Продукція > ARIES ELECTRONICS > Всі товари виробника ARIES ELECTRONICS (15937) > Сторінка 96 з 266
Фото | Назва | Виробник | Інформація |
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16-C195-21 | Aries Electronics | Description: CONN IC DIP SOCKET 16POS GOLD |
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16-C195-30 | Aries Electronics |
Description: CONN IC DIP SOCKET 16POS GOLD Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 16 (2 x 8) Termination: Wire Wrap Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
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16-C195-31 | Aries Electronics | Description: CONN IC DIP SOCKET 16POS GOLD |
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16-C280-20 | Aries Electronics | Description: CONN IC DIP SOCKET 16POS GOLD |
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16-C280-21 | Aries Electronics | Description: CONN IC DIP SOCKET 16POS GOLD |
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16-C280-30 | Aries Electronics | Description: CONN IC DIP SOCKET 16POS GOLD |
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16-C280-31 | Aries Electronics | Description: CONN IC DIP SOCKET 16POS GOLD |
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24-C182-20 | Aries Electronics | Description: CONN IC DIP SOCKET 24POS GOLD |
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24-C182-21 | Aries Electronics | Description: CONN IC DIP SOCKET 24POS GOLD |
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24-C182-30 | Aries Electronics | Description: CONN IC DIP SOCKET 24POS GOLD |
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24-C182-31 | Aries Electronics | Description: CONN IC DIP SOCKET 24POS GOLD |
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24-C212-20 | Aries Electronics | Description: CONN IC DIP SOCKET 24POS GOLD |
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24-C212-21 | Aries Electronics | Description: CONN IC DIP SOCKET 24POS GOLD |
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24-C212-30 | Aries Electronics | Description: CONN IC DIP SOCKET 24POS GOLD |
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24-C212-31 | Aries Electronics | Description: CONN IC DIP SOCKET 24POS GOLD |
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24-C300-20 | Aries Electronics | Description: CONN IC DIP SOCKET 24POS GOLD |
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24-C300-21 | Aries Electronics | Description: CONN IC DIP SOCKET 24POS GOLD |
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24-C300-30 | Aries Electronics | Description: CONN IC DIP SOCKET 24POS GOLD |
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24-C300-31 | Aries Electronics | Description: CONN IC DIP SOCKET 24POS GOLD |
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28-C182-20 | Aries Electronics | Description: CONN IC DIP SOCKET 28POS GOLD |
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28-C182-21 | Aries Electronics | Description: CONN IC DIP SOCKET 28POS GOLD |
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28-C182-30 | Aries Electronics | Description: CONN IC DIP SOCKET 28POS GOLD |
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28-C182-31 | Aries Electronics | Description: CONN IC DIP SOCKET 28POS GOLD |
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28-C212-20 | Aries Electronics | Description: CONN IC DIP SOCKET 28POS GOLD |
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28-C212-21 | Aries Electronics | Description: CONN IC DIP SOCKET 28POS GOLD |
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28-C212-30 | Aries Electronics | Description: CONN IC DIP SOCKET 28POS GOLD |
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28-C212-31 | Aries Electronics | Description: CONN IC DIP SOCKET 28POS GOLD |
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28-C300-20 | Aries Electronics |
Description: CONN IC DIP SOCKET 28POS GOLD Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Wire Wrap Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Part Status: Active |
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28-C300-21 | Aries Electronics |
Description: CONN IC DIP SOCKET 28POS GOLD Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Wire Wrap Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Part Status: Active |
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28-C300-30 | Aries Electronics |
Description: CONN IC DIP SOCKET 28POS GOLD Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Wire Wrap Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Part Status: Active |
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28-C300-31 | Aries Electronics |
Description: CONN IC DIP SOCKET 28POS GOLD Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Wire Wrap Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Part Status: Active |
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32-C182-20 | Aries Electronics | Description: CONN IC DIP SOCKET 32POS GOLD |
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32-C182-21 | Aries Electronics | Description: CONN IC DIP SOCKET 32POS GOLD |
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32-C182-30 | Aries Electronics | Description: CONN IC DIP SOCKET 32POS GOLD |
