HTST-108-01-L-DV Samtec
на замовлення 1007 шт:
термін постачання 21-30 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 283.92 грн |
| 10+ | 234.44 грн |
| 100+ | 174.94 грн |
| 500+ | 153.07 грн |
| 1000+ | 134.73 грн |
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Технічний опис HTST-108-01-L-DV Samtec
Description: CONN HEADER SMD 16POS 2.54MM, Packaging: Tube, Features: Keying Slot, Connector Type: Header, Current Rating (Amps): 3.4A per Contact, Mounting Type: Surface Mount, Number of Positions: 16, Number of Rows: 2, Style: Board to Cable/Wire, Operating Temperature: -55°C ~ 125°C, Contact Type: Male Pin, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Contact Material: Phosphor Bronze, Insulation Color: Natural, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Post: Tin, Part Status: Active, Contact Shape: Square, Insulation Height: 0.350" (8.89mm), Shrouding: Shrouded - 4 Wall, Insulation Material: Liquid Crystal Polymer (LCP), Row Spacing - Mating: 0.100" (2.54mm), Contact Length - Mating: 0.250" (6.35mm).
Інші пропозиції HTST-108-01-L-DV за ціною від 153.5 грн до 295.16 грн
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ | ||||||||||||
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HTST-108-01-L-DV | Виробник : Samtec Inc. |
 Description: CONN HEADER SMD 16POS 2.54MMPackaging: Tube Features: Keying Slot Connector Type: Header Current Rating (Amps): 3.4A per Contact Mounting Type: Surface Mount Number of Positions: 16 Number of Rows: 2 Style: Board to Cable/Wire Operating Temperature: -55°C ~ 125°C Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Phosphor Bronze Insulation Color: Natural Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Tin Part Status: Active Contact Shape: Square Insulation Height: 0.350" (8.89mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP) Row Spacing - Mating: 0.100" (2.54mm) Contact Length - Mating: 0.250" (6.35mm) |
на замовлення 1298 шт: термін постачання 21-31 дні (днів) |
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HTST-108-01-L-DV | Виробник : SAMTEC |
Description: SAMTEC - HTST-108-01-L-DV - Stiftleiste, Wire-to-Board, 2.54 mm, 2 Reihe(n), 16 Kontakt(e), Oberflächenmontage, HTST tariffCode: 85366930 rohsCompliant: YES Kontaktüberzug: Vergoldete Kontakte hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: Phosphorbronze usEccn: EAR99 Steckverbinderkragen: Mit Kragen Anzahl der Kontakte: 16Kontakt(e) euEccn: NLR Steckverbindersysteme: Wire-to-Board Produktpalette: HTST productTraceability: No Kontaktanschluss: Oberflächenmontage Anzahl der Reihen: 2Reihe(n) Rastermaß: 2.54mm SVHC: No SVHC (23-Jan-2024) |
на замовлення 270 шт: термін постачання 21-31 дні (днів) |
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