HSEC8-130-03-H-DV-A Samtec Inc.
Виробник: Samtec Inc.Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide
Packaging: Tray
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 60
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.093" (2.36mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 30
Number of Rows: 2
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Технічний опис HSEC8-130-03-H-DV-A Samtec Inc.
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL, Features: Board Guide, Packaging: Tray, Gender: Female, Contact Finish: Gold, Color: Black, Mounting Type: Surface Mount, Number of Positions: 60, Pitch: 0.031" (0.80mm), Operating Temperature: -55°C ~ 125°C, Read Out: Dual, Contact Type: Cantilever, Card Type: PCI Express™, Card Thickness: 0.093" (2.36mm), Termination: Solder, Contact Finish Thickness: 30.0µin (0.76µm), Contact Material: Beryllium Copper, Number of Positions/Bay/Row: 30, Number of Rows: 2.