![TSM-108-01-S-DH-SL-P-TR TSM-108-01-S-DH-SL-P-TR](https://mm.digikey.com/Volume0/opasdata/d220001/medias/images/4251/MFG_TSM-108-01-x-DH-SL.jpg)
TSM-108-01-S-DH-SL-P-TR Samtec Inc.
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Description: CONN HEADER SMD R/A 16POS 2.54MM
Packaging: Tape & Reel (TR)
Features: Pick and Place, Solder Retention
Connector Type: Header
Mounting Type: Surface Mount, Right Angle
Number of Positions: 16
Number of Rows: 2
Style: Board to Board or Cable
Operating Temperature: -55°C ~ 125°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin
Contact Shape: Square
Insulation Height: 0.240" (6.10mm)
Shrouding: Unshrouded
Insulation Material: Liquid Crystal Polymer (LCP)
Row Spacing - Mating: 0.100" (2.54mm)
Contact Length - Mating: 0.230" (5.84mm)
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Технічний опис TSM-108-01-S-DH-SL-P-TR Samtec Inc.
Description: CONN HEADER SMD R/A 16POS 2.54MM, Packaging: Tape & Reel (TR), Features: Pick and Place, Solder Retention, Connector Type: Header, Mounting Type: Surface Mount, Right Angle, Number of Positions: 16, Number of Rows: 2, Style: Board to Board or Cable, Operating Temperature: -55°C ~ 125°C, Contact Type: Male Pin, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Contact Material: Phosphor Bronze, Insulation Color: Black, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Post: Tin, Contact Shape: Square, Insulation Height: 0.240" (6.10mm), Shrouding: Unshrouded, Insulation Material: Liquid Crystal Polymer (LCP), Row Spacing - Mating: 0.100" (2.54mm), Contact Length - Mating: 0.230" (5.84mm).
Інші пропозиції TSM-108-01-S-DH-SL-P-TR
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TSM-108-01-S-DH-SL-P-TR | Виробник : Samtec |
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