Продукція > ARIES ELECTRONICS > Всі товари виробника ARIES ELECTRONICS (15933) > Сторінка 62 з 266
Фото | Назва | Виробник | Інформація |
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Ціна без ПДВ |
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31-0511-11 | Aries Electronics |
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33-0511-10 | Aries Electronics |
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33-0511-11 | Aries Electronics |
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34-0511-11 | Aries Electronics |
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40-0511-10 | Aries Electronics |
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40-0511-11 | Aries Electronics |
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02-0511-10 | Aries Electronics |
![]() Packaging: Bulk Mounting Type: Through Hole Type: SIP Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 2 (1 x 2) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 50.0µin (1.27µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 50.0µin (1.27µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
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02-0511-11 | Aries Electronics |
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03-0511-10 | Aries Electronics |
![]() Packaging: Bulk Mounting Type: Through Hole Type: SIP Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 3 (1 x 3) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 50.0µin (1.27µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 50.0µin (1.27µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
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03-0511-11 | Aries Electronics |
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0500-0.300 | Aries Electronics |
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0500-0.500 | Aries Electronics |
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0500-0.600 | Aries Electronics |
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0500-0.900 | Aries Electronics |
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0500-1.000 | Aries Electronics |
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0500-1.100 | Aries Electronics |
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0500-1.300 | Aries Electronics |
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0500-1.600 | Aries Electronics |
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0500-1.900 | Aries Electronics |
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05-0511-10 | Aries Electronics |
![]() Packaging: Bulk Mounting Type: Through Hole Type: SIP Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 5 (1 x 5) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 50.0µin (1.27µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 50.0µin (1.27µm) Contact Material - Post: Phosphor Bronze |
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05-0511-11 | Aries Electronics |
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06-0511-10 | Aries Electronics |
![]() Packaging: Bulk Mounting Type: Through Hole Type: SIP Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 6 (1 x 6) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 50.0µin (1.27µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 50.0µin (1.27µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
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06-0511-11 | Aries Electronics |
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11-0511-10 | Aries Electronics |
![]() Packaging: Bulk Mounting Type: Through Hole Type: SIP Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 11 (1 x 11) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 50.0µin (1.27µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 50.0µin (1.27µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
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11-0511-11 | Aries Electronics |
![]() Packaging: Bulk Mounting Type: Through Hole Type: SIP Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 11 (1 x 11) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
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13-0511-10 | Aries Electronics |
![]() Packaging: Bulk Mounting Type: Through Hole Type: SIP Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 13 (1 x 13) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 50.0µin (1.27µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 50.0µin (1.27µm) Contact Material - Post: Phosphor Bronze |
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13-0511-11 | Aries Electronics |
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15-0511-10 | Aries Electronics |
![]() Packaging: Bulk Mounting Type: Through Hole Type: SIP Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 15 (1 x 15) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 50.0µin (1.27µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 50.0µin (1.27µm) Contact Material - Post: Phosphor Bronze |
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15-0511-11 | Aries Electronics |
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17-0511-10 | Aries Electronics |
![]() Packaging: Bulk Mounting Type: Through Hole Type: SIP Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 17 (1 x 17) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 50.0µin (1.27µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 50.0µin (1.27µm) Contact Material - Post: Phosphor Bronze |
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17-0511-11 | Aries Electronics |
![]() Packaging: Bulk Mounting Type: Through Hole Type: SIP Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 17 (1 x 17) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Phosphor Bronze |
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21-0511-10 | Aries Electronics |
![]() Packaging: Bulk Mounting Type: Through Hole Type: SIP Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 21 (1 x 21) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 50.0µin (1.27µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 50.0µin (1.27µm) Contact Material - Post: Phosphor Bronze |
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21-0511-11 | Aries Electronics |
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22-0511-10 | Aries Electronics |
![]() Packaging: Bulk Mounting Type: Through Hole Type: SIP Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 22 (1 x 22) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 50.0µin (1.27µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 50.0µin (1.27µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
