Продукція > ARIES ELECTRONICS > Всі товари виробника ARIES ELECTRONICS (15933) > Сторінка 3 з 266
Фото | Назва | Виробник | Інформація |
Доступність |
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18-650-10 | Aries Electronics |
![]() Packaging: Bulk For Use With/Related Products: 0600 Series Header Number of Positions: 18 Accessory Type: Cap (Cover) |
товар відсутній |
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24-650-10 | Aries Electronics |
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на замовлення 34 шт: термін постачання 21-31 дні (днів) |
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24-650-20 | Aries Electronics |
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на замовлення 89 шт: термін постачання 21-31 дні (днів) |
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28-650-10 | Aries Electronics |
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на замовлення 28 шт: термін постачання 21-31 дні (днів) |
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40-650-10 | Aries Electronics |
![]() Packaging: Bulk For Use With/Related Products: 0600 Series Header Number of Positions: 40 Accessory Type: Cap (Cover) |
на замовлення 136 шт: термін постачання 21-31 дні (днів) |
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08-810-90 | Aries Electronics |
![]() Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole, Right Angle, Vertical Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 8 (2 x 4) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
на замовлення 84 шт: термін постачання 21-31 дні (днів) |
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14-810-90 | Aries Electronics |
![]() Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole, Right Angle, Vertical Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 14 (2 x 7) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
на замовлення 302 шт: термін постачання 21-31 дні (днів) |
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16-810-90 | Aries Electronics |
![]() Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole, Right Angle, Vertical Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 16 (2 x 8) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
товар відсутній |
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14-810-90T | Aries Electronics |
![]() Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole, Right Angle, Vertical Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 14 (2 x 7) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
на замовлення 256 шт: термін постачання 21-31 дні (днів) |
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16-810-90T | Aries Electronics |
![]() Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole, Right Angle, Vertical Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 16 (2 x 8) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
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10-810-90C | Aries Electronics |
![]() Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole, Right Angle, Vertical Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 10 (2 x 5) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Part Status: Active |
на замовлення 25 шт: термін постачання 21-31 дні (днів) |
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14-810-90C | Aries Electronics |
![]() Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole, Right Angle, Vertical Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 14 (2 x 7) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Part Status: Active |
на замовлення 120 шт: термін постачання 21-31 дні (днів) |
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16-810-90C | Aries Electronics |
![]() Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole, Right Angle, Vertical Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 16 (2 x 8) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Part Status: Active |
на замовлення 14 шт: термін постачання 21-31 дні (днів) |
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08-823-90 | Aries Electronics |
![]() Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole, Right Angle, Horizontal Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 8 (2 x 4) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
на замовлення 38 шт: термін постачання 21-31 дні (днів) |
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14-823-90 | Aries Electronics |
![]() Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole, Right Angle, Horizontal Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 14 (2 x 7) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
на замовлення 313 шт: термін постачання 21-31 дні (днів) |
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28-6823-90 | Aries Electronics |
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на замовлення 16 шт: термін постачання 21-31 дні (днів) |
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40-6823-90 | Aries Electronics |
