Продукція > ARIES ELECTRONICS > Всі товари виробника ARIES ELECTRONICS (15933) > Сторінка 5 з 266
Фото | Назва | Виробник | Інформація |
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18-351000-10 | Aries Electronics |
![]() Packaging: Bulk Number of Pins: 18 Mounting Type: Through Hole Convert From (Adapter End): SSOP Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Termination: Solder Pitch - Mating: 0.026" (0.65mm) Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Board Material: FR4 Epoxy Glass |
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20-351000-10 | Aries Electronics |
![]() Packaging: Bulk Number of Pins: 20 Mounting Type: Through Hole Convert From (Adapter End): SSOP Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Termination: Solder Pitch - Mating: 0.026" (0.65mm) Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Board Material: FR4 Epoxy Glass |
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96-080M80 | Aries Electronics |
![]() Number of Pins: 80 Mounting Type: Through Hole Convert From (Adapter End): QFP Convert To (Adapter End): PGA Termination: Solder Pitch - Mating: 0.031" (0.80mm) Contact Finish - Mating: Tin Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Board Material: FR4 Epoxy Glass |
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36-651000-10 | Aries Electronics |
Description: SOCKET ADAPTER 36POS SSOP/DIP .6 Packaging: Bulk Number of Pins: 36 Mounting Type: Through Hole Convert From (Adapter End): SSOP Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Termination: Solder Pitch - Mating: 0.026" (0.65mm) Contact Finish - Mating: Tin Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Board Material: FR4 Epoxy Glass Part Status: Active |
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52-505-110 | Aries Electronics |
![]() Packaging: Bulk Number of Pins: 52 Mounting Type: Through Hole Convert From (Adapter End): PLCC Convert To (Adapter End): PGA Termination: Solder Pitch - Mating: 0.050" (1.27mm) Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin-Lead Board Material: FR4 Epoxy Glass |
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32-9513-10 | Aries Electronics |
![]() Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.9" (22.86mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
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14-036-206 | Aries Electronics |
![]() Packaging: Bulk Connector Type: DIP to DIP, Reversed Contact Finish: Gold Color: Multiple, Ribbon Length: 3.00' (914.40mm) Shielding: Unshielded Number of Positions: 14 Number of Rows: 2 Contact Finish Thickness: 10.0µin (0.25µm) Cable Termination: IDC Pitch - Cable: 0.050" (1.27mm) Pitch - Connector: 0.100" (2.54mm) |
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08-600-11 | Aries Electronics |
![]() Packaging: Bulk Connector Type: DIP, DIL - Header Contact Finish: Gold Color: Black Mounting Type: Through Hole Number of Positions: 8 Pitch: 0.100" (2.54mm) Contact Type: Forked Row Spacing: 0.300" (7.62mm) Termination: Solder Contact Finish Thickness: 10.0µin (0.25µm) Part Status: Active Number of Rows: 2 |
на замовлення 375 шт: термін постачання 21-31 дні (днів) |
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32-655000-10 | Aries Electronics |
![]() Packaging: Bulk Number of Pins: 32 Mounting Type: Through Hole Convert From (Adapter End): TSOP Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Termination: Solder Pitch - Mating: 0.020" (0.50mm) Contact Finish - Mating: Silver Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Board Material: FR4 Epoxy Glass Part Status: Active |
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18-350000-10 | Aries Electronics |
![]() Packaging: Bulk Size / Dimension: 1.800" L x 0.450" W (45.72mm x 11.43mm) Material: FR4 Epoxy Glass Number of Positions: 18 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SOIC Part Status: Active |
на замовлення 132 шт: термін постачання 21-31 дні (днів) |
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14-680-191TC | Aries Electronics |
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08-305984-10 | Aries Electronics |
![]() Packaging: Bulk For Use With/Related Products: HB2E Relay Accessory Type: Adapter |
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18-6810-90T | Aries Electronics |
![]() Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole, Right Angle, Vertical Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 18 (2 x 9) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
на замовлення 94 шт: термін постачання 21-31 дні (днів) |
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16-6810-90T | Aries Electronics |
![]() Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole, Right Angle, Vertical Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 16 (2 x 8) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
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14-823-90C | Aries Electronics |
Description: IC SOCKET 14PIN VERT SCKT HORIZ Features: Closed Frame Mounting Type: Through Hole, Right Angle, Horizontal Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 14 (2 x 7) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Part Status: Active |
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97-68340-P | Aries Electronics |
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97-AQ132D | Aries Electronics |
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40-6554-18 | Aries Electronics |
![]() Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 250°C Number of Positions or Pins (Grid): 40 (2 x 20) Termination: Solder Housing Material: Polyetheretherketone (PEEK), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Nickel Boron Contact Finish Thickness - Mating: 50.0µin (1.27µm) Contact Material - Mating: Beryllium Nickel Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Nickel Boron Contact Finish Thickness - Post: 50.0µin (1.27µm) Contact Material - Post: Beryllium Nickel |
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44-305263-20 | Aries Electronics |
