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08-6501-20 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 8POS TIN
товар відсутній
08-6501-21 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 8POS GOLD
товар відсутній
08-6501-30 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 8POS TIN
товар відсутній
10-6501-20 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 10POS TIN
товар відсутній
10-6501-21 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 10POS GOLD
товар відсутній
10-6501-30 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 10POS TIN
товар відсутній
10-6501-31 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 10POS GOLD
товар відсутній
14-6501-20 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 14POS TIN
товар відсутній
14-6501-21 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 14POS GOLD
товар відсутній
14-6501-31 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 14POS GOLD
товар відсутній
16-6501-20 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 16POS TIN
товар відсутній
16-6501-21 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 16POS GOLD
товар відсутній
16-6501-30 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 16POS TIN
товар відсутній
16-6501-31 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 16POS GOLD
товар відсутній
18-6501-20 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 18POS TIN
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
товар відсутній
18-6501-21 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 18POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
товар відсутній
18-6501-30 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 18POS TIN
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
товар відсутній
18-6501-31 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 18POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
товар відсутній
24-6501-20 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 24POS TIN
товар відсутній
24-6501-21 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 24POS GOLD
товар відсутній
24-6501-30 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 24POS TIN
товар відсутній
24-6501-31 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 24POS GOLD
товар відсутній
28-6501-21 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 28POS GOLD
товар відсутній
28-6501-30 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 28POS TIN
товар відсутній
28-6501-31 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 28POS GOLD
товар відсутній
32-6501-20 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 32POS TIN
товар відсутній
32-6501-21 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 32POS GOLD
товар відсутній
32-6501-30 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 32POS TIN
товар відсутній
32-6501-31 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 32POS GOLD
товар відсутній
40-6501-20 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 40POS TIN
товар відсутній
40-6501-21 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 40POS GOLD
товар відсутній
40-6501-31 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 40POS GOLD
товар відсутній
08-2501-20 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 8POS TIN
товар відсутній
08-2501-21 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 8POS GOLD
товар відсутній
08-2501-30 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 8POS TIN
товар відсутній
08-2501-31 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 8POS GOLD
товар відсутній
08-3501-20 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 8POS TIN
товар відсутній
08-3501-21 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 8POS GOLD
товар відсутній
08-3501-30 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 8POS TIN
товар відсутній
08-3501-31 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 8POS GOLD
товар відсутній
08-6501-31 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 8POS GOLD
товар відсутній
10-2501-20 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 10POS TIN
товар відсутній
10-2501-21 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 10POS GOLD
товар відсутній
10-2501-30 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 10POS TIN
товар відсутній
10-2501-31 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 10POS GOLD
товар відсутній
1109822 Aries Electronics 12005-dip-test-socket.pdf Description: 501 DIP TEST SCKT SOLDER TAIL
товар відсутній
14-3501-20 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 14POS TIN
товар відсутній
14-3501-21 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 14POS GOLD
товар відсутній
14-3501-30 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 14POS TIN
товар відсутній
14-3501-31 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 14POS GOLD
товар відсутній
14-3501-40 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 14POS TIN
товар відсутній
16-3501-20 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 16POS TIN
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
товар відсутній
16-3501-21 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
товар відсутній
16-3501-30 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 16POS TIN
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
товар відсутній
16-3501-31 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
товар відсутній
18-3501-20 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 18POS TIN
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
товар відсутній
18-3501-21 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 18POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
товар відсутній
18-3501-30 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 18POS TIN
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
товар відсутній
18-3501-31 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 18POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
товар відсутній
20-3501-20 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 20POS TIN
товар відсутній
08-6501-20 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 8POS TIN
товар відсутній
08-6501-21 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
товар відсутній
08-6501-30 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 8POS TIN
товар відсутній
10-6501-20 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 10POS TIN
товар відсутній
10-6501-21 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 10POS GOLD
товар відсутній
10-6501-30 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 10POS TIN
товар відсутній
10-6501-31 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 10POS GOLD
товар відсутній
14-6501-20 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 14POS TIN
товар відсутній
14-6501-21 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 14POS GOLD
товар відсутній
14-6501-31 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 14POS GOLD
товар відсутній
16-6501-20 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 16POS TIN
товар відсутній
16-6501-21 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 16POS GOLD
товар відсутній
16-6501-30 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 16POS TIN
товар відсутній
16-6501-31 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 16POS GOLD
товар відсутній
18-6501-20 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 18POS TIN
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
товар відсутній
18-6501-21 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 18POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
товар відсутній
18-6501-30 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 18POS TIN
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
товар відсутній
18-6501-31 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 18POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
товар відсутній
24-6501-20 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 24POS TIN
товар відсутній
24-6501-21 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 24POS GOLD
товар відсутній
24-6501-30 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 24POS TIN
товар відсутній
24-6501-31 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 24POS GOLD
товар відсутній
28-6501-21 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 28POS GOLD
товар відсутній
28-6501-30 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 28POS TIN
товар відсутній
28-6501-31 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 28POS GOLD
товар відсутній
32-6501-20 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 32POS TIN
товар відсутній
32-6501-21 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 32POS GOLD
товар відсутній
32-6501-30 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 32POS TIN
товар відсутній
32-6501-31 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 32POS GOLD
товар відсутній
40-6501-20 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 40POS TIN
товар відсутній
40-6501-21 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 40POS GOLD
товар відсутній
40-6501-31 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 40POS GOLD
товар відсутній
08-2501-20 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 8POS TIN
товар відсутній
08-2501-21 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
товар відсутній
08-2501-30 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 8POS TIN
товар відсутній
08-2501-31 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
товар відсутній
08-3501-20 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 8POS TIN
товар відсутній
08-3501-21 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
товар відсутній
08-3501-30 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 8POS TIN
товар відсутній
08-3501-31 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
товар відсутній
08-6501-31 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
товар відсутній
10-2501-20 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 10POS TIN
товар відсутній
10-2501-21 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 10POS GOLD
товар відсутній
10-2501-30 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 10POS TIN
товар відсутній
10-2501-31 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 10POS GOLD
товар відсутній
1109822 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: 501 DIP TEST SCKT SOLDER TAIL
товар відсутній
14-3501-20 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 14POS TIN
товар відсутній
14-3501-21 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 14POS GOLD
товар відсутній
14-3501-30 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 14POS TIN
товар відсутній
14-3501-31 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 14POS GOLD
товар відсутній
14-3501-40 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 14POS TIN
товар відсутній
16-3501-20 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 16POS TIN
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
товар відсутній
16-3501-21 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
товар відсутній
16-3501-30 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 16POS TIN
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
товар відсутній
16-3501-31 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
товар відсутній
18-3501-20 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 18POS TIN
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
товар відсутній
18-3501-21 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 18POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
товар відсутній
18-3501-30 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 18POS TIN
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
товар відсутній
18-3501-31 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 18POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
товар відсутній
20-3501-20 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 20POS TIN
товар відсутній
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