (Max): 5Gbps
Supplier Device Package: 24-HVQFN (4x4)
Signal Conditioning: Input Equalization, Output De-Emphasis
Part Status: Active
Description: IC REDRIVER USB 3.0 1CH 24HVQFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Delay Time: 1.0ns
Number of Channels: 2
Mounting Type: Surface Mount
Type: Buffer, ReDriver
Operating Temperature: 0°C ~ 85°C
Voltage - Supply: 3V ~ 3.6V
Applications: USB 3.0
Current - Supply: 100mA
Data Rate (Max): 5Gbps
Supplier Device Package: 24-HVQFN (4x4)
Signal Conditioning: Input Equalization, Output De-Emphasis
Part Status: Active
на замовлення 4091 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 3+ | 128.49 грн |
| 10+ | 111.58 грн |
| 25+ | 105.25 грн |
| 100+ | 84.15 грн |
| 250+ | 79.01 грн |
| 500+ | 69.14 грн |
| OM11083,598 |
Виробник: NXP USA Inc.
Description: BOARD BASE FOR LPCXPRESSO MBED
Packaging: Box
For Use With/Related Products: LPCXpresso Boards, mbed Module
Accessory Type: Base Board
Part Status: Obsolete
Description: BOARD BASE FOR LPCXPRESSO MBED
Packaging: Box
For Use With/Related Products: LPCXpresso Boards, mbed Module
Accessory Type: Base Board
Part Status: Obsolete
товар відсутній
| OM13038,598 |
Виробник: NXP USA Inc.
Description: LPC4078 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s), LCD
Core Processor: ARM® Cortex®-M4
Board Type: Evaluation Platform
Utilized IC / Part: LPC4078
Part Status: Obsolete
Description: LPC4078 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s), LCD
Core Processor: ARM® Cortex®-M4
Board Type: Evaluation Platform
Utilized IC / Part: LPC4078
Part Status: Obsolete
товар відсутній
| OM13028,598 |
Виробник: NXP USA Inc.
Description: XPLORER LPC1830 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s), ULINK-ME™ Programmer
Core Processor: ARM® Cortex®-M3
Utilized IC / Part: LPC1830
Platform: Xplorer
Description: XPLORER LPC1830 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s), ULINK-ME™ Programmer
Core Processor: ARM® Cortex®-M3
Utilized IC / Part: LPC1830
Platform: Xplorer
товар відсутній
| OM13045,598 |
Виробник: NXP USA Inc.
Description: LPCXPRESSO LPC1347 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M3
Utilized IC / Part: LPC1347
Platform: LPCXpresso™
Part Status: Obsolete
Description: LPCXPRESSO LPC1347 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M3
Utilized IC / Part: LPC1347
Platform: LPCXpresso™
Part Status: Obsolete
товар відсутній
| TWR-KL25Z48M |
|
Виробник: NXP USA Inc.
Description: TOWER SYSTEM KL2X EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-M0+
Board Type: Evaluation Platform
Utilized IC / Part: KL2x
Platform: Tower System
Part Status: Active
Description: TOWER SYSTEM KL2X EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-M0+
Board Type: Evaluation Platform
Utilized IC / Part: KL2x
Platform: Tower System
Part Status: Active
товар відсутній
| MMA8491QR1 |
|
Виробник: NXP USA Inc.
Description: ACCELEROMETER 8G I2C 12QFN
Packaging: Tape & Reel (TR)
Package / Case: 12-TQFN Exposed Pad
Output Type: I²C
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y, Z
Acceleration Range: ±8G
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.95V ~ 3.6V
Bandwidth: 0.5Hz ~ 400Hz
Supplier Device Package: 12-QFN (3x3)
Sensitivity (LSB/g): 1024
Part Status: Obsolete
Description: ACCELEROMETER 8G I2C 12QFN
Packaging: Tape & Reel (TR)
Package / Case: 12-TQFN Exposed Pad
Output Type: I²C
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y, Z
Acceleration Range: ±8G
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.95V ~ 3.6V
Bandwidth: 0.5Hz ~ 400Hz
Supplier Device Package: 12-QFN (3x3)
Sensitivity (LSB/g): 1024
Part Status: Obsolete
товар відсутній
| LFSTBEB865X |
|
Виробник: NXP USA Inc.