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44-547-11E | Aries Electronics |
![]() Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: SOIC, ZIF (ZIP) Number of Positions or Pins (Grid): 44 (2 x 22) Termination: Solder Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 20.0µin (0.51µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 20.0µin (0.51µm) Contact Material - Post: Beryllium Copper Part Status: Active |
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14-823-90CV0 | Aries Electronics |
Description: CONN IC DIP SOCKET 14POS GOLD Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole, Right Angle, Horizontal Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 14 (2 x 7) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Part Status: Obsolete |
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07-001-152FB | Aries Electronics |
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08-4513-10 | Aries Electronics |
![]() Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: DIP, 0.4" (10.16mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 8 (2 x 4) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Part Status: Active |
на замовлення 1706 шт: термін постачання 21-31 дні (днів) |
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25-0625-11 | Aries Electronics |
![]() Packaging: Bulk Connector Type: Header Strip Contact Finish: Gold Color: Black Mounting Type: Through Hole Number of Positions: 25 Pitch: 0.100" (2.54mm) Contact Type: Forked Termination: Solder Contact Finish Thickness: 10.0µin (0.25µm) Part Status: Active Number of Rows: 1 |
на замовлення 149 шт: термін постачання 21-31 дні (днів) |
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14-354W00-10 | Aries Electronics |
![]() Packaging: Tube Number of Pins: 14 Mounting Type: Through Hole Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Convert To (Adapter End): SOWIC Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin-Lead |
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16-354W00-10 | Aries Electronics |
![]() Packaging: Tube Number of Pins: 16 Mounting Type: Through Hole Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Convert To (Adapter End): SOWIC Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin-Lead Part Status: Active |
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20-354W00-10 | Aries Electronics |
![]() Packaging: Tube Number of Pins: 20 Mounting Type: Through Hole Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Convert To (Adapter End): SOWIC Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin-Lead |
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24-354W00-10 | Aries Electronics |
![]() Packaging: Tube Number of Pins: 24 Mounting Type: Through Hole Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Convert To (Adapter End): SOWIC Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin-Lead Part Status: Active |
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144-PRS12001-16 | Aries Electronics |
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04-600-11 | Aries Electronics |
![]() Packaging: Bulk Connector Type: DIP, DIL - Header Contact Finish: Gold Color: Black Mounting Type: Through Hole Number of Positions: 4 Pitch: 0.100" (2.54mm) Contact Type: Forked Row Spacing: 0.300" (7.62mm) Termination: Solder Contact Finish Thickness: 10.0µin (0.25µm) Number of Rows: 2 |
на замовлення 1053 шт: термін постачання 21-31 дні (днів) |
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04-650-10 | Aries Electronics |
![]() Packaging: Bulk For Use With/Related Products: 0600 Series Header Number of Positions: 4 Accessory Type: Cap (Cover) |
на замовлення 714 шт: термін постачання 21-31 дні (днів) |
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16-304235-10 | Aries Electronics |
Description: 16-PIN SOCKET TO PIN ADAPTER Packaging: Bulk Number of Pins: 16 Mounting Type: Through Hole Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Contact Finish - Mating: Gold Contact Finish - Post: Tin-Lead Board Material: FR4 Epoxy Glass Part Status: Active |
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16-304633-18 | Aries Electronics |
Description: SOCKET ADAPTER 20PLCC TO 16DIP Packaging: Bulk Number of Pins: 16 Mounting Type: Through Hole Convert From (Adapter End): PLCC Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Termination: Solder Pitch - Mating: 0.050" (1.27mm) Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Board Material: FR4 Epoxy Glass Part Status: Active |
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08-350000-11-RC | Aries Electronics |
![]() Packaging: Tube Size / Dimension: 0.800" L x 0.460" W (20.32mm x 11.68mm) Material: FR4 Epoxy Glass Number of Positions: 8 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SOIC Part Status: Active |
на замовлення 1054 шт: термін постачання 21-31 дні (днів) |
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14-350000-11-RC | Aries Electronics |
![]() Packaging: Tube Size / Dimension: 0.700" L x 0.450" W (17.78mm x 11.43mm) Material: FR4 Epoxy Glass Number of Positions: 14 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SOIC Part Status: Active |
на замовлення 758 шт: термін постачання 21-31 дні (днів) |
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14-351000-11-RC | Aries Electronics |
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на замовлення 28 шт: термін постачання 21-31 дні (днів) |
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16-350000-11-RC | Aries Electronics |
![]() Packaging: Tube Size / Dimension: 1.600" L x 0.450" W (40.64mm x 11.43mm) Material: FR4 Epoxy Glass Number of Positions: 16 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SOIC Part Status: Active |
на замовлення 667 шт: термін постачання 21-31 дні (днів) |
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16-351000-11-RC | Aries Electronics |
![]() Packaging: Tube Size / Dimension: 1.600" L x 0.400" W (40.64mm x 10.16mm) Number of Positions: 16 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SSOP Part Status: Active |
на замовлення 6 шт: термін постачання 21-31 дні (днів) |
