Продукція > ARIES ELECTRONICS > Всі товари виробника ARIES ELECTRONICS (15933) > Сторінка 73 з 266

Обрати Сторінку:   [  << Попередня Сторінка ]  1 26 52 68 69 70 71 72 73 74 75 76 77 78 104 130 156 182 208 234 260 266  [ Наступна Сторінка >> ]
Фото Назва Виробник Інформація Доступність
Ціна
без ПДВ
10-6513-11H 10-6513-11H Aries Electronics 12011-dip-collet-socket.pdf Description: CONN IC DIP SOCKET 10POS GOLD
товар відсутній
10-9513-10 10-9513-10 Aries Electronics 12011-dip-collet-socket.pdf Description: CONN IC DIP SOCKET 10POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
товар відсутній
10-9513-10H 10-9513-10H Aries Electronics 12011-dip-collet-socket.pdf Description: CONN IC DIP SOCKET 10POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
товар відсутній
10-9513-10T 10-9513-10T Aries Electronics 12011-dip-collet-socket.pdf Description: CONN IC DIP SOCKET 10POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
товар відсутній
10-9513-11 10-9513-11 Aries Electronics 12011-dip-collet-socket.pdf Description: CONN IC DIP SOCKET 10POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
товар відсутній
10-9513-11H 10-9513-11H Aries Electronics 12011-dip-collet-socket.pdf Description: CONN IC DIP SOCKET 10POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
товар відсутній
12-3513-10 Aries Electronics 12011-dip-collet-socket.pdf Description: CONN IC DIP SOCKET 12POS GOLD
товар відсутній
12-3513-10H Aries Electronics 12011-dip-collet-socket.pdf Description: CONN IC DIP SOCKET 12POS GOLD
товар відсутній
12-3513-10T Aries Electronics 12011-dip-collet-socket.pdf Description: CONN IC DIP SOCKET 12POS GOLD
товар відсутній
12-3513-11 Aries Electronics 12011-dip-collet-socket.pdf Description: CONN IC DIP SOCKET 12POS GOLD
товар відсутній
12-3513-11H Aries Electronics 12011-dip-collet-socket.pdf Description: CONN IC DIP SOCKET 12POS GOLD
товар відсутній
12-4513-10 Aries Electronics 12011-dip-collet-socket.pdf Description: CONN IC DIP SOCKET 12POS GOLD
товар відсутній
12-6513-10 Aries Electronics 12011-dip-collet-socket.pdf Description: CONN IC DIP SOCKET 12POS GOLD
товар відсутній
12-6513-10H Aries Electronics 12011-dip-collet-socket.pdf Description: CONN IC DIP SOCKET 12POS GOLD
товар відсутній
12-6513-10T Aries Electronics 12011-dip-collet-socket.pdf Description: CONN IC DIP SOCKET 12POS GOLD
товар відсутній
12-6513-11 Aries Electronics 12011-dip-collet-socket.pdf Description: CONN IC DIP SOCKET 12POS GOLD
товар відсутній
12-6513-11H Aries Electronics 12011-dip-collet-socket.pdf Description: CONN IC DIP SOCKET 12POS GOLD
товар відсутній
14-6513-10 Aries Electronics 12011-dip-collet-socket.pdf Description: CONN IC DIP SOCKET 14POS GOLD
товар відсутній
14-6513-10H Aries Electronics 12011-dip-collet-socket.pdf Description: CONN IC DIP SOCKET 14POS GOLD
товар відсутній
14-6513-10T Aries Electronics 12011-dip-collet-socket.pdf Description: CONN IC DIP SOCKET 14POS GOLD
товар відсутній
14-6513-11 Aries Electronics 12011-dip-collet-socket.pdf Description: CONN IC DIP SOCKET 14POS GOLD
товар відсутній
14-6513-11H Aries Electronics 12011-dip-collet-socket.pdf Description: CONN IC DIP SOCKET 14POS GOLD
товар відсутній
16-6513-10 Aries Electronics 12011-dip-collet-socket.pdf Description: CONN IC DIP SOCKET 16POS GOLD
товар відсутній
16-6513-10H Aries Electronics 12011-dip-collet-socket.pdf Description: CONN IC DIP SOCKET 16POS GOLD
товар відсутній
16-6513-10T Aries Electronics 12011-dip-collet-socket.pdf Description: CONN IC DIP SOCKET 16POS GOLD
товар відсутній
16-6513-11 Aries Electronics 12011-dip-collet-socket.pdf Description: CONN IC DIP SOCKET 16POS GOLD
товар відсутній
16-6513-11H Aries Electronics 12011-dip-collet-socket.pdf Description: CONN IC DIP SOCKET 16POS GOLD
товар відсутній
18-6513-10H Aries Electronics 12011-dip-collet-socket.pdf Description: CONN IC DIP SOCKET 18POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
18-6513-10T Aries Electronics 12011-dip-collet-socket.pdf Description: CONN IC DIP SOCKET 18POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
18-6513-11 Aries Electronics 12011-dip-collet-socket.pdf Description: CONN IC DIP SOCKET 18POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товар відсутній
18-6513-11H Aries Electronics 12011-dip-collet-socket.pdf Description: CONN IC DIP SOCKET 18POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товар відсутній
20-6513-10H Aries Electronics 12011-dip-collet-socket.pdf Description: CONN IC DIP SOCKET 20POS GOLD
товар відсутній
20-6513-10T Aries Electronics 12011-dip-collet-socket.pdf Description: CONN IC DIP SOCKET 20POS GOLD
товар відсутній
20-6513-11 Aries Electronics 12011-dip-collet-socket.pdf Description: CONN IC DIP SOCKET 20POS GOLD
товар відсутній
20-6513-11H Aries Electronics 12011-dip-collet-socket.pdf Description: CONN IC DIP SOCKET 20POS GOLD
товар відсутній
20-9513-10 Aries Electronics 12011-dip-collet-socket.pdf Description: CONN IC DIP SOCKET 20POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
20-9513-10H Aries Electronics 12011-dip-collet-socket.pdf Description: CONN IC DIP SOCKET 20POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
20-9513-10T Aries Electronics 12011-dip-collet-socket.pdf Description: CONN IC DIP SOCKET 20POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
20-9513-11 Aries Electronics 12011-dip-collet-socket.pdf Description: CONN IC DIP SOCKET 20POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товар відсутній
20-9513-11H Aries Electronics 12011-dip-collet-socket.pdf Description: CONN IC DIP SOCKET 20POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товар відсутній
22-4513-10 Aries Electronics 12011-dip-collet-socket.pdf Description: CONN IC DIP SOCKET 22POS GOLD
товар відсутній
22-4513-10H Aries Electronics 12011-dip-collet-socket.pdf Description: CONN IC DIP SOCKET 22POS GOLD
товар відсутній
22-4513-10T Aries Electronics 12011-dip-collet-socket.pdf Description: CONN IC DIP SOCKET 22POS GOLD
товар відсутній
22-4513-11 Aries Electronics 12011-dip-collet-socket.pdf Description: CONN IC DIP SOCKET 22POS GOLD
товар відсутній
22-4513-11H Aries Electronics 12011-dip-collet-socket.pdf Description: CONN IC DIP SOCKET 22POS GOLD
товар відсутній
22-6513-10 Aries Electronics 12011-dip-collet-socket.pdf Description: CONN IC DIP SOCKET 22POS GOLD
товар відсутній
26-3513-10 Aries Electronics 12011-dip-collet-socket.pdf Description: CONN IC DIP SOCKET 26POS GOLD
товар відсутній
26-3513-10H Aries Electronics 12011-dip-collet-socket.pdf Description: CONN IC DIP SOCKET 26POS GOLD
товар відсутній
26-3513-10T Aries Electronics 12011-dip-collet-socket.pdf Description: CONN IC DIP SOCKET 26POS GOLD
товар відсутній
26-3513-11 Aries Electronics 12011-dip-collet-socket.pdf Description: CONN IC DIP SOCKET 26POS GOLD
товар відсутній
26-3513-11H Aries Electronics 12011-dip-collet-socket.pdf Description: CONN IC DIP SOCKET 26POS GOLD
товар відсутній
26-6513-11 Aries Electronics 12011-dip-collet-socket.pdf Description: CONN IC DIP SOCKET 26POS GOLD
товар відсутній
30-3513-10H Aries Electronics 12011-dip-collet-socket.pdf Description: CONN IC DIP SOCKET 30POS GOLD
товар відсутній
30-3513-10T Aries Electronics 12011-dip-collet-socket.pdf Description: CONN IC DIP SOCKET 30POS GOLD
товар відсутній
30-3513-11 Aries Electronics 12011-dip-collet-socket.pdf Description: CONN IC DIP SOCKET 30POS GOLD
товар відсутній
30-3513-11H Aries Electronics 12011-dip-collet-socket.pdf Description: CONN IC DIP SOCKET 30POS GOLD
товар відсутній
30-6513-10 Aries Electronics 12011-dip-collet-socket.pdf Description: CONN IC DIP SOCKET 30POS GOLD
товар відсутній
30-6513-10H Aries Electronics 12011-dip-collet-socket.pdf Description: CONN IC DIP SOCKET 30POS GOLD
товар відсутній
30-6513-10T Aries Electronics 12011-dip-collet-socket.pdf Description: CONN IC DIP SOCKET 30POS GOLD
товар відсутній
30-6513-11 Aries Electronics 12011-dip-collet-socket.pdf Description: CONN IC DIP SOCKET 30POS GOLD
товар відсутній
10-6513-11H 12011-dip-collet-socket.pdf
10-6513-11H
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 10POS GOLD
товар відсутній
10-9513-10 12011-dip-collet-socket.pdf
10-9513-10
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 10POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
товар відсутній
10-9513-10H 12011-dip-collet-socket.pdf
10-9513-10H
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 10POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
товар відсутній
10-9513-10T 12011-dip-collet-socket.pdf
10-9513-10T
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 10POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
товар відсутній
10-9513-11 12011-dip-collet-socket.pdf
10-9513-11
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 10POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
товар відсутній
10-9513-11H 12011-dip-collet-socket.pdf
10-9513-11H
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 10POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
товар відсутній
12-3513-10 12011-dip-collet-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 12POS GOLD
товар відсутній
12-3513-10H 12011-dip-collet-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 12POS GOLD
товар відсутній
12-3513-10T 12011-dip-collet-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 12POS GOLD
товар відсутній
12-3513-11 12011-dip-collet-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 12POS GOLD
товар відсутній
12-3513-11H 12011-dip-collet-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 12POS GOLD
товар відсутній
12-4513-10 12011-dip-collet-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 12POS GOLD
товар відсутній
12-6513-10 12011-dip-collet-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 12POS GOLD
товар відсутній
12-6513-10H 12011-dip-collet-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 12POS GOLD
товар відсутній
12-6513-10T 12011-dip-collet-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 12POS GOLD
товар відсутній
12-6513-11 12011-dip-collet-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 12POS GOLD
товар відсутній
12-6513-11H 12011-dip-collet-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 12POS GOLD
товар відсутній
14-6513-10 12011-dip-collet-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 14POS GOLD