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32-C182-31 | Aries Electronics | Description: CONN IC DIP SOCKET 32POS GOLD |
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32-C212-20 | Aries Electronics | Description: CONN IC DIP SOCKET 32POS GOLD |
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32-C212-21 | Aries Electronics | Description: CONN IC DIP SOCKET 32POS GOLD |
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32-C212-30 | Aries Electronics | Description: CONN IC DIP SOCKET 32POS GOLD |
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32-C212-31 | Aries Electronics | Description: CONN IC DIP SOCKET 32POS GOLD |
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32-C300-20 | Aries Electronics | Description: CONN IC DIP SOCKET 32POS GOLD |
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32-C300-21 | Aries Electronics | Description: CONN IC DIP SOCKET 32POS GOLD |
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32-C300-30 | Aries Electronics | Description: CONN IC DIP SOCKET 32POS GOLD |
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32-C300-31 | Aries Electronics | Description: CONN IC DIP SOCKET 32POS GOLD |
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40-C182-20 | Aries Electronics | Description: CONN IC DIP SOCKET 40POS GOLD |
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40-C182-21 | Aries Electronics | Description: CONN IC DIP SOCKET 40POS GOLD |
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40-C182-30 | Aries Electronics | Description: CONN IC DIP SOCKET 40POS GOLD |
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40-C182-31 | Aries Electronics | Description: CONN IC DIP SOCKET 40POS GOLD |
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40-C212-20 | Aries Electronics | Description: CONN IC DIP SOCKET 40POS GOLD |
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40-C212-21 | Aries Electronics | Description: CONN IC DIP SOCKET 40POS GOLD |
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40-C212-30 | Aries Electronics | Description: CONN IC DIP SOCKET 40POS GOLD |
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40-C212-31 | Aries Electronics | Description: CONN IC DIP SOCKET 40POS GOLD |
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40-C300-20 | Aries Electronics | Description: CONN IC DIP SOCKET 40POS GOLD |
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40-C300-21 | Aries Electronics | Description: CONN IC DIP SOCKET 40POS GOLD |
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40-C300-30 | Aries Electronics | Description: CONN IC DIP SOCKET 40POS GOLD |
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40-C300-31 | Aries Electronics | Description: CONN IC DIP SOCKET 40POS GOLD |
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5679-107-12 | Aries Electronics | Description: 518 OPN FRM CAP SOCKET SLDR TAIL |
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7340-140-12 | Aries Electronics | Description: 518 OPN FRM CAP SOCKET SLDR TAIL |
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14-3518-101 | Aries Electronics |
Description: CONN IC DIP SOCKET 14POS GOLD Features: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 14 (2 x 7) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Part Status: Active |
на замовлення 106 шт: термін постачання 21-31 дні (днів) |
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14-3518-101H | Aries Electronics | Description: CONN IC DIP SOCKET 14POS GOLD |
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14-3518-102 | Aries Electronics | Description: CONN IC DIP SOCKET 14POS GOLD |
товар відсутній |
16-C195-30 |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 16POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 16POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
28-C300-20 |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 28POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 28POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
товар відсутній
28-C300-21 |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 28POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 28POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
товар відсутній
28-C300-30 |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 28POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 28POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
товар відсутній
28-C300-31 |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 28POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 28POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
товар відсутній
5679-107-12 |
Виробник: Aries Electronics
Description: 518 OPN FRM CAP SOCKET SLDR TAIL
Description: 518 OPN FRM CAP SOCKET SLDR TAIL
товар відсутній
7340-140-12 |
Виробник: Aries Electronics
Description: 518 OPN FRM CAP SOCKET SLDR TAIL
Description: 518 OPN FRM CAP SOCKET SLDR TAIL
товар відсутній
14-3518-101 |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 14POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 14POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
на замовлення 106 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
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1+ | 322.14 грн |
10+ | 281.66 грн |
25+ | 266.8 грн |
50+ | 244.56 грн |
100+ | 232.91 грн |