MC33PF3000A4ESR2 NXP USA Inc.
Виробник: NXP USA Inc.
Description: POWER MANAGEMENT IC I.MX7 PRE-
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: i.MX Processors
Supplier Device Package: 48-QFN (7x7)
Part Status: Active
Description: POWER MANAGEMENT IC I.MX7 PRE-
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: i.MX Processors
Supplier Device Package: 48-QFN (7x7)
Part Status: Active
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Технічний опис MC33PF3000A4ESR2 NXP USA Inc.
Description: POWER MANAGEMENT IC I.MX7 PRE-, Packaging: Tape & Reel (TR), Package / Case: 48-VFQFN Exposed Pad, Mounting Type: Surface Mount, Wettable Flank, Operating Temperature: -40°C ~ 105°C, Voltage - Supply: 2.8V ~ 5.5V, Applications: i.MX Processors, Supplier Device Package: 48-QFN (7x7), Part Status: Active.
Інші пропозиції MC33PF3000A4ESR2
Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
---|---|---|---|---|---|
MC33PF3000A4ESR2 | Виробник : NXP Semiconductors | Power Management Specialised - PMIC Power Management IC, i.MX7, pre-prog, 4 buck, 6 LDO, 1 boost, Auto, QFN 48 |
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