MT61K512M32KPA-18:E TR Micron Technology Inc.
Виробник: Micron Technology Inc.
Description: GDDR6 16GBIT 32 180/252 TFBGA 2
Packaging: Tape & Reel (TR)
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Memory Size: 16Gbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 95°C (TC)
Voltage - Supply: 1.3095V ~ 1.391V
Technology: SGRAM - GDDR6
Clock Frequency: 9 GHz
Memory Format: DRAM
Supplier Device Package: 180-FBGA (12x14)
Memory Interface: POD_135
Memory Organization: 512M x 32
Description: GDDR6 16GBIT 32 180/252 TFBGA 2
Packaging: Tape & Reel (TR)
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Memory Size: 16Gbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 95°C (TC)
Voltage - Supply: 1.3095V ~ 1.391V
Technology: SGRAM - GDDR6
Clock Frequency: 9 GHz
Memory Format: DRAM
Supplier Device Package: 180-FBGA (12x14)
Memory Interface: POD_135
Memory Organization: 512M x 32
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Технічний опис MT61K512M32KPA-18:E TR Micron Technology Inc.
Description: GDDR6 16GBIT 32 180/252 TFBGA 2, Packaging: Tape & Reel (TR), Package / Case: 180-TFBGA, Mounting Type: Surface Mount, Memory Size: 16Gbit, Memory Type: Volatile, Operating Temperature: 0°C ~ 95°C (TC), Voltage - Supply: 1.3095V ~ 1.391V, Technology: SGRAM - GDDR6, Clock Frequency: 9 GHz, Memory Format: DRAM, Supplier Device Package: 180-FBGA (12x14), Memory Interface: POD_135, Memory Organization: 512M x 32.
Інші пропозиції MT61K512M32KPA-18:E TR
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
|---|---|---|---|---|---|
 |
MT61K512M32KPA-18:E TR | Виробник : Micron |
 DRAM GDDR6 16Gbit 32 180/252 TFBGA 2 CT |
товар відсутній |