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22-0511-11 | Aries Electronics |
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23-0511-10 | Aries Electronics |
![]() Packaging: Bulk Mounting Type: Through Hole Type: SIP Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 23 (1 x 23) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 50.0µin (1.27µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 50.0µin (1.27µm) Contact Material - Post: Phosphor Bronze |
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23-0511-11 | Aries Electronics |
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24-0511-10 | Aries Electronics |
![]() Packaging: Bulk Mounting Type: Through Hole Type: SIP Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 24 (1 x 24) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 50.0µin (1.27µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 50.0µin (1.27µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
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24-0511-11 | Aries Electronics |
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26-0511-10 | Aries Electronics |
![]() Packaging: Bulk Mounting Type: Through Hole Type: SIP Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 26 (1 x 26) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 50.0µin (1.27µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 50.0µin (1.27µm) Contact Material - Post: Phosphor Bronze |
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26-0511-11 | Aries Electronics |
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28-0511-10 | Aries Electronics |
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28-0511-11 | Aries Electronics |
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29-0511-10 | Aries Electronics |
![]() Packaging: Bulk Mounting Type: Through Hole Type: SIP Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 29 (1 x 29) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 50.0µin (1.27µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 50.0µin (1.27µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
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29-0511-11 | Aries Electronics |
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32-0511-10 | Aries Electronics |
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32-0511-11 | Aries Electronics |
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35-0511-10 | Aries Electronics |
![]() Packaging: Bulk Mounting Type: Through Hole Type: SIP Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 35 (1 x 35) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 50.0µin (1.27µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 50.0µin (1.27µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
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35-0511-11 | Aries Electronics |
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36-0511-10 | Aries Electronics |
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36-0511-11 | Aries Electronics |
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37-0511-10 | Aries Electronics |
![]() Packaging: Bulk Mounting Type: Through Hole Type: SIP Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 37 (1 x 37) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 50.0µin (1.27µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 50.0µin (1.27µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
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37-0511-11 | Aries Electronics |
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38-0511-10 | Aries Electronics |
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38-0511-11 | Aries Electronics |
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39-0511-10 | Aries Electronics |
![]() Packaging: Bulk Mounting Type: Through Hole Type: SIP Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 39 (1 x 39) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 50.0µin (1.27µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 50.0µin (1.27µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
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39-0511-11 | Aries Electronics |
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07-0501-20 | Aries Electronics |
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07-0501-21 | Aries Electronics |
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07-0501-30 | Aries Electronics |
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02-0511-10 |
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Виробник: Aries Electronics
Description: CONN SOCKET SIP 2POS TIN
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 2 (1 x 2)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN SOCKET SIP 2POS TIN
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 2 (1 x 2)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
товар відсутній
03-0511-10 |
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Виробник: Aries Electronics
Description: CONN SOCKET SIP 3POS TIN
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 3 (1 x 3)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN SOCKET SIP 3POS TIN
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 3 (1 x 3)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
товар відсутній
0500-0.300 |
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0500-0.500 |
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0500-0.600 |
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товар відсутній
0500-0.900 |
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товар відсутній
0500-1.000 |
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товар відсутній
0500-1.100 |
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товар відсутній
0500-1.300 |
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товар відсутній
0500-1.600 |
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товар відсутній
0500-1.900 |
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товар відсутній
05-0511-10 |
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Виробник: Aries Electronics
Description: CONN SOCKET SIP 5POS TIN
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 5 (1 x 5)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Phosphor Bronze
Description: CONN SOCKET SIP 5POS TIN
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 5 (1 x 5)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Phosphor Bronze
товар відсутній
06-0511-10 |
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Виробник: Aries Electronics
Description: CONN SOCKET SIP 6POS TIN
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 6 (1 x 6)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN SOCKET SIP 6POS TIN
