Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (35277) > Сторінка 125 з 588
| Фото | Назва | Виробник | Інформація |
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MCZ33972AEK | NXP USA Inc. |
 Description: IC INTERFACE SPECIALIZED 32SOICPackaging: Tube Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Mounting Type: Surface Mount Interface: SPI Serial Voltage - Supply: 8V ~ 26V Applications: Switch Monitoring Supplier Device Package: 32-SOIC-EP |
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MCZ33972AEW | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 32SOIC Packaging: Tube Package / Case: 32-BSSOP (0.295", 7.50mm Width) Mounting Type: Surface Mount Interface: SPI Serial Voltage - Supply: 8V ~ 26V Applications: Switch Monitoring Supplier Device Package: 32-SOIC |
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MCZ33972AEWR2 | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 32SOIC Packaging: Tape & Reel (TR) Package / Case: 32-BSSOP (0.295", 7.50mm Width) Mounting Type: Surface Mount Interface: SPI Serial Voltage - Supply: 8V ~ 26V Applications: Switch Monitoring Supplier Device Package: 32-SOIC |
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MCZ33975EK | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 32SOIC Packaging: Tube Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Mounting Type: Surface Mount Interface: SPI Serial Voltage - Supply: 5.5V ~ 28V Applications: Automotive Supplier Device Package: 32-SOIC-EP |
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MCZ33975EKR2 | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 32SOIC Packaging: Tape & Reel (TR) Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Mounting Type: Surface Mount Interface: SPI Serial Voltage - Supply: 5.5V ~ 28V Supplier Device Package: 32-SOIC-EP Grade: Automotive |
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MCZ33991EGR2 | NXP USA Inc. |
Description: IC MTR DRV BIPLR 4.5-5.5V 24SOIC |
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MCZ33993EW | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 32SOIC |
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MCZ33993EWR2 | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 32SOIC |
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| MFR4300FRDC | NXP USA Inc. | Description: FRDC FLEXRAY DAUGHTER CARD |
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| MFR4310FRDC | NXP USA Inc. | Description: FRDC FLEXRAY DAUGHTER CARD |
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MMA7330LR1 | NXP USA Inc. |
Description: ACCELEROMETER 4-12G ANALOG 14LGA |
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MMA7360LR1 | NXP USA Inc. |
Description: ACCEL 1.5-6G ANALOG 14LGA |
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MMA7455LR1 | NXP USA Inc. |
Description: ACCELEROMETER 2-8G I2C/SPI 14LGA Packaging: Tape & Reel (TR) Features: Adjustable Bandwidth, Selectable Scale Package / Case: 14-TFLGA Output Type: I2C, SPI Mounting Type: Surface Mount Type: Digital Axis: X, Y, Z Acceleration Range: ±2g, 4g, 8g Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.4V ~ 3.6V Bandwidth: 62.5Hz ~ 125Hz Supplier Device Package: 14-LGA (3x5) Sensitivity (LSB/g): 64 (±2g) ~ 16 (±8g) |
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MMA7455LR2 | NXP USA Inc. |
Description: ACCELEROMETER 2-8G I2C/SPI 14LGA Features: Adjustable Bandwidth, Selectable Scale Packaging: Tape & Reel (TR) Package / Case: 14-TFLGA Output Type: I2C, SPI Mounting Type: Surface Mount Type: Digital Axis: X, Y, Z Acceleration Range: ±2g, 4g, 8g Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.4V ~ 3.6V Bandwidth: 62.5Hz ~ 125Hz Supplier Device Package: 14-LGA (3x5) Sensitivity (LSB/g): 64 (±2g) ~ 16 (±8g) |
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MMA7455LT | NXP USA Inc. |
 Description: ACCELEROMETER 2-8G I2C/SPI 14LGAFeatures: Adjustable Bandwidth, Selectable Scale Packaging: Tray Package / Case: 14-TFLGA Output Type: I2C, SPI Mounting Type: Surface Mount Type: Digital Axis: X, Y, Z Acceleration Range: ±2g, 4g, 8g Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.4V ~ 3.6V Bandwidth: 62.5Hz ~ 125Hz Supplier Device Package: 14-LGA (3x5) Sensitivity (LSB/g): 64 (±2g) ~ 16 (±8g) |
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MMG3006NT1 | NXP USA Inc. |