![]() Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole, Right Angle, Horizontal Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 40 (2 x 20) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
на замовлення 195 шт: термін постачання 21-31 дні (днів) |
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C9314-02 | Aries Electronics |
![]() Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 14 (2 x 7) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Phosphor Bronze Part Status: Obsolete |
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20-350001-10 | Aries Electronics |
![]() Packaging: Bulk Number of Pins: 20 Mounting Type: Through Hole Convert From (Adapter End): SOJ Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Termination: Solder Pitch - Mating: 0.050" (1.27mm) Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Board Material: FR4 Epoxy Glass Part Status: Active |
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28-653000-10 | Aries Electronics |
![]() Packaging: Bulk Number of Pins: 28 Mounting Type: Through Hole Convert From (Adapter End): PLCC Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Termination: Solder Pitch - Mating: 0.050" (1.27mm) Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Board Material: FR4 Epoxy Glass Part Status: Active |
на замовлення 36 шт: термін постачання 21-31 дні (днів) |
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32-650000-10 | Aries Electronics |
![]() Packaging: Bulk Size / Dimension: 3.200" L x 0.480" W (81.28mm x 12.19mm) Material: FR4 Epoxy Glass Number of Positions: 32 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SOJ Part Status: Active |
на замовлення 28 шт: термін постачання 21-31 дні (днів) |
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32-450001-10 | Aries Electronics |
![]() Packaging: Bulk Number of Pins: 32 Mounting Type: Through Hole Convert From (Adapter End): SOJ Convert To (Adapter End): DIP, 0.4" (10.16mm) Row Spacing Termination: Solder Pitch - Mating: 0.050" (1.27mm) Pitch - Post: 0.100" (2.54mm) Board Material: FR4 Epoxy Glass Part Status: Active |
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28-350002-10 | Aries Electronics |
![]() Packaging: Tube Size / Dimension: 2.800" L x 0.400" W (71.12mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 28 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SOIC Part Status: Active |
на замовлення 77 шт: термін постачання 21-31 дні (днів) |
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24-350000-10 | Aries Electronics |
![]() Packaging: Bulk Size / Dimension: 2.400" L x 0.450" W (60.96mm x 11.43mm) Material: FR4 Epoxy Glass Number of Positions: 24 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SOIC Part Status: Active |
на замовлення 14 шт: термін постачання 21-31 дні (днів) |
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28-650000-10 | Aries Electronics |
![]() Packaging: Tube Size / Dimension: 2.800" L x 0.480" W (71.12mm x 12.19mm) Material: FR4 Epoxy Glass Number of Positions: 28 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SOIC Part Status: Active |
на замовлення 240 шт: термін постачання 21-31 дні (днів) |
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56-184M65 | Aries Electronics | Description: SOCKET ADAPTER QFP TO 184PGA |
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68-505-110 | Aries Electronics |
![]() Packaging: Bulk Size / Dimension: 1.100" L x 1.100" W (27.94mm x 27.94mm) Material: FR4 Epoxy Glass Number of Positions: 68 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to PGA Package Accepted: PLCC |
на замовлення 824 шт: термін постачання 21-31 дні (днів) |
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18-6511-10 | Aries Electronics |
Description: SOCKET 18 PIN SOLDER TAIL TIN Features: Closed Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 18 (2 x 9) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
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20-F40-10 | Aries Electronics |
![]() Packaging: Tube Connector Type: Receptacle, Breakaway Current Rating (Amps): 8A Mounting Type: Through Hole Number of Positions: 20 Operating Temperature: -55°C ~ 105°C Contact Type: Female Socket Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.200" (5.08mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Finish - Post: Tin Part Status: Active Contact Length - Post: 0.129" (3.28mm) Insulation Height: 0.040" (1.02mm) Row Spacing - Mating: 0.200" (5.08mm) Number of Rows: 2 |
на замовлення 373 шт: термін постачання 21-31 дні (днів) |
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52-536-11 | Aries Electronics |
Description: CONN SOCKET PLCC ZIF 52POS GOLD Features: Open Frame Mounting Type: Through Hole Type: PLCC, ZIF (ZIP) Number of Positions or Pins (Grid): 52 (4 x 13) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 12.0µin (0.30µm) |
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24-516-11 | Aries Electronics |
![]() Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, ZIF (ZIP) Number of Positions or Pins (Grid): 24 (2 x 12) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Beryllium Copper |
