Продукція > ARIES ELECTRONICS > Всі товари виробника ARIES ELECTRONICS (15936) > Сторінка 70 з 266

Обрати Сторінку:   [  << Попередня Сторінка ]  1 26 52 65 66 67 68 69 70 71 72 73 74 75 78 104 130 156 182 208 234 260 266  [ Наступна Сторінка >> ]
Фото Назва Виробник Інформація Доступність
Ціна
без ПДВ
30-7374-10 Aries Electronics 12010-strip-line-socket.pdf Description: CONN SOCKET SIP 30POS TIN
Features: Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 30 (1 x 30)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
товар відсутній
30-7375-10 Aries Electronics 12010-strip-line-socket.pdf Description: CONN SOCKET SIP 30POS TIN
Features: Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 30 (1 x 30)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
товар відсутній
30-7400-10 Aries Electronics 12010-strip-line-socket.pdf Description: CONN SOCKET SIP 30POS TIN
товар відсутній
30-7430-10 Aries Electronics 12010-strip-line-socket.pdf Description: CONN SOCKET SIP 30POS TIN
Packaging: Bulk
Features: Elevated
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 30 (1 x 30)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
товар відсутній
30-7435-10 Aries Electronics 12010-strip-line-socket.pdf Description: CONN SOCKET SIP 30POS TIN
Features: Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 30 (1 x 30)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
товар відсутній
30-7437-10 Aries Electronics 12010-strip-line-socket.pdf Description: CONN SOCKET SIP 30POS TIN
Features: Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 30 (1 x 30)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
товар відсутній
30-7440-10 Aries Electronics 12010-strip-line-socket.pdf Description: CONN SOCKET SIP 30POS TIN
товар відсутній
30-7472-10 Aries Electronics 12010-strip-line-socket.pdf Description: CONN SOCKET SIP 30POS TIN
товар відсутній
30-7920-10 Aries Electronics 12010-strip-line-socket.pdf Description: CONN SOCKET SIP 30POS TIN
товар відсутній
30-7970-10 Aries Electronics 12010-strip-line-socket.pdf Description: CONN SOCKET SIP 30POS TIN
товар відсутній
30-7XXXX-10 Aries Electronics 12010-strip-line-socket.pdf Description: CONN SOCKET SIP 30POS TIN
товар відсутній
31-7400-10 Aries Electronics 12010-strip-line-socket.pdf Description: CONN SOCKET SIP 31POS TIN
товар відсутній
31-7440-10 Aries Electronics 12010-strip-line-socket.pdf Description: CONN SOCKET SIP 31POS TIN
товар відсутній
31-7500-10 Aries Electronics 12010-strip-line-socket.pdf Description: CONN SOCKET SIP 31POS TIN
Features: Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 31 (1 x 31)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
товар відсутній
31-7XXXX-10 Aries Electronics 12010-strip-line-socket.pdf Description: CONN SOCKET SIP 31POS TIN
товар відсутній
32-7553-10 Aries Electronics 12010-strip-line-socket.pdf Description: CONN SOCKET SIP 32POS TIN
товар відсутній
32-7XXXX-10 Aries Electronics 12010-strip-line-socket.pdf Description: CONN SOCKET SIP 32POS TIN
товар відсутній
33-7XXXX-10 Aries Electronics 12010-strip-line-socket.pdf Description: CONN SOCKET SIP 33POS TIN
товар відсутній
34-71050-10 Aries Electronics 12010-strip-line-socket.pdf Description: CONN SOCKET SIP 34POS TIN
товар відсутній
34-71130-10 Aries Electronics 12010-strip-line-socket.pdf Description: CONN SOCKET SIP 34POS TIN
товар відсутній
34-71250-10 Aries Electronics 12010-strip-line-socket.pdf Description: CONN SOCKET SIP 34POS TIN
товар відсутній
34-7335-10 Aries Electronics 12010-strip-line-socket.pdf Description: CONN SOCKET SIP 34POS TIN
товар відсутній
34-7350-10 Aries Electronics 12010-strip-line-socket.pdf Description: CONN SOCKET SIP 34POS TIN
товар відсутній
34-7394-10 Aries Electronics 12010-strip-line-socket.pdf Description: CONN SOCKET SIP 34POS TIN
Features: Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 34 (1 x 34)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
товар відсутній
34-7400-10 Aries Electronics 12010-strip-line-socket.pdf Description: CONN SOCKET SIP 34POS TIN
товар відсутній
34-7435-10 Aries Electronics 12010-strip-line-socket.pdf Description: CONN SOCKET SIP 34POS TIN
Features: Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 34 (1 x 34)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
товар відсутній
34-7450-10 Aries Electronics 12010-strip-line-socket.pdf Description: CONN SOCKET SIP 34POS TIN
товар відсутній
34-7453-10 Aries Electronics 12010-strip-line-socket.pdf Description: CONN SOCKET SIP 34POS TIN
товар відсутній
34-7500-10 Aries Electronics 12010-strip-line-socket.pdf Description: CONN SOCKET SIP 34POS TIN