Description: IC AMP CELL 400MHZ-2.4GHZ 16QFN Packaging: Tape & Reel (TR) Package / Case: 16-VQFN Exposed Pad Mounting Type: Surface Mount Frequency: 400MHz ~ 2.4GHz RF Type: Cellular, PCS, PHS, WLL Voltage - Supply: 5V Gain: 17.5dB Current - Supply: 850mA Noise Figure: 6.6dB P1dB: 33dBm Test Frequency: 900MHz Supplier Device Package: 16-QFN (4x4) Part Status: Active |
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| MPC5510KIT208 | NXP USA Inc. |
Description: MPC5510 EVAL BRD |
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| MPC5553EVB | NXP USA Inc. |
Description: MPC5553 EVAL BRD |
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| MPC5553EVBGHS | NXP USA Inc. |
Description: MPC5553 EVAL BRD |
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| MPC5553EVBISYS | NXP USA Inc. |
Description: MPC5553 EVAL BRD |
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MPC5553MZP132 | NXP USA Inc. |
Description: IC MCU 32BIT 1.5MB FLASH 416PBGA |
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MPC5553MZQ132 | NXP USA Inc. |
Description: IC MCU 32BIT 1.5MB FLASH 324PBGA |
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MPC5554EVB | NXP USA Inc. |
Description: MPC5554 EVAL BRD Packaging: Bulk Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: e200 Utilized IC / Part: MPC5554 |
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MPC5554EVBGHS | NXP USA Inc. |
Description: MPC5554 EVAL BRD |
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MPC5554EVBISYS | NXP USA Inc. |
Description: MPC5554 EVAL BRD |
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MPC5554INT | NXP USA Inc. |
Description: MPC5554 EVAL BRD Packaging: Bulk Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: e200 Utilized IC / Part: MPC5554 |
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| MPC5561EVB | NXP USA Inc. |
Description: MPC5561 EVAL BRD Packaging: Bulk Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: e200 Utilized IC / Part: MPC5561 |
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MPC5566EVB | NXP USA Inc. |
Description: MPC5566 EVAL BRD Packaging: Bulk Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: e200 Board Type: Evaluation Platform Utilized IC / Part: MPC5566 Part Status: Active |
на замовлення 6 шт: термін постачання 21-31 дні (днів) |
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| MPC5567EVB | NXP USA Inc. |
Description: MPC5567 EVAL BRD Packaging: Bulk Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s), Cable(s), Power Supply, USB Multilink Programmer Core Processor: e200 Utilized IC / Part: MPC5567 |
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MPC7410HX400LE | NXP USA Inc. |
Description: IC MPU MPC74XX 400MHZ 360FCCBGA |
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MPC8260ADS-TCOM | NXP USA Inc. |
Description: BOARD DEV ADS POWERQUICC II Packaging: Bulk For Use With/Related Products: 8260ADS Accessory Type: Interface Board Part Status: Obsolete |
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MPC8313ECVRAFF | NXP USA Inc. |
Description: IC MPU MPC83XX 333MHZ 516TEPBGA Packaging: Tray Package / Case: 516-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 333MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e300c3 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 516-TEPBGA (27x27) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Security; SEC 2.2 RAM Controllers: DDR, DDR2 Graphics Acceleration: No Security Features: Cryptography Additional Interfaces: DUART, HSSI, I2C, PCI, SPI |
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MPC8313EVRAFF | NXP USA Inc. |
Description: IC MPU MPC83XX 333MHZ 516TEPBGA Packaging: Tray Package / Case: 516-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 333MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e300c3 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 516-TEPBGA (27x27) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Security; SEC 2.2 RAM Controllers: DDR, DDR2 Graphics Acceleration: No Security Features: Cryptography Additional Interfaces: DUART, HSSI, I2C, PCI, SPI |
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MPC8347CVVAGDB | NXP USA Inc. |
Description: IC MPU MPC83XX 400MHZ 672LBGA Packaging: Tray Package / Case: 672-LBGA Mounting Type: Surface Mount Speed: 400MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e300 Voltage - I/O: 2.5V, 3.3V Supplier Device Package: 672-LBGA (35x35) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR Graphics Acceleration: No Additional Interfaces: DUART, I2C, PCI, SPI |
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MPC8347CVVAJDB | NXP USA Inc. |
