Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (35410) > Сторінка 126 з 591
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MPC5554EVB | NXP USA Inc. |
 Description: MPC5554 EVAL BRDPackaging: Bulk Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: e200 Utilized IC / Part: MPC5554 |
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MPC5554EVBGHS | NXP USA Inc. |
Description: MPC5554 EVAL BRD |
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MPC5554EVBISYS | NXP USA Inc. |
Description: MPC5554 EVAL BRD |
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MPC5554INT | NXP USA Inc. |
Description: MPC5554 EVAL BRD Packaging: Bulk Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: e200 Utilized IC / Part: MPC5554 |
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| MPC5561EVB | NXP USA Inc. |
Description: MPC5561 EVAL BRD Packaging: Bulk Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: e200 Utilized IC / Part: MPC5561 |
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MPC5566EVB | NXP USA Inc. |
Description: MPC5566 EVAL BRD Packaging: Bulk Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: e200 Board Type: Evaluation Platform Utilized IC / Part: MPC5566 Part Status: Active |
на замовлення 6 шт: термін постачання 21-31 дні (днів) |
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| MPC5567EVB | NXP USA Inc. |
Description: MPC5567 EVAL BRD Packaging: Bulk Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s), Cable(s), Power Supply, USB Multilink Programmer Core Processor: e200 Utilized IC / Part: MPC5567 |
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MPC7410HX400LE | NXP USA Inc. |
Description: IC MPU MPC74XX 400MHZ 360CBGA Packaging: Tray Package / Case: 360-BCBGA, FCCBGA Mounting Type: Surface Mount Speed: 400MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC G4 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 360-CBGA (25x25) Number of Cores/Bus Width: 1 Core, 32-Bit Graphics Acceleration: No |
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MPC8260ADS-TCOM | NXP USA Inc. |
Description: BOARD DEV ADS POWERQUICC II Packaging: Bulk For Use With/Related Products: 8260ADS Accessory Type: Interface Board Part Status: Obsolete |
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MPC8313ECVRAFF | NXP USA Inc. |
Description: IC MPU MPC83XX 333MHZ 516TEPBGA Packaging: Tray Package / Case: 516-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 333MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e300c3 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 516-TEPBGA (27x27) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Security; SEC 2.2 RAM Controllers: DDR, DDR2 Graphics Acceleration: No Security Features: Cryptography Additional Interfaces: DUART, HSSI, I2C, PCI, SPI |
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MPC8313EVRAFF | NXP USA Inc. |
Description: IC MPU MPC83XX 333MHZ 516TEPBGA Packaging: Tray Package / Case: 516-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 333MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e300c3 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 516-TEPBGA (27x27) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Security; SEC 2.2 RAM Controllers: DDR, DDR2 Graphics Acceleration: No Security Features: Cryptography Additional Interfaces: DUART, HSSI, I2C, PCI, SPI |
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MPC8347CVVAGDB | NXP USA Inc. |
Description: IC MPU MPC83XX 400MHZ 672LBGA Packaging: Tray Package / Case: 672-LBGA Mounting Type: Surface Mount Speed: 400MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e300 Voltage - I/O: 2.5V, 3.3V Supplier Device Package: 672-LBGA (35x35) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR Graphics Acceleration: No Additional Interfaces: DUART, I2C, PCI, SPI |
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MPC8347CVVAJDB | NXP USA Inc. |
Description: IC MPU MPC83XX 533MHZ 672LBGA Packaging: Tray Package / Case: 672-LBGA Mounting Type: Surface Mount Speed: 533MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e300 Voltage - I/O: 2.5V, 3.3V Supplier Device Package: 672-LBGA (35x35) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR Graphics Acceleration: No Additional Interfaces: DUART, I2C, PCI, SPI |
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MPC8347CVVAJFB | NXP USA Inc. |
Description: IC MPU MPC83XX 533MHZ 672LBGA Packaging: Tray Package / Case: 672-LBGA Mounting Type: Surface Mount Speed: 533MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e300 Voltage - I/O: 2.5V, 3.3V Supplier Device Package: 672-LBGA (35x35) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR Graphics Acceleration: No Additional Interfaces: DUART, I2C, PCI, SPI Part Status: Obsolete |
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MPC8349CVVAJDB | NXP USA Inc. |
Description: IC MPU MPC83XX 533MHZ 672LBGA Packaging: Tray Package / Case: 672-LBGA Mounting Type: Surface Mount Speed: 533MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e300 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 672-LBGA (35x35) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, DDR2 Graphics Acceleration: No Additional Interfaces: DUART, I2C, PCI, SPI |
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MPC8349CZUAGDB | NXP USA Inc. |
Description: IC MPU MPC83XX 400MHZ 672LBGA Packaging: Tray Package / Case: 672-LBGA Mounting Type: Surface Mount Speed: 400MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e300 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 672-LBGA (35x35) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, DDR2 Graphics Acceleration: No Part Status: Obsolete |
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MPC8358ECVVAGDGA | NXP USA Inc. |