товар відсутній
34-7550-10 Aries Electronics 12010-strip-line-socket.pdf Description: CONN SOCKET SIP 34POS TIN
товар відсутній
34-7650-10 Aries Electronics 12010-strip-line-socket.pdf Description: CONN SOCKET SIP 34POS TIN
Features: Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 34 (1 x 34)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
товар відсутній
34-7725-10 Aries Electronics 12010-strip-line-socket.pdf Description: CONN SOCKET SIP 34POS TIN
Features: Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 34 (1 x 34)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
товар відсутній
34-7750-10 Aries Electronics 12010-strip-line-socket.pdf Description: CONN SOCKET SIP 34POS TIN
товар відсутній
34-7XXXX-10 Aries Electronics 12010-strip-line-socket.pdf Description: CONN SOCKET SIP 34POS TIN
товар відсутній
35-71000-10 Aries Electronics 12010-strip-line-socket.pdf Description: CONN SOCKET SIP 35POS TIN
товар відсутній
35-7360-10 Aries Electronics 12010-strip-line-socket.pdf Description: CONN SOCKET SIP 35POS TIN
товар відсутній
35-7435-10 Aries Electronics 12010-strip-line-socket.pdf Description: CONN SOCKET SIP 35POS TIN
Features: Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 35 (1 x 35)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
товар відсутній
35-7XXXX-10 Aries Electronics 12010-strip-line-socket.pdf Description: CONN SOCKET SIP 35POS TIN
товар відсутній
36-7XXXX-10 Aries Electronics 12010-strip-line-socket.pdf Description: CONN SOCKET SIP 36POS TIN
товар відсутній
37-7XXXX-10 Aries Electronics 12010-strip-line-socket.pdf Description: CONN SOCKET SIP 37POS TIN
товар відсутній
38-7XXXX-10 Aries Electronics 12010-strip-line-socket.pdf Description: CONN SOCKET SIP 38POS TIN
товар відсутній
39-7XXXX-10 Aries Electronics 12010-strip-line-socket.pdf Description: CONN SOCKET SIP 39POS TIN
товар відсутній
40-7350-10 Aries Electronics 12010-strip-line-socket.pdf Description: CONN SOCKET SIP 40POS TIN
товар відсутній
40-7950-10 Aries Electronics 12010-strip-line-socket.pdf Description: CONN SOCKET SIP 40POS TIN
Features: Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 40 (1 x 40)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
товар відсутній
40-7XXXX-10 Aries Electronics 12010-strip-line-socket.pdf Description: CONN SOCKET SIP 40POS TIN
товар відсутній
06-3513-10T Aries Electronics 12011-dip-collet-socket.pdf Description: CONN IC DIP SOCKET 6POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
06-3513-11 Aries Electronics 12011-dip-collet-socket.pdf Description: CONN IC DIP SOCKET 6POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товар відсутній
06-3513-11H Aries Electronics 12011-dip-collet-socket.pdf Description: CONN IC DIP SOCKET 6POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товар відсутній
08-3513-00 Aries Electronics 12011-dip-collet-socket.pdf Description: CONN IC DIP SOCKET 8POS GOLD
товар відсутній
08-3513-10 Aries Electronics 12011-dip-collet-socket.pdf Description: CONN IC DIP SOCKET 8POS GOLD
товар відсутній
08-3513-10H Aries Electronics 12011-dip-collet-socket.pdf Description: CONN IC DIP SOCKET 8POS GOLD
товар відсутній
08-3513-11 Aries Electronics 12011-dip-collet-socket.pdf Description: CONN IC DIP SOCKET 8POS GOLD
товар відсутній
14-3513-00 Aries Electronics 12011-dip-collet-socket.pdf Description: CONN IC DIP SOCKET 14POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
товар відсутній
16-3513-00 Aries Electronics 12011-dip-collet-socket.pdf Description: CONN IC DIP SOCKET 16POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
14-3513-10 Aries Electronics 12011-dip-collet-socket.pdf Description: CONN IC DIP SOCKET 14POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
товар відсутній
14-3513-10H Aries Electronics 12011-dip-collet-socket.pdf Description: CONN IC DIP SOCKET 14POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
товар відсутній
14-3513-10T Aries Electronics 12011-dip-collet-socket.pdf Description: CONN IC DIP SOCKET 14POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
товар відсутній
14-3513-11 Aries Electronics 12011-dip-collet-socket.pdf Description: CONN IC DIP SOCKET 14POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
товар відсутній
14-3513-11H Aries Electronics 12011-dip-collet-socket.pdf Description: CONN IC DIP SOCKET 14POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
товар відсутній
18-3513-00 Aries Electronics 12011-dip-collet-socket.pdf Description: CONN IC DIP SOCKET 18POS GOLD
товар відсутній
30-7374-10 12010-strip-line-socket.pdf
Виробник: Aries Electronics