Description: IC MPU MPC83XX 533MHZ 672LBGA Packaging: Tray Package / Case: 672-LBGA Mounting Type: Surface Mount Speed: 533MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e300 Voltage - I/O: 2.5V, 3.3V Supplier Device Package: 672-LBGA (35x35) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR Graphics Acceleration: No Additional Interfaces: DUART, I2C, PCI, SPI |
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MPC8347CVVAJFB | NXP USA Inc. |
Description: IC MPU MPC83XX 533MHZ 672LBGA Packaging: Tray Package / Case: 672-LBGA Mounting Type: Surface Mount Speed: 533MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e300 Voltage - I/O: 2.5V, 3.3V Supplier Device Package: 672-LBGA (35x35) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR Graphics Acceleration: No Additional Interfaces: DUART, I2C, PCI, SPI Part Status: Obsolete |
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MPC8349CVVAJDB | NXP USA Inc. |
Description: IC MPU MPC83XX 533MHZ 672LBGA Packaging: Tray Package / Case: 672-LBGA Mounting Type: Surface Mount Speed: 533MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e300 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 672-LBGA (35x35) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, DDR2 Graphics Acceleration: No Additional Interfaces: DUART, I2C, PCI, SPI |
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MPC8349CZUAGDB | NXP USA Inc. |
Description: IC MPU MPC83XX 400MHZ 672LBGA Packaging: Tray Package / Case: 672-LBGA Mounting Type: Surface Mount Speed: 400MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e300 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 672-LBGA (35x35) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, DDR2 Graphics Acceleration: No Part Status: Obsolete |
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MPC8358ECVVAGDGA | NXP USA Inc. |
Description: IC MPU MPC83XX 400MHZ 740TBGA Packaging: Tray Package / Case: 740-LBGA Mounting Type: Surface Mount Speed: 400MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e300 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 740-TBGA (37.5x37.5) Ethernet: 10/100/1000Mbps (1) USB: USB 1.x (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine, Security; SEC RAM Controllers: DDR, DDR2 Graphics Acceleration: No Security Features: Cryptography, Random Number Generator Part Status: Obsolete Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART |
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MPC8358EVRAGDDA | NXP USA Inc. |
Description: IC MPU MPC83XX 400MHZ 668BGA Packaging: Tray Package / Case: 668-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 400MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e300 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 668-PBGA-PGE (29x29) Ethernet: 10/100/1000Mbps (1) USB: USB 1.x (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine, Security; SEC RAM Controllers: DDR, DDR2 Graphics Acceleration: No Security Features: Cryptography, Random Number Generator Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART Part Status: Active |
на замовлення 32 шт: термін постачання 21-31 дні (днів) |
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MPC8358VVAGDGA | NXP USA Inc. |
Description: IC MPU MPC83XX 400MHZ 740TBGA Packaging: Tray Package / Case: 740-LBGA Mounting Type: Surface Mount Speed: 400MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e300 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 740-TBGA (37.5x37.5) Ethernet: 10/100/1000Mbps (1) USB: USB 1.x (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR, DDR2 Graphics Acceleration: No |
на замовлення 21 шт: термін постачання 21-31 дні (днів) |
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MPC8360CVVAGDGA | NXP USA Inc. |
Description: IC MPU MPC83XX 400MHZ 740TBGA Packaging: Tray Package / Case: 740-LBGA Mounting Type: Surface Mount Speed: 400MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e300 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 740-TBGA (37.5x37.5) Ethernet: 10/100/1000Mbps (1) USB: USB 1.x (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR, DDR2 Graphics Acceleration: No Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART |
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MPC8360CVVAJDGA | NXP USA Inc. |