Description: IC MPU MPC83XX 400MHZ 740TBGA Packaging: Tray Package / Case: 740-LBGA Mounting Type: Surface Mount Speed: 400MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e300 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 740-TBGA (37.5x37.5) Ethernet: 10/100/1000Mbps (1) USB: USB 1.x (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine, Security; SEC RAM Controllers: DDR, DDR2 Graphics Acceleration: No Security Features: Cryptography, Random Number Generator Part Status: Obsolete Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART |
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MPC8358EVRAGDDA | NXP USA Inc. |
Description: IC MPU MPC83XX 400MHZ 668BGA Packaging: Tray Package / Case: 668-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 400MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e300 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 668-PBGA-PGE (29x29) Ethernet: 10/100/1000Mbps (1) USB: USB 1.x (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine, Security; SEC RAM Controllers: DDR, DDR2 Graphics Acceleration: No Security Features: Cryptography, Random Number Generator Part Status: Active Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART |
на замовлення 32 шт: термін постачання 21-31 дні (днів) |
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MPC8358VVAGDGA | NXP USA Inc. |
Description: IC MPU MPC83XX 400MHZ 740TBGA Packaging: Tray Package / Case: 740-LBGA Mounting Type: Surface Mount Speed: 400MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e300 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 740-TBGA (37.5x37.5) Ethernet: 10/100/1000Mbps (1) USB: USB 1.x (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR, DDR2 Graphics Acceleration: No |
на замовлення 21 шт: термін постачання 21-31 дні (днів) |
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MPC8360CVVAGDGA | NXP USA Inc. |
Description: IC MPU MPC83XX 400MHZ 740TBGA Packaging: Tray Package / Case: 740-LBGA Mounting Type: Surface Mount Speed: 400MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e300 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 740-TBGA (37.5x37.5) Ethernet: 10/100/1000Mbps (1) USB: USB 1.x (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR, DDR2 Graphics Acceleration: No Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART |
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MPC8360CVVAJDGA | NXP USA Inc. |
Description: IC MPU MPC83XX 533MHZ 740TBGA Packaging: Tray Package / Case: 740-LBGA Mounting Type: Surface Mount Speed: 533MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e300 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 740-TBGA (37.5x37.5) Ethernet: 10/100/1000Mbps (1) USB: USB 1.x (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR, DDR2 Graphics Acceleration: No Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART |
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MPC8360EA-MDS-PB | NXP USA Inc. |
Description: MPC8360EA EVAL BRD Packaging: Bulk Mounting Type: Fixed Type: MPU Contents: Board(s), Cable(s), Power Supply Core Processor: e300 Board Type: Evaluation Platform Utilized IC / Part: MPC8360EA Part Status: Discontinued at Digi-Key |
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MPC8360EVVAJDGA | NXP USA Inc. |
Description: IC MPU MPC83XX 533MHZ 740TBGA |
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MPC8360EVVALFHA | NXP USA Inc. |
Description: IC MPU MPC83XX 667MHZ 740TBGA Packaging: Tray Package / Case: 740-LBGA Mounting Type: Surface Mount Speed: 667MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e300 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 740-TBGA (37.5x37.5) Ethernet: 10/100/1000Mbps (1) USB: USB 1.x (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine, Security; SEC RAM Controllers: DDR, DDR2 Graphics Acceleration: No Security Features: Cryptography, Random Number Generator Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART |
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MPC8360ZUAJDGA | NXP USA Inc. |
Description: IC MPU MPC83XX 533MHZ 740TBGA Packaging: Tray Package / Case: 740-LBGA Mounting Type: Surface Mount Speed: 533MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e300 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 740-TBGA (37.5x37.5) Ethernet: 10/100/1000Mbps (1) USB: USB 1.x (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR, DDR2 Graphics Acceleration: No Part Status: Obsolete |
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| MPC8377E-MDS-PB | NXP USA Inc. |
Description: MPC8377E EVAL BRD Packaging: Bulk Mounting Type: Fixed Type: MPU Contents: Board(s) Core Processor: e300 Utilized IC / Part: MPC8377E |
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MPC8540ADS-BGA | NXP USA Inc. |
Description: MPC8540 EVAL BRD |
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MPC8548ECHXAQG | NXP USA Inc. |
Description: IC MPU MPC85XX 1.0GHZ 783FCBGA Packaging: Tray Package / Case: 783-BBGA, FCBGA Mounting Type: Surface Mount Speed: 1.0GHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e500 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 783-FCBGA (29x29) Ethernet: 10/100/1000Mbps (4) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Signal Processing; SPE, Security; SEC RAM Controllers: DDR, DDR2, SDRAM Graphics Acceleration: No Security Features: Cryptography, Random Number Generator |
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MPC8548ECVUAQG | NXP USA Inc. |
Description: IC MPU MPC85XX 1.0GHZ 783FCBGA Packaging: Tray Package / Case: 783-BBGA, FCBGA Mounting Type: Surface Mount Speed: 1.0GHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e500 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 783-FCBGA (29x29) Ethernet: 10/100/1000Mbps (4) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Signal Processing; SPE, Security; SEC RAM Controllers: DDR, DDR2, SDRAM Graphics Acceleration: No Security Features: Cryptography, Random Number Generator |