Description: CONN SOCKET SIP 30POS TIN
Features: Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 30 (1 x 30)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
товар відсутній
30-7375-10 12010-strip-line-socket.pdf
Виробник: Aries Electronics
Description: CONN SOCKET SIP 30POS TIN
Features: Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 30 (1 x 30)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
товар відсутній
30-7400-10 12010-strip-line-socket.pdf
Виробник: Aries Electronics
Description: CONN SOCKET SIP 30POS TIN
товар відсутній
30-7430-10 12010-strip-line-socket.pdf
Виробник: Aries Electronics
Description: CONN SOCKET SIP 30POS TIN
Packaging: Bulk
Features: Elevated
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 30 (1 x 30)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
товар відсутній
30-7435-10 12010-strip-line-socket.pdf
Виробник: Aries Electronics
Description: CONN SOCKET SIP 30POS TIN
Features: Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 30 (1 x 30)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
товар відсутній
30-7437-10 12010-strip-line-socket.pdf
Виробник: Aries Electronics
Description: CONN SOCKET SIP 30POS TIN
Features: Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 30 (1 x 30)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
товар відсутній
30-7440-10 12010-strip-line-socket.pdf
Виробник: Aries Electronics
Description: CONN SOCKET SIP 30POS TIN
товар відсутній
30-7472-10 12010-strip-line-socket.pdf
Виробник: Aries Electronics
Description: CONN SOCKET SIP 30POS TIN
товар відсутній
30-7920-10 12010-strip-line-socket.pdf
Виробник: Aries Electronics
Description: CONN SOCKET SIP 30POS TIN
товар відсутній
30-7970-10 12010-strip-line-socket.pdf
Виробник: Aries Electronics
Description: CONN SOCKET SIP 30POS TIN
товар відсутній
30-7XXXX-10 12010-strip-line-socket.pdf
Виробник: Aries Electronics
Description: CONN SOCKET SIP 30POS TIN
товар відсутній
31-7400-10 12010-strip-line-socket.pdf
Виробник: Aries Electronics
Description: CONN SOCKET SIP 31POS TIN
товар відсутній
31-7440-10 12010-strip-line-socket.pdf
Виробник: Aries Electronics
Description: CONN SOCKET SIP 31POS TIN
товар відсутній
31-7500-10 12010-strip-line-socket.pdf
Виробник: Aries Electronics
Description: CONN SOCKET SIP 31POS TIN
Features: Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 31 (1 x 31)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
товар відсутній
31-7XXXX-10 12010-strip-line-socket.pdf
Виробник: Aries Electronics
Description: CONN SOCKET SIP 31POS TIN
товар відсутній
32-7553-10 12010-strip-line-socket.pdf
Виробник: Aries Electronics
Description: CONN SOCKET SIP 32POS TIN
товар відсутній
32-7XXXX-10 12010-strip-line-socket.pdf
Виробник: Aries Electronics
Description: CONN SOCKET SIP 32POS TIN
товар відсутній
33-7XXXX-10 12010-strip-line-socket.pdf
Виробник: Aries Electronics
Description: CONN SOCKET SIP 33POS TIN
товар відсутній
34-71050-10 12010-strip-line-socket.pdf
Виробник: Aries Electronics
Description: CONN SOCKET SIP 34POS TIN
товар відсутній
34-71130-10 12010-strip-line-socket.pdf
Виробник: Aries Electronics
Description: CONN SOCKET SIP 34POS TIN
товар відсутній
34-71250-10 12010-strip-line-socket.pdf
Виробник: Aries Electronics
Description: CONN SOCKET SIP 34POS TIN
товар відсутній
34-7335-10 12010-strip-line-socket.pdf
Виробник: Aries Electronics
Description: CONN SOCKET SIP 34POS TIN
товар відсутній
34-7350-10 12010-strip-line-socket.pdf
Виробник: Aries Electronics
Description: CONN SOCKET SIP 34POS TIN
товар відсутній
34-7394-10 12010-strip-line-socket.pdf
Виробник: Aries Electronics
Description: CONN SOCKET SIP 34POS TIN
Features: Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 34 (1 x 34)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
товар відсутній
34-7400-10 12010-strip-line-socket.pdf
Виробник: Aries Electronics
Description: CONN SOCKET SIP 34POS TIN
товар відсутній
34-7435-10 12010-strip-line-socket.pdf
Виробник: Aries Electronics
Description: CONN SOCKET SIP 34POS TIN
Features: Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 34 (1 x 34)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
товар відсутній
34-7450-10 12010-strip-line-socket.pdf
Виробник: Aries Electronics
Description: CONN SOCKET SIP 34POS TIN
товар відсутній
34-7453-10 12010-strip-line-socket.pdf
Виробник: Aries Electronics
Description: CONN SOCKET SIP 34POS TIN
товар відсутній
34-7500-10 12010-strip-line-socket.pdf
Виробник: Aries Electronics
Description: CONN SOCKET SIP 34POS TIN
товар відсутній
34-7550-10 12010-strip-line-socket.pdf
Виробник: Aries Electronics