Description: IC MPU MPC83XX 533MHZ 740TBGA Packaging: Tray Package / Case: 740-LBGA Mounting Type: Surface Mount Speed: 533MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e300 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 740-TBGA (37.5x37.5) Ethernet: 10/100/1000Mbps (1) USB: USB 1.x (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR, DDR2 Graphics Acceleration: No Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART |
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MPC8360EA-MDS-PB | NXP USA Inc. |
Description: MPC8360EA EVAL BRD Packaging: Bulk Mounting Type: Fixed Type: MPU Contents: Board(s), Cable(s), Power Supply Core Processor: e300 Board Type: Evaluation Platform Utilized IC / Part: MPC8360EA Part Status: Discontinued at Digi-Key |
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MPC8360EVVAJDGA | NXP USA Inc. |
Description: IC MPU MPC83XX 533MHZ 740TBGA |
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MPC8360EVVALFHA | NXP USA Inc. |
Description: IC MPU MPC83XX 667MHZ 740TBGA Packaging: Tray Package / Case: 740-LBGA Mounting Type: Surface Mount Speed: 667MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e300 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 740-TBGA (37.5x37.5) Ethernet: 10/100/1000Mbps (1) USB: USB 1.x (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine, Security; SEC RAM Controllers: DDR, DDR2 Graphics Acceleration: No Security Features: Cryptography, Random Number Generator Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART |
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MPC8360ZUAJDGA | NXP USA Inc. |
Description: IC MPU MPC83XX 533MHZ 740TBGA Packaging: Tray Package / Case: 740-LBGA Mounting Type: Surface Mount Speed: 533MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e300 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 740-TBGA (37.5x37.5) Ethernet: 10/100/1000Mbps (1) USB: USB 1.x (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR, DDR2 Graphics Acceleration: No Part Status: Obsolete |
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| MPC8377E-MDS-PB | NXP USA Inc. |
Description: MPC8377E EVAL BRD Packaging: Bulk Mounting Type: Fixed Type: MPU Contents: Board(s) Core Processor: e300 Utilized IC / Part: MPC8377E |
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MPC8540ADS-BGA | NXP USA Inc. |
Description: MPC8540 EVAL BRD |
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MPC8548ECHXAQG | NXP USA Inc. |
Description: IC MPU MPC85XX 1.0GHZ 783FCBGA Packaging: Tray Package / Case: 783-BBGA, FCBGA Mounting Type: Surface Mount Speed: 1.0GHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e500 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 783-FCBGA (29x29) Ethernet: 10/100/1000Mbps (4) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Signal Processing; SPE, Security; SEC RAM Controllers: DDR, DDR2, SDRAM Graphics Acceleration: No Security Features: Cryptography, Random Number Generator |
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MPC8548ECVUAQG | NXP USA Inc. |
Description: IC MPU MPC85XX 1.0GHZ 783FCBGA Packaging: Tray Package / Case: 783-BBGA, FCBGA Mounting Type: Surface Mount Speed: 1.0GHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e500 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 783-FCBGA (29x29) Ethernet: 10/100/1000Mbps (4) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Signal Processing; SPE, Security; SEC RAM Controllers: DDR, DDR2, SDRAM Graphics Acceleration: No Security Features: Cryptography, Random Number Generator |
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| MPC8555CDS | NXP USA Inc. | Description: MPC8555 EVAL BRD |
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MPC8560ADS-BGA | NXP USA Inc. | Description: MPC8560 EVAL BRD |
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MPR083EJR2 | NXP USA Inc. |
Description: IC CTLR TOUCH SENSR PROX 16TSSOP Packaging: Tape & Reel (TR) Package / Case: 16-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Interface: I2C Type: Buttons, Slider, Wheel Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.8V ~ 3.6V Current - Supply: 1.62mA Number of Inputs: 8 Supplier Device Package: 16-TSSOP Proximity Detection: Yes DigiKey Programmable: Not Verified |
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MPR084EJR2 | NXP USA Inc. |
Description: IC CTLR TOUCH SENSR PROX 16TSSOP Packaging: Tape & Reel (TR) Package / Case: 16-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Interface: I2C Type: Buttons, Slider, Wheel Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.8V ~ 3.6V Current - Supply: 1.62mA Number of Inputs: 8 Supplier Device Package: 16-TSSOP Proximity Detection: Yes DigiKey Programmable: Not Verified |