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| MPC8555CDS | NXP USA Inc. | Description: MPC8555 EVAL BRD |
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MPC8560ADS-BGA | NXP USA Inc. | Description: MPC8560 EVAL BRD |
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MPR083EJR2 | NXP USA Inc. |
Description: IC CTLR TOUCH SENSR PROX 16TSSOP Packaging: Tape & Reel (TR) Package / Case: 16-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Interface: I2C Type: Buttons, Slider, Wheel Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.8V ~ 3.6V Current - Supply: 1.62mA Number of Inputs: 8 Supplier Device Package: 16-TSSOP Proximity Detection: Yes DigiKey Programmable: Not Verified |
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MPR084QR2 | NXP USA Inc. |
Description: IC CTLR TOUCH SENSOR PROX 16-QFN Packaging: Tape & Reel (TR) Package / Case: 16-VQFN Exposed Pad Mounting Type: Surface Mount Interface: I2C Type: Buttons, Slider, Wheel Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.8V ~ 3.6V Current - Supply: 1.62mA Number of Inputs: 8 Supplier Device Package: 16-QFN-EP (5x5) Proximity Detection: Yes DigiKey Programmable: Not Verified |
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MRF5S4125NBR1 | NXP USA Inc. |
Description: FET RF 65V 465MHZ TO-272-4 |
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MRF5S4125NR1 | NXP USA Inc. |
Description: FET RF 65V 465MHZ TO-270-4 |
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MRF6V10250HSR3 | NXP USA Inc. |
Description: FET RF 100V 1.09GHZ NI780S |
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MRF6V10250HSR5 | NXP USA Inc. |
Description: FET RF 100V 1.09GHZ NI780S |
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MRF7S16150HR3 | NXP USA Inc. |
Description: FET RF 65V 1.66GHZ NI-780 Packaging: Tape & Reel (TR) Package / Case: SOT-957A Mounting Type: Chassis Mount Frequency: 1.6GHz ~ 1.66GHz Power - Output: 32W Gain: 19.7dB Technology: LDMOS Supplier Device Package: NI-780H-2L Part Status: Obsolete Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 1.5 A |
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MRF7S16150HR5 | NXP USA Inc. |
Description: FET RF 65V 1.66GHZ NI-780 Packaging: Tape & Reel (TR) Package / Case: SOT-957A Mounting Type: Chassis Mount Frequency: 1.6GHz ~ 1.66GHz Power - Output: 32W Gain: 19.7dB Technology: LDMOS Supplier Device Package: NI-780H-2L Part Status: Obsolete Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 1.5 A |
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MRF7S19080HSR3 | NXP USA Inc. |
Description: FET RF 65V 1.99GHZ NI-780S Packaging: Tape & Reel (TR) Package / Case: NI-780S Mounting Type: Chassis Mount Frequency: 1.99GHz Power - Output: 24W Gain: 18dB Technology: LDMOS Supplier Device Package: NI-780S Part Status: Obsolete Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 750 mA |
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MRF7S21080HR5 | NXP USA Inc. |
Description: FET RF 65V 2.17GHZ NI-780 |
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MRF7S21080HSR5 | NXP USA Inc. |
Description: FET RF 65V 2.17GHZ NI-780S |
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MRF7S21150HR3 | NXP USA Inc. |
Description: FET RF 65V 2.17GHZ NI-780 Packaging: Tape & Reel (TR) Package / Case: SOT-957A Mounting Type: Chassis Mount Frequency: 2.11GHz ~ 2.17GHz Power - Output: 44W Gain: 17.5dB Technology: LDMOS Supplier Device Package: NI-780H-2L Part Status: Obsolete Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 1.35 A |
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MRF7S21150HR5 | NXP USA Inc. |
Description: FET RF 65V 2.17GHZ NI-780 Packaging: Tape & Reel (TR) Package / Case: SOT-957A Mounting Type: Chassis Mount Frequency: 2.11GHz ~ 2.17GHz Power - Output: 44W Gain: 17.5dB Technology: LDMOS Supplier Device Package: NI-780H-2L Part Status: Obsolete Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 1.35 A |
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MRF7S21150HSR3 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V NI780 Packaging: Tape & Reel (TR) Package / Case: NI-780S Mounting Type: Chassis Mount Frequency: 2.11GHz ~ 2.17GHz Power - Output: 44W Gain: 17.5dB Technology: LDMOS Supplier Device Package: NI-780S Part Status: Obsolete Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 1.35 A |
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MRF7S27130HR3 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V NI780 Packaging: Tape & Reel (TR) Package / Case: SOT-957A Mounting Type: Chassis Mount Frequency: 2.7GHz Power - Output: 23W Gain: 16.5dB Technology: LDMOS Supplier Device Package: NI-780H-2L Part Status: Obsolete Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 1.5 A |
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MRF7S27130HR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V NI780 Packaging: Tape & Reel (TR) Package / Case: SOT-957A Mounting Type: Chassis Mount Frequency: 2.7GHz Power - Output: 23W Gain: 16.5dB Technology: LDMOS Supplier Device Package: NI-780H-2L Part Status: Obsolete Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 1.5 A |
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MRF7S27130HSR3 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V NI780 Packaging: Tape & Reel (TR) Package / Case: NI-780S Mounting Type: Chassis Mount Frequency: 2.7GHz Power - Output: 23W Gain: 16.5dB Technology: LDMOS Supplier Device Package: NI-780S Part Status: Obsolete Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 1.5 A |