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95-132I25 | Aries Electronics |
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96-100M65 | Aries Electronics |
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96-160M65 | Aries Electronics |
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14-3625-21 | Aries Electronics | Description: CONN HDR DIP POST 14POS GOLD |
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25-0625-21 | Aries Electronics |
![]() Packaging: Bulk Connector Type: Header Strip Contact Finish: Gold Color: Black Mounting Type: Through Hole Number of Positions: 25 Pitch: 0.100" (2.54mm) Contact Type: Post Termination: Solder Contact Finish Thickness: 10.0µin (0.25µm) Part Status: Active Number of Rows: 1 |
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96-208M50 | Aries Electronics |
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32-536-11 | Aries Electronics |
Description: CONN SOCKET PLCC ZIF 32POS GOLD Features: Open Frame Mounting Type: Through Hole Type: PLCC, ZIF (ZIP) Number of Positions or Pins (Grid): 32 (2 x 7, 2 x 9) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 12.0µin (0.30µm) |
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40-516-11 | Aries Electronics |
![]() Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, ZIF (ZIP) Number of Positions or Pins (Grid): 40 (2 x 20) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Beryllium Copper Part Status: Active |
на замовлення 20 шт: термін постачання 21-31 дні (днів) |
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16-600-11 | Aries Electronics |
![]() Packaging: Bulk Connector Type: DIP, DIL - Header Contact Finish: Gold Color: Black Mounting Type: Through Hole Number of Positions: 16 Pitch: 0.100" (2.54mm) Contact Type: Forked Row Spacing: 0.300" (7.62mm) Termination: Solder Contact Finish Thickness: 10.0µin (0.25µm) Part Status: Active Number of Rows: 2 |
на замовлення 323 шт: термін постачання 21-31 дні (днів) |
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10-6823-90T | Aries Electronics |
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24-6574-10 | Aries Electronics |
![]() Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 24 (2 x 12) Termination: Solder Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Beryllium Copper Part Status: Active |
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24-6574-11 | Aries Electronics |
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28-6574-10 | Aries Electronics |
![]() Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Beryllium Copper Part Status: Active |
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28-6574-11 | Aries Electronics |
![]() Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Beryllium Copper Part Status: Active |
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32-6574-10 | Aries Electronics |
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32-6574-11 | Aries Electronics |
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40-6574-10 | Aries Electronics |
![]() Features: Closed Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 40 (2 x 20) Termination: Solder Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Beryllium Copper Part Status: Active |
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40-6574-11 | Aries Electronics |
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48-6574-10 | Aries Electronics |
![]() Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 48 (2 x 24) Termination: Solder Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Beryllium Copper |
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48-6574-11 | Aries Electronics |
![]() Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 48 (2 x 24) Termination: Solder Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Beryllium Copper |
товар відсутній |
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40-0518-10 | Aries Electronics |
![]() Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 40 (1 x 40) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Part Status: Active |
на замовлення 5392 шт: термін постачання 21-31 дні (днів) |
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40-0518-11 | Aries Electronics |
![]() Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 40 (1 x 40) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Part Status: Active |
на замовлення 168 шт: термін постачання 21-31 дні (днів) |
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1107741 | Aries Electronics |
![]() Packaging: Tube For Use With/Related Products: Oscillators Accessory Type: Socket, Full Size Package Accepted: 14-DIP, 4 Lead (Full Size) Number of Positions: 14 |
на замовлення 1858 шт: термін постачання 21-31 дні (днів) |
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1108800 | Aries Electronics |
![]() Packaging: Tube For Use With/Related Products: Oscillators Accessory Type: Socket, Half Size Package Accepted: 8-DIP, 4 Lead (Half Size) Part Status: Active Number of Positions: 8 |
на замовлення 1307 шт: термін постачання 21-31 дні (днів) |
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08-6810-90 | Aries Electronics |
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товар відсутній |
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10-2810-90 | Aries Electronics |
![]() Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole, Right Angle, Vertical Type: DIP, 0.2" (5.08mm) Row Spacing Number of Positions or Pins (Grid): 10 (2 x 5) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
на замовлення 884 шт: термін постачання 21-31 дні (днів) |
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08-6810-90C | Aries Electronics |
![]() Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole, Right Angle, Vertical Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 8 (2 x 4) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
товар відсутній |
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04-655-10 | Aries Electronics |
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товар відсутній |
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06-655-10 | Aries Electronics |
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товар відсутній |
18-650-10 |
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Виробник: Aries Electronics
Description: DIP HEADER COVER 18 PIN .270
Packaging: Bulk
For Use With/Related Products: 0600 Series Header
Number of Positions: 18
Accessory Type: Cap (Cover)
Description: DIP HEADER COVER 18 PIN .270
Packaging: Bulk
For Use With/Related Products: 0600 Series Header
Number of Positions: 18
Accessory Type: Cap (Cover)
товар відсутній
24-650-10 |
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Виробник: Aries Electronics
Description: DIP HEADER COVER 24 PIN .270
Description: DIP HEADER COVER 24 PIN .270
на замовлення 34 шт:
термін постачання 21-31 дні (днів)24-650-20 |
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Виробник: Aries Electronics
Description: DIP HEADER COVER 24 PIN .510
Description: DIP HEADER COVER 24 PIN .510
на замовлення 89 шт:
термін постачання 21-31 дні (днів)28-650-10 |
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Виробник: Aries Electronics
Description: DIP HEADER COVER 28 PIN .270
Description: DIP HEADER COVER 28 PIN .270
на замовлення 28 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 382.21 грн |
10+ | 334.01 грн |
25+ | 316.4 грн |
40-650-10 |
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Виробник: Aries Electronics
Description: DIP HEADER COVER 40 PIN .270
Packaging: Bulk
For Use With/Related Products: 0600 Series Header
Number of Positions: 40
Accessory Type: Cap (Cover)
Description: DIP HEADER COVER 40 PIN .270
Packaging: Bulk
For Use With/Related Products: 0600 Series Header
Number of Positions: 40
Accessory Type: Cap (Cover)
на замовлення 136 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 352.06 грн |
10+ | 307.88 грн |
25+ | 291.63 грн |
50+ | 267.32 грн |
100+ | 254.59 грн |
08-810-90 |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 8POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 84 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 588.02 грн |
10+ | 509.62 грн |
25+ | 480.06 грн |
50+ | 438.97 грн |
14-810-90 |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 14POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 14POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 302 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 742.56 грн |
10+ | 643.77 грн |
100+ | 575.32 грн |
16-810-90 |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
товар відсутній
14-810-90T |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 14POS TIN
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 14POS TIN
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 256 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 644.56 грн |
10+ | 558.55 грн |
25+ | 526.14 грн |
50+ | 481.12 грн |
100+ | 468.45 грн |
250+ | 417.81 грн |
16-810-90T |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 16POS TIN
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 16POS TIN
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
товар відсутній
10-810-90C |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 10POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 10POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
на замовлення 25 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 790.06 грн |
10+ | 674.05 грн |
25+ | 648.13 грн |
14-810-90C |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 14POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 14POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
на замовлення 120 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 862.43 грн |
10+ | 736.33 грн |
25+ | 708.01 грн |
50+ | 637.87 грн |
100+ | 602.43 грн |
16-810-90C |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
на замовлення 14 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 895.6 грн |
10+ | 764.43 грн |
08-823-90 |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 8POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 38 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 617.42 грн |
10+ | 537.78 грн |
25+ | 508.05 грн |
14-823-90 |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 14POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 14POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 313 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 807.4 грн |
10+ | 699.67 грн |
25+ | 659.11 грн |
50+ | 602.7 грн |
100+ | 586.84 грн |
250+ | 523.4 грн |
28-6823-90 |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 28POS GOLD
Description: CONN IC DIP SOCKET 28POS GOLD
на замовлення 16 шт:
термін постачання 21-31 дні (днів)40-6823-90 |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 40POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 40POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 195 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 1549.96 грн |
10+ | 1307 грн |
25+ | 1250.52 грн |
50+ | 1135.72 грн |
100+ | 1097.85 грн |
C9314-02 |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 14POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Obsolete
Description: CONN IC DIP SOCKET 14POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Obsolete
товар відсутній
20-350001-10 |
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Виробник: Aries Electronics
Description: SOCKET ADAPTER SOJ TO 20DIP 0.3
Packaging: Bulk
Number of Pins: 20
Mounting Type: Through Hole
Convert From (Adapter End): SOJ
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Board Material: FR4 Epoxy Glass
Part Status: Active
Description: SOCKET ADAPTER SOJ TO 20DIP 0.3
Packaging: Bulk
Number of Pins: 20
Mounting Type: Through Hole
Convert From (Adapter End): SOJ
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Board Material: FR4 Epoxy Glass
Part Status: Active
товар відсутній
28-653000-10 |
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Виробник: Aries Electronics
Description: SOCKET ADAPTER PLCC TO 28DIP 0.6
Packaging: Bulk
Number of Pins: 28
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
Description: SOCKET ADAPTER PLCC TO 28DIP 0.6
Packaging: Bulk
Number of Pins: 28
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
на замовлення 36 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 3004.93 грн |
17+ | 2534.25 грн |
32-650000-10 |
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Виробник: Aries Electronics
Description: SOCKET ADAPTER SOJ TO 32DIP 0.6
Packaging: Bulk
Size / Dimension: 3.200" L x 0.480" W (81.28mm x 12.19mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOJ
Part Status: Active
Description: SOCKET ADAPTER SOJ TO 32DIP 0.6
Packaging: Bulk
Size / Dimension: 3.200" L x 0.480" W (81.28mm x 12.19mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOJ
Part Status: Active
на замовлення 28 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 2848.88 грн |
15+ | 2402.46 грн |
32-450001-10 |
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Виробник: Aries Electronics
Description: SOCKET ADAPTER SOJ TO 32DIP 0.4
Packaging: Bulk
Number of Pins: 32
Mounting Type: Through Hole
Convert From (Adapter End): SOJ
Convert To (Adapter End): DIP, 0.4" (10.16mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Board Material: FR4 Epoxy Glass
Part Status: Active
Description: SOCKET ADAPTER SOJ TO 32DIP 0.4
Packaging: Bulk
Number of Pins: 32
Mounting Type: Through Hole
Convert From (Adapter End): SOJ
Convert To (Adapter End): DIP, 0.4" (10.16mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Board Material: FR4 Epoxy Glass
Part Status: Active
товар відсутній
28-350002-10 |
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Виробник: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 28DIP 0.3
Packaging: Tube
Size / Dimension: 2.800" L x 0.400" W (71.12mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
Description: SOCKET ADAPTER SOIC TO 28DIP 0.3
Packaging: Tube
Size / Dimension: 2.800" L x 0.400" W (71.12mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
на замовлення 77 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 1532.62 грн |
10+ | 1292.27 грн |
25+ | 1236.41 грн |
50+ | 1122.88 грн |
24-350000-10 |
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Виробник: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 24DIP 0.3
Packaging: Bulk
Size / Dimension: 2.400" L x 0.450" W (60.96mm x 11.43mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
Description: SOCKET ADAPTER SOIC TO 24DIP 0.3
Packaging: Bulk
Size / Dimension: 2.400" L x 0.450" W (60.96mm x 11.43mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
на замовлення 14 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 1385.62 грн |
10+ | 1168.27 грн |
28-650000-10 |
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Виробник: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 28DIP 0.6
Packaging: Tube
Size / Dimension: 2.800" L x 0.480" W (71.12mm x 12.19mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
Description: SOCKET ADAPTER SOIC TO 28DIP 0.6
Packaging: Tube