Description: BOARD EVAL FOR MMA865XFC
Packaging: Box
Sensitivity: 1024 count/g, 512 count/g, 256 count/g, 128 count/g, 64 count/g
Interface: I2C
Voltage - Supply: 1.95V ~ 3.6V
Sensor Type: Accelerometer, 3 Axis
Utilized IC / Part: MMA8652FC, MMA8653FC
Supplied Contents: Board(s)
Sensing Range: ±2g, 4g, 8g
Part Status: Active
Description: BOARD EVAL FOR MMA865XFC
Packaging: Box
Sensitivity: 1024 count/g, 512 count/g, 256 count/g, 128 count/g, 64 count/g
Interface: I2C
Voltage - Supply: 1.95V ~ 3.6V
Sensor Type: Accelerometer, 3 Axis
Utilized IC / Part: MMA8652FC, MMA8653FC
Supplied Contents: Board(s)
Sensing Range: ±2g, 4g, 8g
Part Status: Active
товар відсутній
| MK10DX256VMC7 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32B 256KB FLASH 121MAPBGA
Packaging: Tray
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 39x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Number of I/O: 74
DigiKey Programmable: Not Verified
Description: IC MCU 32B 256KB FLASH 121MAPBGA
Packaging: Tray
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 39x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Number of I/O: 74
DigiKey Programmable: Not Verified
на замовлення 359 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 916.92 грн |
| 10+ | 705.49 грн |
| 80+ | 595.88 грн |
| MK30DX64VMC7 |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLSH 121MAPBGA
Packaging: Tray
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 38x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, SPI, UART/USART
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Part Status: Active
Number of I/O: 74
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLSH 121MAPBGA
Packaging: Tray
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 38x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, SPI, UART/USART
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Part Status: Active
Number of I/O: 74
DigiKey Programmable: Not Verified
товар відсутній
| MK30DX256VMC7 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32B 256KB FLASH 121MAPBGA
Packaging: Tray
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 38x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, SPI, UART/USART
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Number of I/O: 74
DigiKey Programmable: Not Verified
Description: IC MCU 32B 256KB FLASH 121MAPBGA
Packaging: Tray
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 38x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, SPI, UART/USART
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Number of I/O: 74
DigiKey Programmable: Not Verified
товар відсутній
| MMA8652FCR1 |
|
Виробник: NXP USA Inc.
Description: ACCELEROMETER 2-8G I2C 10DFN
Packaging: Tape & Reel (TR)
Features: Sleep Mode
Package / Case: 10-VFDFN
Output Type: I²C
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.95V ~ 3.6V
Bandwidth: 0.78Hz ~ 400Hz
Supplier Device Package: 10-DFN (2x2)
Sensitivity (LSB/g): 1024 (±2g) ~ 256 (±8g)
Part Status: Obsolete
Description: ACCELEROMETER 2-8G I2C 10DFN
Packaging: Tape & Reel (TR)
Features: Sleep Mode
Package / Case: 10-VFDFN
Output Type: I²C
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.95V ~ 3.6V
Bandwidth: 0.78Hz ~ 400Hz
Supplier Device Package: 10-DFN (2x2)
Sensitivity (LSB/g): 1024 (±2g) ~ 256 (±8g)
Part Status: Obsolete
товар відсутній
| MMA8652FCR1 |
|
Виробник: NXP USA Inc.
Description: ACCELEROMETER 2-8G I2C 10DFN
Packaging: Cut Tape (CT)
Features: Sleep Mode
Package / Case: 10-VFDFN
Output Type: I²C
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.95V ~ 3.6V
Bandwidth: 0.78Hz ~ 400Hz
Supplier Device Package: 10-DFN (2x2)
Sensitivity (LSB/g): 1024 (±2g) ~ 256 (±8g)
Part Status: Obsolete
Description: ACCELEROMETER 2-8G I2C 10DFN
Packaging: Cut Tape (CT)
Features: Sleep Mode
Package / Case: 10-VFDFN
Output Type: I²C
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.95V ~ 3.6V
Bandwidth: 0.78Hz ~ 400Hz
Supplier Device Package: 10-DFN (2x2)
Sensitivity (LSB/g): 1024 (±2g) ~ 256 (±8g)
Part Status: Obsolete
товар відсутній
| MCIMX6Q5EYM10AC |
|
Виробник: NXP USA Inc.
Description: IC MPU I.MX6Q 1.0GHZ 624FCPBGA
Packaging: Tray
Package / Case: 624-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Part Status: Not For New Designs
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Description: IC MPU I.MX6Q 1.0GHZ 624FCPBGA
Packaging: Tray
Package / Case: 624-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Part Status: Not For New Designs
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
на замовлення 119 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 5762.33 грн |
| 10+ | 4583.73 грн |
| 80+ | 4221.83 грн |
| MCIMX6S5DVM10AB |
|
Виробник: NXP USA Inc.
Description: IC MPU I.MX6S 1.0GHZ 624MAPBGA
Packaging: Tray
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Part Status: Not For New Designs
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Description: IC MPU I.MX6S 1.0GHZ 624MAPBGA
Packaging: Tray
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Part Status: Not For New Designs
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
на замовлення 190 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 3008.52 грн |
| 10+ | 2323.38 грн |
| 80+ | 1983.97 грн |
| MCIMX6U5DVM10AB |
|
Виробник: NXP USA Inc.
Description: IC MPU I.MX6DL 1.0GHZ 624MAPBGA
Packaging: Tray
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Part Status: Not For New Designs
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Description: IC MPU I.MX6DL 1.0GHZ 624MAPBGA
Packaging: Tray
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Part Status: Not For New Designs
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
на замовлення 898 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 2475.54 грн |
| 10+ | 2039.31 грн |