Продукція > ARIES ELECTRONICS > Всі товари виробника ARIES ELECTRONICS (15932) > Сторінка 95 з 266
Фото | Назва | Виробник | Інформація |
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16-C195-00 | Aries Electronics | Description: CONN IC DIP SOCKET 16POS GOLD |
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16-C280-00 | Aries Electronics | Description: CONN IC DIP SOCKET 16POS GOLD |
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24-C182-00 | Aries Electronics | Description: CONN IC DIP SOCKET 24POS GOLD |
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24-C212-00 | Aries Electronics | Description: CONN IC DIP SOCKET 24POS GOLD |
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24-C300-00 | Aries Electronics | Description: CONN IC DIP SOCKET 24POS GOLD |
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28-C182-00 | Aries Electronics | Description: CONN IC DIP SOCKET 28POS GOLD |
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28-C212-00 | Aries Electronics | Description: CONN IC DIP SOCKET 28POS GOLD |
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28-C300-00 | Aries Electronics |
Description: CONN IC DIP SOCKET 28POS GOLD Packaging: Bulk Features: Closed Frame Mounting Type: Surface Mount Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Part Status: Active |
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32-C182-00 | Aries Electronics | Description: CONN IC DIP SOCKET 32POS GOLD |
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32-C212-00 | Aries Electronics | Description: CONN IC DIP SOCKET 32POS GOLD |
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32-C300-00 | Aries Electronics | Description: CONN IC DIP SOCKET 32POS GOLD |
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40-C182-00 | Aries Electronics | Description: CONN IC DIP SOCKET 40POS GOLD |
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40-C212-00 | Aries Electronics | Description: CONN IC DIP SOCKET 40POS GOLD |
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40-C300-00 | Aries Electronics | Description: CONN IC DIP SOCKET 40POS GOLD |
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14-C195-10 | Aries Electronics | Description: CONN IC DIP SOCKET 14POS GOLD |
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14-C195-10T | Aries Electronics | Description: CONN IC DIP SOCKET 14POS TIN |
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14-C195-11 | Aries Electronics | Description: CONN IC DIP SOCKET 14POS GOLD |
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14-C280-10T | Aries Electronics | Description: CONN IC DIP SOCKET 14POS TIN |
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14-C280-11 | Aries Electronics | Description: CONN IC DIP SOCKET 14POS GOLD |
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16-C195-10 | Aries Electronics | Description: CONN IC DIP SOCKET 16POS GOLD |
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16-C195-10H | Aries Electronics | Description: CONN IC DIP SOCKET 16POS GOLD |
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16-C195-11 | Aries Electronics | Description: CONN IC DIP SOCKET 16POS GOLD |
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16-C280-11 | Aries Electronics | Description: CONN IC DIP SOCKET 16POS GOLD |
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16-C280-11H | Aries Electronics | Description: CONN IC DIP SOCKET 16POS GOLD |
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2357-108-12 | Aries Electronics |
Description: EJECT-A-DP LCK/EJCT SCKT SLDR TL Part Status: Active |
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24-C182-10H | Aries Electronics | Description: CONN IC DIP SOCKET 24POS GOLD |
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24-C182-11 | Aries Electronics | Description: CONN IC DIP SOCKET 24POS GOLD |
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24-C182-11H | Aries Electronics | Description: CONN IC DIP SOCKET 24POS GOLD |
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24-C212-10 | Aries Electronics | Description: CONN IC DIP SOCKET 24POS GOLD |
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24-C212-11 | Aries Electronics | Description: CONN IC DIP SOCKET 24POS GOLD |
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24-C300-10 | Aries Electronics | Description: CONN IC DIP SOCKET 24POS GOLD |
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24-C300-11 | Aries Electronics | Description: CONN IC DIP SOCKET 24POS GOLD |
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28-C182-11H | Aries Electronics | Description: CONN IC DIP SOCKET 28POS GOLD |
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28-C212-10 | Aries Electronics | Description: CONN IC DIP SOCKET 28POS GOLD |
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28-C212-10T | Aries Electronics | Description: CONN IC DIP SOCKET 28POS TIN |
