Продукція > ARIES ELECTRONICS > Всі товари виробника ARIES ELECTRONICS (15936) > Сторінка 93 з 266
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
|---|---|---|---|---|---|
| 22-0508-20 | Aries Electronics |
 Description: CONN SOCKET SIP 22POS GOLD |
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| 22-0508-21 | Aries Electronics |
Description: CONN SOCKET SIP 22POS GOLD |
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| 22-0508-30 | Aries Electronics |
Description: CONN SOCKET SIP 22POS GOLD |
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| 22-0508-31 | Aries Electronics |
Description: CONN SOCKET SIP 22POS GOLD |
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| 22-1508-20 | Aries Electronics |
Description: CONN IC DIP SOCKET 22POS GOLD Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.2" (5.08mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 22 (2 x 11) Termination: Wire Wrap Housing Material: Polyamide (PA46), Nylon 4/6 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
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| 22-1508-21 | Aries Electronics |
Description: CONN IC DIP SOCKET 22POS GOLD Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.2" (5.08mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 22 (2 x 11) Termination: Wire Wrap Housing Material: Polyamide (PA46), Nylon 4/6 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass |
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| 22-1508-30 | Aries Electronics |
Description: CONN IC DIP SOCKET 22POS GOLD Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.2" (5.08mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 22 (2 x 11) Termination: Wire Wrap Housing Material: Polyamide (PA46), Nylon 4/6 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
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| 22-1508-31 | Aries Electronics |
Description: CONN IC DIP SOCKET 22POS GOLD Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.2" (5.08mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 22 (2 x 11) Termination: Wire Wrap Housing Material: Polyamide (PA46), Nylon 4/6 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass |
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| 23-0508-20 | Aries Electronics |
Description: CONN SOCKET SIP 23POS GOLD |
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| 23-0508-21 | Aries Electronics |
Description: CONN SOCKET SIP 23POS GOLD |
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| 23-0508-30 | Aries Electronics |
Description: CONN SOCKET SIP 23POS GOLD |
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| 23-0508-31 | Aries Electronics |
Description: CONN SOCKET SIP 23POS GOLD |
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| 24-0508-20 | Aries Electronics |
Description: CONN SOCKET SIP 24POS GOLD |
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| 24-0508-21 | Aries Electronics |
Description: CONN SOCKET SIP 24POS GOLD |
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| 24-0508-30 | Aries Electronics |
Description: CONN SOCKET SIP 24POS GOLD |
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| 24-0508-31 | Aries Electronics |
Description: CONN SOCKET SIP 24POS GOLD |
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| 24-1508-20 | Aries Electronics |
Description: CONN IC DIP SOCKET 24POS GOLD |
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| 24-1508-21 | Aries Electronics |
Description: CONN IC DIP SOCKET 24POS GOLD |
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| 24-1508-30 | Aries Electronics |
Description: CONN IC DIP SOCKET 24POS GOLD |
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| 24-1508-31 | Aries Electronics |
Description: CONN IC DIP SOCKET 24POS GOLD |
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| 25-0508-20 | Aries Electronics |
Description: CONN SOCKET SIP 25POS GOLD |
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| 25-0508-21 | Aries Electronics |
Description: CONN SOCKET SIP 25POS GOLD |
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| 25-0508-30 | Aries Electronics |
Description: CONN SOCKET SIP 25POS GOLD |
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| 25-0508-31 | Aries Electronics |
Description: CONN SOCKET SIP 25POS GOLD |
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| 26-0508-20 | Aries Electronics |
Description: CONN SOCKET SIP 26POS GOLD |
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| 26-0508-21 | Aries Electronics |
Description: CONN SOCKET SIP 26POS GOLD |
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| 26-0508-30 | Aries Electronics |
Description: CONN SOCKET SIP 26POS GOLD |
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| 26-0508-31 | Aries Electronics |
Description: CONN SOCKET SIP 26POS GOLD |
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| 26-1508-20 | Aries Electronics |
Description: CONN IC DIP SOCKET 26POS GOLD |
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| 26-1508-21 | Aries Electronics |
Description: CONN IC DIP SOCKET 26POS GOLD |
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| 26-1508-30 | Aries Electronics |
Description: CONN IC DIP SOCKET 26POS GOLD |