Size / Dimension: 2.800" L x 0.480" W (71.12mm x 12.19mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
на замовлення 240 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 5283.14 грн |
10+ | 4668.59 грн |
25+ | 4489.05 грн |
84+ | 3847.69 грн |
68-505-110 |
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Виробник: Aries Electronics
Description: SOCKET ADAPTER PLCC TO 68PGA
Packaging: Bulk
Size / Dimension: 1.100" L x 1.100" W (27.94mm x 27.94mm)
Material: FR4 Epoxy Glass
Number of Positions: 68
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to PGA
Package Accepted: PLCC
Description: SOCKET ADAPTER PLCC TO 68PGA
Packaging: Bulk
Size / Dimension: 1.100" L x 1.100" W (27.94mm x 27.94mm)
Material: FR4 Epoxy Glass
Number of Positions: 68
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to PGA
Package Accepted: PLCC
на замовлення 824 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 1827.39 грн |
10+ | 1540.76 грн |
25+ | 1474.12 грн |
50+ | 1338.79 грн |
100+ | 1294.16 грн |
250+ | 1222.76 грн |
500+ | 1167.6 грн |
18-6511-10 |
Виробник: Aries Electronics
Description: SOCKET 18 PIN SOLDER TAIL TIN
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: SOCKET 18 PIN SOLDER TAIL TIN
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
товар відсутній
20-F40-10 |
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Виробник: Aries Electronics
Description: CONN RCPT 20POS 0.2 TIN PCB
Packaging: Tube
Connector Type: Receptacle, Breakaway
Current Rating (Amps): 8A
Mounting Type: Through Hole
Number of Positions: 20
Operating Temperature: -55°C ~ 105°C
Contact Type: Female Socket
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.200" (5.08mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Length - Post: 0.129" (3.28mm)
Insulation Height: 0.040" (1.02mm)
Row Spacing - Mating: 0.200" (5.08mm)
Number of Rows: 2
Description: CONN RCPT 20POS 0.2 TIN PCB
Packaging: Tube
Connector Type: Receptacle, Breakaway
Current Rating (Amps): 8A
Mounting Type: Through Hole
Number of Positions: 20
Operating Temperature: -55°C ~ 105°C
Contact Type: Female Socket
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.200" (5.08mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Length - Post: 0.129" (3.28mm)
Insulation Height: 0.040" (1.02mm)
Row Spacing - Mating: 0.200" (5.08mm)
Number of Rows: 2
на замовлення 373 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 1319.28 грн |
10+ | 1100.76 грн |
100+ | 907.22 грн |
52-536-11 |
Виробник: Aries Electronics
Description: CONN SOCKET PLCC ZIF 52POS GOLD
Features: Open Frame
Mounting Type: Through Hole
Type: PLCC, ZIF (ZIP)
Number of Positions or Pins (Grid): 52 (4 x 13)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 12.0µin (0.30µm)
Description: CONN SOCKET PLCC ZIF 52POS GOLD
Features: Open Frame
Mounting Type: Through Hole
Type: PLCC, ZIF (ZIP)
Number of Positions or Pins (Grid): 52 (4 x 13)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 12.0µin (0.30µm)
товар відсутній
24-516-11 |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS GLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP)
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
Description: CONN IC DIP SOCKET ZIF 24POS GLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP)
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
товар відсутній
25-0625-21 |
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Виробник: Aries Electronics
Description: CONN HDR STRIP POST 25POS GOLD
Packaging: Bulk
Connector Type: Header Strip
Contact Finish: Gold
Color: Black
Mounting Type: Through Hole
Number of Positions: 25
Pitch: 0.100" (2.54mm)
Contact Type: Post
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Part Status: Active
Number of Rows: 1
Description: CONN HDR STRIP POST 25POS GOLD
Packaging: Bulk
Connector Type: Header Strip
Contact Finish: Gold
Color: Black
Mounting Type: Through Hole
Number of Positions: 25
Pitch: 0.100" (2.54mm)
Contact Type: Post
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Part Status: Active
Number of Rows: 1
товар відсутній
32-536-11 |
Виробник: Aries Electronics
Description: CONN SOCKET PLCC ZIF 32POS GOLD
Features: Open Frame
Mounting Type: Through Hole
Type: PLCC, ZIF (ZIP)
Number of Positions or Pins (Grid): 32 (2 x 7, 2 x 9)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 12.0µin (0.30µm)
Description: CONN SOCKET PLCC ZIF 32POS GOLD
Features: Open Frame
Mounting Type: Through Hole
Type: PLCC, ZIF (ZIP)
Number of Positions or Pins (Grid): 32 (2 x 7, 2 x 9)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 12.0µin (0.30µm)
товар відсутній
40-516-11 |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 40POS GLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP)
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET ZIF 40POS GLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP)
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
на замовлення 20 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 1423.31 грн |
10+ | 1187.58 грн |
16-600-11 |
