TEM-115-02-03.0-H-D-WT Samtec Inc.

Description: CONN HEADER SMD 30POS 0.8MM, Features: Solder Retention, Packaging: Tray, Connector Type: Header, Current Rating (Amps): 2.9A per Contact, Mounting Type: Surface Mount, Number of Positions: 30, Number of Rows: 2, Style: Board to Board, Operating Temperature: -55°C ~ 125°C, Contact Type: Male Pin, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Contact Material: Phosphor Bronze, Insulation Color: Black, Pitch - Mating: 0.031" (0.80mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Post: Gold, Part Status: Active, Contact Shape: Square, Insulation Height: 0.220" (5.60mm), Shrouding: Shrouded - 4 Wall, Insulation Material: Liquid Crystal Polymer (LCP), Row Spacing - Mating: 0.063" (1.60mm).