товар відсутній
14-6513-10H 12011-dip-collet-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 14POS GOLD
товар відсутній
14-6513-10T 12011-dip-collet-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 14POS GOLD
товар відсутній
14-6513-11 12011-dip-collet-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 14POS GOLD
товар відсутній
14-6513-11H 12011-dip-collet-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 14POS GOLD
товар відсутній
16-6513-10 12011-dip-collet-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 16POS GOLD
товар відсутній
16-6513-10H 12011-dip-collet-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 16POS GOLD
товар відсутній
16-6513-10T 12011-dip-collet-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 16POS GOLD
товар відсутній
16-6513-11 12011-dip-collet-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 16POS GOLD
товар відсутній
16-6513-11H 12011-dip-collet-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 16POS GOLD
товар відсутній
18-6513-10H 12011-dip-collet-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 18POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
18-6513-10T 12011-dip-collet-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 18POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
18-6513-11 12011-dip-collet-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 18POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товар відсутній
18-6513-11H 12011-dip-collet-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 18POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товар відсутній
20-6513-10H 12011-dip-collet-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 20POS GOLD
товар відсутній
20-6513-10T 12011-dip-collet-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 20POS GOLD
товар відсутній
20-6513-11 12011-dip-collet-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 20POS GOLD
товар відсутній
20-6513-11H 12011-dip-collet-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 20POS GOLD
товар відсутній
20-9513-10 12011-dip-collet-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 20POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
20-9513-10H 12011-dip-collet-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 20POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
20-9513-10T 12011-dip-collet-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 20POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
20-9513-11 12011-dip-collet-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 20POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товар відсутній
20-9513-11H 12011-dip-collet-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 20POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товар відсутній
22-4513-10 12011-dip-collet-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 22POS GOLD
товар відсутній
22-4513-10H 12011-dip-collet-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 22POS GOLD
товар відсутній
22-4513-10T 12011-dip-collet-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 22POS GOLD
товар відсутній
22-4513-11 12011-dip-collet-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 22POS GOLD
товар відсутній
22-4513-11H 12011-dip-collet-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 22POS GOLD
товар відсутній
22-6513-10 12011-dip-collet-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 22POS GOLD
товар відсутній
26-3513-10 12011-dip-collet-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 26POS GOLD
товар відсутній
26-3513-10H 12011-dip-collet-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 26POS GOLD
товар відсутній
26-3513-10T 12011-dip-collet-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 26POS GOLD
товар відсутній
26-3513-11 12011-dip-collet-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 26POS GOLD
товар відсутній
26-3513-11H 12011-dip-collet-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 26POS GOLD
товар відсутній
26-6513-11 12011-dip-collet-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 26POS GOLD
товар відсутній
30-3513-10H 12011-dip-collet-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 30POS GOLD
товар відсутній
30-3513-10T 12011-dip-collet-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 30POS GOLD
товар відсутній
30-3513-11 12011-dip-collet-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 30POS GOLD
товар відсутній
30-3513-11H 12011-dip-collet-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 30POS GOLD
товар відсутній
30-6513-10 12011-dip-collet-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 30POS GOLD
товар відсутній
30-6513-10H 12011-dip-collet-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 30POS GOLD
товар відсутній
30-6513-10T 12011-dip-collet-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 30POS GOLD
товар відсутній
30-6513-11 12011-dip-collet-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 30POS GOLD
товар відсутній
Обрати Сторінку:   [  << Попередня Сторінка ]  1 26 52 68 69 70 71 72 73 74 75 76 77 78 104 130 156 182 208 234 260 266  [ Наступна Сторінка >> ]