TEM-150-02-03.0-H-D-LC Samtec Inc.
Виробник: Samtec Inc.
Description: .8MM TIGER EYE MICRO TERMINAL
Packaging: Tray
Features: Board Lock
Connector Type: Header
Current Rating (Amps): 2.9A per Contact
Mounting Type: Surface Mount
Number of Positions: 100
Number of Rows: 2
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Contact Material: Phosphor Bronze
Insulation Color: Black
Pitch - Mating: 0.031" (0.80mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Gold
Contact Shape: Square
Insulation Height: 0.220" (5.60mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Liquid Crystal Polymer (LCP)
Row Spacing - Mating: 0.063" (1.60mm)
Description: .8MM TIGER EYE MICRO TERMINAL
Packaging: Tray
Features: Board Lock
Connector Type: Header
Current Rating (Amps): 2.9A per Contact
Mounting Type: Surface Mount
Number of Positions: 100
Number of Rows: 2
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Contact Material: Phosphor Bronze
Insulation Color: Black
Pitch - Mating: 0.031" (0.80mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Gold
Contact Shape: Square
Insulation Height: 0.220" (5.60mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Liquid Crystal Polymer (LCP)
Row Spacing - Mating: 0.063" (1.60mm)
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Технічний опис TEM-150-02-03.0-H-D-LC Samtec Inc.
Description: .8MM TIGER EYE MICRO TERMINAL, Packaging: Tray, Features: Board Lock, Connector Type: Header, Current Rating (Amps): 2.9A per Contact, Mounting Type: Surface Mount, Number of Positions: 100, Number of Rows: 2, Style: Board to Board, Operating Temperature: -55°C ~ 125°C, Contact Type: Male Pin, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Contact Material: Phosphor Bronze, Insulation Color: Black, Pitch - Mating: 0.031" (0.80mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Post: Gold, Contact Shape: Square, Insulation Height: 0.220" (5.60mm), Shrouding: Shrouded - 4 Wall, Insulation Material: Liquid Crystal Polymer (LCP), Row Spacing - Mating: 0.063" (1.60mm).
Інші пропозиції TEM-150-02-03.0-H-D-LC
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TEM-150-02-03.0-H-D-LC | Виробник : Samtec |
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