Продукція > ARIES ELECTRONICS > Всі товари виробника ARIES ELECTRONICS (15933) > Сторінка 67 з 266
Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
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10-7400-10 | Aries Electronics |
Description: CONN SOCKET SIP 10POS TIN Features: Elevated Packaging: Bulk Mounting Type: Through Hole Type: SIP Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 10 (1 x 10) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
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10-7410-10 | Aries Electronics | Description: CONN SOCKET SIP 10POS TIN |
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10-7450-10 | Aries Electronics | Description: CONN SOCKET SIP 10POS TIN |
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10-7475-10 | Aries Electronics | Description: CONN SOCKET SIP 10POS TIN |
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10-7500-10 | Aries Electronics | Description: CONN SOCKET SIP 10POS TIN |
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10-7550-10 | Aries Electronics | Description: CONN SOCKET SIP 10POS TIN |
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10-7560-10 | Aries Electronics | Description: CONN SOCKET SIP 10POS TIN |
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10-7600-10 | Aries Electronics | Description: CONN SOCKET SIP 10POS TIN |
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10-7775-10 | Aries Electronics | Description: CONN SOCKET SIP 10POS TIN |
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10-7860-10 | Aries Electronics |
Description: CONN SOCKET SIP 10POS TIN Packaging: Bulk Features: Elevated Mounting Type: Through Hole Type: SIP Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 10 (1 x 10) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Phosphor Bronze |
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10-7925-10 | Aries Electronics | Description: CONN SOCKET SIP 10POS TIN |
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10-7XXXX-10 | Aries Electronics | Description: CONN SOCKET SIP 10POS TIN |
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1107659-01 | Aries Electronics |
Description: 700 ELEVATOR STRIP-LINE SOCKET Part Status: Active |
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11-71000-10 | Aries Electronics |
Description: CONN SOCKET SIP 11POS TIN Packaging: Bulk Features: Elevated Mounting Type: Through Hole Type: SIP Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 11 (1 x 11) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Phosphor Bronze |
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11-7400-10 | Aries Electronics |
Description: CONN SOCKET SIP 11POS TIN Packaging: Bulk Features: Elevated Mounting Type: Through Hole Type: SIP Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 11 (1 x 11) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
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11-7587-10 | Aries Electronics |
Description: CONN SOCKET SIP 11POS TIN Packaging: Bulk Features: Elevated Mounting Type: Through Hole Type: SIP Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 11 (1 x 11) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Phosphor Bronze |
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11-7XXXX-10 | Aries Electronics | Description: CONN SOCKET SIP 11POS TIN |
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12-7350-10 | Aries Electronics |
Description: CONN SOCKET SIP 12POS TIN Packaging: Bulk Features: Elevated Mounting Type: Through Hole Type: SIP Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 12 (1 x 12) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
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12-7435-10 | Aries Electronics |
Description: CONN SOCKET SIP 12POS TIN Packaging: Bulk Features: Elevated Mounting Type: Through Hole Type: SIP Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 12 (1 x 12) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
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12-7500-10 | Aries Electronics |
Description: CONN SOCKET SIP 12POS TIN Packaging: Bulk Features: Elevated Mounting Type: Through Hole Type: SIP Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 12 (1 x 12) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Phosphor Bronze |
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12-7550-10 | Aries Electronics | Description: CONN SOCKET SIP 12POS TIN |
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12-7590-10 | Aries Electronics |
Description: CONN SOCKET SIP 12POS TIN Packaging: Bulk Features: Elevated Mounting Type: Through Hole Type: SIP Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 12 (1 x 12) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Phosphor Bronze |
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12-7750-10 | Aries Electronics | Description: CONN SOCKET SIP 12POS TIN |
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12-7XXXX-10 | Aries Electronics | Description: CONN SOCKET SIP 12POS TIN |
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13-7450-10 | Aries Electronics | Description: CONN SOCKET SIP 13POS TIN |
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13-7970-10 | Aries Electronics |
Description: CONN SOCKET SIP 13POS TIN Packaging: Bulk Features: Elevated Mounting Type: Through Hole Type: SIP Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 13 (1 x 13) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
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13-7XXXX-10 | Aries Electronics |
