Технічний опис TSM-103-04-F-SV-A Samtec
Description: CONN HEADER SMD 3POS 2.54MM, Packaging: Tube, Features: Board Guide, Connector Type: Header, Cuttable, Mounting Type: Surface Mount, Number of Positions: 3, Number of Rows: 1, Style: Board to Board or Cable, Operating Temperature: -55°C ~ 125°C, Contact Type: Male Pin, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Contact Material: Phosphor Bronze, Insulation Color: Black, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 3.00µin (0.076µm), Contact Finish - Post: Tin, Contact Shape: Square, Insulation Height: 0.100" (2.54mm), Shrouding: Unshrouded, Insulation Material: Liquid Crystal Polymer (LCP), Contact Length - Mating: 0.120" (3.05mm).
Інші пропозиції TSM-103-04-F-SV-A
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
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TSM-103-04-F-SV-A | Виробник : Samtec |
 Conn Unshrouded Header HDR 3 POS 2.54mm Solder ST Top Entry SMD |
товар відсутній |
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TSM-103-04-F-SV-A | Виробник : Samtec Inc. |
Description: CONN HEADER SMD 3POS 2.54MM Packaging: Tube Features: Board Guide Connector Type: Header, Cuttable Mounting Type: Surface Mount Number of Positions: 3 Number of Rows: 1 Style: Board to Board or Cable Operating Temperature: -55°C ~ 125°C Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Phosphor Bronze Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Post: Tin Contact Shape: Square Insulation Height: 0.100" (2.54mm) Shrouding: Unshrouded Insulation Material: Liquid Crystal Polymer (LCP) Contact Length - Mating: 0.120" (3.05mm) |
товар відсутній |
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TSM-103-04-F-SV-A | Виробник : Samtec |
Headers & Wire Housings |
товар відсутній |