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MPR084QR2 | NXP USA Inc. |
Description: IC CTLR TOUCH SENSOR PROX 16-QFN Packaging: Tape & Reel (TR) Package / Case: 16-VQFN Exposed Pad Mounting Type: Surface Mount Interface: I2C Type: Buttons, Slider, Wheel Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.8V ~ 3.6V Current - Supply: 1.62mA Number of Inputs: 8 Supplier Device Package: 16-QFN-EP (5x5) Proximity Detection: Yes DigiKey Programmable: Not Verified |
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MRF5S4125NBR1 | NXP USA Inc. |
Description: FET RF 65V 465MHZ TO-272-4 |
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MRF5S4125NR1 | NXP USA Inc. |
Description: FET RF 65V 465MHZ TO-270-4 |
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MRF6V10250HSR3 | NXP USA Inc. |
Description: FET RF 100V 1.09GHZ NI780S |
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MRF6V10250HSR5 | NXP USA Inc. |
Description: FET RF 100V 1.09GHZ NI780S |
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| MCZ33972AEK |
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Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 8V ~ 26V
Applications: Switch Monitoring
Supplier Device Package: 32-SOIC-EP
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 8V ~ 26V
Applications: Switch Monitoring
Supplier Device Package: 32-SOIC-EP
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| MCZ33972AEW |
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Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tube
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 8V ~ 26V
Applications: Switch Monitoring
Supplier Device Package: 32-SOIC
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tube
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 8V ~ 26V
Applications: Switch Monitoring
Supplier Device Package: 32-SOIC
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| MCZ33972AEWR2 |
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Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tape & Reel (TR)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 8V ~ 26V
Applications: Switch Monitoring
Supplier Device Package: 32-SOIC
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tape & Reel (TR)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 8V ~ 26V
Applications: Switch Monitoring
Supplier Device Package: 32-SOIC
товар відсутній
| MCZ33975EK |
|
Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 5.5V ~ 28V
Applications: Automotive
Supplier Device Package: 32-SOIC-EP
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 5.5V ~ 28V
Applications: Automotive
Supplier Device Package: 32-SOIC-EP
товар відсутній
| MCZ33975EKR2 |
|
Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 5.5V ~ 28V
Supplier Device Package: 32-SOIC-EP
Grade: Automotive
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 5.5V ~ 28V
Supplier Device Package: 32-SOIC-EP
Grade: Automotive
товар відсутній
| MMA7455LR1 |
|
Виробник: NXP USA Inc.
Description: ACCELEROMETER 2-8G I2C/SPI 14LGA
Packaging: Tape & Reel (TR)
Features: Adjustable Bandwidth, Selectable Scale
Package / Case: 14-TFLGA
Output Type: I2C, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.4V ~ 3.6V
Bandwidth: 62.5Hz ~ 125Hz
Supplier Device Package: 14-LGA (3x5)
Sensitivity (LSB/g): 64 (±2g) ~ 16 (±8g)
Description: ACCELEROMETER 2-8G I2C/SPI 14LGA
Packaging: Tape & Reel (TR)
Features: Adjustable Bandwidth, Selectable Scale
Package / Case: 14-TFLGA
Output Type: I2C, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.4V ~ 3.6V
Bandwidth: 62.5Hz ~ 125Hz
Supplier Device Package: 14-LGA (3x5)
Sensitivity (LSB/g): 64 (±2g) ~ 16 (±8g)
товар відсутній
| MMA7455LR2 |
|
Виробник: NXP USA Inc.
Description: ACCELEROMETER 2-8G I2C/SPI 14LGA
Features: Adjustable Bandwidth, Selectable Scale
Packaging: Tape & Reel (TR)
Package / Case: 14-TFLGA
Output Type: I2C, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.4V ~ 3.6V
Bandwidth: 62.5Hz ~ 125Hz
Supplier Device Package: 14-LGA (3x5)
Sensitivity (LSB/g): 64 (±2g) ~ 16 (±8g)
Description: ACCELEROMETER 2-8G I2C/SPI 14LGA
Features: Adjustable Bandwidth, Selectable Scale
Packaging: Tape & Reel (TR)
Package / Case: 14-TFLGA
Output Type: I2C, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.4V ~ 3.6V
Bandwidth: 62.5Hz ~ 125Hz
Supplier Device Package: 14-LGA (3x5)
Sensitivity (LSB/g): 64 (±2g) ~ 16 (±8g)
товар відсутній
| MMA7455LT | |
|
Виробник: NXP USA Inc.