Description: CONN SOCKET SIP 34POS TIN
товар відсутній
34-7650-10 12010-strip-line-socket.pdf
Виробник: Aries Electronics
Description: CONN SOCKET SIP 34POS TIN
Features: Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 34 (1 x 34)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
товар відсутній
34-7725-10 12010-strip-line-socket.pdf
Виробник: Aries Electronics
Description: CONN SOCKET SIP 34POS TIN
Features: Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 34 (1 x 34)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
товар відсутній
34-7750-10 12010-strip-line-socket.pdf
Виробник: Aries Electronics
Description: CONN SOCKET SIP 34POS TIN
товар відсутній
34-7XXXX-10 12010-strip-line-socket.pdf
Виробник: Aries Electronics
Description: CONN SOCKET SIP 34POS TIN
товар відсутній
35-71000-10 12010-strip-line-socket.pdf
Виробник: Aries Electronics
Description: CONN SOCKET SIP 35POS TIN
товар відсутній
35-7360-10 12010-strip-line-socket.pdf
Виробник: Aries Electronics
Description: CONN SOCKET SIP 35POS TIN
товар відсутній
35-7435-10 12010-strip-line-socket.pdf
Виробник: Aries Electronics
Description: CONN SOCKET SIP 35POS TIN
Features: Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 35 (1 x 35)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
товар відсутній
35-7XXXX-10 12010-strip-line-socket.pdf
Виробник: Aries Electronics
Description: CONN SOCKET SIP 35POS TIN
товар відсутній
36-7XXXX-10 12010-strip-line-socket.pdf
Виробник: Aries Electronics
Description: CONN SOCKET SIP 36POS TIN
товар відсутній
37-7XXXX-10 12010-strip-line-socket.pdf
Виробник: Aries Electronics
Description: CONN SOCKET SIP 37POS TIN
товар відсутній
38-7XXXX-10 12010-strip-line-socket.pdf
Виробник: Aries Electronics
Description: CONN SOCKET SIP 38POS TIN
товар відсутній
39-7XXXX-10 12010-strip-line-socket.pdf
Виробник: Aries Electronics
Description: CONN SOCKET SIP 39POS TIN
товар відсутній
40-7350-10 12010-strip-line-socket.pdf
Виробник: Aries Electronics
Description: CONN SOCKET SIP 40POS TIN
товар відсутній
40-7950-10 12010-strip-line-socket.pdf
Виробник: Aries Electronics
Description: CONN SOCKET SIP 40POS TIN
Features: Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 40 (1 x 40)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
товар відсутній
40-7XXXX-10 12010-strip-line-socket.pdf
Виробник: Aries Electronics
Description: CONN SOCKET SIP 40POS TIN
товар відсутній
06-3513-10T 12011-dip-collet-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 6POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
06-3513-11 12011-dip-collet-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 6POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товар відсутній
06-3513-11H 12011-dip-collet-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 6POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товар відсутній
08-3513-00 12011-dip-collet-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
товар відсутній
08-3513-10 12011-dip-collet-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
товар відсутній
08-3513-10H 12011-dip-collet-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
товар відсутній
08-3513-11 12011-dip-collet-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
товар відсутній
14-3513-00 12011-dip-collet-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 14POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
товар відсутній
16-3513-00 12011-dip-collet-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 16POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
14-3513-10 12011-dip-collet-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 14POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
товар відсутній
14-3513-10H 12011-dip-collet-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 14POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
товар відсутній
14-3513-10T 12011-dip-collet-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 14POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
товар відсутній
14-3513-11 12011-dip-collet-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 14POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
товар відсутній
14-3513-11H 12011-dip-collet-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 14POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
товар відсутній
18-3513-00 12011-dip-collet-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 18POS GOLD
товар відсутній
Обрати Сторінку:   [  << Попередня Сторінка ]  1 26 52 65 66 67 68 69 70 71 72 73 74 75 78 104 130 156 182 208 234 260 266  [ Наступна Сторінка >> ]