MC35FS6501NAE NXP USA Inc.
Виробник: NXP USA Inc.
Description: FS6500
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
Description: FS6500
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
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Технічний опис MC35FS6501NAE NXP USA Inc.
Description: FS6500, Packaging: Tray, Package / Case: 48-LQFP Exposed Pad, Mounting Type: Surface Mount, Operating Temperature: -40°C ~ 150°C (TA), Voltage - Supply: 1V ~ 5V, Applications: System Basis Chip, Supplier Device Package: 48-HLQFP (7x7), Part Status: Active, Grade: Automotive, Qualification: AEC-Q100.
Інші пропозиції MC35FS6501NAE
Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
---|---|---|---|---|---|
MC35FS6501NAE | Виробник : NXP Semiconductors | Power Management Specialised - PMIC System Basis chip, DCDC 0.8A Vcore FS1B, LQFP48EP, Tray |
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