SAC57D53MCVLT NXP USA Inc.
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 208LQFP
Packaging: Tray
Package / Case: 208-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz, 320MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 2.3M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-A5/M4/M0+
Data Converters: A/D 24x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, SPI
Peripherals: DMA, LCD, LVD/HVD, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 3MB FLASH 208LQFP
Packaging: Tray
Package / Case: 208-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz, 320MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 2.3M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-A5/M4/M0+
Data Converters: A/D 24x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, SPI
Peripherals: DMA, LCD, LVD/HVD, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
DigiKey Programmable: Not Verified
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Технічний опис SAC57D53MCVLT NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 208LQFP, Packaging: Tray, Package / Case: 208-LQFP Exposed Pad, Mounting Type: Surface Mount, Speed: 80MHz, 160MHz, 320MHz, Program Memory Size: 3MB (3M x 8), RAM Size: 2.3M x 8, Operating Temperature: -40°C ~ 105°C (TA), Oscillator Type: Internal, Program Memory Type: FLASH, Core Processor: ARM® Cortex®-A5/M4/M0+, Data Converters: A/D 24x12b, Core Size: 32-Bit Tri-Core, Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V, Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, SPI, Peripherals: DMA, LCD, LVD/HVD, POR, PWM, WDT, Supplier Device Package: 208-LQFP (28x28), DigiKey Programmable: Not Verified.
Інші пропозиції SAC57D53MCVLT
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SAC57D53MCVLT | Виробник : NXP Semiconductors |
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