TSM-115-02-L-DV-LC-P-TR Samtec Inc.
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Description: CONN HEADER SMD 30POS 2.54MM
Features: Board Lock, Pick and Place
Packaging: Tape & Reel (TR)
Connector Type: Header, Cuttable
Mounting Type: Surface Mount
Number of Positions: 30
Number of Rows: 2
Style: Board to Board or Cable
Operating Temperature: -55°C ~ 125°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Tin
Contact Shape: Square
Insulation Height: 0.100" (2.54mm)
Shrouding: Unshrouded
Insulation Material: Liquid Crystal Polymer (LCP)
Row Spacing - Mating: 0.100" (2.54mm)
Contact Length - Mating: 0.320" (8.13mm)
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Технічний опис TSM-115-02-L-DV-LC-P-TR Samtec Inc.
Description: CONN HEADER SMD 30POS 2.54MM, Features: Board Lock, Pick and Place, Packaging: Tape & Reel (TR), Connector Type: Header, Cuttable, Mounting Type: Surface Mount, Number of Positions: 30, Number of Rows: 2, Style: Board to Board or Cable, Operating Temperature: -55°C ~ 125°C, Contact Type: Male Pin, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Contact Material: Phosphor Bronze, Insulation Color: Black, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Post: Tin, Contact Shape: Square, Insulation Height: 0.100" (2.54mm), Shrouding: Unshrouded, Insulation Material: Liquid Crystal Polymer (LCP), Row Spacing - Mating: 0.100" (2.54mm), Contact Length - Mating: 0.320" (8.13mm).
Інші пропозиції TSM-115-02-L-DV-LC-P-TR
Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
---|---|---|---|---|---|
TSM-115-02-L-DV-LC-P-TR | Виробник : Samtec |
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