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 6 (1 x 6)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
товар відсутній
11-0511-10 |
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Виробник: Aries Electronics
Description: CONN SOCKET SIP 11POS TIN
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 11 (1 x 11)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN SOCKET SIP 11POS TIN
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 11 (1 x 11)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
товар відсутній
11-0511-11 |
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Виробник: Aries Electronics
Description: CONN SOCKET SIP 11POS GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 11 (1 x 11)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN SOCKET SIP 11POS GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 11 (1 x 11)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
товар відсутній
13-0511-10 |
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Виробник: Aries Electronics
Description: CONN SOCKET SIP 13POS TIN
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 13 (1 x 13)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Phosphor Bronze
Description: CONN SOCKET SIP 13POS TIN
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 13 (1 x 13)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Phosphor Bronze
товар відсутній
15-0511-10 |
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Виробник: Aries Electronics
Description: CONN SOCKET SIP 15POS TIN
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 15 (1 x 15)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Phosphor Bronze
Description: CONN SOCKET SIP 15POS TIN
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 15 (1 x 15)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Phosphor Bronze
товар відсутній
17-0511-10 |
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Виробник: Aries Electronics
Description: CONN SOCKET SIP 17POS TIN
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 17 (1 x 17)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Phosphor Bronze
Description: CONN SOCKET SIP 17POS TIN
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 17 (1 x 17)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Phosphor Bronze
товар відсутній
17-0511-11 |
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Виробник: Aries Electronics
Description: CONN SOCKET SIP 17POS GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 17 (1 x 17)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Description: CONN SOCKET SIP 17POS GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 17 (1 x 17)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
товар відсутній
21-0511-10 |
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Виробник: Aries Electronics
Description: CONN SOCKET SIP 21POS TIN
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 21 (1 x 21)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Phosphor Bronze
Description: CONN SOCKET SIP 21POS TIN
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 21 (1 x 21)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Phosphor Bronze
товар відсутній
22-0511-10 |
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Виробник: Aries Electronics
Description: CONN SOCKET SIP 22POS TIN
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 22 (1 x 22)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN SOCKET SIP 22POS TIN
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 22 (1 x 22)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
товар відсутній
23-0511-10 |
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Виробник: Aries Electronics
Description: CONN SOCKET SIP 23POS TIN
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 23 (1 x 23)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Phosphor Bronze
Description: CONN SOCKET SIP 23POS TIN
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 23 (1 x 23)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Phosphor Bronze
товар відсутній
24-0511-10 |
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Виробник: Aries Electronics
Description: CONN SOCKET SIP 24POS TIN
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 24 (1 x 24)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN SOCKET SIP 24POS TIN
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 24 (1 x 24)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
товар відсутній
26-0511-10 |
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Виробник: Aries Electronics
Description: CONN SOCKET SIP 26POS TIN
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 26 (1 x 26)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Phosphor Bronze
Description: CONN SOCKET SIP 26POS TIN
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 26 (1 x 26)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Phosphor Bronze
товар відсутній
29-0511-10 |
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Виробник: Aries Electronics
Description: CONN SOCKET SIP 29POS TIN
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 29 (1 x 29)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN SOCKET SIP 29POS TIN
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 29 (1 x 29)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
товар відсутній
35-0511-10 |
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Виробник: Aries Electronics
Description: CONN SOCKET SIP 35POS TIN
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 35 (1 x 35)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN SOCKET SIP 35POS TIN
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 35 (1 x 35)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
товар відсутній
37-0511-10 |
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Виробник: Aries Electronics
Description: CONN SOCKET SIP 37POS TIN
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 37 (1 x 37)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN SOCKET SIP 37POS TIN
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 37 (1 x 37)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
товар відсутній
39-0511-10 |
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Виробник: Aries Electronics
Description: CONN SOCKET SIP 39POS TIN
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 39 (1 x 39)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN SOCKET SIP 39POS TIN
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 39 (1 x 39)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
товар відсутній