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28-C212-11 | Aries Electronics | Description: CONN IC DIP SOCKET 28POS GOLD |
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28-C300-10 | Aries Electronics |
Description: CONN IC DIP SOCKET 28POS GOLD Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Part Status: Active |
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28-C300-11 | Aries Electronics |
Description: CONN IC DIP SOCKET 28POS GOLD Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Part Status: Active |
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32-C182-11 | Aries Electronics | Description: CONN IC DIP SOCKET 32POS GOLD |
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32-C212-10 | Aries Electronics | Description: CONN IC DIP SOCKET 32POS GOLD |
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32-C212-11 | Aries Electronics | Description: CONN IC DIP SOCKET 32POS GOLD |
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32-C300-10 | Aries Electronics | Description: CONN IC DIP SOCKET 32POS GOLD |
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32-C300-11 | Aries Electronics | Description: CONN IC DIP SOCKET 32POS GOLD |
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40-C182-11 | Aries Electronics | Description: CONN IC DIP SOCKET 40POS GOLD |
на замовлення 9 шт: термін постачання 21-31 дні (днів) |
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40-C182-11H | Aries Electronics | Description: CONN IC DIP SOCKET 40POS GOLD |
товар відсутній |
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40-C212-10 | Aries Electronics |
Description: CONN IC DIP SOCKET 40POS GOLD Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 40 (2 x 20) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Part Status: Active |
на замовлення 1452 шт: термін постачання 21-31 дні (днів) |
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40-C212-11 | Aries Electronics | Description: CONN IC DIP SOCKET 40POS GOLD |
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40-C300-10 | Aries Electronics | Description: CONN IC DIP SOCKET 40POS GOLD |
товар відсутній |
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40-C300-11 | Aries Electronics | Description: CONN IC DIP SOCKET 40POS GOLD |
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32-C212-10H | Aries Electronics | Description: CONN IC DIP SOCKET 32POS GOLD |
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32-C212-10T | Aries Electronics | Description: CONN IC DIP SOCKET 32POS TIN |
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14-C195-20 | Aries Electronics | Description: CONN IC DIP SOCKET 14POS GOLD |
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14-C195-21 | Aries Electronics | Description: CONN IC DIP SOCKET 14POS GOLD |
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14-C195-30 | Aries Electronics |
Description: CONN IC DIP SOCKET 14POS GOLD Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 14 (2 x 7) Termination: Wire Wrap Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
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14-C195-31 | Aries Electronics | Description: CONN IC DIP SOCKET 14POS GOLD |
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14-C280-20 | Aries Electronics | Description: CONN IC DIP SOCKET 14POS GOLD |
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14-C280-21 | Aries Electronics | Description: CONN IC DIP SOCKET 14POS GOLD |
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14-C280-30 | Aries Electronics | Description: CONN IC DIP SOCKET 14POS GOLD |
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14-C280-31 | Aries Electronics | Description: CONN IC DIP SOCKET 14POS GOLD |
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16-C195-20 | Aries Electronics | Description: CONN IC DIP SOCKET 16POS GOLD |
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28-C300-00 |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Surface Mount
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Surface Mount
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
товар відсутній
2357-108-12 |
товар відсутній
28-C300-10 |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
товар відсутній
28-C300-11 |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
товар відсутній
40-C182-11 |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 40POS GOLD
Description: CONN IC DIP SOCKET 40POS GOLD
на замовлення 9 шт:
термін постачання 21-31 дні (днів)40-C212-10 |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 40POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 40POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
на замовлення 1452 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 719.95 грн |
10+ | 623.66 грн |
100+ | 557.38 грн |
1000+ | 387.36 грн |
14-C195-30 |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 14POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 14POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній