Продукція > SAMTEC INC. > Всі товари виробника SAMTEC INC. (193510) > Сторінка 3225 з 3226
Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
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ZW-10-09-G-D-446-158 | Samtec Inc. |
Description: CONN BRD STACK .100" 20POS Packaging: Bulk Color: Black Mounting Type: Through Hole Pitch: 0.100" (2.54mm) Row Spacing: 0.100" (2.54mm) Termination: Solder Contact Finish - Post (Mating): Gold Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm) Number of Rows: 2 Number of Positions: 20 Length - Overall Pin: 0.730" (18.542mm) Length - Post (Mating): 0.126" (3.200mm) Length - Stack Height: 0.446" (11.328mm) Length - Tail: 0.158" (4.013mm) |
на замовлення 1225 шт: термін постачання 21-31 дні (днів) |
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ZW-14-09-G-D-446-158 | Samtec Inc. |
Description: CONN BRD STACK .100" 28POS Packaging: Bulk Color: Black Mounting Type: Through Hole Pitch: 0.100" (2.54mm) Row Spacing: 0.100" (2.54mm) Termination: Solder Contact Finish - Post (Mating): Gold Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm) Number of Rows: 2 Number of Positions: 28 Length - Overall Pin: 0.730" (18.542mm) Length - Post (Mating): 0.126" (3.200mm) Length - Stack Height: 0.446" (11.328mm) Length - Tail: 0.158" (4.013mm) |
на замовлення 442 шт: термін постачання 21-31 дні (днів) |
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ZW-14-09-G-D-446-158 | Samtec Inc. |
Description: CONN BRD STACK .100" 28POS Packaging: Bulk Color: Black Mounting Type: Through Hole Pitch: 0.100" (2.54mm) Row Spacing: 0.100" (2.54mm) Termination: Solder Contact Finish - Post (Mating): Gold Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm) Number of Rows: 2 Number of Positions: 28 Length - Overall Pin: 0.730" (18.542mm) Length - Post (Mating): 0.126" (3.200mm) Length - Stack Height: 0.446" (11.328mm) Length - Tail: 0.158" (4.013mm) |
на замовлення 734 шт: термін постачання 21-31 дні (днів) |
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HW-05-15-G-D-446-SM-A | Samtec Inc. |
Description: CONN HDR 10POS 0.1 STACK SMD Packaging: Bulk Color: Black Mounting Type: Surface Mount Pitch: 0.100" (2.54mm) Row Spacing: 0.100" (2.54mm) Termination: Solder Contact Finish - Post (Mating): Gold Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm) Number of Rows: 2 Number of Positions: 10 Length - Overall Pin: 0.565" (14.351mm) Length - Post (Mating): 0.119" (3.023mm) Length - Stack Height: 0.446" (11.328mm) |
на замовлення 274 шт: термін постачання 21-31 дні (днів) |
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HW-05-15-G-D-446-SM-A | Samtec Inc. |
Description: CONN HDR 10POS 0.1 STACK SMD Packaging: Tube Color: Black Mounting Type: Surface Mount Pitch: 0.100" (2.54mm) Row Spacing: 0.100" (2.54mm) Termination: Solder Contact Finish - Post (Mating): Gold Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm) Number of Rows: 2 Number of Positions: 10 Length - Overall Pin: 0.565" (14.351mm) Length - Post (Mating): 0.119" (3.023mm) Length - Stack Height: 0.446" (11.328mm) |
на замовлення 165 шт: термін постачання 21-31 дні (днів) |
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ZW-15-10-S-D-446-150 | Samtec Inc. |
Description: CONN BRD STACK .100" 30POS Packaging: Bulk Color: Black Mounting Type: Through Hole Pitch: 0.100" (2.54mm) Row Spacing: 0.100" (2.54mm) Termination: Solder Contact Finish - Post (Mating): Gold Contact Finish Thickness - Post (Mating): 30.0µin (0.76µm) Number of Rows: 2 Number of Positions: 30 Length - Overall Pin: 0.830" (21.082mm) Length - Post (Mating): 0.234" (5.944mm) Length - Stack Height: 0.446" (11.328mm) Length - Tail: 0.150" (3.810mm) |
на замовлення 442 шт: термін постачання 21-31 дні (днів) |
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ZW-15-10-S-D-446-150 | Samtec Inc. |
Description: CONN BRD STACK .100" 30POS Packaging: Bulk Color: Black Mounting Type: Through Hole Pitch: 0.100" (2.54mm) Row Spacing: 0.100" (2.54mm) Termination: Solder Contact Finish - Post (Mating): Gold Contact Finish Thickness - Post (Mating): 30.0µin (0.76µm) Number of Rows: 2 Number of Positions: 30 Length - Overall Pin: 0.830" (21.082mm) Length - Post (Mating): 0.234" (5.944mm) Length - Stack Height: 0.446" (11.328mm) Length - Tail: 0.150" (3.810mm) |
на замовлення 734 шт: термін постачання 21-31 дні (днів) |
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TW-25-06-S-D-446-090 | Samtec Inc. |
Description: CONN BRD STACK 2.00 50POS Packaging: Bulk Color: Black Mounting Type: Through Hole Pitch: 0.079" (2.00mm) Row Spacing: 0.079" (2.00mm) Termination: Solder Contact Finish - Post (Mating): Gold Contact Finish Thickness - Post (Mating): 30.0µin (0.76µm) Number of Rows: 2 Number of Positions: 50 Length - Overall Pin: 0.673" (17.094mm) Length - Post (Mating): 0.137" (3.480mm) Length - Stack Height: 0.446" (11.328mm) Length - Tail: 0.090" (2.286mm) |
на замовлення 182 шт: термін постачання 21-31 дні (днів) |
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TW-25-06-S-D-446-090 | Samtec Inc. |
Description: CONN BRD STACK 2.00 50POS Packaging: Bulk Color: Black Mounting Type: Through Hole Pitch: 0.079" (2.00mm) Row Spacing: 0.079" (2.00mm) Termination: Solder Contact Finish - Post (Mating): Gold Contact Finish Thickness - Post (Mating): 30.0µin (0.76µm) Number of Rows: 2 Number of Positions: 50 Length - Overall Pin: 0.673" (17.094mm) Length - Post (Mating): 0.137" (3.480mm) Length - Stack Height: 0.446" (11.328mm) Length - Tail: 0.090" (2.286mm) |
на замовлення 302 шт: термін постачання 21-31 дні (днів) |
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HW-07-15-G-D-446-SM-A | Samtec Inc. |
Description: CONN HDR 14POS 0.1 STACK SMD Packaging: Tube Color: Black Mounting Type: Surface Mount Pitch: 0.100" (2.54mm) Row Spacing: 0.100" (2.54mm) Termination: Solder Contact Finish - Post (Mating): Gold Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm) Number of Rows: 2 Number of Positions: 14 Length - Overall Pin: 0.565" (14.351mm) Length - Post (Mating): 0.119" (3.023mm) Length - Stack Height: 0.446" (11.328mm) |
на замовлення 135 шт: термін постачання 21-31 дні (днів) |
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HW-07-15-G-D-446-SM-A | Samtec Inc. |
Description: CONN HDR 14POS 0.1 STACK SMD Packaging: Tube Color: Black Mounting Type: Surface Mount Pitch: 0.100" (2.54mm) Row Spacing: 0.100" (2.54mm) Termination: Solder Contact Finish - Post (Mating): Gold Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm) Number of Rows: 2 Number of Positions: 14 Length - Overall Pin: 0.565" (14.351mm) Length - Post (Mating): 0.119" (3.023mm) Length - Stack Height: 0.446" (11.328mm) |
на замовлення 224 шт: термін постачання 21-31 дні (днів) |
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HW-13-09-G-D-446-SM | Samtec Inc. |
Description: CONN HDR 26POS 0.1 STACK SMD Packaging: Bulk Color: Black Mounting Type: Surface Mount Pitch: 0.100" (2.54mm) Row Spacing: 0.100" (2.54mm) Termination: Solder Contact Finish - Post (Mating): Gold Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm) Number of Rows: 2 Number of Positions: 26 Length - Overall Pin: 0.665" (16.891mm) Length - Post (Mating): 0.219" (5.563mm) Length - Stack Height: 0.446" (11.328mm) |
на замовлення 166 шт: термін постачання 21-31 дні (днів) |
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MTMM-128-11-G-D-446 | Samtec Inc. |
Description: 2MM TERMINAL STRIP Packaging: Bulk |
на замовлення 90 шт: термін постачання 21-31 дні (днів) |
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MTMM-128-11-G-D-446 | Samtec Inc. |
Description: 2MM TERMINAL STRIP Packaging: Bulk |
на замовлення 149 шт: термін постачання 21-31 дні (днів) |
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HW-36-09-G-D-446-SM | Samtec Inc. |
Description: CONN HDR 72POS 0.1 STACK SMD Packaging: Bulk Color: Black Mounting Type: Surface Mount Pitch: 0.100" (2.54mm) Row Spacing: 0.100" (2.54mm) Termination: Solder Contact Finish - Post (Mating): Gold Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm) Number of Rows: 2 Number of Positions: 72 Length - Overall Pin: 0.665" (16.891mm) Length - Post (Mating): 0.219" (5.563mm) Length - Stack Height: 0.446" (11.328mm) |
на замовлення 73 шт: термін постачання 21-31 дні (днів) |
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HW-36-09-G-D-446-SM | Samtec Inc. |
Description: CONN HDR 72POS 0.1 STACK SMD Packaging: Tube Color: Black Mounting Type: Surface Mount Pitch: 0.100" (2.54mm) Row Spacing: 0.100" (2.54mm) Termination: Solder Contact Finish - Post (Mating): Gold Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm) Number of Rows: 2 Number of Positions: 72 Length - Overall Pin: 0.665" (16.891mm) Length - Post (Mating): 0.219" (5.563mm) Length - Stack Height: 0.446" (11.328mm) |
на замовлення 44 шт: термін постачання 21-31 дні (днів) |
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HSEC8-110-01-S-DV-A-WT-TR | Samtec Inc. |
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL Features: Board Guide, Solder Retention Packaging: Tape & Reel (TR) Gender: Female Contact Finish: Gold Color: Black Mounting Type: Surface Mount Number of Positions: 20 Pitch: 0.031" (0.80mm) Operating Temperature: -55°C ~ 125°C Read Out: Dual Contact Type: Cantilever Card Type: PCI Express™ Card Thickness: 0.062" (1.57mm) Termination: Solder Contact Finish Thickness: 30.0µin (0.76µm) Contact Material: Beryllium Copper Number of Positions/Bay/Row: 10 Number of Rows: 2 |
товар відсутній |
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HSEC8-113-01-SM-DV-A-L2-K-TR | Samtec Inc. |
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL Features: Board Guide, Pick and Place Packaging: Tape & Reel (TR) Gender: Female Contact Finish: Gold Color: Black Mounting Type: Surface Mount Number of Positions: 26 Pitch: 0.031" (0.80mm) Operating Temperature: -55°C ~ 125°C Read Out: Dual Contact Type: Cantilever Card Type: PCI Express™ Card Thickness: 0.062" (1.57mm) Termination: Solder Contact Finish Thickness: 30.0µin (0.76µm) Contact Material: Beryllium Copper Number of Positions/Bay/Row: 13 Number of Rows: 2 |
товар відсутній |
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HSEC8-110-03-S-DV-A-WT-TR | Samtec Inc. |
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL Features: Board Guide, Solder Retention Packaging: Tape & Reel (TR) Gender: Female Contact Finish: Gold Color: Black Mounting Type: Surface Mount Number of Positions: 20 Pitch: 0.031" (0.80mm) Operating Temperature: -55°C ~ 125°C Read Out: Dual Contact Type: Cantilever Card Type: PCI Express™ Card Thickness: 0.093" (2.36mm) Termination: Solder Contact Finish Thickness: 30.0µin (0.76µm) Contact Material: Beryllium Copper Number of Positions/Bay/Row: 10 Number of Rows: 2 |
товар відсутній |
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HSEC8-109-01-S-DV-A-L2-K | Samtec Inc. |
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL Features: Latches Packaging: Bulk Gender: Female Contact Finish: Gold Color: Black Mounting Type: Surface Mount Number of Positions: 18 Pitch: 0.031" (0.80mm) Operating Temperature: -55°C ~ 125°C Read Out: Dual Contact Type: Cantilever Card Type: PCI Express™ Card Thickness: 0.062" (1.57mm) Termination: Solder Contact Finish Thickness: 30.0µin (0.76µm) Contact Material: Beryllium Copper Number of Positions/Bay/Row: 9 Number of Rows: 2 |
товар відсутній |
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HSEC8-110-01-SM-DV-K-TR | Samtec Inc. |
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL Features: Pick and Place Packaging: Tape & Reel (TR) Gender: Female Contact Finish: Gold Color: Black Mounting Type: Surface Mount Number of Positions: 20 Pitch: 0.031" (0.80mm) Operating Temperature: -55°C ~ 125°C Read Out: Dual Contact Type: Cantilever Card Type: PCI Express™ Card Thickness: 0.062" (1.57mm) Termination: Solder Contact Finish Thickness: 30.0µin (0.76µm) Contact Material: Beryllium Copper Number of Positions/Bay/Row: 10 Number of Rows: 2 |
товар відсутній |
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HSEC8-170-03-L-DV-A-TR | Samtec Inc. |
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL Features: Board Guide Packaging: Tape & Reel (TR) Gender: Female Contact Finish: Gold Color: Black Mounting Type: Surface Mount Number of Positions: 140 Pitch: 0.031" (0.80mm) Operating Temperature: -55°C ~ 125°C Read Out: Dual Contact Type: Cantilever Card Type: PCI Express™ Card Thickness: 0.093" (2.36mm) Termination: Solder Contact Finish Thickness: 10.0µin (0.25µm) Contact Material: Beryllium Copper Number of Positions/Bay/Row: 30; 40 Number of Rows: 2 |
товар відсутній |
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HSEC8-130-03-L-DV-A-WT-K-TR | Samtec Inc. |
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL Features: Board Guide, Pick and Place, Solder Retention Packaging: Tape & Reel (TR) Gender: Female Contact Finish: Gold Color: Black Mounting Type: Surface Mount Number of Positions: 60 Pitch: 0.031" (0.80mm) Operating Temperature: -55°C ~ 125°C Read Out: Dual Contact Type: Cantilever Card Type: PCI Express™ Card Thickness: 0.093" (2.36mm) Termination: Solder Contact Finish Thickness: 10.0µin (0.25µm) Contact Material: Beryllium Copper Number of Positions/Bay/Row: 30 Number of Rows: 2 |
товар відсутній |
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HSEC8-110-01-S-DV-A-GR-K-TR | Samtec Inc. |
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL Features: Board Guide, Pick and Place Packaging: Tape & Reel (TR) Gender: Female Contact Finish: Gold Color: Black Mounting Type: Surface Mount Number of Positions: 20 Pitch: 0.031" (0.80mm) Operating Temperature: -55°C ~ 125°C Read Out: Dual Contact Type: Cantilever Card Type: PCI Express™ Card Thickness: 0.062" (1.57mm) Termination: Solder Contact Finish Thickness: 30.0µin (0.76µm) Contact Material: Beryllium Copper Number of Positions/Bay/Row: 10 Number of Rows: 2 |
товар відсутній |
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HSEC8-120-01-2-DP-A-K | Samtec Inc. |
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL Features: Board Guide, Pick and Place Packaging: Tape & Reel (TR) Gender: Female Contact Finish: Gold Color: Black Mounting Type: Surface Mount Number of Positions: 40 Pitch: 0.031" (0.80mm) Operating Temperature: -55°C ~ 125°C Read Out: Dual Contact Type: Cantilever Card Type: PCI Express™ Card Thickness: 0.062" (1.57mm) Termination: Solder Contact Finish Thickness: 20.0µin (0.51µm) Contact Material: Copper Alloy Number of Rows: 2 |
товар відсутній |
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HSEC8-110-01-H-DV-A-WT-K-TR | Samtec Inc. |
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL Features: Board Guide, Pick and Place, Solder Retention Packaging: Bulk Gender: Female Contact Finish: Gold Color: Black Mounting Type: Surface Mount Number of Positions: 20 Pitch: 0.031" (0.80mm) Operating Temperature: -55°C ~ 125°C Read Out: Dual Contact Type: Cantilever Card Type: PCI Express™ Card Thickness: 0.062" (1.57mm) Termination: Solder Contact Finish Thickness: 30.0µin (0.76µm) Contact Material: Beryllium Copper Number of Positions/Bay/Row: 10 Number of Rows: 2 |
товар відсутній |
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HSEC8-137-01-L-DV-K-TR | Samtec Inc. |
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL Features: Pick and Place Packaging: Tape & Reel (TR) Gender: Female Contact Finish: Gold Color: Black Mounting Type: Surface Mount Number of Positions: 74 Pitch: 0.031" (0.80mm) Operating Temperature: -55°C ~ 125°C Read Out: Dual Contact Type: Cantilever Card Type: PCI Express™ Card Thickness: 0.062" (1.57mm) Termination: Solder Contact Finish Thickness: 10.0µin (0.25µm) Contact Material: Beryllium Copper Number of Positions/Bay/Row: 15; 20 Number of Rows: 2 |
товар відсутній |
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HSEC8-109-01-S-DV-A-BL-TR | Samtec Inc. |
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL Features: Board Guide, Board Lock Packaging: Tape & Reel (TR) Gender: Female Contact Finish: Gold Color: Black Mounting Type: Surface Mount Number of Positions: 18 Pitch: 0.031" (0.80mm) Operating Temperature: -55°C ~ 125°C Read Out: Dual Contact Type: Cantilever Card Type: PCI Express™ Card Thickness: 0.062" (1.57mm) Termination: Solder Contact Finish Thickness: 30.0µin (0.76µm) Contact Material: Beryllium Copper Number of Positions/Bay/Row: 4; 5 Number of Rows: 2 |
товар відсутній |
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HSEC8-120-03-S-DV-A-WT-K-TR | Samtec Inc. |
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL Features: Board Guide, Pick and Place, Solder Retention Packaging: Tape & Reel (TR) Gender: Female Contact Finish: Gold Color: Black Mounting Type: Surface Mount Number of Positions: 40 Pitch: 0.031" (0.80mm) Operating Temperature: -55°C ~ 125°C Read Out: Dual Contact Type: Cantilever Card Type: PCI Express™ Card Thickness: 0.093" (2.36mm) Termination: Solder Contact Finish Thickness: 30.0µin (0.76µm) Contact Material: Beryllium Copper Number of Positions/Bay/Row: 20 Number of Rows: 2 |
товар відсутній |
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HSEC8-140-01-L-DV-A-GR-K-TR | Samtec Inc. |
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL Features: Board Guide, Pick and Place Packaging: Tape & Reel (TR) Gender: Female Contact Finish: Gold Color: Black Mounting Type: Surface Mount Number of Positions: 80 Pitch: 0.031" (0.80mm) Operating Temperature: -55°C ~ 125°C Read Out: Dual Contact Type: Cantilever Card Type: PCI Express™ Card Thickness: 0.062" (1.57mm) Termination: Solder Contact Finish Thickness: 10.0µin (0.25µm) Contact Material: Beryllium Copper Number of Positions/Bay/Row: 18; 22 Number of Rows: 2 |
товар відсутній |
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HSEC8-140-03-S-DV-A-TR | Samtec Inc. |
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL Features: Board Guide Packaging: Tape & Reel (TR) Gender: Female Contact Finish: Gold Color: Black Mounting Type: Surface Mount Number of Positions: 80 Pitch: 0.031" (0.80mm) Operating Temperature: -55°C ~ 125°C Read Out: Dual Contact Type: Cantilever Card Type: PCI Express™ Card Thickness: 0.093" (2.36mm) Termination: Solder Contact Finish Thickness: 30.0µin (0.76µm) Contact Material: Beryllium Copper Number of Positions/Bay/Row: 18; 22 Number of Rows: 2 |
товар відсутній |
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HSEC8-120-01-SM-DV-A-WT | Samtec Inc. |
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL Features: Board Guide, Solder Retention Packaging: Tray Gender: Female Contact Finish: Gold Color: Black Mounting Type: Surface Mount Number of Positions: 40 Pitch: 0.031" (0.80mm) Operating Temperature: -55°C ~ 125°C Read Out: Dual Contact Type: Cantilever Card Type: PCI Express™ Card Thickness: 0.062" (1.57mm) Termination: Solder Contact Finish Thickness: 30.0µin (0.76µm) Contact Material: Beryllium Copper Number of Positions/Bay/Row: 20 Number of Rows: 2 |
товар відсутній |
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HSEC8-113-01-H-DV-A-BL-TR | Samtec Inc. |
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL Features: Board Guide, Board Lock Packaging: Tape & Reel (TR) Gender: Female Contact Finish: Gold Color: Black Mounting Type: Surface Mount Number of Positions: 26 Pitch: 0.031" (0.80mm) Operating Temperature: -55°C ~ 125°C Read Out: Dual Contact Type: Cantilever Card Type: PCI Express™ Card Thickness: 0.062" (1.57mm) Termination: Solder Contact Finish Thickness: 30.0µin (0.76µm) Contact Material: Beryllium Copper Number of Positions/Bay/Row: 6; 7 Number of Rows: 2 |
товар відсутній |
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HSEC8-112-01-L-DP-A-WT-K | Samtec Inc. |
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL Features: Pick and Place, Solder Retention Packaging: Tape & Reel (TR) Gender: Female Contact Finish: Gold Color: Black Mounting Type: Surface Mount Number of Positions: 24 Pitch: 0.031" (0.80mm) Operating Temperature: -55°C ~ 125°C Read Out: Dual Contact Type: Cantilever Card Type: PCI Express™ Card Thickness: 0.062" (1.57mm) Termination: Solder Contact Finish Thickness: 10.0µin (0.25µm) Contact Material: Copper Alloy Number of Rows: 2 |
товар відсутній |
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HSEC8-109-01-L-RA-BL-TR | Samtec Inc. |
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL Features: Board Lock Packaging: Tape & Reel (TR) Gender: Female Contact Finish: Gold Color: Black Mounting Type: Surface Mount, Right Angle Number of Positions: 18 Pitch: 0.031" (0.80mm) Operating Temperature: -55°C ~ 125°C Read Out: Dual Contact Type: Cantilever Card Type: PCI Express™ Card Thickness: 0.062" (1.57mm) Termination: Solder Contact Finish Thickness: 10.0µin (0.25µm) Contact Material: Beryllium Copper Number of Positions/Bay/Row: 4; 5 Number of Rows: 2 |
товар відсутній |
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HSEC8-116-01-L-DP-A-WT-K | Samtec Inc. |
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL Features: Pick and Place, Solder Retention Packaging: Tape & Reel (TR) Gender: Female Contact Finish: Gold Color: Black Mounting Type: Surface Mount Number of Positions: 32 Pitch: 0.031" (0.80mm) Operating Temperature: -55°C ~ 125°C Read Out: Dual Contact Type: Cantilever Card Type: PCI Express™ Card Thickness: 0.062" (1.57mm) Termination: Solder Contact Finish Thickness: 10.0µin (0.25µm) Contact Material: Copper Alloy Number of Rows: 2 |
товар відсутній |
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HSEC8-160-01-L-DV-TR | Samtec Inc. |
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL Packaging: Tape & Reel (TR) Gender: Female Contact Finish: Gold Color: Black Mounting Type: Surface Mount Number of Positions: 120 Pitch: 0.031" (0.80mm) Operating Temperature: -55°C ~ 125°C Read Out: Dual Contact Type: Cantilever Card Type: PCI Express™ Card Thickness: 0.062" (1.57mm) Termination: Solder Contact Finish Thickness: 10.0µin (0.25µm) Contact Material: Beryllium Copper Number of Positions/Bay/Row: 28; 32 Number of Rows: 2 |
товар відсутній |
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HSEC8-130-03-H-DV-A | Samtec Inc. |
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL Features: Board Guide Packaging: Tray Gender: Female Contact Finish: Gold Color: Black Mounting Type: Surface Mount Number of Positions: 60 Pitch: 0.031" (0.80mm) Operating Temperature: -55°C ~ 125°C Read Out: Dual Contact Type: Cantilever Card Type: PCI Express™ Card Thickness: 0.093" (2.36mm) Termination: Solder Contact Finish Thickness: 30.0µin (0.76µm) Contact Material: Beryllium Copper Number of Positions/Bay/Row: 30 Number of Rows: 2 |
товар відсутній |
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HSEC8-130-01-SM-DV-A-BL-K-TR | Samtec Inc. |
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL Features: Board Guide, Board Lock, Pick and Place Packaging: Tape & Reel (TR) Gender: Female Contact Finish: Gold Color: Black Mounting Type: Surface Mount Number of Positions: 60 Pitch: 0.031" (0.80mm) Operating Temperature: -55°C ~ 125°C Read Out: Dual Contact Type: Cantilever Card Type: PCI Express™ Card Thickness: 0.062" (1.57mm) Termination: Solder Contact Finish Thickness: 30.0µin (0.76µm) Contact Material: Beryllium Copper Number of Positions/Bay/Row: 30 Number of Rows: 2 |
товар відсутній |
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HSEC8-170-01-S-DV-A-WT-TR | Samtec Inc. |
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL Features: Board Guide, Solder Retention Packaging: Tape & Reel (TR) Gender: Female Contact Finish: Gold Color: Black Mounting Type: Surface Mount Number of Positions: 140 Pitch: 0.031" (0.80mm) Operating Temperature: -55°C ~ 125°C Read Out: Dual Contact Type: Cantilever Card Type: PCI Express™ Card Thickness: 0.062" (1.57mm) Termination: Solder Contact Finish Thickness: 30.0µin (0.76µm) Contact Material: Beryllium Copper Number of Positions/Bay/Row: 30; 40 Number of Rows: 2 |
товар відсутній |
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HSEC8-109-01-S-RA-BL-TR | Samtec Inc. |
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL Features: Board Lock Packaging: Tape & Reel (TR) Gender: Female Contact Finish: Gold Color: Black Mounting Type: Surface Mount, Right Angle Number of Positions: 18 Pitch: 0.031" (0.80mm) Operating Temperature: -55°C ~ 125°C Read Out: Dual Contact Type: Cantilever Card Type: PCI Express™ Card Thickness: 0.062" (1.57mm) Termination: Solder Contact Finish Thickness: 30.0µin (0.76µm) Contact Material: Beryllium Copper Number of Positions/Bay/Row: 4; 5 Number of Rows: 2 |
товар відсутній |
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HSEC8-130-01-S-DV-A-GR-K-TR | Samtec Inc. |
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL Features: Board Guide, Pick and Place Packaging: Tape & Reel (TR) Gender: Female Contact Finish: Gold Color: Black Mounting Type: Surface Mount Number of Positions: 60 Pitch: 0.031" (0.80mm) Operating Temperature: -55°C ~ 125°C Read Out: Dual Contact Type: Cantilever Card Type: PCI Express™ Card Thickness: 0.062" (1.57mm) Termination: Solder Contact Finish Thickness: 30.0µin (0.76µm) Contact Material: Beryllium Copper Number of Positions/Bay/Row: 30 Number of Rows: 2 |
товар відсутній |
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DW-04-19-T-S-1045 | Samtec Inc. |
Description: CONN HDR 4POS 0.1 STACK T/H TIN Packaging: Bulk Color: Black Mounting Type: Through Hole Pitch: 0.100" (2.54mm) Termination: Solder Contact Finish - Post (Mating): Tin Number of Rows: 1 Number of Positions: 4 Length - Overall Pin: 1.330" (33.782mm) Length - Post (Mating): 0.175" (4.445mm) Length - Stack Height: 1.045" (26.543mm) Length - Tail: 0.110" (2.794mm) |
на замовлення 485 шт: термін постачання 21-31 дні (днів) |
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MTMM-105-02-S-D-150 | Samtec Inc. |
Description: CONN HEADER VERT 10POS 2MM Packaging: Bulk Connector Type: Header, Cuttable Current Rating (Amps): 3A Mounting Type: Through Hole Number of Positions: 10 Number of Rows: 2 Style: Board to Board or Cable Operating Temperature: -55°C ~ 125°C Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Phosphor Bronze Insulation Color: Black Pitch - Mating: 0.079" (2.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Tin Contact Shape: Square Contact Length - Post: 0.046" (1.17mm) Insulation Height: 0.059" (1.50mm) Shrouding: Unshrouded Overall Contact Length: 0.255" (6.48mm) Insulation Material: Liquid Crystal Polymer (LCP) Row Spacing - Mating: 0.079" (2.00mm) Contact Length - Mating: 0.150" (3.81mm) |
на замовлення 1366 шт: термін постачання 21-31 дні (днів) |
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MTMM-113-02-S-D-150 | Samtec Inc. |
Description: 2MM TERMINAL STRIP Packaging: Bulk |
на замовлення 433 шт: термін постачання 21-31 дні (днів) |
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TW-15-02-S-D-155-100 | Samtec Inc. |
Description: CONN BRD STACK 2.00 30POS Packaging: Bulk Color: Black Mounting Type: Through Hole Pitch: 0.079" (2.00mm) Row Spacing: 0.079" (2.00mm) Termination: Solder Contact Finish - Post (Mating): Gold Contact Finish Thickness - Post (Mating): 30.0µin (0.76µm) Number of Rows: 2 Number of Positions: 30 Length - Overall Pin: 0.377" (9.576mm) Length - Post (Mating): 0.122" (3.099mm) Length - Stack Height: 0.155" (3.937mm) Length - Tail: 0.100" (2.540mm) |
на замовлення 295 шт: термін постачання 21-31 дні (днів) |
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ESW-108-12-S-D-15 | Samtec Inc. |
Description: CONN SKT .100" 20POS Packaging: Bulk Connector Type: Elevated Socket Voltage Rating: 550VAC Current Rating (Amps): 5.2A per Contact Mounting Type: Through Hole Number of Positions: 16 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Forked Fastening Type: Push-Pull Number of Positions Loaded: 15 Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Tin Contact Length - Post: 0.090" (2.29mm) Insulation Height: 0.435" (11.05mm) Row Spacing - Mating: 0.100" (2.54mm) Number of Rows: 2 |
на замовлення 138 шт: термін постачання 21-31 дні (днів) |
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SMM-120-02-S-D-15-P | Samtec Inc. |
Description: CONN RCPT 40POS 0.079 GOLD SMD Features: Pick and Place Packaging: Tube Connector Type: Receptacle Voltage Rating: 350VAC Current Rating (Amps): 3.2A per Contact Mounting Type: Surface Mount Number of Positions: 40 Style: Board to Board or Cable Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: 39 Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.079" (2.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Tin Insulation Height: 0.140" (3.56mm) Row Spacing - Mating: 0.079" (2.00mm) Number of Rows: 2 |
на замовлення 242 шт: термін постачання 21-31 дні (днів) |
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MTMS-150-52-S-D-155 | Samtec Inc. |
Description: CONN HDR .050" 100POS Packaging: Tube Connector Type: Header Mounting Type: Through Hole Number of Positions: 100 Number of Rows: 2 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Contact Material: Phosphor Bronze Insulation Color: Black Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Tin Contact Shape: Square Contact Length - Post: 0.170" (4.32mm) Insulation Height: 0.100" (2.54mm) Shrouding: Unshrouded Overall Contact Length: 0.425" (10.80mm) Insulation Material: Liquid Crystal Polymer (LCP) Row Spacing - Mating: 0.100" (2.54mm) Contact Length - Mating: 0.155" (3.94mm) |
на замовлення 189 шт: термін постачання 21-31 дні (днів) |
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S2SD-15-24C-L-05.00-S | Samtec Inc. |
Description: 2.00 MM TIGER EYE DOUBLE ROW DIS Packaging: Bulk Connector Type: Socket to Individual Wire Leads Contact Finish: Gold Color: Multiple, Individual Shielding: Unshielded Number of Positions: 30 Number of Rows: 2 Contact Finish Thickness: 10.0µin (0.25µm) Cable Termination: Crimp Pitch - Connector: 0.079" (2.00mm) |
на замовлення 27 шт: термін постачання 21-31 дні (днів) |
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S2SD-15-24-L-12.00-SR | Samtec Inc. |
Description: 2.00 MM TIGER EYE DOUBLE ROW DIS Packaging: Bulk Connector Type: Socket to Individual Wire Leads Contact Finish: Gold Color: Black, Individual Shielding: Unshielded Number of Positions: 30 Number of Rows: 2 Contact Finish Thickness: 10.0µin (0.25µm) Cable Termination: Crimp Pitch - Connector: 0.079" (2.00mm) |
товар відсутній |
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S2SD-15-24-L-12.00-SR | Samtec Inc. |
Description: 2.00 MM TIGER EYE DOUBLE ROW DIS Packaging: Bulk Connector Type: Socket to Individual Wire Leads Contact Finish: Gold Color: Black, Individual Shielding: Unshielded Number of Positions: 30 Number of Rows: 2 Contact Finish Thickness: 10.0µin (0.25µm) Cable Termination: Crimp Pitch - Connector: 0.079" (2.00mm) |
на замовлення 27 шт: термін постачання 21-31 дні (днів) |
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S2SD-15-24-L-20.00-SR | Samtec Inc. |
Description: 2.00 MM TIGER EYE DOUBLE ROW DIS Packaging: Bulk Connector Type: Socket to Individual Wire Leads Contact Finish: Gold Color: Black, Individual Shielding: Unshielded Number of Positions: 30 Number of Rows: 2 Contact Finish Thickness: 10.0µin (0.25µm) Cable Termination: Crimp Pitch - Connector: 0.079" (2.00mm) |
товар відсутній |
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S2SD-15-24-L-20.00-SR | Samtec Inc. |
Description: 2.00 MM TIGER EYE DOUBLE ROW DIS Packaging: Bulk Connector Type: Socket to Individual Wire Leads Contact Finish: Gold Color: Black, Individual Shielding: Unshielded Number of Positions: 30 Number of Rows: 2 Contact Finish Thickness: 10.0µin (0.25µm) Cable Termination: Crimp Pitch - Connector: 0.079" (2.00mm) |
на замовлення 27 шт: термін постачання 21-31 дні (днів) |
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S2SD-15-24-L-06.00-DR-NDX | Samtec Inc. |
Description: 2.00 MM TIGER EYE DOUBLE ROW DIS Packaging: Bulk Connector Type: Socket to Socket Contact Finish: Gold Color: Black, Individual Shielding: Unshielded Number of Positions: 30 Number of Rows: 2 Contact Finish Thickness: 10.0µin (0.25µm) Cable Termination: Crimp Pitch - Connector: 0.079" (2.00mm) |
товар відсутній |
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S2SD-15-24-L-06.00-DR-NDX | Samtec Inc. |
Description: 2.00 MM TIGER EYE DOUBLE ROW DIS Packaging: Bulk Connector Type: Socket to Socket Contact Finish: Gold Color: Black, Individual Shielding: Unshielded Number of Positions: 30 Number of Rows: 2 Contact Finish Thickness: 10.0µin (0.25µm) Cable Termination: Crimp Pitch - Connector: 0.079" (2.00mm) |
на замовлення 27 шт: термін постачання 21-31 дні (днів) |
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S2SD-15-24C-L-20.00-SR | Samtec Inc. |
Description: 2.00 MM TIGER EYE DOUBLE ROW DIS Packaging: Bulk Connector Type: Socket to Individual Wire Leads Contact Finish: Gold Color: Multiple, Individual Shielding: Unshielded Number of Positions: 30 Number of Rows: 2 Contact Finish Thickness: 10.0µin (0.25µm) Cable Termination: Crimp Pitch - Connector: 0.079" (2.00mm) |
товар відсутній |
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S2SD-15-24C-L-20.00-SR | Samtec Inc. |
Description: 2.00 MM TIGER EYE DOUBLE ROW DIS Packaging: Bulk Connector Type: Socket to Individual Wire Leads Contact Finish: Gold Color: Multiple, Individual Shielding: Unshielded Number of Positions: 30 Number of Rows: 2 Contact Finish Thickness: 10.0µin (0.25µm) Cable Termination: Crimp Pitch - Connector: 0.079" (2.00mm) |
на замовлення 27 шт: термін постачання 21-31 дні (днів) |
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ERM8-050-01-S-D-EM2-L-TR | Samtec Inc. |
Description: CONN HDR 100POS EDGE MNT GOLD Features: Latches Packaging: Tape & Reel (TR) Connector Type: Header, Center Strip Contacts Contact Finish: Gold Mounting Type: Board Edge, Straddle Mount Number of Positions: 100 Pitch: 0.031" (0.80mm) Contact Finish Thickness: 30.0µin (0.76µm) Number of Rows: 2 |
на замовлення 125 шт: термін постачання 21-31 дні (днів) |
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ERM8-050-01-S-D-EM2-L-TR | Samtec Inc. |
Description: CONN HDR 100POS EDGE MNT GOLD Features: Latches Packaging: Cut Tape (CT) Connector Type: Header, Center Strip Contacts Contact Finish: Gold Mounting Type: Board Edge, Straddle Mount Number of Positions: 100 Pitch: 0.031" (0.80mm) Contact Finish Thickness: 30.0µin (0.76µm) Number of Rows: 2 |
на замовлення 195 шт: термін постачання 21-31 дні (днів) |
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ZW-10-09-G-D-446-158 |
Виробник: Samtec Inc.
Description: CONN BRD STACK .100" 20POS
Packaging: Bulk
Color: Black
Mounting Type: Through Hole
Pitch: 0.100" (2.54mm)
Row Spacing: 0.100" (2.54mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm)
Number of Rows: 2
Number of Positions: 20
Length - Overall Pin: 0.730" (18.542mm)
Length - Post (Mating): 0.126" (3.200mm)
Length - Stack Height: 0.446" (11.328mm)
Length - Tail: 0.158" (4.013mm)
Description: CONN BRD STACK .100" 20POS
Packaging: Bulk
Color: Black
Mounting Type: Through Hole
Pitch: 0.100" (2.54mm)
Row Spacing: 0.100" (2.54mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm)
Number of Rows: 2
Number of Positions: 20
Length - Overall Pin: 0.730" (18.542mm)
Length - Post (Mating): 0.126" (3.200mm)
Length - Stack Height: 0.446" (11.328mm)
Length - Tail: 0.158" (4.013mm)
на замовлення 1225 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 449.45 грн |
50+ | 352.63 грн |
100+ | 299.31 грн |
500+ | 250.18 грн |
1000+ | 194.46 грн |
ZW-14-09-G-D-446-158 |
Виробник: Samtec Inc.
Description: CONN BRD STACK .100" 28POS
Packaging: Bulk
Color: Black
Mounting Type: Through Hole
Pitch: 0.100" (2.54mm)
Row Spacing: 0.100" (2.54mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm)
Number of Rows: 2
Number of Positions: 28
Length - Overall Pin: 0.730" (18.542mm)
Length - Post (Mating): 0.126" (3.200mm)
Length - Stack Height: 0.446" (11.328mm)
Length - Tail: 0.158" (4.013mm)
Description: CONN BRD STACK .100" 28POS
Packaging: Bulk
Color: Black
Mounting Type: Through Hole
Pitch: 0.100" (2.54mm)
Row Spacing: 0.100" (2.54mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm)
Number of Rows: 2
Number of Positions: 28
Length - Overall Pin: 0.730" (18.542mm)
Length - Post (Mating): 0.126" (3.200mm)
Length - Stack Height: 0.446" (11.328mm)
Length - Tail: 0.158" (4.013mm)
на замовлення 442 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
2+ | 266.25 грн |
ZW-14-09-G-D-446-158 |
Виробник: Samtec Inc.
Description: CONN BRD STACK .100" 28POS
Packaging: Bulk
Color: Black
Mounting Type: Through Hole
Pitch: 0.100" (2.54mm)
Row Spacing: 0.100" (2.54mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm)
Number of Rows: 2
Number of Positions: 28
Length - Overall Pin: 0.730" (18.542mm)
Length - Post (Mating): 0.126" (3.200mm)
Length - Stack Height: 0.446" (11.328mm)
Length - Tail: 0.158" (4.013mm)
Description: CONN BRD STACK .100" 28POS
Packaging: Bulk
Color: Black
Mounting Type: Through Hole
Pitch: 0.100" (2.54mm)
Row Spacing: 0.100" (2.54mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm)
Number of Rows: 2
Number of Positions: 28
Length - Overall Pin: 0.730" (18.542mm)
Length - Post (Mating): 0.126" (3.200mm)
Length - Stack Height: 0.446" (11.328mm)
Length - Tail: 0.158" (4.013mm)
на замовлення 734 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 484.38 грн |
25+ | 421.68 грн |
50+ | 391.41 грн |
100+ | 350.26 грн |
500+ | 272.93 грн |
HW-05-15-G-D-446-SM-A |
Виробник: Samtec Inc.
Description: CONN HDR 10POS 0.1 STACK SMD
Packaging: Bulk
Color: Black
Mounting Type: Surface Mount
Pitch: 0.100" (2.54mm)
Row Spacing: 0.100" (2.54mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm)
Number of Rows: 2
Number of Positions: 10
Length - Overall Pin: 0.565" (14.351mm)
Length - Post (Mating): 0.119" (3.023mm)
Length - Stack Height: 0.446" (11.328mm)
Description: CONN HDR 10POS 0.1 STACK SMD
Packaging: Bulk
Color: Black
Mounting Type: Surface Mount
Pitch: 0.100" (2.54mm)
Row Spacing: 0.100" (2.54mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm)
Number of Rows: 2
Number of Positions: 10
Length - Overall Pin: 0.565" (14.351mm)
Length - Post (Mating): 0.119" (3.023mm)
Length - Stack Height: 0.446" (11.328mm)
на замовлення 274 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 348.54 грн |
50+ | 273.85 грн |
100+ | 232.66 грн |
HW-05-15-G-D-446-SM-A |
Виробник: Samtec Inc.
Description: CONN HDR 10POS 0.1 STACK SMD
Packaging: Tube
Color: Black
Mounting Type: Surface Mount
Pitch: 0.100" (2.54mm)
Row Spacing: 0.100" (2.54mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm)
Number of Rows: 2
Number of Positions: 10
Length - Overall Pin: 0.565" (14.351mm)
Length - Post (Mating): 0.119" (3.023mm)
Length - Stack Height: 0.446" (11.328mm)
Description: CONN HDR 10POS 0.1 STACK SMD
Packaging: Tube
Color: Black
Mounting Type: Surface Mount
Pitch: 0.100" (2.54mm)
Row Spacing: 0.100" (2.54mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm)
Number of Rows: 2
Number of Positions: 10
Length - Overall Pin: 0.565" (14.351mm)
Length - Post (Mating): 0.119" (3.023mm)
Length - Stack Height: 0.446" (11.328mm)
на замовлення 165 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
43+ | 191.72 грн |
ZW-15-10-S-D-446-150 |
Виробник: Samtec Inc.
Description: CONN BRD STACK .100" 30POS
Packaging: Bulk
Color: Black
Mounting Type: Through Hole
Pitch: 0.100" (2.54mm)
Row Spacing: 0.100" (2.54mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 30.0µin (0.76µm)
Number of Rows: 2
Number of Positions: 30
Length - Overall Pin: 0.830" (21.082mm)
Length - Post (Mating): 0.234" (5.944mm)
Length - Stack Height: 0.446" (11.328mm)
Length - Tail: 0.150" (3.810mm)
Description: CONN BRD STACK .100" 30POS
Packaging: Bulk
Color: Black
Mounting Type: Through Hole
Pitch: 0.100" (2.54mm)
Row Spacing: 0.100" (2.54mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 30.0µin (0.76µm)
Number of Rows: 2
Number of Positions: 30
Length - Overall Pin: 0.830" (21.082mm)
Length - Post (Mating): 0.234" (5.944mm)
Length - Stack Height: 0.446" (11.328mm)
Length - Tail: 0.150" (3.810mm)
на замовлення 442 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 399.77 грн |
ZW-15-10-S-D-446-150 |
Виробник: Samtec Inc.
Description: CONN BRD STACK .100" 30POS
Packaging: Bulk
Color: Black
Mounting Type: Through Hole
Pitch: 0.100" (2.54mm)
Row Spacing: 0.100" (2.54mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 30.0µin (0.76µm)
Number of Rows: 2
Number of Positions: 30
Length - Overall Pin: 0.830" (21.082mm)
Length - Post (Mating): 0.234" (5.944mm)
Length - Stack Height: 0.446" (11.328mm)
Length - Tail: 0.150" (3.810mm)
Description: CONN BRD STACK .100" 30POS
Packaging: Bulk
Color: Black
Mounting Type: Through Hole
Pitch: 0.100" (2.54mm)
Row Spacing: 0.100" (2.54mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 30.0µin (0.76µm)
Number of Rows: 2
Number of Positions: 30
Length - Overall Pin: 0.830" (21.082mm)
Length - Post (Mating): 0.234" (5.944mm)
Length - Stack Height: 0.446" (11.328mm)
Length - Tail: 0.150" (3.810mm)
на замовлення 734 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 727.35 грн |
25+ | 633.76 грн |
50+ | 588.93 грн |
100+ | 526.52 грн |
500+ | 410.53 грн |
TW-25-06-S-D-446-090 |
Виробник: Samtec Inc.
Description: CONN BRD STACK 2.00 50POS
Packaging: Bulk
Color: Black
Mounting Type: Through Hole
Pitch: 0.079" (2.00mm)
Row Spacing: 0.079" (2.00mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 30.0µin (0.76µm)
Number of Rows: 2
Number of Positions: 50
Length - Overall Pin: 0.673" (17.094mm)
Length - Post (Mating): 0.137" (3.480mm)
Length - Stack Height: 0.446" (11.328mm)
Length - Tail: 0.090" (2.286mm)
Description: CONN BRD STACK 2.00 50POS
Packaging: Bulk
Color: Black
Mounting Type: Through Hole
Pitch: 0.079" (2.00mm)
Row Spacing: 0.079" (2.00mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 30.0µin (0.76µm)
Number of Rows: 2
Number of Positions: 50
Length - Overall Pin: 0.673" (17.094mm)
Length - Post (Mating): 0.137" (3.480mm)
Length - Stack Height: 0.446" (11.328mm)
Length - Tail: 0.090" (2.286mm)
на замовлення 182 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 877.94 грн |
TW-25-06-S-D-446-090 |
Виробник: Samtec Inc.
Description: CONN BRD STACK 2.00 50POS
Packaging: Bulk
Color: Black
Mounting Type: Through Hole
Pitch: 0.079" (2.00mm)
Row Spacing: 0.079" (2.00mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 30.0µin (0.76µm)
Number of Rows: 2
Number of Positions: 50
Length - Overall Pin: 0.673" (17.094mm)
Length - Post (Mating): 0.137" (3.480mm)
Length - Stack Height: 0.446" (11.328mm)
Length - Tail: 0.090" (2.286mm)
Description: CONN BRD STACK 2.00 50POS
Packaging: Bulk
Color: Black
Mounting Type: Through Hole
Pitch: 0.079" (2.00mm)
Row Spacing: 0.079" (2.00mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 30.0µin (0.76µm)
Number of Rows: 2
Number of Positions: 50
Length - Overall Pin: 0.673" (17.094mm)
Length - Post (Mating): 0.137" (3.480mm)
Length - Stack Height: 0.446" (11.328mm)
Length - Tail: 0.090" (2.286mm)
на замовлення 302 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 1595.19 грн |
10+ | 1455.31 грн |
25+ | 1400.79 грн |
50+ | 1282.75 грн |
100+ | 956.38 грн |
HW-07-15-G-D-446-SM-A |
Виробник: Samtec Inc.
Description: CONN HDR 14POS 0.1 STACK SMD
Packaging: Tube
Color: Black
Mounting Type: Surface Mount
Pitch: 0.100" (2.54mm)
Row Spacing: 0.100" (2.54mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm)
Number of Rows: 2
Number of Positions: 14
Length - Overall Pin: 0.565" (14.351mm)
Length - Post (Mating): 0.119" (3.023mm)
Length - Stack Height: 0.446" (11.328mm)
Description: CONN HDR 14POS 0.1 STACK SMD
Packaging: Tube
Color: Black
Mounting Type: Surface Mount
Pitch: 0.100" (2.54mm)
Row Spacing: 0.100" (2.54mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm)
Number of Rows: 2
Number of Positions: 14
Length - Overall Pin: 0.565" (14.351mm)
Length - Post (Mating): 0.119" (3.023mm)
Length - Stack Height: 0.446" (11.328mm)
на замовлення 135 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
32+ | 253.3 грн |
HW-07-15-G-D-446-SM-A |
Виробник: Samtec Inc.
Description: CONN HDR 14POS 0.1 STACK SMD
Packaging: Tube
Color: Black
Mounting Type: Surface Mount
Pitch: 0.100" (2.54mm)
Row Spacing: 0.100" (2.54mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm)
Number of Rows: 2
Number of Positions: 14
Length - Overall Pin: 0.565" (14.351mm)
Length - Post (Mating): 0.119" (3.023mm)
Length - Stack Height: 0.446" (11.328mm)
Description: CONN HDR 14POS 0.1 STACK SMD
Packaging: Tube
Color: Black
Mounting Type: Surface Mount
Pitch: 0.100" (2.54mm)
Row Spacing: 0.100" (2.54mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm)
Number of Rows: 2
Number of Positions: 14
Length - Overall Pin: 0.565" (14.351mm)
Length - Post (Mating): 0.119" (3.023mm)
Length - Stack Height: 0.446" (11.328mm)
на замовлення 224 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 460.32 грн |
50+ | 362.31 грн |
100+ | 307.79 грн |
HW-13-09-G-D-446-SM |
Виробник: Samtec Inc.
Description: CONN HDR 26POS 0.1 STACK SMD
Packaging: Bulk
Color: Black
Mounting Type: Surface Mount
Pitch: 0.100" (2.54mm)
Row Spacing: 0.100" (2.54mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm)
Number of Rows: 2
Number of Positions: 26
Length - Overall Pin: 0.665" (16.891mm)
Length - Post (Mating): 0.219" (5.563mm)
Length - Stack Height: 0.446" (11.328mm)
Description: CONN HDR 26POS 0.1 STACK SMD
Packaging: Bulk
Color: Black
Mounting Type: Surface Mount
Pitch: 0.100" (2.54mm)
Row Spacing: 0.100" (2.54mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm)
Number of Rows: 2
Number of Positions: 26
Length - Overall Pin: 0.665" (16.891mm)
Length - Post (Mating): 0.219" (5.563mm)
Length - Stack Height: 0.446" (11.328mm)
на замовлення 166 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 586.07 грн |
25+ | 510.15 грн |
50+ | 475.01 грн |
100+ | 424.18 грн |
MTMM-128-11-G-D-446 |
на замовлення 90 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 752.96 грн |
MTMM-128-11-G-D-446 |
на замовлення 149 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 1369.3 грн |
10+ | 1219.02 грн |
25+ | 1152.38 грн |
50+ | 1041.67 грн |
100+ | 768.75 грн |
HW-36-09-G-D-446-SM |
Виробник: Samtec Inc.
Description: CONN HDR 72POS 0.1 STACK SMD
Packaging: Bulk
Color: Black
Mounting Type: Surface Mount
Pitch: 0.100" (2.54mm)
Row Spacing: 0.100" (2.54mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm)
Number of Rows: 2
Number of Positions: 72
Length - Overall Pin: 0.665" (16.891mm)
Length - Post (Mating): 0.219" (5.563mm)
Length - Stack Height: 0.446" (11.328mm)
Description: CONN HDR 72POS 0.1 STACK SMD
Packaging: Bulk
Color: Black
Mounting Type: Surface Mount
Pitch: 0.100" (2.54mm)
Row Spacing: 0.100" (2.54mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm)
Number of Rows: 2
Number of Positions: 72
Length - Overall Pin: 0.665" (16.891mm)
Length - Post (Mating): 0.219" (5.563mm)
Length - Stack Height: 0.446" (11.328mm)
на замовлення 73 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 1542.41 грн |
10+ | 1372.93 грн |
25+ | 1297.81 грн |
50+ | 1174.72 грн |
HW-36-09-G-D-446-SM |
Виробник: Samtec Inc.
Description: CONN HDR 72POS 0.1 STACK SMD
Packaging: Tube
Color: Black
Mounting Type: Surface Mount
Pitch: 0.100" (2.54mm)
Row Spacing: 0.100" (2.54mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm)
Number of Rows: 2
Number of Positions: 72
Length - Overall Pin: 0.665" (16.891mm)
Length - Post (Mating): 0.219" (5.563mm)
Length - Stack Height: 0.446" (11.328mm)
Description: CONN HDR 72POS 0.1 STACK SMD
Packaging: Tube
Color: Black
Mounting Type: Surface Mount
Pitch: 0.100" (2.54mm)
Row Spacing: 0.100" (2.54mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm)
Number of Rows: 2
Number of Positions: 72
Length - Overall Pin: 0.665" (16.891mm)
Length - Post (Mating): 0.219" (5.563mm)
Length - Stack Height: 0.446" (11.328mm)
на замовлення 44 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
6+ | 848.57 грн |
HSEC8-110-01-S-DV-A-WT-TR |
Виробник: Samtec Inc.
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide, Solder Retention
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 20
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 10
Number of Rows: 2
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide, Solder Retention
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 20
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 10
Number of Rows: 2
товар відсутній
HSEC8-113-01-SM-DV-A-L2-K-TR |
Виробник: Samtec Inc.
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide, Pick and Place
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 26
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 13
Number of Rows: 2
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide, Pick and Place
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 26
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 13
Number of Rows: 2
товар відсутній
HSEC8-110-03-S-DV-A-WT-TR |
Виробник: Samtec Inc.
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide, Solder Retention
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 20
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.093" (2.36mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 10
Number of Rows: 2
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide, Solder Retention
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 20
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.093" (2.36mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 10
Number of Rows: 2
товар відсутній
HSEC8-109-01-S-DV-A-L2-K |
Виробник: Samtec Inc.
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Latches
Packaging: Bulk
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 18
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 9
Number of Rows: 2
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Latches
Packaging: Bulk
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 18
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 9
Number of Rows: 2
товар відсутній
HSEC8-110-01-SM-DV-K-TR |
Виробник: Samtec Inc.
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Pick and Place
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 20
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 10
Number of Rows: 2
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Pick and Place
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 20
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 10
Number of Rows: 2
товар відсутній
HSEC8-170-03-L-DV-A-TR |
Виробник: Samtec Inc.
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 140
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.093" (2.36mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 30; 40
Number of Rows: 2
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 140
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.093" (2.36mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 30; 40
Number of Rows: 2
товар відсутній
HSEC8-130-03-L-DV-A-WT-K-TR |
Виробник: Samtec Inc.
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide, Pick and Place, Solder Retention
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 60
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.093" (2.36mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 30
Number of Rows: 2
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide, Pick and Place, Solder Retention
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 60
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.093" (2.36mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 30
Number of Rows: 2
товар відсутній
HSEC8-110-01-S-DV-A-GR-K-TR |
Виробник: Samtec Inc.
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide, Pick and Place
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 20
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 10
Number of Rows: 2
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide, Pick and Place
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 20
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 10
Number of Rows: 2
товар відсутній
HSEC8-120-01-2-DP-A-K |
Виробник: Samtec Inc.
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide, Pick and Place
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 40
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 20.0µin (0.51µm)
Contact Material: Copper Alloy
Number of Rows: 2
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide, Pick and Place
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 40
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 20.0µin (0.51µm)
Contact Material: Copper Alloy
Number of Rows: 2
товар відсутній
HSEC8-110-01-H-DV-A-WT-K-TR |
Виробник: Samtec Inc.
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide, Pick and Place, Solder Retention
Packaging: Bulk
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 20
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 10
Number of Rows: 2
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide, Pick and Place, Solder Retention
Packaging: Bulk
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 20
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 10
Number of Rows: 2
товар відсутній
HSEC8-137-01-L-DV-K-TR |
Виробник: Samtec Inc.
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Pick and Place
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 74
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 15; 20
Number of Rows: 2
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Pick and Place
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 74
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 15; 20
Number of Rows: 2
товар відсутній
HSEC8-109-01-S-DV-A-BL-TR |
Виробник: Samtec Inc.
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide, Board Lock
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 18
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 4; 5
Number of Rows: 2
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide, Board Lock
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 18
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 4; 5
Number of Rows: 2
товар відсутній
HSEC8-120-03-S-DV-A-WT-K-TR |
Виробник: Samtec Inc.
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide, Pick and Place, Solder Retention
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 40
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.093" (2.36mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 20
Number of Rows: 2
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide, Pick and Place, Solder Retention
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 40
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.093" (2.36mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 20
Number of Rows: 2
товар відсутній
HSEC8-140-01-L-DV-A-GR-K-TR |
Виробник: Samtec Inc.
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide, Pick and Place
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 80
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 18; 22
Number of Rows: 2
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide, Pick and Place
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 80
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 18; 22
Number of Rows: 2
товар відсутній
HSEC8-140-03-S-DV-A-TR |
Виробник: Samtec Inc.
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 80
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.093" (2.36mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 18; 22
Number of Rows: 2
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 80
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.093" (2.36mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 18; 22
Number of Rows: 2
товар відсутній
HSEC8-120-01-SM-DV-A-WT |
Виробник: Samtec Inc.
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide, Solder Retention
Packaging: Tray
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 40
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 20
Number of Rows: 2
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide, Solder Retention
Packaging: Tray
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 40
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 20
Number of Rows: 2
товар відсутній
HSEC8-113-01-H-DV-A-BL-TR |
Виробник: Samtec Inc.
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide, Board Lock
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 26
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 6; 7
Number of Rows: 2
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide, Board Lock
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 26
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 6; 7
Number of Rows: 2
товар відсутній
HSEC8-112-01-L-DP-A-WT-K |
Виробник: Samtec Inc.
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Pick and Place, Solder Retention
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 24
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Contact Material: Copper Alloy
Number of Rows: 2
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Pick and Place, Solder Retention
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 24
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Contact Material: Copper Alloy
Number of Rows: 2
товар відсутній
HSEC8-109-01-L-RA-BL-TR |
Виробник: Samtec Inc.
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Lock
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount, Right Angle
Number of Positions: 18
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 4; 5
Number of Rows: 2
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Lock
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount, Right Angle
Number of Positions: 18
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 4; 5
Number of Rows: 2
товар відсутній
HSEC8-116-01-L-DP-A-WT-K |
Виробник: Samtec Inc.
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Pick and Place, Solder Retention
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 32
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Contact Material: Copper Alloy
Number of Rows: 2
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Pick and Place, Solder Retention
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 32
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Contact Material: Copper Alloy
Number of Rows: 2
товар відсутній
HSEC8-160-01-L-DV-TR |
Виробник: Samtec Inc.
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 120
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 28; 32
Number of Rows: 2
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 120
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 28; 32
Number of Rows: 2
товар відсутній
HSEC8-130-03-H-DV-A |
Виробник: Samtec Inc.
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide
Packaging: Tray
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 60
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.093" (2.36mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 30
Number of Rows: 2
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide
Packaging: Tray
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 60
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.093" (2.36mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 30
Number of Rows: 2
товар відсутній
HSEC8-130-01-SM-DV-A-BL-K-TR |
Виробник: Samtec Inc.
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide, Board Lock, Pick and Place
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 60
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 30
Number of Rows: 2
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide, Board Lock, Pick and Place
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 60
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 30
Number of Rows: 2
товар відсутній
HSEC8-170-01-S-DV-A-WT-TR |
Виробник: Samtec Inc.
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide, Solder Retention
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 140
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 30; 40
Number of Rows: 2
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide, Solder Retention
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 140
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 30; 40
Number of Rows: 2
товар відсутній
HSEC8-109-01-S-RA-BL-TR |
Виробник: Samtec Inc.
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Lock
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount, Right Angle
Number of Positions: 18
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 4; 5
Number of Rows: 2
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Lock
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount, Right Angle
Number of Positions: 18
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 4; 5
Number of Rows: 2
товар відсутній
HSEC8-130-01-S-DV-A-GR-K-TR |
Виробник: Samtec Inc.
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide, Pick and Place
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 60
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 30
Number of Rows: 2
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide, Pick and Place
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 60
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 30
Number of Rows: 2
товар відсутній
DW-04-19-T-S-1045 |
Виробник: Samtec Inc.
Description: CONN HDR 4POS 0.1 STACK T/H TIN
Packaging: Bulk
Color: Black
Mounting Type: Through Hole
Pitch: 0.100" (2.54mm)
Termination: Solder
Contact Finish - Post (Mating): Tin
Number of Rows: 1
Number of Positions: 4
Length - Overall Pin: 1.330" (33.782mm)
Length - Post (Mating): 0.175" (4.445mm)
Length - Stack Height: 1.045" (26.543mm)
Length - Tail: 0.110" (2.794mm)
Description: CONN HDR 4POS 0.1 STACK T/H TIN
Packaging: Bulk
Color: Black
Mounting Type: Through Hole
Pitch: 0.100" (2.54mm)
Termination: Solder
Contact Finish - Post (Mating): Tin
Number of Rows: 1
Number of Positions: 4
Length - Overall Pin: 1.330" (33.782mm)
Length - Post (Mating): 0.175" (4.445mm)
Length - Stack Height: 1.045" (26.543mm)
Length - Tail: 0.110" (2.794mm)
на замовлення 485 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
5+ | 73.74 грн |
50+ | 55.75 грн |
100+ | 44.84 грн |
MTMM-105-02-S-D-150 |
Виробник: Samtec Inc.
Description: CONN HEADER VERT 10POS 2MM
Packaging: Bulk
Connector Type: Header, Cuttable
Current Rating (Amps): 3A
Mounting Type: Through Hole
Number of Positions: 10
Number of Rows: 2
Style: Board to Board or Cable
Operating Temperature: -55°C ~ 125°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Black
Pitch - Mating: 0.079" (2.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin
Contact Shape: Square
Contact Length - Post: 0.046" (1.17mm)
Insulation Height: 0.059" (1.50mm)
Shrouding: Unshrouded
Overall Contact Length: 0.255" (6.48mm)
Insulation Material: Liquid Crystal Polymer (LCP)
Row Spacing - Mating: 0.079" (2.00mm)
Contact Length - Mating: 0.150" (3.81mm)
Description: CONN HEADER VERT 10POS 2MM
Packaging: Bulk
Connector Type: Header, Cuttable
Current Rating (Amps): 3A
Mounting Type: Through Hole
Number of Positions: 10
Number of Rows: 2
Style: Board to Board or Cable
Operating Temperature: -55°C ~ 125°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Black
Pitch - Mating: 0.079" (2.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin
Contact Shape: Square
Contact Length - Post: 0.046" (1.17mm)
Insulation Height: 0.059" (1.50mm)
Shrouding: Unshrouded
Overall Contact Length: 0.255" (6.48mm)
Insulation Material: Liquid Crystal Polymer (LCP)
Row Spacing - Mating: 0.079" (2.00mm)
Contact Length - Mating: 0.150" (3.81mm)
на замовлення 1366 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 374.93 грн |
50+ | 294.46 грн |
100+ | 249.63 грн |
500+ | 208.11 грн |
1000+ | 153.52 грн |
MTMM-113-02-S-D-150 |
на замовлення 433 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 749.86 грн |
25+ | 653.14 грн |
50+ | 607.09 грн |
100+ | 542.44 грн |
TW-15-02-S-D-155-100 |
Виробник: Samtec Inc.
Description: CONN BRD STACK 2.00 30POS
Packaging: Bulk
Color: Black
Mounting Type: Through Hole
Pitch: 0.079" (2.00mm)
Row Spacing: 0.079" (2.00mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 30.0µin (0.76µm)
Number of Rows: 2
Number of Positions: 30
Length - Overall Pin: 0.377" (9.576mm)
Length - Post (Mating): 0.122" (3.099mm)
Length - Stack Height: 0.155" (3.937mm)
Length - Tail: 0.100" (2.540mm)
Description: CONN BRD STACK 2.00 30POS
Packaging: Bulk
Color: Black
Mounting Type: Through Hole
Pitch: 0.079" (2.00mm)
Row Spacing: 0.079" (2.00mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 30.0µin (0.76µm)
Number of Rows: 2
Number of Positions: 30
Length - Overall Pin: 0.377" (9.576mm)
Length - Post (Mating): 0.122" (3.099mm)
Length - Stack Height: 0.155" (3.937mm)
Length - Tail: 0.100" (2.540mm)
на замовлення 295 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 875.61 грн |
10+ | 779.19 грн |
25+ | 736.74 грн |
50+ | 666.4 грн |
100+ | 496.96 грн |
ESW-108-12-S-D-15 |
Виробник: Samtec Inc.
Description: CONN SKT .100" 20POS
Packaging: Bulk
Connector Type: Elevated Socket
Voltage Rating: 550VAC
Current Rating (Amps): 5.2A per Contact
Mounting Type: Through Hole
Number of Positions: 16
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Forked
Fastening Type: Push-Pull
Number of Positions Loaded: 15
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin
Contact Length - Post: 0.090" (2.29mm)
Insulation Height: 0.435" (11.05mm)
Row Spacing - Mating: 0.100" (2.54mm)
Number of Rows: 2
Description: CONN SKT .100" 20POS
Packaging: Bulk
Connector Type: Elevated Socket
Voltage Rating: 550VAC
Current Rating (Amps): 5.2A per Contact
Mounting Type: Through Hole
Number of Positions: 16
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Forked
Fastening Type: Push-Pull
Number of Positions Loaded: 15
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin
Contact Length - Post: 0.090" (2.29mm)
Insulation Height: 0.435" (11.05mm)
Row Spacing - Mating: 0.100" (2.54mm)
Number of Rows: 2
на замовлення 138 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 451.78 грн |
25+ | 392.62 грн |
50+ | 364.75 грн |
100+ | 326.37 грн |
SMM-120-02-S-D-15-P |
Виробник: Samtec Inc.
Description: CONN RCPT 40POS 0.079 GOLD SMD
Features: Pick and Place
Packaging: Tube
Connector Type: Receptacle
Voltage Rating: 350VAC
Current Rating (Amps): 3.2A per Contact
Mounting Type: Surface Mount
Number of Positions: 40
Style: Board to Board or Cable
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: 39
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.079" (2.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin
Insulation Height: 0.140" (3.56mm)
Row Spacing - Mating: 0.079" (2.00mm)
Number of Rows: 2
Description: CONN RCPT 40POS 0.079 GOLD SMD
Features: Pick and Place
Packaging: Tube
Connector Type: Receptacle
Voltage Rating: 350VAC
Current Rating (Amps): 3.2A per Contact
Mounting Type: Surface Mount
Number of Positions: 40
Style: Board to Board or Cable
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: 39
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.079" (2.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin
Insulation Height: 0.140" (3.56mm)
Row Spacing - Mating: 0.079" (2.00mm)
Number of Rows: 2
на замовлення 242 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 1442.27 грн |
10+ | 1283.31 грн |
25+ | 1212.98 грн |
50+ | 1097.38 грн |
100+ | 854.03 грн |
MTMS-150-52-S-D-155 |
Виробник: Samtec Inc.
Description: CONN HDR .050" 100POS
Packaging: Tube
Connector Type: Header
Mounting Type: Through Hole
Number of Positions: 100
Number of Rows: 2
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Contact Material: Phosphor Bronze
Insulation Color: Black
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin
Contact Shape: Square
Contact Length - Post: 0.170" (4.32mm)
Insulation Height: 0.100" (2.54mm)
Shrouding: Unshrouded
Overall Contact Length: 0.425" (10.80mm)
Insulation Material: Liquid Crystal Polymer (LCP)
Row Spacing - Mating: 0.100" (2.54mm)
Contact Length - Mating: 0.155" (3.94mm)
Description: CONN HDR .050" 100POS
Packaging: Tube
Connector Type: Header
Mounting Type: Through Hole
Number of Positions: 100
Number of Rows: 2
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Contact Material: Phosphor Bronze
Insulation Color: Black
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin
Contact Shape: Square
Contact Length - Post: 0.170" (4.32mm)
Insulation Height: 0.100" (2.54mm)
Shrouding: Unshrouded
Overall Contact Length: 0.425" (10.80mm)
Insulation Material: Liquid Crystal Polymer (LCP)
Row Spacing - Mating: 0.100" (2.54mm)
Contact Length - Mating: 0.155" (3.94mm)
на замовлення 189 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 1497.39 грн |
10+ | 1332.94 грн |
25+ | 1260.26 грн |
50+ | 1139.47 грн |
100+ | 897.25 грн |
S2SD-15-24C-L-05.00-S |
Виробник: Samtec Inc.
Description: 2.00 MM TIGER EYE DOUBLE ROW DIS
Packaging: Bulk
Connector Type: Socket to Individual Wire Leads
Contact Finish: Gold
Color: Multiple, Individual
Shielding: Unshielded
Number of Positions: 30
Number of Rows: 2
Contact Finish Thickness: 10.0µin (0.25µm)
Cable Termination: Crimp
Pitch - Connector: 0.079" (2.00mm)
Description: 2.00 MM TIGER EYE DOUBLE ROW DIS
Packaging: Bulk
Connector Type: Socket to Individual Wire Leads
Contact Finish: Gold
Color: Multiple, Individual
Shielding: Unshielded
Number of Positions: 30
Number of Rows: 2
Contact Finish Thickness: 10.0µin (0.25µm)
Cable Termination: Crimp
Pitch - Connector: 0.079" (2.00mm)
на замовлення 27 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 1775.28 грн |
10+ | 1618.94 грн |
25+ | 1558.33 грн |
S2SD-15-24-L-12.00-SR |
Виробник: Samtec Inc.
Description: 2.00 MM TIGER EYE DOUBLE ROW DIS
Packaging: Bulk
Connector Type: Socket to Individual Wire Leads
Contact Finish: Gold
Color: Black, Individual
Shielding: Unshielded
Number of Positions: 30
Number of Rows: 2
Contact Finish Thickness: 10.0µin (0.25µm)
Cable Termination: Crimp
Pitch - Connector: 0.079" (2.00mm)
Description: 2.00 MM TIGER EYE DOUBLE ROW DIS
Packaging: Bulk
Connector Type: Socket to Individual Wire Leads
Contact Finish: Gold
Color: Black, Individual
Shielding: Unshielded
Number of Positions: 30
Number of Rows: 2
Contact Finish Thickness: 10.0µin (0.25µm)
Cable Termination: Crimp
Pitch - Connector: 0.079" (2.00mm)
товар відсутній
S2SD-15-24-L-12.00-SR |
Виробник: Samtec Inc.
Description: 2.00 MM TIGER EYE DOUBLE ROW DIS
Packaging: Bulk
Connector Type: Socket to Individual Wire Leads
Contact Finish: Gold
Color: Black, Individual
Shielding: Unshielded
Number of Positions: 30
Number of Rows: 2
Contact Finish Thickness: 10.0µin (0.25µm)
Cable Termination: Crimp
Pitch - Connector: 0.079" (2.00mm)
Description: 2.00 MM TIGER EYE DOUBLE ROW DIS
Packaging: Bulk
Connector Type: Socket to Individual Wire Leads
Contact Finish: Gold
Color: Black, Individual
Shielding: Unshielded
Number of Positions: 30
Number of Rows: 2
Contact Finish Thickness: 10.0µin (0.25µm)
Cable Termination: Crimp
Pitch - Connector: 0.079" (2.00mm)
на замовлення 27 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 2007.38 грн |
10+ | 1829.81 грн |
25+ | 1761.92 грн |
S2SD-15-24-L-20.00-SR |
Виробник: Samtec Inc.
Description: 2.00 MM TIGER EYE DOUBLE ROW DIS
Packaging: Bulk
Connector Type: Socket to Individual Wire Leads
Contact Finish: Gold
Color: Black, Individual
Shielding: Unshielded
Number of Positions: 30
Number of Rows: 2
Contact Finish Thickness: 10.0µin (0.25µm)
Cable Termination: Crimp
Pitch - Connector: 0.079" (2.00mm)
Description: 2.00 MM TIGER EYE DOUBLE ROW DIS
Packaging: Bulk
Connector Type: Socket to Individual Wire Leads
Contact Finish: Gold
Color: Black, Individual
Shielding: Unshielded
Number of Positions: 30
Number of Rows: 2
Contact Finish Thickness: 10.0µin (0.25µm)
Cable Termination: Crimp
Pitch - Connector: 0.079" (2.00mm)
товар відсутній
S2SD-15-24-L-20.00-SR |
Виробник: Samtec Inc.
Description: 2.00 MM TIGER EYE DOUBLE ROW DIS
Packaging: Bulk
Connector Type: Socket to Individual Wire Leads
Contact Finish: Gold
Color: Black, Individual
Shielding: Unshielded
Number of Positions: 30
Number of Rows: 2
Contact Finish Thickness: 10.0µin (0.25µm)
Cable Termination: Crimp
Pitch - Connector: 0.079" (2.00mm)
Description: 2.00 MM TIGER EYE DOUBLE ROW DIS
Packaging: Bulk
Connector Type: Socket to Individual Wire Leads
Contact Finish: Gold
Color: Black, Individual
Shielding: Unshielded
Number of Positions: 30
Number of Rows: 2
Contact Finish Thickness: 10.0µin (0.25µm)
Cable Termination: Crimp
Pitch - Connector: 0.079" (2.00mm)
на замовлення 27 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 2484 грн |
10+ | 2264.78 грн |
25+ | 2179.98 грн |
S2SD-15-24-L-06.00-DR-NDX |
Виробник: Samtec Inc.
Description: 2.00 MM TIGER EYE DOUBLE ROW DIS
Packaging: Bulk
Connector Type: Socket to Socket
Contact Finish: Gold
Color: Black, Individual
Shielding: Unshielded
Number of Positions: 30
Number of Rows: 2
Contact Finish Thickness: 10.0µin (0.25µm)
Cable Termination: Crimp
Pitch - Connector: 0.079" (2.00mm)
Description: 2.00 MM TIGER EYE DOUBLE ROW DIS
Packaging: Bulk
Connector Type: Socket to Socket
Contact Finish: Gold
Color: Black, Individual
Shielding: Unshielded
Number of Positions: 30
Number of Rows: 2
Contact Finish Thickness: 10.0µin (0.25µm)
Cable Termination: Crimp
Pitch - Connector: 0.079" (2.00mm)
товар відсутній
S2SD-15-24-L-06.00-DR-NDX |
Виробник: Samtec Inc.
Description: 2.00 MM TIGER EYE DOUBLE ROW DIS
Packaging: Bulk
Connector Type: Socket to Socket
Contact Finish: Gold
Color: Black, Individual
Shielding: Unshielded
Number of Positions: 30
Number of Rows: 2
Contact Finish Thickness: 10.0µin (0.25µm)
Cable Termination: Crimp
Pitch - Connector: 0.079" (2.00mm)
Description: 2.00 MM TIGER EYE DOUBLE ROW DIS
Packaging: Bulk
Connector Type: Socket to Socket
Contact Finish: Gold
Color: Black, Individual
Shielding: Unshielded
Number of Positions: 30
Number of Rows: 2
Contact Finish Thickness: 10.0µin (0.25µm)
Cable Termination: Crimp
Pitch - Connector: 0.079" (2.00mm)
на замовлення 27 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 2695.92 грн |
10+ | 2457.48 грн |
25+ | 2365.36 грн |
S2SD-15-24C-L-20.00-SR |
Виробник: Samtec Inc.
Description: 2.00 MM TIGER EYE DOUBLE ROW DIS
Packaging: Bulk
Connector Type: Socket to Individual Wire Leads
Contact Finish: Gold
Color: Multiple, Individual
Shielding: Unshielded
Number of Positions: 30
Number of Rows: 2
Contact Finish Thickness: 10.0µin (0.25µm)
Cable Termination: Crimp
Pitch - Connector: 0.079" (2.00mm)
Description: 2.00 MM TIGER EYE DOUBLE ROW DIS
Packaging: Bulk
Connector Type: Socket to Individual Wire Leads
Contact Finish: Gold
Color: Multiple, Individual
Shielding: Unshielded
Number of Positions: 30
Number of Rows: 2
Contact Finish Thickness: 10.0µin (0.25µm)
Cable Termination: Crimp
Pitch - Connector: 0.079" (2.00mm)
товар відсутній
S2SD-15-24C-L-20.00-SR |
Виробник: Samtec Inc.
Description: 2.00 MM TIGER EYE DOUBLE ROW DIS
Packaging: Bulk
Connector Type: Socket to Individual Wire Leads
Contact Finish: Gold
Color: Multiple, Individual
Shielding: Unshielded
Number of Positions: 30
Number of Rows: 2
Contact Finish Thickness: 10.0µin (0.25µm)
Cable Termination: Crimp
Pitch - Connector: 0.079" (2.00mm)
Description: 2.00 MM TIGER EYE DOUBLE ROW DIS
Packaging: Bulk
Connector Type: Socket to Individual Wire Leads
Contact Finish: Gold
Color: Multiple, Individual
Shielding: Unshielded
Number of Positions: 30
Number of Rows: 2
Contact Finish Thickness: 10.0µin (0.25µm)
Cable Termination: Crimp
Pitch - Connector: 0.079" (2.00mm)
на замовлення 27 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 2751.03 грн |
10+ | 2507.12 грн |
25+ | 2413.83 грн |
ERM8-050-01-S-D-EM2-L-TR |
Виробник: Samtec Inc.
Description: CONN HDR 100POS EDGE MNT GOLD
Features: Latches
Packaging: Tape & Reel (TR)
Connector Type: Header, Center Strip Contacts
Contact Finish: Gold
Mounting Type: Board Edge, Straddle Mount
Number of Positions: 100
Pitch: 0.031" (0.80mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Number of Rows: 2
Description: CONN HDR 100POS EDGE MNT GOLD
Features: Latches
Packaging: Tape & Reel (TR)
Connector Type: Header, Center Strip Contacts
Contact Finish: Gold
Mounting Type: Board Edge, Straddle Mount
Number of Positions: 100
Pitch: 0.031" (0.80mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Number of Rows: 2
на замовлення 125 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
125+ | 443.28 грн |
ERM8-050-01-S-D-EM2-L-TR |
Виробник: Samtec Inc.
Description: CONN HDR 100POS EDGE MNT GOLD
Features: Latches
Packaging: Cut Tape (CT)
Connector Type: Header, Center Strip Contacts
Contact Finish: Gold
Mounting Type: Board Edge, Straddle Mount
Number of Positions: 100
Pitch: 0.031" (0.80mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Number of Rows: 2
Description: CONN HDR 100POS EDGE MNT GOLD
Features: Latches
Packaging: Cut Tape (CT)
Connector Type: Header, Center Strip Contacts
Contact Finish: Gold
Mounting Type: Board Edge, Straddle Mount
Number of Positions: 100
Pitch: 0.031" (0.80mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Number of Rows: 2
на замовлення 195 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 604.7 грн |
10+ | 526.39 грн |
25+ | 497.6 грн |
50+ | 452.5 грн |