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MRF7S27130HSR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V NI780 Packaging: Tape & Reel (TR) Package / Case: NI-780S Mounting Type: Chassis Mount Frequency: 2.7GHz Power - Output: 23W Gain: 16.5dB Technology: LDMOS Supplier Device Package: NI-780S Part Status: Obsolete Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 1.5 A |
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| MRF7S38010HR3 | NXP USA Inc. |
Description: FET RF 65V 3.6GHZ NI-400 |
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| MRF7S38010HR5 | NXP USA Inc. |
Description: FET RF 65V 3.6GHZ NI-400 |
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| MRF7S38010HSR3 | NXP USA Inc. |
Description: FET RF 65V 3.6GHZ NI-400S Packaging: Tape & Reel (TR) Package / Case: NI-400S-2S Mounting Type: Surface Mount Frequency: 3.4GHz ~ 3.6GHz Power - Output: 2W Gain: 15dB Technology: LDMOS Supplier Device Package: NI-400S-2S Part Status: Obsolete Voltage - Rated: 65 V Voltage - Test: 30 V Current - Test: 160 mA |
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| MRFE6P3300HR3 | NXP USA Inc. |
Description: RF MOSFET LDMOS 32V NI860C3 Packaging: Tape & Reel (TR) Package / Case: NI-860C3 Mounting Type: Chassis Mount Frequency: 857MHz ~ 863MHz Power - Output: 270W Gain: 20.4dB Technology: LDMOS Supplier Device Package: NI-860C3 Voltage - Rated: 66 V Voltage - Test: 32 V Current - Test: 1.6 A |
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MRFE6S9045NR1 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V TO270-2 Packaging: Tape & Reel (TR) Package / Case: TO-270AA Mounting Type: Surface Mount Frequency: 880MHz Power - Output: 10W Gain: 22.1dB Technology: LDMOS Supplier Device Package: TO-270-2 Part Status: Obsolete Voltage - Rated: 66 V Voltage - Test: 28 V Current - Test: 350 mA |
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MRFE6S9060NR1 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V TO270-2 Packaging: Tape & Reel (TR) Package / Case: TO-270AA Mounting Type: Surface Mount Frequency: 880MHz Power - Output: 14W Gain: 21.1dB Technology: LDMOS Supplier Device Package: TO-270-2 Part Status: Active Voltage - Rated: 66 V Voltage - Test: 28 V Current - Test: 450 mA |
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MRFE6S9125NBR1 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V TO272-4 Packaging: Tape & Reel (TR) Package / Case: TO-272BB Mounting Type: Chassis Mount Frequency: 880MHz Power - Output: 27W Gain: 20.2dB Technology: LDMOS Supplier Device Package: TO-272 WB-4 Part Status: Obsolete Voltage - Rated: 66 V Voltage - Test: 28 V Current - Test: 950 mA |
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MRFE6S9125NR1 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V TO270-4 Packaging: Tape & Reel (TR) Package / Case: TO-270AB Mounting Type: Surface Mount Frequency: 880MHz Power - Output: 27W Gain: 20.2dB Technology: LDMOS Supplier Device Package: TO-270 WB-4 Part Status: Obsolete Voltage - Rated: 66 V Voltage - Test: 28 V Current - Test: 950 mA |
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MRFE6S9130HR3 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V NI780 Packaging: Tape & Reel (TR) Package / Case: SOT-957A Mounting Type: Chassis Mount Frequency: 880MHz Power - Output: 27W Gain: 19.2dB Technology: LDMOS Supplier Device Package: NI-780H-2L Voltage - Rated: 66 V Voltage - Test: 28 V Current - Test: 950 mA |
товар відсутній |
|||||
| MRFE6S9135HSR5 | NXP USA Inc. |
Description: FET RF 66V 940MHZ NI-880S |
товар відсутній |
||||||
|
|
MRFE6S9160HR3 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V NI780 Packaging: Tape & Reel (TR) Package / Case: SOT-957A Mounting Type: Chassis Mount Frequency: 880MHz Power - Output: 35W Gain: 21dB Technology: LDMOS Supplier Device Package: NI-780H-2L Voltage - Rated: 66 V Voltage - Test: 28 V Current - Test: 1.2 A |
товар відсутній |
| MPC5554EVB |
|
Виробник: NXP USA Inc.
Description: MPC5554 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Utilized IC / Part: MPC5554
Description: MPC5554 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Utilized IC / Part: MPC5554
товар відсутній
| MPC5554INT |
|
Виробник: NXP USA Inc.
Description: MPC5554 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Utilized IC / Part: MPC5554
Description: MPC5554 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Utilized IC / Part: MPC5554
товар відсутній
| MPC5561EVB |
|
Виробник: NXP USA Inc.
Description: MPC5561 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Utilized IC / Part: MPC5561
Description: MPC5561 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Utilized IC / Part: MPC5561
товар відсутній
| MPC5566EVB |
|
Виробник: NXP USA Inc.
Description: MPC5566 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Board Type: Evaluation Platform
Utilized IC / Part: MPC5566
Part Status: Active
Description: MPC5566 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Board Type: Evaluation Platform
Utilized IC / Part: MPC5566
Part Status: Active
на замовлення 6 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 126654 грн |
| MPC5567EVB |
|
Виробник: NXP USA Inc.
Description: MPC5567 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s), Power Supply, USB Multilink Programmer
Core Processor: e200
Utilized IC / Part: MPC5567
Description: MPC5567 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s), Power Supply, USB Multilink Programmer
Core Processor: e200
Utilized IC / Part: MPC5567
товар відсутній
| MPC7410HX400LE |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC74XX 400MHZ 360CBGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 360-CBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Description: IC MPU MPC74XX 400MHZ 360CBGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 360-CBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
товар відсутній
| MPC8260ADS-TCOM |
Виробник: NXP USA Inc.
