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S9S08DZ32F2VLCR NXP USA Inc.
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Description: IC MCU 8BIT 32KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 25
DigiKey Programmable: Not Verified
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Технічний опис S9S08DZ32F2VLCR NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 32LQFP, Packaging: Tape & Reel (TR), Package / Case: 32-LQFP, Mounting Type: Surface Mount, Speed: 40MHz, Program Memory Size: 32KB (32K x 8), RAM Size: 2K x 8, Operating Temperature: -40°C ~ 105°C (TA), Oscillator Type: External, Program Memory Type: FLASH, EEPROM Size: 1K x 8, Core Processor: S08, Data Converters: A/D 10x12b, Core Size: 8-Bit, Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V, Connectivity: CANbus, I2C, LINbus, SCI, SPI, Peripherals: LVD, POR, PWM, WDT, Supplier Device Package: 32-LQFP (7x7), Part Status: Active, Number of I/O: 25, DigiKey Programmable: Not Verified.
Інші пропозиції S9S08DZ32F2VLCR
Фото | Назва | Виробник | Інформація |
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Ціна без ПДВ |
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S9S08DZ32F2VLCR | Виробник : NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 32KB (32K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 1K x 8 Core Processor: S08 Data Converters: A/D 10x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 32-LQFP (7x7) Part Status: Active Number of I/O: 25 DigiKey Programmable: Not Verified |
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S9S08DZ32F2VLCR | Виробник : NXP Semiconductors |
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