Description: ACCELEROMETER 2-8G I2C/SPI 14LGA
Features: Adjustable Bandwidth, Selectable Scale
Packaging: Tray
Package / Case: 14-TFLGA
Output Type: I2C, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.4V ~ 3.6V
Bandwidth: 62.5Hz ~ 125Hz
Supplier Device Package: 14-LGA (3x5)
Sensitivity (LSB/g): 64 (±2g) ~ 16 (±8g)
Description: ACCELEROMETER 2-8G I2C/SPI 14LGA
Features: Adjustable Bandwidth, Selectable Scale
Packaging: Tray
Package / Case: 14-TFLGA
Output Type: I2C, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.4V ~ 3.6V
Bandwidth: 62.5Hz ~ 125Hz
Supplier Device Package: 14-LGA (3x5)
Sensitivity (LSB/g): 64 (±2g) ~ 16 (±8g)
товар відсутній
| MMG3006NT1 |
|
Виробник: NXP USA Inc.
Description: IC AMP CELL 400MHZ-2.4GHZ 16QFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 400MHz ~ 2.4GHz
RF Type: Cellular, PCS, PHS, WLL
Voltage - Supply: 5V
Gain: 17.5dB
Current - Supply: 850mA
Noise Figure: 6.6dB
P1dB: 33dBm
Test Frequency: 900MHz
Supplier Device Package: 16-QFN (4x4)
Part Status: Active
Description: IC AMP CELL 400MHZ-2.4GHZ 16QFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 400MHz ~ 2.4GHz
RF Type: Cellular, PCS, PHS, WLL
Voltage - Supply: 5V
Gain: 17.5dB
Current - Supply: 850mA
Noise Figure: 6.6dB
P1dB: 33dBm
Test Frequency: 900MHz
Supplier Device Package: 16-QFN (4x4)
Part Status: Active
товар відсутній
| MPC5554EVB |
|
Виробник: NXP USA Inc.
Description: MPC5554 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Utilized IC / Part: MPC5554
Description: MPC5554 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Utilized IC / Part: MPC5554
товар відсутній
| MPC5554INT |
|
Виробник: NXP USA Inc.
Description: MPC5554 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Utilized IC / Part: MPC5554
Description: MPC5554 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Utilized IC / Part: MPC5554
товар відсутній
| MPC5561EVB |
|
Виробник: NXP USA Inc.
Description: MPC5561 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Utilized IC / Part: MPC5561
Description: MPC5561 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Utilized IC / Part: MPC5561
товар відсутній
| MPC5566EVB |
|
Виробник: NXP USA Inc.
Description: MPC5566 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Board Type: Evaluation Platform
Utilized IC / Part: MPC5566
Part Status: Active
Description: MPC5566 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Board Type: Evaluation Platform
Utilized IC / Part: MPC5566
Part Status: Active
на замовлення 6 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 122864.84 грн |
| MPC5567EVB |
|
Виробник: NXP USA Inc.
Description: MPC5567 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s), Power Supply, USB Multilink Programmer
Core Processor: e200
Utilized IC / Part: MPC5567
Description: MPC5567 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s), Power Supply, USB Multilink Programmer
Core Processor: e200
Utilized IC / Part: MPC5567
товар відсутній
| MPC8260ADS-TCOM |
Виробник: NXP USA Inc.
Description: BOARD DEV ADS POWERQUICC II
Packaging: Bulk
For Use With/Related Products: 8260ADS
Accessory Type: Interface Board
Part Status: Obsolete
Description: BOARD DEV ADS POWERQUICC II
Packaging: Bulk
For Use With/Related Products: 8260ADS
Accessory Type: Interface Board
Part Status: Obsolete
товар відсутній
| MPC8313ECVRAFF |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 333MHZ 516TEPBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
Description: IC MPU MPC83XX 333MHZ 516TEPBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
товар відсутній
| MPC8313EVRAFF |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 333MHZ 516TEPBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
Description: IC MPU MPC83XX 333MHZ 516TEPBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
товар відсутній
| MPC8347CVVAGDB |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 672LBGA
Packaging: Tray
Package / Case: 672-LBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 672-LBGA (35x35)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI, SPI
Description: IC MPU MPC83XX 400MHZ 672LBGA
Packaging: Tray
Package / Case: 672-LBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 672-LBGA (35x35)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI, SPI
товар відсутній
| MPC8347CVVAJDB |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 533MHZ 672LBGA
Packaging: Tray
Package / Case: 672-LBGA
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 672-LBGA (35x35)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI, SPI
Description: IC MPU MPC83XX 533MHZ 672LBGA
Packaging: Tray
Package / Case: 672-LBGA
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 672-LBGA (35x35)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI, SPI
товар відсутній
| MPC8347CVVAJFB |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 533MHZ 672LBGA
Packaging: Tray
Package / Case: 672-LBGA
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 672-LBGA (35x35)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI, SPI
Part Status: Obsolete
Description: IC MPU MPC83XX 533MHZ 672LBGA
Packaging: Tray
Package / Case: 672-LBGA
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 672-LBGA (35x35)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI, SPI
Part Status: Obsolete
товар відсутній
| MPC8349CVVAJDB |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 533MHZ 672LBGA
Packaging: Tray
Package / Case: 672-LBGA
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 672-LBGA (35x35)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI, SPI
Description: IC MPU MPC83XX 533MHZ 672LBGA
Packaging: Tray
Package / Case: 672-LBGA
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 672-LBGA (35x35)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI, SPI
товар відсутній
| MPC8349CZUAGDB |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 672LBGA
Packaging: Tray
Package / Case: 672-LBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 672-LBGA (35x35)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Part Status: Obsolete
Description: IC MPU MPC83XX 400MHZ 672LBGA
Packaging: Tray
Package / Case: 672-LBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 672-LBGA (35x35)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Part Status: Obsolete
товар відсутній
| MPC8358ECVVAGDGA |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 740TBGA
Packaging: Tray
Package / Case: 740-LBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 740-TBGA (37.5x37.5)
Ethernet: 10/100/1000Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Part Status: Obsolete
Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART
Description: IC MPU MPC83XX 400MHZ 740TBGA
Packaging: Tray
Package / Case: 740-LBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 740-TBGA (37.5x37.5)
Ethernet: 10/100/1000Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Part Status: Obsolete
Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART
товар відсутній
| MPC8358EVRAGDDA |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 668BGA
Packaging: Tray
Package / Case: 668-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 668-PBGA-PGE (29x29)
Ethernet: 10/100/1000Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART
Part Status: Active
Description: IC MPU MPC83XX 400MHZ 668BGA
Packaging: Tray
Package / Case: 668-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 668-PBGA-PGE (29x29)
Ethernet: 10/100/1000Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART
Part Status: Active
на замовлення 32 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 5718.99 грн |
| 10+ | 5439.46 грн |
| MPC8358VVAGDGA |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 740TBGA
Packaging: Tray
Package / Case: 740-LBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 740-TBGA (37.5x37.5)
Ethernet: 10/100/1000Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Description: IC MPU MPC83XX 400MHZ 740TBGA
Packaging: Tray
Package / Case: 740-LBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 740-TBGA (37.5x37.5)
Ethernet: 10/100/1000Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
на замовлення 21 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 9107.66 грн |
| 21+ | 7232.77 грн |
| MPC8360CVVAGDGA |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 740TBGA
Packaging: Tray
Package / Case: 740-LBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 740-TBGA (37.5x37.5)
Ethernet: 10/100/1000Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART
Description: IC MPU MPC83XX 400MHZ 740TBGA
Packaging: Tray
Package / Case: 740-LBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 740-TBGA (37.5x37.5)
Ethernet: 10/100/1000Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART
товар відсутній
| MPC8360CVVAJDGA |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 533MHZ 740TBGA
Packaging: Tray
Package / Case: 740-LBGA
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 740-TBGA (37.5x37.5)
Ethernet: 10/100/1000Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART
Description: IC MPU MPC83XX 533MHZ 740TBGA
Packaging: Tray
Package / Case: 740-LBGA
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 740-TBGA (37.5x37.5)
Ethernet: 10/100/1000Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART
товар відсутній
| MPC8360EA-MDS-PB |
|
Виробник: NXP USA Inc.