Description: BOARD DEV ADS POWERQUICC II
Packaging: Bulk
For Use With/Related Products: 8260ADS
Accessory Type: Interface Board
Part Status: Obsolete
Description: BOARD DEV ADS POWERQUICC II
Packaging: Bulk
For Use With/Related Products: 8260ADS
Accessory Type: Interface Board
Part Status: Obsolete
товар відсутній
| MPC8313ECVRAFF |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 333MHZ 516TEPBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
Description: IC MPU MPC83XX 333MHZ 516TEPBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
товар відсутній
| MPC8313EVRAFF |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 333MHZ 516TEPBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
Description: IC MPU MPC83XX 333MHZ 516TEPBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
товар відсутній
| MPC8347CVVAGDB |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 672LBGA
Packaging: Tray
Package / Case: 672-LBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 672-LBGA (35x35)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI, SPI
Description: IC MPU MPC83XX 400MHZ 672LBGA
Packaging: Tray
Package / Case: 672-LBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 672-LBGA (35x35)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI, SPI
товар відсутній
| MPC8347CVVAJDB |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 533MHZ 672LBGA
Packaging: Tray
Package / Case: 672-LBGA
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 672-LBGA (35x35)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI, SPI
Description: IC MPU MPC83XX 533MHZ 672LBGA
Packaging: Tray
Package / Case: 672-LBGA
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 672-LBGA (35x35)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI, SPI
товар відсутній
| MPC8347CVVAJFB |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 533MHZ 672LBGA
Packaging: Tray
Package / Case: 672-LBGA
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 672-LBGA (35x35)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI, SPI
Part Status: Obsolete
Description: IC MPU MPC83XX 533MHZ 672LBGA
Packaging: Tray
Package / Case: 672-LBGA
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 672-LBGA (35x35)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI, SPI
Part Status: Obsolete
товар відсутній
| MPC8349CVVAJDB |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 533MHZ 672LBGA
Packaging: Tray
Package / Case: 672-LBGA
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 672-LBGA (35x35)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI, SPI
Description: IC MPU MPC83XX 533MHZ 672LBGA
Packaging: Tray
Package / Case: 672-LBGA
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 672-LBGA (35x35)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI, SPI
товар відсутній
| MPC8349CZUAGDB |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 672LBGA
Packaging: Tray
Package / Case: 672-LBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 672-LBGA (35x35)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Part Status: Obsolete
Description: IC MPU MPC83XX 400MHZ 672LBGA
Packaging: Tray
Package / Case: 672-LBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 672-LBGA (35x35)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Part Status: Obsolete
товар відсутній
| MPC8358ECVVAGDGA |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 740TBGA
Packaging: Tray
Package / Case: 740-LBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 740-TBGA (37.5x37.5)
Ethernet: 10/100/1000Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Part Status: Obsolete
Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART
Description: IC MPU MPC83XX 400MHZ 740TBGA
Packaging: Tray
Package / Case: 740-LBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 740-TBGA (37.5x37.5)
Ethernet: 10/100/1000Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Part Status: Obsolete
Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART
товар відсутній
| MPC8358EVRAGDDA |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 668BGA
Packaging: Tray
Package / Case: 668-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 668-PBGA-PGE (29x29)
Ethernet: 10/100/1000Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Part Status: Active
Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART
Description: IC MPU MPC83XX 400MHZ 668BGA
Packaging: Tray
Package / Case: 668-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 668-PBGA-PGE (29x29)
Ethernet: 10/100/1000Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Part Status: Active
Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART
на замовлення 32 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 5895.37 грн |
| 10+ | 5607.21 грн |
| MPC8358VVAGDGA |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 740TBGA
Packaging: Tray
Package / Case: 740-LBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 740-TBGA (37.5x37.5)
Ethernet: 10/100/1000Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Description: IC MPU MPC83XX 400MHZ 740TBGA
Packaging: Tray
Package / Case: 740-LBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 740-TBGA (37.5x37.5)
Ethernet: 10/100/1000Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
на замовлення 21 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 9388.54 грн |
| 21+ | 7455.83 грн |
| MPC8360CVVAGDGA |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 740TBGA
Packaging: Tray
Package / Case: 740-LBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 740-TBGA (37.5x37.5)
Ethernet: 10/100/1000Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART
Description: IC MPU MPC83XX 400MHZ 740TBGA
Packaging: Tray
Package / Case: 740-LBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 740-TBGA (37.5x37.5)
Ethernet: 10/100/1000Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART
товар відсутній
| MPC8360CVVAJDGA |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 533MHZ 740TBGA
Packaging: Tray
Package / Case: 740-LBGA
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 740-TBGA (37.5x37.5)
Ethernet: 10/100/1000Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART
Description: IC MPU MPC83XX 533MHZ 740TBGA
Packaging: Tray
Package / Case: 740-LBGA
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 740-TBGA (37.5x37.5)
Ethernet: 10/100/1000Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART
товар відсутній
| MPC8360EA-MDS-PB |
|
Виробник: NXP USA Inc.
