SU1210000000G Amphenol Anytek


Виробник: Amphenol Anytek
Description: SU-2*6P BLACK ; 10.0MM CLIP PLA
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.1" (2.54mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 12 (2 x 6)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Brass
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Beryllium Copper
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Технічний опис SU1210000000G Amphenol Anytek

Description: SU-2*6P BLACK ; 10.0MM CLIP PLA, Packaging: Bulk, Features: Closed Frame, Mounting Type: Through Hole, Type: DIP, 0.1" (2.54mm) Row Spacing, Operating Temperature: -40°C ~ 105°C, Number of Positions or Pins (Grid): 12 (2 x 6), Termination: Solder, Housing Material: Polyphenylene Sulfide (PPS), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Brass, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: FLASH, Contact Material - Post: Beryllium Copper.

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SU1210000000G Виробник : Amphenol Anytek _aytP3s8kfGQ-1379118.pdf Fixed Terminal Blocks
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