на замовлення 4882 шт:
термін постачання 21-30 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 3+ | 120.68 грн |
| 10+ | 103.58 грн |
| 25+ | 82.33 грн |
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Технічний опис HSS-C2540-SMT-TR CUI Devices
Description: HEAT SINK TO-263 COPPER, Packaging: Tape & Reel (TR), Material: Copper, Length: 0.763" (19.38mm), Shape: Rectangular, Fins, Type: Board Level, Width: 1.000" (25.40mm), Package Cooled: TO-263 (D²Pak), Power Dissipation @ Temperature Rise: 3.8W @ 75°C, Thermal Resistance @ Forced Air Flow: 5.50°C/W @ 200 LFM, Thermal Resistance @ Natural: 21.90°C/W, Fin Height: 0.450" (11.43mm), Material Finish: Tin, Part Status: Active.
Інші пропозиції HSS-C2540-SMT-TR
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
|---|---|---|---|---|---|
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HSS-C2540-SMT-TR | Виробник : CUI DEVICES |
 Heat Sink Passive TO-263 SMD Copper 5.5C/W Tin |
товар відсутній |
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HSS-C2540-SMT-TR | Виробник : CUI Devices |
Description: HEAT SINK TO-263 COPPER Packaging: Tape & Reel (TR) Material: Copper Length: 0.763" (19.38mm) Shape: Rectangular, Fins Type: Board Level Width: 1.000" (25.40mm) Package Cooled: TO-263 (D²Pak) Power Dissipation @ Temperature Rise: 3.8W @ 75°C Thermal Resistance @ Forced Air Flow: 5.50°C/W @ 200 LFM Thermal Resistance @ Natural: 21.90°C/W Fin Height: 0.450" (11.43mm) Material Finish: Tin Part Status: Active |
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HSS-C2540-SMT-TR | Виробник : CUI Devices |
Description: HEAT SINK TO-263 COPPER Packaging: Cut Tape (CT) Material: Copper Length: 0.763" (19.38mm) Shape: Rectangular, Fins Type: Board Level Width: 1.000" (25.40mm) Package Cooled: TO-263 (D²Pak) Power Dissipation @ Temperature Rise: 3.8W @ 75°C Thermal Resistance @ Forced Air Flow: 5.50°C/W @ 200 LFM Thermal Resistance @ Natural: 21.90°C/W Fin Height: 0.450" (11.43mm) Material Finish: Tin Part Status: Active |
товар відсутній |
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| HSS-C2540-SMT-TR | Виробник : CUI Devices |
Category: Heatsinks Description: Heatsink: extruded; U; TO263; silver; L: 19.38mm; W: 25.4mm; C1100 Mounting: SMT Colour: silver Length: 19.38mm Thermal resistance: max. 21.9°C/W Type of heatsink: extruded Heatsink shape: U Material finishing: tin plated Plate thickness: 0.6mm Thermal resistance @200 LFM: 5.5°C/W Width: 25.4mm Material: C1100 Height: 11.43mm Application: TO263 |
товар відсутній |