Description: MPC8360EA EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s), Cable(s), Power Supply
Core Processor: e300
Board Type: Evaluation Platform
Utilized IC / Part: MPC8360EA
Part Status: Discontinued at Digi-Key
Description: MPC8360EA EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s), Cable(s), Power Supply
Core Processor: e300
Board Type: Evaluation Platform
Utilized IC / Part: MPC8360EA
Part Status: Discontinued at Digi-Key
товар відсутній
| MPC8360EVVALFHA |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 667MHZ 740TBGA
Packaging: Tray
Package / Case: 740-LBGA
Mounting Type: Surface Mount
Speed: 667MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 740-TBGA (37.5x37.5)
Ethernet: 10/100/1000Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART
Description: IC MPU MPC83XX 667MHZ 740TBGA
Packaging: Tray
Package / Case: 740-LBGA
Mounting Type: Surface Mount
Speed: 667MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 740-TBGA (37.5x37.5)
Ethernet: 10/100/1000Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART
товар відсутній
| MPC8360ZUAJDGA |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 533MHZ 740TBGA
Packaging: Tray
Package / Case: 740-LBGA
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 740-TBGA (37.5x37.5)
Ethernet: 10/100/1000Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Part Status: Obsolete
Description: IC MPU MPC83XX 533MHZ 740TBGA
Packaging: Tray
Package / Case: 740-LBGA
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 740-TBGA (37.5x37.5)
Ethernet: 10/100/1000Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Part Status: Obsolete
товар відсутній
| MPC8377E-MDS-PB |
|
Виробник: NXP USA Inc.
Description: MPC8377E EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: e300
Utilized IC / Part: MPC8377E
Description: MPC8377E EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: e300
Utilized IC / Part: MPC8377E
товар відсутній
| MPC8548ECHXAQG |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC85XX 1.0GHZ 783FCBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCBGA (29x29)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Description: IC MPU MPC85XX 1.0GHZ 783FCBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCBGA (29x29)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
товар відсутній
| MPC8548ECVUAQG |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC85XX 1.0GHZ 783FCBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCBGA (29x29)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Description: IC MPU MPC85XX 1.0GHZ 783FCBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCBGA (29x29)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
товар відсутній
| MPR083EJR2 |
Виробник: NXP USA Inc.
Description: IC CTLR TOUCH SENSR PROX 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Interface: I2C
Type: Buttons, Slider, Wheel
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 3.6V
Current - Supply: 1.62mA
Number of Inputs: 8
Supplier Device Package: 16-TSSOP
Proximity Detection: Yes
DigiKey Programmable: Not Verified
Description: IC CTLR TOUCH SENSR PROX 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Interface: I2C
Type: Buttons, Slider, Wheel
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 3.6V
Current - Supply: 1.62mA
Number of Inputs: 8
Supplier Device Package: 16-TSSOP
Proximity Detection: Yes
DigiKey Programmable: Not Verified
товар відсутній
| MPR084QR2 |
Виробник: NXP USA Inc.
Description: IC CTLR TOUCH SENSOR PROX 16-QFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VQFN Exposed Pad
Mounting Type: Surface Mount
Interface: I2C
Type: Buttons, Slider, Wheel
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 3.6V
Current - Supply: 1.62mA
Number of Inputs: 8
Supplier Device Package: 16-QFN-EP (5x5)
Proximity Detection: Yes
DigiKey Programmable: Not Verified
Description: IC CTLR TOUCH SENSOR PROX 16-QFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VQFN Exposed Pad
Mounting Type: Surface Mount
Interface: I2C
Type: Buttons, Slider, Wheel
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 3.6V
Current - Supply: 1.62mA
Number of Inputs: 8
Supplier Device Package: 16-QFN-EP (5x5)
Proximity Detection: Yes
DigiKey Programmable: Not Verified
товар відсутній
| MRF7S16150HR3 |
|
Виробник: NXP USA Inc.
Description: FET RF 65V 1.66GHZ NI-780
Packaging: Tape & Reel (TR)
Package / Case: SOT-957A
Mounting Type: Chassis Mount
Frequency: 1.6GHz ~ 1.66GHz
Power - Output: 32W
Gain: 19.7dB
Technology: LDMOS
Supplier Device Package: NI-780H-2L
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.5 A
Description: FET RF 65V 1.66GHZ NI-780
Packaging: Tape & Reel (TR)
Package / Case: SOT-957A
Mounting Type: Chassis Mount
Frequency: 1.6GHz ~ 1.66GHz
Power - Output: 32W
Gain: 19.7dB
Technology: LDMOS
Supplier Device Package: NI-780H-2L
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.5 A
товар відсутній
| MRF7S16150HR5 |
|
Виробник: NXP USA Inc.
Description: FET RF 65V 1.66GHZ NI-780
Packaging: Tape & Reel (TR)
Package / Case: SOT-957A
Mounting Type: Chassis Mount
Frequency: 1.6GHz ~ 1.66GHz
Power - Output: 32W
Gain: 19.7dB
Technology: LDMOS
Supplier Device Package: NI-780H-2L
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.5 A
Description: FET RF 65V 1.66GHZ NI-780
Packaging: Tape & Reel (TR)
Package / Case: SOT-957A
Mounting Type: Chassis Mount
Frequency: 1.6GHz ~ 1.66GHz
Power - Output: 32W
Gain: 19.7dB
Technology: LDMOS
Supplier Device Package: NI-780H-2L
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.5 A
товар відсутній
| MRF7S19080HSR3 |
|
Виробник: NXP USA Inc.
Description: FET RF 65V 1.99GHZ NI-780S
Packaging: Tape & Reel (TR)
Package / Case: NI-780S
Mounting Type: Chassis Mount
Frequency: 1.99GHz
Power - Output: 24W
Gain: 18dB
Technology: LDMOS
Supplier Device Package: NI-780S
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 750 mA
Description: FET RF 65V 1.99GHZ NI-780S
Packaging: Tape & Reel (TR)
Package / Case: NI-780S
Mounting Type: Chassis Mount
Frequency: 1.99GHz
Power - Output: 24W
Gain: 18dB
Technology: LDMOS
Supplier Device Package: NI-780S
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 750 mA
товар відсутній
| MRF7S21150HR3 |
|
Виробник: NXP USA Inc.
Description: FET RF 65V 2.17GHZ NI-780
Packaging: Tape & Reel (TR)
Package / Case: SOT-957A
Mounting Type: Chassis Mount
Frequency: 2.11GHz ~ 2.17GHz
Power - Output: 44W
Gain: 17.5dB
Technology: LDMOS
Supplier Device Package: NI-780H-2L
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.35 A
Description: FET RF 65V 2.17GHZ NI-780
Packaging: Tape & Reel (TR)
Package / Case: SOT-957A
Mounting Type: Chassis Mount
Frequency: 2.11GHz ~ 2.17GHz
Power - Output: 44W
Gain: 17.5dB
Technology: LDMOS
Supplier Device Package: NI-780H-2L
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.35 A
товар відсутній
| MRF7S21150HR5 |
|
Виробник: NXP USA Inc.
Description: FET RF 65V 2.17GHZ NI-780
Packaging: Tape & Reel (TR)
Package / Case: SOT-957A
Mounting Type: Chassis Mount
Frequency: 2.11GHz ~ 2.17GHz
Power - Output: 44W
Gain: 17.5dB
Technology: LDMOS
Supplier Device Package: NI-780H-2L
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.35 A
Description: FET RF 65V 2.17GHZ NI-780
Packaging: Tape & Reel (TR)
Package / Case: SOT-957A
Mounting Type: Chassis Mount
Frequency: 2.11GHz ~ 2.17GHz
Power - Output: 44W
Gain: 17.5dB
Technology: LDMOS
Supplier Device Package: NI-780H-2L
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.35 A
товар відсутній
| MRF7S21150HSR3 |
|
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S
Mounting Type: Chassis Mount
Frequency: 2.11GHz ~ 2.17GHz
Power - Output: 44W
Gain: 17.5dB
Technology: LDMOS
Supplier Device Package: NI-780S
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.35 A
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S
Mounting Type: Chassis Mount
Frequency: 2.11GHz ~ 2.17GHz
Power - Output: 44W
Gain: 17.5dB
Technology: LDMOS
Supplier Device Package: NI-780S
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.35 A
товар відсутній
| MRF7S27130HR3 |
|
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: SOT-957A
Mounting Type: Chassis Mount
Frequency: 2.7GHz
Power - Output: 23W
Gain: 16.5dB
Technology: LDMOS
Supplier Device Package: NI-780H-2L
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.5 A
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: SOT-957A
Mounting Type: Chassis Mount
Frequency: 2.7GHz
Power - Output: 23W
Gain: 16.5dB
Technology: LDMOS
Supplier Device Package: NI-780H-2L
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.5 A
товар відсутній
| MRF7S27130HR5 |
|
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: SOT-957A
Mounting Type: Chassis Mount
Frequency: 2.7GHz
Power - Output: 23W
Gain: 16.5dB
Technology: LDMOS
Supplier Device Package: NI-780H-2L
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.5 A
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: SOT-957A
Mounting Type: Chassis Mount
Frequency: 2.7GHz
Power - Output: 23W
Gain: 16.5dB
Technology: LDMOS
Supplier Device Package: NI-780H-2L
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.5 A
товар відсутній
| MRF7S27130HSR3 |
|
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S
Mounting Type: Chassis Mount
Frequency: 2.7GHz
Power - Output: 23W
Gain: 16.5dB
Technology: LDMOS
Supplier Device Package: NI-780S
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.5 A
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S
Mounting Type: Chassis Mount
Frequency: 2.7GHz
Power - Output: 23W
Gain: 16.5dB
Technology: LDMOS
Supplier Device Package: NI-780S
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.5 A
товар відсутній
| MRF7S27130HSR5 |
|
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S
Mounting Type: Chassis Mount
Frequency: 2.7GHz
Power - Output: 23W
Gain: 16.5dB
Technology: LDMOS
Supplier Device Package: NI-780S
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.5 A
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S
Mounting Type: Chassis Mount
Frequency: 2.7GHz
Power - Output: 23W
Gain: 16.5dB
Technology: LDMOS
Supplier Device Package: NI-780S
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.5 A
товар відсутній
| MRF7S38010HSR3 |
|
Виробник: NXP USA Inc.
