Технічний опис LPC2210FBD144/01,5 NXP Semiconductors
Description: IC MCU 16/32BIT ROMLESS 144LQFP, Packaging: Tray, Package / Case: 144-LQFP, Mounting Type: Surface Mount, Speed: 60MHz, RAM Size: 16K x 8, Operating Temperature: -40°C ~ 85°C (TA), Oscillator Type: Internal, Program Memory Type: ROMless, Core Processor: ARM7®, Data Converters: A/D 8x10b, Core Size: 16/32-Bit, Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V, Connectivity: EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART, Peripherals: POR, PWM, WDT, Supplier Device Package: 144-LQFP (20x20), Number of I/O: 76, DigiKey Programmable: Not Verified.
Інші пропозиції LPC2210FBD144/01,5
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LPC2210FBD144/01,5 | Виробник : NXP USA Inc. |
 Description: IC MCU 16/32BIT ROMLESS 144LQFPPackaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 60MHz RAM Size: 16K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: ARM7® Data Converters: A/D 8x10b Core Size: 16/32-Bit Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V Connectivity: EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 76 DigiKey Programmable: Not Verified |
товар відсутній |
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LPC2210FBD144/01,5 | Виробник : NXP Semiconductors |
ARM Microcontrollers - MCU ARM7 16KR/10BADC ROMLESS |
товар відсутній |