Description: CONN SOCKET SIP 13POS TIN Packaging: Bulk Features: Elevated Mounting Type: Through Hole Type: SIP Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 13 (1 x 13) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Phosphor Bronze |
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14-7350-10 | Aries Electronics | Description: CONN SOCKET SIP 14POS TIN |
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14-7380-10 | Aries Electronics | Description: CONN SOCKET SIP 14POS TIN |
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14-7470-10 | Aries Electronics | Description: CONN SOCKET SIP 14POS TIN |
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14-7500-10 | Aries Electronics | Description: CONN SOCKET SIP 14POS TIN |
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14-7750-10 | Aries Electronics | Description: CONN SOCKET SIP 14POS TIN |
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14-7XXXX-10 | Aries Electronics | Description: CONN SOCKET SIP 14POS TIN |
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15-7350-10 | Aries Electronics | Description: CONN SOCKET SIP 15POS TIN |
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15-7450-10 | Aries Electronics | Description: CONN SOCKET SIP 15POS TIN |
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15-7500-10 | Aries Electronics | Description: CONN SOCKET SIP 15POS TIN |
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15-7540-10 | Aries Electronics | Description: CONN SOCKET SIP 15POS TIN |
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15-7635-10 | Aries Electronics | Description: CONN SOCKET SIP 15POS TIN |
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15-7695-10 | Aries Electronics | Description: CONN SOCKET SIP 15POS TIN |
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15-7850-10 | Aries Electronics | Description: CONN SOCKET SIP 15POS TIN |
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15-7XXXX-10 | Aries Electronics | Description: CONN SOCKET SIP 15POS TIN |
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16-71000-10 | Aries Electronics | Description: CONN SOCKET SIP 16POS TIN |
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16-7415-10 | Aries Electronics | Description: CONN SOCKET SIP 16POS TIN |
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16-7440-10 | Aries Electronics | Description: CONN SOCKET SIP 16POS TIN |
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16-7500-10 | Aries Electronics | Description: CONN SOCKET SIP 16POS TIN |
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16-7980-10 | Aries Electronics | Description: CONN SOCKET SIP 16POS TIN |
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16-7XXXX-10 | Aries Electronics | Description: CONN SOCKET SIP 16POS TIN |
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17-71140-10 | Aries Electronics | Description: CONN SOCKET SIP 17POS TIN |
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17-71250-10 | Aries Electronics | Description: CONN SOCKET SIP 17POS TIN |
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17-7465-10 | Aries Electronics | Description: CONN SOCKET SIP 17POS TIN |
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17-7490-10 | Aries Electronics | Description: CONN SOCKET SIP 17POS TIN |
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17-7500-10 | Aries Electronics | Description: CONN SOCKET SIP 17POS TIN |
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17-7650-10 | Aries Electronics |
Description: CONN SOCKET SIP 17POS TIN Features: Elevated Packaging: Bulk Mounting Type: Through Hole Type: SIP Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 17 (1 x 17) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Phosphor Bronze |
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17-7750-10 | Aries Electronics |
Description: CONN SOCKET SIP 17POS TIN Features: Elevated Packaging: Bulk Mounting Type: Through Hole Type: SIP Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 17 (1 x 17) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Phosphor Bronze |
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17-7XXXX-10 | Aries Electronics | Description: CONN SOCKET SIP 17POS TIN |
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18-71000-10 | Aries Electronics | Description: CONN SOCKET SIP 18POS TIN |
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18-7500-10 | Aries Electronics | Description: CONN SOCKET SIP 18POS TIN |
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18-7625-10 | Aries Electronics | Description: CONN SOCKET SIP 18POS TIN |
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18-7650-10 | Aries Electronics |
Description: CONN SOCKET SIP 18POS TIN Features: Elevated Packaging: Bulk Mounting Type: Through Hole Type: SIP Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 18 (1 x 18) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Phosphor Bronze |
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18-7740-10 | Aries Electronics | Description: CONN SOCKET SIP 18POS TIN |
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10-7400-10 |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 10POS TIN
Features: Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 10 (1 x 10)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN SOCKET SIP 10POS TIN
Features: Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 10 (1 x 10)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
