SIDC161D170HX1SA2 Infineon Technologies

Description: DIODE GP 1.7KV 300A WAFER, Packaging: Bulk, Package / Case: Die, Mounting Type: Surface Mount, Speed: Standard Recovery >500ns, > 200mA (Io), Technology: Standard, Current - Average Rectified (Io): 300A, Supplier Device Package: Sawn on foil, Operating Temperature - Junction: -55°C ~ 150°C, Part Status: Discontinued at Digi-Key, Voltage - DC Reverse (Vr) (Max): 1700 V, Voltage - Forward (Vf) (Max) @ If: 1.8 V @ 300 A, Current Coupled to Voltage - Forward (Vf) (Max) @ If: 300, Voltage Coupled to Current - Reverse Leakage @ Vr: 1700, Current - Reverse Leakage @ Vr: 27 µA @ 1700 V.