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18-351000-11-RC | Aries Electronics |
![]() Packaging: Tube Number of Pins: 18 Mounting Type: Through Hole Convert From (Adapter End): SSOP Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Termination: Solder Pitch - Mating: 0.026" (0.65mm) Contact Finish - Mating: Gold Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Board Material: FR4 Epoxy Glass |
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18-350000-11-RC | Aries Electronics |
![]() Packaging: Tube Size / Dimension: 1.800" L x 0.450" W (45.72mm x 11.43mm) Material: FR4 Epoxy Glass Number of Positions: 18 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SOIC Part Status: Active |
на замовлення 109 шт: термін постачання 21-31 дні (днів) |
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20-350000-11-RC | Aries Electronics |
![]() Packaging: Tube Size / Dimension: 2.000" L x 0.450" W (50.80mm x 11.43mm) Material: FR4 Epoxy Glass Number of Positions: 20 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SOIC Part Status: Active |
на замовлення 821 шт: термін постачання 21-31 дні (днів) |
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20-350001-11-RC | Aries Electronics |
![]() Packaging: Tube Number of Pins: 20 Mounting Type: Through Hole Convert From (Adapter End): SOJ Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Termination: Solder Pitch - Mating: 0.050" (1.27mm) Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Board Material: FR4 Epoxy Glass Part Status: Active |
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20-351000-11-RC | Aries Electronics |
![]() Packaging: Tube Size / Dimension: 2.000" L x 0.400" W (50.80mm x 10.16mm) Number of Positions: 20 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SSOP |
на замовлення 502 шт: термін постачання 21-31 дні (днів) |
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24-650000-11-RC | Aries Electronics |
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24-350000-11-RC | Aries Electronics |
![]() Packaging: Tube Size / Dimension: 2.400" L x 0.450" W (60.96mm x 11.43mm) Material: FR4 Epoxy Glass Number of Positions: 24 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SOIC Part Status: Active |
на замовлення 354 шт: термін постачання 21-31 дні (днів) |
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28-650000-11-RC | Aries Electronics |
![]() Packaging: Tube Size / Dimension: 2.800" L x 0.700" W (71.12mm x 17.78mm) Material: FR4 Epoxy Glass Number of Positions: 28 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SOIC Part Status: Active |
на замовлення 59 шт: термін постачання 21-31 дні (днів) |
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28-350002-11-RC | Aries Electronics |
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28-351000-11-RC | Aries Electronics |
![]() Packaging: Tube Size / Dimension: 2.800" L x 0.400" W (71.12mm x 10.16mm) Number of Positions: 28 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SSOP Part Status: Active |
на замовлення 134 шт: термін постачання 21-31 дні (днів) |
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28-651000-11-RC | Aries Electronics |
Description: SOCKET ADAPTER SSOP TO 28DIP 0.6 Packaging: Tube Number of Pins: 28 Mounting Type: Through Hole Convert From (Adapter End): SSOP Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Termination: Solder Pitch - Mating: 0.026" (0.65mm) Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Board Material: FR4 Epoxy Glass |
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32-650000-11-RC | Aries Electronics |
![]() Packaging: Tube Number of Pins: 32 Mounting Type: Through Hole Convert From (Adapter End): SOJ Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Termination: Solder Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Board Material: FR4 Epoxy Glass Part Status: Active |
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32-450001-11-RC | Aries Electronics |
![]() Packaging: Tube Number of Pins: 32 Mounting Type: Through Hole Convert From (Adapter End): SOJ Convert To (Adapter End): DIP, 0.4" (10.16mm) Row Spacing Termination: Solder Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Board Material: FR4 Epoxy Glass Part Status: Active |
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108-PRS12005-12 | Aries Electronics |
![]() Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA, ZIF (ZIP) Operating Temperature: -65°C ~ 125°C Termination: Solder Housing Material: Polyphenylene Sulfide (PPS) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Beryllium Copper Part Status: Active |
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28-650000-10-P | Aries Electronics |
![]() Packaging: Bulk Number of Pins: 28 Mounting Type: Through Hole Convert From (Adapter End): SOIC Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Termination: Solder Pitch - Mating: 0.050" (1.27mm) Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Board Material: FR4 Epoxy Glass |
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42-6554-10 | Aries Electronics |
![]() Features: Closed Frame Packaging: Tray Mounting Type: Through Hole Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 42 (2 x 21) Termination: Solder Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Beryllium Copper |
товар відсутній |
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56-PRS15057-12 | Aries Electronics |
Description: ZIF PGA SOCKET 56PIN 15X15 Features: Closed Frame Mounting Type: Through Hole Type: PGA, ZIF (ZIP) Termination: Solder Housing Material: Polyphenylene Sulfide (PPS) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Beryllium Copper Part Status: Active |
товар відсутній |
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16-675-191T | Aries Electronics |
![]() Packaging: Tube Features: Programmable Connector Type: Header Contact Finish: Tin Color: Black Mounting Type: Through Hole Number of Positions: 16 Pitch: 0.100" (2.54mm) Contact Type: Male Pin Row Spacing: 0.300" (7.62mm) Termination: Solder Contact Finish Thickness: 200.0µin (5.08µm) Part Status: Active Number of Rows: 2 |
на замовлення 126 шт: термін постачання 21-31 дні (днів) |
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24-351000-10 | Aries Electronics |
![]() Packaging: Bulk Number of Pins: 24 Mounting Type: Through Hole Convert From (Adapter End): SSOP Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Termination: Solder Pitch - Mating: 0.026" (0.65mm) Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Board Material: FR4 Epoxy Glass |
товар відсутній |
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10-2810-90C | Aries Electronics |
![]() Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole, Right Angle, Vertical Type: DIP, 0.2" (5.08mm) Row Spacing Number of Positions or Pins (Grid): 10 (2 x 5) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Part Status: Active |
на замовлення 270 шт: термін постачання 21-31 дні (днів) |
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18-6810-90TWR | Aries Electronics |
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товар відсутній |
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48-6645-18 | Aries Electronics |
![]() Packaging: Bulk Number of Pins: 48 Mounting Type: Through Hole Convert From (Adapter End): TQFP Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Termination: Solder Pitch - Mating: 0.050" (1.27mm) Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Board Material: FR4 Epoxy Glass Part Status: Active |
товар відсутній |
18-351000-10 |
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Виробник: Aries Electronics
Description: SOCKET ADAPTER SSOP TO 18DIP 0.3
Packaging: Bulk
Number of Pins: 18
Mounting Type: Through Hole
Convert From (Adapter End): SSOP
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.026" (0.65mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Description: SOCKET ADAPTER SSOP TO 18DIP 0.3
Packaging: Bulk
Number of Pins: 18
Mounting Type: Through Hole
Convert From (Adapter End): SSOP
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.026" (0.65mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
товар відсутній
20-351000-10 |
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Виробник: Aries Electronics
Description: SOCKET ADAPTER SSOP TO 20DIP 0.3
Packaging: Bulk
Number of Pins: 20
Mounting Type: Through Hole
Convert From (Adapter End): SSOP
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.026" (0.65mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Description: SOCKET ADAPTER SSOP TO 20DIP 0.3
Packaging: Bulk
Number of Pins: 20
Mounting Type: Through Hole
Convert From (Adapter End): SSOP
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.026" (0.65mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
товар відсутній
96-080M80 |
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Виробник: Aries Electronics
Description: SOCKET ADAPTER QFP TO 80PGA
Number of Pins: 80
Mounting Type: Through Hole
Convert From (Adapter End): QFP
Convert To (Adapter End): PGA
Termination: Solder
Pitch - Mating: 0.031" (0.80mm)
Contact Finish - Mating: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Description: SOCKET ADAPTER QFP TO 80PGA
Number of Pins: 80
Mounting Type: Through Hole
Convert From (Adapter End): QFP
Convert To (Adapter End): PGA
Termination: Solder
Pitch - Mating: 0.031" (0.80mm)
Contact Finish - Mating: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
товар відсутній
36-651000-10 |
Виробник: Aries Electronics
Description: SOCKET ADAPTER 36POS SSOP/DIP .6
Packaging: Bulk
Number of Pins: 36
Mounting Type: Through Hole
Convert From (Adapter End): SSOP
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.026" (0.65mm)
Contact Finish - Mating: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
Description: SOCKET ADAPTER 36POS SSOP/DIP .6
Packaging: Bulk
Number of Pins: 36
Mounting Type: Through Hole
Convert From (Adapter End): SSOP
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.026" (0.65mm)
Contact Finish - Mating: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
товар відсутній
52-505-110 |
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Виробник: Aries Electronics
Description: SOCKET ADAPTER PLCC TO 52PGA
Packaging: Bulk
Number of Pins: 52
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): PGA
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Description: SOCKET ADAPTER PLCC TO 52PGA
Packaging: Bulk
Number of Pins: 52
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): PGA
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
товар відсутній
32-9513-10 |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 32POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 32POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
14-036-206 |
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Виробник: Aries Electronics
Description: CABLE DIP MALE/FEMALE 14POS GOLD
Packaging: Bulk
Connector Type: DIP to DIP, Reversed
Contact Finish: Gold
Color: Multiple, Ribbon
Length: 3.00' (914.40mm)
Shielding: Unshielded
Number of Positions: 14
Number of Rows: 2
Contact Finish Thickness: 10.0µin (0.25µm)
Cable Termination: IDC
Pitch - Cable: 0.050" (1.27mm)
Pitch - Connector: 0.100" (2.54mm)
Description: CABLE DIP MALE/FEMALE 14POS GOLD
Packaging: Bulk
Connector Type: DIP to DIP, Reversed
Contact Finish: Gold
Color: Multiple, Ribbon
Length: 3.00' (914.40mm)
Shielding: Unshielded
Number of Positions: 14
Number of Rows: 2
Contact Finish Thickness: 10.0µin (0.25µm)
Cable Termination: IDC
Pitch - Cable: 0.050" (1.27mm)
Pitch - Connector: 0.100" (2.54mm)
товар відсутній
08-600-11 |
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Виробник: Aries Electronics
Description: CONN HDR DIP FORK 8POS GOLD
Packaging: Bulk
Connector Type: DIP, DIL - Header
Contact Finish: Gold
Color: Black
Mounting Type: Through Hole
Number of Positions: 8
Pitch: 0.100" (2.54mm)
Contact Type: Forked
Row Spacing: 0.300" (7.62mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Part Status: Active
Number of Rows: 2
Description: CONN HDR DIP FORK 8POS GOLD
Packaging: Bulk
Connector Type: DIP, DIL - Header
Contact Finish: Gold
Color: Black
Mounting Type: Through Hole
Number of Positions: 8
Pitch: 0.100" (2.54mm)
Contact Type: Forked
Row Spacing: 0.300" (7.62mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Part Status: Active
Number of Rows: 2
на замовлення 375 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
3+ | 143.99 грн |
44+ | 113.17 грн |
132+ | 108.03 грн |
32-655000-10 |
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Виробник: Aries Electronics
Description: SOCKET ADAPTER TSOP TO 32DIP 0.6
Packaging: Bulk
Number of Pins: 32
Mounting Type: Through Hole
Convert From (Adapter End): TSOP
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.020" (0.50mm)
Contact Finish - Mating: Silver
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
Description: SOCKET ADAPTER TSOP TO 32DIP 0.6
Packaging: Bulk
Number of Pins: 32
Mounting Type: Through Hole
Convert From (Adapter End): TSOP
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.020" (0.50mm)
Contact Finish - Mating: Silver
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
товар відсутній
18-350000-10 |
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Виробник: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 18DIP 0.3
Packaging: Bulk
Size / Dimension: 1.800" L x 0.450" W (45.72mm x 11.43mm)
Material: FR4 Epoxy Glass
Number of Positions: 18
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
Description: SOCKET ADAPTER SOIC TO 18DIP 0.3
Packaging: Bulk
Size / Dimension: 1.800" L x 0.450" W (45.72mm x 11.43mm)
Material: FR4 Epoxy Glass
Number of Positions: 18
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
на замовлення 132 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 1133.82 грн |
10+ | 967.98 грн |
25+ | 930.73 грн |
50+ | 838.49 грн |
08-305984-10 |
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Виробник: Aries Electronics
Description: ADAPTER FOR TX2SA
Packaging: Bulk
For Use With/Related Products: HB2E Relay
Accessory Type: Adapter
Description: ADAPTER FOR TX2SA
Packaging: Bulk
For Use With/Related Products: HB2E Relay
Accessory Type: Adapter
товар відсутній
18-6810-90T |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 18POS TIN
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 18POS TIN
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 94 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 1072.01 грн |
10+ | 915.06 грн |
25+ | 879.85 грн |
50+ | 792.68 грн |
16-6810-90T |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 16POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 16POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
товар відсутній
14-823-90C |
Виробник: Aries Electronics
Description: IC SOCKET 14PIN VERT SCKT HORIZ
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
Description: IC SOCKET 14PIN VERT SCKT HORIZ
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
товар відсутній
40-6554-18 |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 40POS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 250°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyetheretherketone (PEEK), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Nickel Boron
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Beryllium Nickel
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Boron
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Beryllium Nickel
Description: CONN IC DIP SOCKET ZIF 40POS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 250°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyetheretherketone (PEEK), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Nickel Boron
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Beryllium Nickel
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Boron
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Beryllium Nickel
товар відсутній
44-547-11E |
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Виробник: Aries Electronics
Description: CONN SOCKET SOIC ZIF 44POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SOIC, ZIF (ZIP)
Number of Positions or Pins (Grid): 44 (2 x 22)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 20.0µin (0.51µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 20.0µin (0.51µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN SOCKET SOIC ZIF 44POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SOIC, ZIF (ZIP)
Number of Positions or Pins (Grid): 44 (2 x 22)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 20.0µin (0.51µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 20.0µin (0.51µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
товар відсутній
14-823-90CV0 |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 14POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Obsolete
Description: CONN IC DIP SOCKET 14POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Obsolete
товар відсутній
08-4513-10 |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 8POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
на замовлення 1706 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
3+ | 113.08 грн |
10+ | 94.81 грн |
100+ | 84.71 грн |
1000+ | 56.79 грн |
25-0625-11 |
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Виробник: Aries Electronics
Description: CONN HDR STRIP FORK 25POS GOLD
Packaging: Bulk
Connector Type: Header Strip
Contact Finish: Gold
Color: Black
Mounting Type: Through Hole
Number of Positions: 25
Pitch: 0.100" (2.54mm)
Contact Type: Forked
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Part Status: Active
Number of Rows: 1
Description: CONN HDR STRIP FORK 25POS GOLD
Packaging: Bulk
Connector Type: Header Strip
Contact Finish: Gold
Color: Black
Mounting Type: Through Hole
Number of Positions: 25
Pitch: 0.100" (2.54mm)
Contact Type: Forked
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Part Status: Active
Number of Rows: 1
на замовлення 149 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 1001.9 грн |
10+ | 855.46 грн |
100+ | 745.73 грн |
14-354W00-10 |
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Виробник: Aries Electronics
Description: CONN ADAPTER 14PIN DIP TO SOWIC
Packaging: Tube
Number of Pins: 14
Mounting Type: Through Hole
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOWIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Description: CONN ADAPTER 14PIN DIP TO SOWIC
Packaging: Tube
Number of Pins: 14
Mounting Type: Through Hole
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOWIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
товар відсутній
16-354W00-10 |
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Виробник: Aries Electronics
Description: CONN ADAPTER 16PIN DIP TO SOWIC
Packaging: Tube
Number of Pins: 16
Mounting Type: Through Hole
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOWIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Part Status: Active
Description: CONN ADAPTER 16PIN DIP TO SOWIC
Packaging: Tube
Number of Pins: 16
Mounting Type: Through Hole
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOWIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Part Status: Active
товар відсутній
20-354W00-10 |
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Виробник: Aries Electronics
Description: CONN ADAPTER 20PIN DIP TO SOWIC
Packaging: Tube
Number of Pins: 20
Mounting Type: Through Hole
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOWIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Description: CONN ADAPTER 20PIN DIP TO SOWIC
Packaging: Tube
Number of Pins: 20
Mounting Type: Through Hole
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOWIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
товар відсутній
24-354W00-10 |
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Виробник: Aries Electronics
Description: CONN ADAPTER 24PIN DIP TO SOWIC
Packaging: Tube
Number of Pins: 24
Mounting Type: Through Hole
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOWIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Part Status: Active
Description: CONN ADAPTER 24PIN DIP TO SOWIC
Packaging: Tube
Number of Pins: 24
Mounting Type: Through Hole
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOWIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Part Status: Active
товар відсутній
04-600-11 |
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Виробник: Aries Electronics
Description: CONN HDR DIP FORK 4POS GOLD
Packaging: Bulk
Connector Type: DIP, DIL - Header
Contact Finish: Gold
Color: Black
Mounting Type: Through Hole
Number of Positions: 4
Pitch: 0.100" (2.54mm)
Contact Type: Forked
Row Spacing: 0.300" (7.62mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Number of Rows: 2
Description: CONN HDR DIP FORK 4POS GOLD
Packaging: Bulk
Connector Type: DIP, DIL - Header
Contact Finish: Gold
Color: Black
Mounting Type: Through Hole
Number of Positions: 4
Pitch: 0.100" (2.54mm)
Contact Type: Forked
Row Spacing: 0.300" (7.62mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Number of Rows: 2
на замовлення 1053 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
3+ | 112.33 грн |
60+ | 87.86 грн |
120+ | 83.87 грн |
540+ | 65.59 грн |
1020+ | 56.22 грн |
04-650-10 |
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Виробник: Aries Electronics
Description: 4PIN HEADER COVER
Packaging: Bulk
For Use With/Related Products: 0600 Series Header
Number of Positions: 4
Accessory Type: Cap (Cover)
Description: 4PIN HEADER COVER
Packaging: Bulk
For Use With/Related Products: 0600 Series Header
Number of Positions: 4
Accessory Type: Cap (Cover)
на замовлення 714 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
2+ | 218.62 грн |
10+ | 190.93 грн |
25+ | 180.79 грн |
50+ | 165.74 грн |
100+ | 157.85 грн |
250+ | 138.11 грн |
500+ | 131.97 грн |
16-304235-10 |
Виробник: Aries Electronics
Description: 16-PIN SOCKET TO PIN ADAPTER
Packaging: Bulk
Number of Pins: 16
Mounting Type: Through Hole
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Contact Finish - Mating: Gold
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
Description: 16-PIN SOCKET TO PIN ADAPTER
Packaging: Bulk
Number of Pins: 16
Mounting Type: Through Hole
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Contact Finish - Mating: Gold
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
товар відсутній
16-304633-18 |
Виробник: Aries Electronics
Description: SOCKET ADAPTER 20PLCC TO 16DIP
Packaging: Bulk
Number of Pins: 16
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
Description: SOCKET ADAPTER 20PLCC TO 16DIP
Packaging: Bulk
Number of Pins: 16
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
товар відсутній
08-350000-11-RC |
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Виробник: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 8DIP 0.3
Packaging: Tube
Size / Dimension: 0.800" L x 0.460" W (20.32mm x 11.68mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
Description: SOCKET ADAPTER SOIC TO 8DIP 0.3
Packaging: Tube
Size / Dimension: 0.800" L x 0.460" W (20.32mm x 11.68mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
на замовлення 1054 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 741.81 грн |
10+ | 642.54 грн |
48+ | 589.78 грн |
96+ | 538.92 грн |
288+ | 480.66 грн |
528+ | 451.52 грн |
1008+ | 392.55 грн |
14-350000-11-RC |
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Виробник: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 14DIP 0.3
Packaging: Tube
Size / Dimension: 0.700" L x 0.450" W (17.78mm x 11.43mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
Description: SOCKET ADAPTER SOIC TO 14DIP 0.3
Packaging: Tube
Size / Dimension: 0.700" L x 0.450" W (17.78mm x 11.43mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
на замовлення 758 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 1485.13 грн |
10+ | 1239.34 грн |
25+ | 1174.71 грн |
50+ | 1086.43 грн |
100+ | 958.62 грн |
308+ | 894.71 грн |
616+ | 861.18 грн |
14-351000-11-RC |
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Виробник: Aries Electronics
Description: SOCKET ADAPTER SSOP TO 14DIP 0.3
Description: SOCKET ADAPTER SSOP TO 14DIP 0.3
на замовлення 28 шт:
термін постачання 21-31 дні (днів)16-350000-11-RC |
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Виробник: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 16DIP 0.3
Packaging: Tube
Size / Dimension: 1.600" L x 0.450" W (40.64mm x 11.43mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
Description: SOCKET ADAPTER SOIC TO 16DIP 0.3
Packaging: Tube
Size / Dimension: 1.600" L x 0.450" W (40.64mm x 11.43mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
на замовлення 667 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 1635.15 грн |
24+ | 1379 грн |
48+ | 1276.84 грн |
120+ | 1158.32 грн |
264+ | 1094.42 грн |
504+ | 1062.47 грн |
16-351000-11-RC |
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Виробник: Aries Electronics
Description: SOCKET ADAPTER SSOP TO 16DIP 0.3
Packaging: Tube
Size / Dimension: 1.600" L x 0.400" W (40.64mm x 10.16mm)
Number of Positions: 16
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SSOP
Part Status: Active
Description: SOCKET ADAPTER SSOP TO 16DIP 0.3
Packaging: Tube
Size / Dimension: 1.600" L x 0.400" W (40.64mm x 10.16mm)
Number of Positions: 16
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SSOP
Part Status: Active
на замовлення 6 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 2042.24 грн |
18-351000-11-RC |
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Виробник: Aries Electronics
Description: SOCKET ADAPTER SSOP TO 18DIP 0.3
Packaging: Tube
Number of Pins: 18
Mounting Type: Through Hole
Convert From (Adapter End): SSOP
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.026" (0.65mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
Description: SOCKET ADAPTER SSOP TO 18DIP 0.3
Packaging: Tube
Number of Pins: 18
Mounting Type: Through Hole
Convert From (Adapter End): SSOP
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.026" (0.65mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
товар відсутній
18-350000-11-RC |
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Виробник: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 18DIP 0.3
Packaging: Tube
Size / Dimension: 1.800" L x 0.450" W (45.72mm x 11.43mm)
Material: FR4 Epoxy Glass
Number of Positions: 18
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
Description: SOCKET ADAPTER SOIC TO 18DIP 0.3
Packaging: Tube
Size / Dimension: 1.800" L x 0.450" W (45.72mm x 11.43mm)
Material: FR4 Epoxy Glass
Number of Positions: 18
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
на замовлення 109 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 1610.27 грн |
10+ | 1357.96 грн |
25+ | 1299.28 грн |
50+ | 1179.99 грн |
20-350000-11-RC |
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Виробник: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 20DIP 0.3
Packaging: Tube
Size / Dimension: 2.000" L x 0.450" W (50.80mm x 11.43mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
Description: SOCKET ADAPTER SOIC TO 20DIP 0.3
Packaging: Tube
Size / Dimension: 2.000" L x 0.450" W (50.80mm x 11.43mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
на замовлення 821 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 1778.38 грн |
19+ | 1499.74 грн |
38+ | 1434.92 грн |
57+ | 1303.19 грн |
114+ | 1259.74 грн |
266+ | 1190.24 грн |
513+ | 1136.54 грн |
20-350001-11-RC |
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Виробник: Aries Electronics
Description: SOCKET ADAPTER SOJ TO 20DIP 0.3
Packaging: Tube
Number of Pins: 20
Mounting Type: Through Hole
Convert From (Adapter End): SOJ
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Board Material: FR4 Epoxy Glass
Part Status: Active
Description: SOCKET ADAPTER SOJ TO 20DIP 0.3
Packaging: Tube
Number of Pins: 20
Mounting Type: Through Hole
Convert From (Adapter End): SOJ
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Board Material: FR4 Epoxy Glass
Part Status: Active
товар відсутній
20-351000-11-RC |
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Виробник: Aries Electronics
Description: SOCKET ADAPTER SSOP TO 20DIP 0.3
Packaging: Tube
Size / Dimension: 2.000" L x 0.400" W (50.80mm x 10.16mm)
Number of Positions: 20
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SSOP
Description: SOCKET ADAPTER SSOP TO 20DIP 0.3
Packaging: Tube
Size / Dimension: 2.000" L x 0.400" W (50.80mm x 10.16mm)
Number of Positions: 20
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SSOP
на замовлення 502 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 1885.43 грн |
19+ | 1590.02 грн |
38+ | 1521.33 грн |
57+ | 1381.65 грн |
114+ | 1335.6 грн |
266+ | 1261.91 грн |
24-650000-11-RC |
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Виробник: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 24DIP 0.6
Description: SOCKET ADAPTER SOIC TO 24DIP 0.6
товар відсутній
24-350000-11-RC |
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Виробник: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 24DIP 0.3
Packaging: Tube
Size / Dimension: 2.400" L x 0.450" W (60.96mm x 11.43mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
Description: SOCKET ADAPTER SOIC TO 24DIP 0.3
Packaging: Tube
Size / Dimension: 2.400" L x 0.450" W (60.96mm x 11.43mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
на замовлення 354 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 1998.52 грн |
16+ | 1685.43 грн |
32+ | 1612.63 грн |
64+ | 1464.56 грн |
112+ | 1415.74 грн |
256+ | 1337.63 грн |
28-650000-11-RC |
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Виробник: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 28DIP 0.6
Packaging: Tube
Size / Dimension: 2.800" L x 0.700" W (71.12mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
Description: SOCKET ADAPTER SOIC TO 28DIP 0.6
Packaging: Tube
Size / Dimension: 2.800" L x 0.700" W (71.12mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
на замовлення 59 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 3991.75 грн |
10+ | 3526.89 грн |
25+ | 3391.27 грн |
28-350002-11-RC |
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Виробник: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 28DIP 0.3
Description: SOCKET ADAPTER SOIC TO 28DIP 0.3
товар відсутній
28-351000-11-RC |
