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S912XET256W1MAGR NXP USA Inc.
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 119
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 256KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 119
DigiKey Programmable: Not Verified
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Технічний опис S912XET256W1MAGR NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 144LQFP, Packaging: Tape & Reel (TR), Package / Case: 144-LQFP, Mounting Type: Surface Mount, Speed: 50MHz, Program Memory Size: 256KB (256K x 8), RAM Size: 16K x 8, Operating Temperature: -40°C ~ 125°C (TA), Oscillator Type: External, Program Memory Type: FLASH, EEPROM Size: 4K x 8, Core Processor: HCS12X, Data Converters: A/D 24x12b, Core Size: 16-Bit, Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V, Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI, Peripherals: LVD, POR, PWM, WDT, Supplier Device Package: 144-LQFP (20x20), Number of I/O: 119, DigiKey Programmable: Not Verified.
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S912XET256W1MAGR | Виробник : NXP Semiconductors |
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