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| 26-1508-31 | Aries Electronics |
Description: CONN IC DIP SOCKET 26POS GOLD |
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| 27-0508-20 | Aries Electronics |
Description: CONN SOCKET SIP 27POS GOLD |
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| 27-0508-21 | Aries Electronics |
Description: CONN SOCKET SIP 27POS GOLD |
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| 27-0508-30 | Aries Electronics |
Description: CONN SOCKET SIP 27POS GOLD |
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| 27-0508-31 | Aries Electronics |
Description: CONN SOCKET SIP 27POS GOLD |
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| 28-0508-20 | Aries Electronics |
Description: CONN SOCKET SIP 28POS GOLD |
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| 28-0508-21 | Aries Electronics |
Description: CONN SOCKET SIP 28POS GOLD |
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| 28-0508-30 | Aries Electronics |
Description: CONN SOCKET SIP 28POS GOLD |
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| 28-0508-31 | Aries Electronics |
Description: CONN SOCKET SIP 28POS GOLD |
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| 28-1508-20 | Aries Electronics |
Description: CONN IC DIP SOCKET 28POS GOLD |
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| 28-1508-21 | Aries Electronics |
Description: CONN IC DIP SOCKET 28POS GOLD |
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| 28-1508-30 | Aries Electronics |
Description: CONN IC DIP SOCKET 28POS GOLD |
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| 28-1508-31 | Aries Electronics |
Description: CONN IC DIP SOCKET 28POS GOLD |
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| 29-0508-20 | Aries Electronics |
Description: X508 SMD SNG/DUAL SCKT WIRE WRAP |
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| 29-0508-21 | Aries Electronics |
Description: CONN SOCKET SIP 29POS GOLD |
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| 29-0508-30 | Aries Electronics |
Description: CONN SOCKET SIP 29POS GOLD |
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| 29-0508-31 | Aries Electronics |
Description: CONN SOCKET SIP 29POS GOLD |
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| 30-0508-20 | Aries Electronics |
Description: CONN SOCKET SIP 30POS GOLD |
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| 30-0508-21 | Aries Electronics |
Description: CONN SOCKET SIP 30POS GOLD |
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| 30-0508-30 | Aries Electronics |
Description: CONN SOCKET SIP 30POS GOLD |
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| 30-0508-31 | Aries Electronics |
Description: CONN SOCKET SIP 30POS GOLD |
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| 30-1508-20 | Aries Electronics |
Description: CONN IC DIP SOCKET 30POS GOLD |
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| 30-1508-21 | Aries Electronics |
Description: CONN IC DIP SOCKET 30POS GOLD Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.2" (5.08mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 30 (2 x 15) Termination: Wire Wrap Housing Material: Polyamide (PA46), Nylon 4/6 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Part Status: Active |
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| 30-1508-30 | Aries Electronics |
Description: CONN IC DIP SOCKET 30POS GOLD |
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| 30-1508-31 | Aries Electronics |
Description: CONN IC DIP SOCKET 30POS GOLD |
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| 31-0508-20 | Aries Electronics |
Description: CONN SOCKET SIP 31POS GOLD |
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| 31-0508-21 | Aries Electronics |
Description: CONN SOCKET SIP 31POS GOLD |
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| 31-0508-30 | Aries Electronics |
Description: CONN SOCKET SIP 31POS GOLD |
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| 31-0508-31 | Aries Electronics |
Description: CONN SOCKET SIP 31POS GOLD |
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| 22-1508-20 |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 22POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 22POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
| 22-1508-21 |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 22POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 22POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товар відсутній
| 22-1508-30 |
|
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 22POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 22POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
| 22-1508-31 |
|
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 22POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 22POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товар відсутній
| 30-1508-21 |
|
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 30POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 30 (2 x 15)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 30POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 30 (2 x 15)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
товар відсутній