Технічний опис W63CH6MBVACE Winbond
Description: IC DRAM 4GBIT PAR 178VFBGA, Packaging: Tray, Package / Case: 178-VFBGA, Mounting Type: Surface Mount, Memory Size: 4Gbit, Memory Type: Volatile, Operating Temperature: -25°C ~ 85°C (TC), Voltage - Supply: 1.14V ~ 1.3V, 1.7V ~ 1.95V, Technology: SDRAM - Mobile LPDDR3, Clock Frequency: 933 MHz, Memory Format: DRAM, Supplier Device Package: 178-VFBGA (11x11.5), Write Cycle Time - Word, Page: 15ns, Memory Interface: Parallel, Memory Organization: 256M x 16, DigiKey Programmable: Not Verified.
Інші пропозиції W63CH6MBVACE
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
|---|---|---|---|---|---|
| W63CH6MBVACE | Виробник : Winbond Electronics |
 Description: IC DRAM 4GBIT PAR 178VFBGAPackaging: Tray Package / Case: 178-VFBGA Mounting Type: Surface Mount Memory Size: 4Gbit Memory Type: Volatile Operating Temperature: -25°C ~ 85°C (TC) Voltage - Supply: 1.14V ~ 1.3V, 1.7V ~ 1.95V Technology: SDRAM - Mobile LPDDR3 Clock Frequency: 933 MHz Memory Format: DRAM Supplier Device Package: 178-VFBGA (11x11.5) Write Cycle Time - Word, Page: 15ns Memory Interface: Parallel Memory Organization: 256M x 16 DigiKey Programmable: Not Verified |
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