Description: MPC8360EA EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s), Cable(s), Power Supply
Core Processor: e300
Board Type: Evaluation Platform
Utilized IC / Part: MPC8360EA
Part Status: Discontinued at Digi-Key
Description: MPC8360EA EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s), Cable(s), Power Supply
Core Processor: e300
Board Type: Evaluation Platform
Utilized IC / Part: MPC8360EA
Part Status: Discontinued at Digi-Key
товар відсутній
| MPC8360EVVALFHA |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 667MHZ 740TBGA
Packaging: Tray
Package / Case: 740-LBGA
Mounting Type: Surface Mount
Speed: 667MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 740-TBGA (37.5x37.5)
Ethernet: 10/100/1000Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART
Description: IC MPU MPC83XX 667MHZ 740TBGA
Packaging: Tray
Package / Case: 740-LBGA
Mounting Type: Surface Mount
Speed: 667MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 740-TBGA (37.5x37.5)
Ethernet: 10/100/1000Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART
товар відсутній
| MPC8360ZUAJDGA |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 533MHZ 740TBGA
Packaging: Tray
Package / Case: 740-LBGA
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 740-TBGA (37.5x37.5)
Ethernet: 10/100/1000Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Part Status: Obsolete
Description: IC MPU MPC83XX 533MHZ 740TBGA
Packaging: Tray
Package / Case: 740-LBGA
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 740-TBGA (37.5x37.5)
Ethernet: 10/100/1000Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Part Status: Obsolete
товар відсутній
| MPC8377E-MDS-PB |
|
Виробник: NXP USA Inc.
Description: MPC8377E EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: e300
Utilized IC / Part: MPC8377E
Description: MPC8377E EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: e300
Utilized IC / Part: MPC8377E
товар відсутній
| MPC8548ECHXAQG |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC85XX 1.0GHZ 783FCBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCBGA (29x29)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Description: IC MPU MPC85XX 1.0GHZ 783FCBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCBGA (29x29)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
товар відсутній
| MPC8548ECVUAQG |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC85XX 1.0GHZ 783FCBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCBGA (29x29)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Description: IC MPU MPC85XX 1.0GHZ 783FCBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCBGA (29x29)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
товар відсутній
| MPR083EJR2 |
Виробник: NXP USA Inc.
Description: IC CTLR TOUCH SENSR PROX 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Interface: I2C
Type: Buttons, Slider, Wheel
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 3.6V
Current - Supply: 1.62mA
Number of Inputs: 8
Supplier Device Package: 16-TSSOP
Proximity Detection: Yes
DigiKey Programmable: Not Verified
Description: IC CTLR TOUCH SENSR PROX 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Interface: I2C
Type: Buttons, Slider, Wheel
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 3.6V
Current - Supply: 1.62mA
Number of Inputs: 8
Supplier Device Package: 16-TSSOP
Proximity Detection: Yes
DigiKey Programmable: Not Verified
товар відсутній
| MPR084EJR2 |
|
Виробник: NXP USA Inc.
Description: IC CTLR TOUCH SENSR PROX 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Interface: I2C
Type: Buttons, Slider, Wheel
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 3.6V
Current - Supply: 1.62mA
Number of Inputs: 8
Supplier Device Package: 16-TSSOP
Proximity Detection: Yes
DigiKey Programmable: Not Verified
Description: IC CTLR TOUCH SENSR PROX 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Interface: I2C
Type: Buttons, Slider, Wheel
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 3.6V
Current - Supply: 1.62mA
Number of Inputs: 8
Supplier Device Package: 16-TSSOP
Proximity Detection: Yes
DigiKey Programmable: Not Verified
товар відсутній
| MPR084QR2 |
Виробник: NXP USA Inc.
Description: IC CTLR TOUCH SENSOR PROX 16-QFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VQFN Exposed Pad
Mounting Type: Surface Mount
Interface: I2C
Type: Buttons, Slider, Wheel
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 3.6V
Current - Supply: 1.62mA
Number of Inputs: 8
Supplier Device Package: 16-QFN-EP (5x5)
Proximity Detection: Yes
DigiKey Programmable: Not Verified
Description: IC CTLR TOUCH SENSOR PROX 16-QFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VQFN Exposed Pad
Mounting Type: Surface Mount
Interface: I2C
Type: Buttons, Slider, Wheel
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 3.6V
Current - Supply: 1.62mA
Number of Inputs: 8
Supplier Device Package: 16-QFN-EP (5x5)
Proximity Detection: Yes
DigiKey Programmable: Not Verified
товар відсутній