Description: FET RF 65V 3.6GHZ NI-400S
Packaging: Tape & Reel (TR)
Package / Case: NI-400S-2S
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.6GHz
Power - Output: 2W
Gain: 15dB
Technology: LDMOS
Supplier Device Package: NI-400S-2S
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 30 V
Current - Test: 160 mA
Description: FET RF 65V 3.6GHZ NI-400S
Packaging: Tape & Reel (TR)
Package / Case: NI-400S-2S
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.6GHz
Power - Output: 2W
Gain: 15dB
Technology: LDMOS
Supplier Device Package: NI-400S-2S
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 30 V
Current - Test: 160 mA
товар відсутній
| MRFE6P3300HR3 |
|
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 32V NI860C3
Packaging: Tape & Reel (TR)
Package / Case: NI-860C3
Mounting Type: Chassis Mount
Frequency: 857MHz ~ 863MHz
Power - Output: 270W
Gain: 20.4dB
Technology: LDMOS
Supplier Device Package: NI-860C3
Voltage - Rated: 66 V
Voltage - Test: 32 V
Current - Test: 1.6 A
Description: RF MOSFET LDMOS 32V NI860C3
Packaging: Tape & Reel (TR)
Package / Case: NI-860C3
Mounting Type: Chassis Mount
Frequency: 857MHz ~ 863MHz
Power - Output: 270W
Gain: 20.4dB
Technology: LDMOS
Supplier Device Package: NI-860C3
Voltage - Rated: 66 V
Voltage - Test: 32 V
Current - Test: 1.6 A
товар відсутній
| MRFE6S9045NR1 |
|
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 28V TO270-2
Packaging: Tape & Reel (TR)
Package / Case: TO-270AA
Mounting Type: Surface Mount
Frequency: 880MHz
Power - Output: 10W
Gain: 22.1dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Part Status: Obsolete
Voltage - Rated: 66 V
Voltage - Test: 28 V
Current - Test: 350 mA
Description: RF MOSFET LDMOS 28V TO270-2
Packaging: Tape & Reel (TR)
Package / Case: TO-270AA
Mounting Type: Surface Mount
Frequency: 880MHz
Power - Output: 10W
Gain: 22.1dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Part Status: Obsolete
Voltage - Rated: 66 V
Voltage - Test: 28 V
Current - Test: 350 mA
товар відсутній
| MRFE6S9060NR1 |
|
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 28V TO270-2
Packaging: Tape & Reel (TR)
Package / Case: TO-270AA
Mounting Type: Surface Mount
Frequency: 880MHz
Power - Output: 14W
Gain: 21.1dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Part Status: Active
Voltage - Rated: 66 V
Voltage - Test: 28 V
Current - Test: 450 mA
Description: RF MOSFET LDMOS 28V TO270-2
Packaging: Tape & Reel (TR)
Package / Case: TO-270AA
Mounting Type: Surface Mount
Frequency: 880MHz
Power - Output: 14W
Gain: 21.1dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Part Status: Active
Voltage - Rated: 66 V
Voltage - Test: 28 V
Current - Test: 450 mA
товар відсутній
| MRFE6S9125NBR1 |
|
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 28V TO272-4
Packaging: Tape & Reel (TR)
Package / Case: TO-272BB
Mounting Type: Chassis Mount
Frequency: 880MHz
Power - Output: 27W
Gain: 20.2dB
Technology: LDMOS
Supplier Device Package: TO-272 WB-4
Part Status: Obsolete
Voltage - Rated: 66 V
Voltage - Test: 28 V
Current - Test: 950 mA
Description: RF MOSFET LDMOS 28V TO272-4
Packaging: Tape & Reel (TR)
Package / Case: TO-272BB
Mounting Type: Chassis Mount
Frequency: 880MHz
Power - Output: 27W
Gain: 20.2dB
Technology: LDMOS
Supplier Device Package: TO-272 WB-4
Part Status: Obsolete
Voltage - Rated: 66 V
Voltage - Test: 28 V
Current - Test: 950 mA
товар відсутній
| MRFE6S9125NR1 |
|
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 28V TO270-4
Packaging: Tape & Reel (TR)
Package / Case: TO-270AB
Mounting Type: Surface Mount
Frequency: 880MHz
Power - Output: 27W
Gain: 20.2dB
Technology: LDMOS
Supplier Device Package: TO-270 WB-4
Part Status: Obsolete
Voltage - Rated: 66 V
Voltage - Test: 28 V
Current - Test: 950 mA
Description: RF MOSFET LDMOS 28V TO270-4
Packaging: Tape & Reel (TR)
Package / Case: TO-270AB
Mounting Type: Surface Mount
Frequency: 880MHz
Power - Output: 27W
Gain: 20.2dB
Technology: LDMOS
Supplier Device Package: TO-270 WB-4
Part Status: Obsolete
Voltage - Rated: 66 V
Voltage - Test: 28 V
Current - Test: 950 mA
товар відсутній
| MRFE6S9130HR3 |
|
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: SOT-957A
Mounting Type: Chassis Mount
Frequency: 880MHz
Power - Output: 27W
Gain: 19.2dB
Technology: LDMOS
Supplier Device Package: NI-780H-2L
Voltage - Rated: 66 V
Voltage - Test: 28 V
Current - Test: 950 mA
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: SOT-957A
Mounting Type: Chassis Mount
Frequency: 880MHz
Power - Output: 27W
Gain: 19.2dB
Technology: LDMOS
Supplier Device Package: NI-780H-2L
Voltage - Rated: 66 V
Voltage - Test: 28 V
Current - Test: 950 mA
товар відсутній
| MRFE6S9160HR3 |
|
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: SOT-957A
Mounting Type: Chassis Mount
Frequency: 880MHz
Power - Output: 35W
Gain: 21dB
Technology: LDMOS
Supplier Device Package: NI-780H-2L
Voltage - Rated: 66 V
Voltage - Test: 28 V
Current - Test: 1.2 A
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: SOT-957A
Mounting Type: Chassis Mount
Frequency: 880MHz
Power - Output: 35W
Gain: 21dB
Technology: LDMOS
Supplier Device Package: NI-780H-2L
Voltage - Rated: 66 V
Voltage - Test: 28 V
Current - Test: 1.2 A
товар відсутній