SBB830-QTY25 Chip Quik Inc.
Виробник: Chip Quik Inc.
Description: 830 PTS SOLDER-IN BREADBOARD (EX
Packaging: Bulk
Size / Dimension: 6.60" L x 2.30" W (167.6mm x 58.4mm)
Pitch: 0.1" (2.54mm) Grid
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: 5 Hole Pad (Single Side)
Plating: Plated Through Hole (PTH)
Description: 830 PTS SOLDER-IN BREADBOARD (EX
Packaging: Bulk
Size / Dimension: 6.60" L x 2.30" W (167.6mm x 58.4mm)
Pitch: 0.1" (2.54mm) Grid
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: 5 Hole Pad (Single Side)
Plating: Plated Through Hole (PTH)
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Технічний опис SBB830-QTY25 Chip Quik Inc.
Description: 830 PTS SOLDER-IN BREADBOARD (EX, Packaging: Bulk, Size / Dimension: 6.60" L x 2.30" W (167.6mm x 58.4mm), Pitch: 0.1" (2.54mm) Grid, Board Thickness: 0.063" (1.60mm), Proto Board Type: Breadboard, General Purpose, Hole Diameter: 0.039" (1.00mm), Circuit Pattern: 5 Hole Pad (Single Side), Plating: Plated Through Hole (PTH).
Інші пропозиції SBB830-QTY25
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
|---|---|---|---|---|---|
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SBB830-QTY25 | Виробник : Chip Quik | PCBs & Breadboards 830 pts solder-in breadboard Qty 25 |
товар відсутній |