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Виробник: Aries Electronics
Description: SOCKET ADAPTER SSOP TO 28DIP 0.3
Packaging: Tube
Size / Dimension: 2.800" L x 0.400" W (71.12mm x 10.16mm)
Number of Positions: 28
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SSOP
Part Status: Active
Description: SOCKET ADAPTER SSOP TO 28DIP 0.3
Packaging: Tube
Size / Dimension: 2.800" L x 0.400" W (71.12mm x 10.16mm)
Number of Positions: 28
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SSOP
Part Status: Active
на замовлення 134 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 1866.59 грн |
14+ | 1574.22 грн |
28+ | 1506.17 грн |
56+ | 1367.88 грн |
112+ | 1322.29 грн |
28-651000-11-RC |
Виробник: Aries Electronics
Description: SOCKET ADAPTER SSOP TO 28DIP 0.6
Packaging: Tube
Number of Pins: 28
Mounting Type: Through Hole
Convert From (Adapter End): SSOP
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.026" (0.65mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
Description: SOCKET ADAPTER SSOP TO 28DIP 0.6
Packaging: Tube
Number of Pins: 28
Mounting Type: Through Hole
Convert From (Adapter End): SSOP
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.026" (0.65mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
товар відсутній
32-650000-11-RC |
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Виробник: Aries Electronics
Description: SOCKET ADAPTER SOJ TO 32DIP 0.6
Packaging: Tube
Number of Pins: 32
Mounting Type: Through Hole
Convert From (Adapter End): SOJ
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
Part Status: Active
Description: SOCKET ADAPTER SOJ TO 32DIP 0.6
Packaging: Tube
Number of Pins: 32
Mounting Type: Through Hole
Convert From (Adapter End): SOJ
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
Part Status: Active
товар відсутній
32-450001-11-RC |
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Виробник: Aries Electronics
Description: SOCKET ADAPTER SOJ TO 32DIP 0.4
Packaging: Tube
Number of Pins: 32
Mounting Type: Through Hole
Convert From (Adapter End): SOJ
Convert To (Adapter End): DIP, 0.4" (10.16mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
Part Status: Active
Description: SOCKET ADAPTER SOJ TO 32DIP 0.4
Packaging: Tube
Number of Pins: 32
Mounting Type: Through Hole
Convert From (Adapter End): SOJ
Convert To (Adapter End): DIP, 0.4" (10.16mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
Part Status: Active
товар відсутній
108-PRS12005-12 |
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Виробник: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN SOCKET PGA ZIF GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
товар відсутній
28-650000-10-P |
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Виробник: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 28DIP 0.6
Packaging: Bulk
Number of Pins: 28
Mounting Type: Through Hole
Convert From (Adapter End): SOIC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Description: SOCKET ADAPTER SOIC TO 28DIP 0.6
Packaging: Bulk
Number of Pins: 28
Mounting Type: Through Hole
Convert From (Adapter End): SOIC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
товар відсутній
42-6554-10 |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 42POS TIN
Features: Closed Frame
Packaging: Tray
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Description: CONN IC DIP SOCKET ZIF 42POS TIN
Features: Closed Frame
Packaging: Tray
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
товар відсутній
56-PRS15057-12 |
Виробник: Aries Electronics
Description: ZIF PGA SOCKET 56PIN 15X15
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: ZIF PGA SOCKET 56PIN 15X15
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
товар відсутній
16-675-191T |
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Виробник: Aries Electronics
Description: CONN HDR MALE PIN 16POS TIN
Packaging: Tube
Features: Programmable
Connector Type: Header
Contact Finish: Tin
Color: Black
Mounting Type: Through Hole
Number of Positions: 16
Pitch: 0.100" (2.54mm)
Contact Type: Male Pin
Row Spacing: 0.300" (7.62mm)
Termination: Solder
Contact Finish Thickness: 200.0µin (5.08µm)
Part Status: Active
Number of Rows: 2
Description: CONN HDR MALE PIN 16POS TIN
Packaging: Tube
Features: Programmable
Connector Type: Header
Contact Finish: Tin
Color: Black
Mounting Type: Through Hole
Number of Positions: 16
Pitch: 0.100" (2.54mm)
Contact Type: Male Pin
Row Spacing: 0.300" (7.62mm)
Termination: Solder
Contact Finish Thickness: 200.0µin (5.08µm)
Part Status: Active
Number of Rows: 2
на замовлення 126 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
2+ | 192.99 грн |
10+ | 161.96 грн |
100+ | 144.73 грн |
24-351000-10 |
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Виробник: Aries Electronics
Description: SOCKET ADAPTER SSOP TO 24DIP 0.3
Packaging: Bulk
Number of Pins: 24
Mounting Type: Through Hole
Convert From (Adapter End): SSOP
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.026" (0.65mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Description: SOCKET ADAPTER SSOP TO 24DIP 0.3
Packaging: Bulk
Number of Pins: 24
Mounting Type: Through Hole
Convert From (Adapter End): SSOP
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.026" (0.65mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
товар відсутній
10-2810-90C |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 10POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 10POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
на замовлення 270 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 592.54 грн |
10+ | 512.96 грн |
100+ | 458.48 грн |
48-6645-18 |
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Виробник: Aries Electronics
Description: SOCKET ADAPTER TQFP TO 48DIP 0.6
Packaging: Bulk
Number of Pins: 48
Mounting Type: Through Hole
Convert From (Adapter End): TQFP
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
Description: SOCKET ADAPTER TQFP TO 48DIP 0.6
Packaging: Bulk
Number of Pins: 48
Mounting Type: Through Hole
Convert From (Adapter End): TQFP
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
товар відсутній