товар відсутній
10-7860-10 |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 10POS TIN
Packaging: Bulk
Features: Elevated
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 10 (1 x 10)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Description: CONN SOCKET SIP 10POS TIN
Packaging: Bulk
Features: Elevated
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 10 (1 x 10)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
товар відсутній
1107659-01 |
товар відсутній
11-71000-10 |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 11POS TIN
Packaging: Bulk
Features: Elevated
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 11 (1 x 11)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Description: CONN SOCKET SIP 11POS TIN
Packaging: Bulk
Features: Elevated
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 11 (1 x 11)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
товар відсутній
11-7400-10 |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 11POS TIN
Packaging: Bulk
Features: Elevated
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 11 (1 x 11)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN SOCKET SIP 11POS TIN
Packaging: Bulk
Features: Elevated
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 11 (1 x 11)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
товар відсутній
11-7587-10 |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 11POS TIN
Packaging: Bulk
Features: Elevated
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 11 (1 x 11)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Description: CONN SOCKET SIP 11POS TIN
Packaging: Bulk
Features: Elevated
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 11 (1 x 11)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
товар відсутній
12-7350-10 |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 12POS TIN
Packaging: Bulk
Features: Elevated
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 12 (1 x 12)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN SOCKET SIP 12POS TIN
Packaging: Bulk
Features: Elevated
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 12 (1 x 12)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
товар відсутній
12-7435-10 |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 12POS TIN
Packaging: Bulk
Features: Elevated
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 12 (1 x 12)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN SOCKET SIP 12POS TIN
Packaging: Bulk
Features: Elevated
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 12 (1 x 12)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
товар відсутній
12-7500-10 |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 12POS TIN
Packaging: Bulk
Features: Elevated
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 12 (1 x 12)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Description: CONN SOCKET SIP 12POS TIN
Packaging: Bulk
Features: Elevated
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 12 (1 x 12)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
товар відсутній
12-7590-10 |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 12POS TIN
Packaging: Bulk
Features: Elevated
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 12 (1 x 12)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Description: CONN SOCKET SIP 12POS TIN
Packaging: Bulk
Features: Elevated
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 12 (1 x 12)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
товар відсутній
13-7970-10 |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 13POS TIN
Packaging: Bulk
Features: Elevated
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 13 (1 x 13)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN SOCKET SIP 13POS TIN
Packaging: Bulk
Features: Elevated
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 13 (1 x 13)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
товар відсутній
13-7XXXX-10 |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 13POS TIN
Packaging: Bulk
Features: Elevated
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 13 (1 x 13)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Description: CONN SOCKET SIP 13POS TIN
Packaging: Bulk
Features: Elevated
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 13 (1 x 13)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
товар відсутній
17-7650-10 |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 17POS TIN
Features: Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 17 (1 x 17)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Description: CONN SOCKET SIP 17POS TIN
Features: Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 17 (1 x 17)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
товар відсутній
17-7750-10 |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 17POS TIN
Features: Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 17 (1 x 17)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Description: CONN SOCKET SIP 17POS TIN
Features: Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 17 (1 x 17)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
товар відсутній
18-7650-10 |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 18POS TIN
Features: Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 18 (1 x 18)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Description: CONN SOCKET SIP 18POS TIN
Features: Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 18 (1 x 18)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
товар відсутній