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LPC18S30FET100E NXP Semiconductors
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MCU 32-bit ARM Cortex M3 ROMLess 2.5V/3.3V Automotive 100-Pin TFBGA Tray
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Технічний опис LPC18S30FET100E NXP Semiconductors
Description: IC MCU 32BIT ROMLESS 100TFBGA, Packaging: Tray, Package / Case: 100-TFBGA, Mounting Type: Surface Mount, Speed: 180MHz, RAM Size: 200K x 8, Operating Temperature: -40°C ~ 85°C (TA), Oscillator Type: Internal, Program Memory Type: ROMless, Core Processor: ARM® Cortex®-M3, Data Converters: A/D 4x10b; D/A 1x10b, Core Size: 32-Bit Single-Core, Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V, Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, MMC/SD, SPI, SSI, SSP, UART/USART, USB, Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, WDT, Supplier Device Package: 100-TFBGA (9x9), Number of I/O: 49, DigiKey Programmable: Not Verified.
Інші пропозиції LPC18S30FET100E
Фото | Назва | Виробник | Інформація |
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LPC18S30FET100E | Виробник : NXP |
![]() Description: IC: ARM microcontroller; 200kBSRAM; TFBGA100; 2.4÷3.6VDC Type of integrated circuit: ARM microcontroller Interface: CAN; Ethernet; I2C; SPI; UART; USART; USB Memory: 200kB SRAM Supply voltage: 2.4...3.6V DC Mounting: SMD Operating temperature: -40...85°C Number of inputs/outputs: 49 Case: TFBGA100 Kind of architecture: Cortex M3 кількість в упаковці: 260 шт |
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LPC18S30FET100E | Виробник : NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 100TFBGA Packaging: Tray Package / Case: 100-TFBGA Mounting Type: Surface Mount Speed: 180MHz RAM Size: 200K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: ARM® Cortex®-M3 Data Converters: A/D 4x10b; D/A 1x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, MMC/SD, SPI, SSI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, WDT Supplier Device Package: 100-TFBGA (9x9) Number of I/O: 49 DigiKey Programmable: Not Verified |
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LPC18S30FET100E | Виробник : NXP Semiconductors |
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товар відсутній |
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LPC18S30FET100E | Виробник : NXP |
![]() Description: IC: ARM microcontroller; 200kBSRAM; TFBGA100; 2.4÷3.6VDC Type of integrated circuit: ARM microcontroller Interface: CAN; Ethernet; I2C; SPI; UART; USART; USB Memory: 200kB SRAM Supply voltage: 2.4...3.6V DC Mounting: SMD Operating temperature: -40...85°C Number of inputs/outputs: 49 Case: TFBGA100 Kind of architecture: Cortex M3 |
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