Технічний опис SIDC30D60E6X1SA1 Infineon Technologies
Description: DIODE GP 600V 75A WAFER, Packaging: Bulk, Package / Case: Die, Mounting Type: Surface Mount, Speed: Standard Recovery >500ns, > 200mA (Io), Technology: Standard, Current - Average Rectified (Io): 75A, Supplier Device Package: Sawn on foil, Operating Temperature - Junction: -55°C ~ 150°C, Part Status: Obsolete, Voltage - DC Reverse (Vr) (Max): 600 V, Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 75 A, Current - Reverse Leakage @ Vr: 27 µA @ 600 V.
Інші пропозиції SIDC30D60E6X1SA1
Фото | Назва | Виробник | Інформація |
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SIDC30D60E6X1SA1 | Виробник : Infineon Technologies |
![]() Packaging: Bulk Package / Case: Die Mounting Type: Surface Mount Speed: Standard Recovery >500ns, > 200mA (Io) Technology: Standard Current - Average Rectified (Io): 75A Supplier Device Package: Sawn on foil Operating Temperature - Junction: -55°C ~ 150°C Part Status: Obsolete Voltage - DC Reverse (Vr) (Max): 600 V Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 75 A Current - Reverse Leakage @ Vr: 27 µA @ 600 V |
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SIDC30D60E6X1SA1 | Виробник : Infineon Technologies |
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товар відсутній |