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Виробник: Aries Electronics
Description: CONN HDR DIP FORK 16POS GOLD
Packaging: Bulk
Connector Type: DIP, DIL - Header
Contact Finish: Gold
Color: Black
Mounting Type: Through Hole
Number of Positions: 16
Pitch: 0.100" (2.54mm)
Contact Type: Forked
Row Spacing: 0.300" (7.62mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Part Status: Active
Number of Rows: 2
Description: CONN HDR DIP FORK 16POS GOLD
Packaging: Bulk
Connector Type: DIP, DIL - Header
Contact Finish: Gold
Color: Black
Mounting Type: Through Hole
Number of Positions: 16
Pitch: 0.100" (2.54mm)
Contact Type: Forked
Row Spacing: 0.300" (7.62mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Part Status: Active
Number of Rows: 2
на замовлення 323 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
2+ | 230.68 грн |
10+ | 201.81 грн |
100+ | 177.81 грн |
24-6574-10 |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET ZIF 24POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
товар відсутній
28-6574-10 |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET ZIF 28POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
товар відсутній
28-6574-11 |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET ZIF 28POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
товар відсутній
40-6574-10 |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 40POS TIN
Features: Closed Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET ZIF 40POS TIN
Features: Closed Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
товар відсутній
48-6574-10 |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 48POS GLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
Description: CONN IC DIP SOCKET ZIF 48POS GLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
товар відсутній
48-6574-11 |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 48POS GLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
Description: CONN IC DIP SOCKET ZIF 48POS GLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
товар відсутній
40-0518-10 |
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Виробник: Aries Electronics
Description: CONN SOCKET SIP 40POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 40 (1 x 40)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
Description: CONN SOCKET SIP 40POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 40 (1 x 40)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
на замовлення 5392 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
2+ | 284.21 грн |
10+ | 248.28 грн |
100+ | 218.79 грн |
500+ | 174.53 грн |
1000+ | 148.86 грн |
40-0518-11 |
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Виробник: Aries Electronics
Description: CONN SOCKET SIP 40POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 40 (1 x 40)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
Description: CONN SOCKET SIP 40POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 40 (1 x 40)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
на замовлення 168 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 451.57 грн |
10+ | 393.18 грн |
100+ | 344.25 грн |
1107741 |
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Виробник: Aries Electronics
Description: OSCILLATOR SOCKET FULL SIZE 4PIN
Packaging: Tube
For Use With/Related Products: Oscillators
Accessory Type: Socket, Full Size
Package Accepted: 14-DIP, 4 Lead (Full Size)
Number of Positions: 14
Description: OSCILLATOR SOCKET FULL SIZE 4PIN
Packaging: Tube
For Use With/Related Products: Oscillators
Accessory Type: Socket, Full Size
Package Accepted: 14-DIP, 4 Lead (Full Size)
Number of Positions: 14
на замовлення 1858 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
4+ | 90.46 грн |
10+ | 73.68 грн |
28+ | 70.7 грн |
56+ | 64.94 грн |
112+ | 62.11 грн |
252+ | 56.46 грн |
504+ | 49.99 грн |
1008+ | 44.43 грн |
1108800 |
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Виробник: Aries Electronics
Description: OSCILLATOR SOCKET HALF SIZE 4PIN
Packaging: Tube
For Use With/Related Products: Oscillators
Accessory Type: Socket, Half Size
Package Accepted: 8-DIP, 4 Lead (Half Size)
Part Status: Active
Number of Positions: 8
Description: OSCILLATOR SOCKET HALF SIZE 4PIN
Packaging: Tube
For Use With/Related Products: Oscillators
Accessory Type: Socket, Half Size
Package Accepted: 8-DIP, 4 Lead (Half Size)
Part Status: Active
Number of Positions: 8
на замовлення 1307 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
5+ | 67.85 грн |
10+ | 55.32 грн |
49+ | 51.88 грн |
98+ | 46.58 грн |
294+ | 42.35 грн |
539+ | 38.11 грн |
1029+ | 33.32 грн |
10-2810-90 |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 10POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 10POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 884 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 695.07 грн |
10+ | 602.54 грн |
100+ | 538.49 грн |
08-6810-90C |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 8POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній