HSS-B20-NP-04 CUI Devices
Виробник: CUI Devices
Description: HEATSINK TO-220 6.5W ALUMINUM
Packaging: Box
Material: Aluminum
Length: 1.450" (36.83mm)
Shape: Rectangular, Fins
Type: Board Level
Width: 1.750" (44.45mm)
Package Cooled: TO-220
Attachment Method: Bolt On
Power Dissipation @ Temperature Rise: 6.5W @ 75°C
Thermal Resistance @ Forced Air Flow: 3.76°C/W @ 200 LFM
Thermal Resistance @ Natural: 11.54°C/W
Fin Height: 0.370" (9.40mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEATSINK TO-220 6.5W ALUMINUM
Packaging: Box
Material: Aluminum
Length: 1.450" (36.83mm)
Shape: Rectangular, Fins
Type: Board Level
Width: 1.750" (44.45mm)
Package Cooled: TO-220
Attachment Method: Bolt On
Power Dissipation @ Temperature Rise: 6.5W @ 75°C
Thermal Resistance @ Forced Air Flow: 3.76°C/W @ 200 LFM
Thermal Resistance @ Natural: 11.54°C/W
Fin Height: 0.370" (9.40mm)
Material Finish: Black Anodized
Part Status: Active
на замовлення 5583 шт:
термін постачання 21-31 дні (днів)
Кількість | Ціна без ПДВ |
---|---|
10+ | 30.94 грн |
11+ | 27.88 грн |
25+ | 26.5 грн |
50+ | 24.22 грн |
100+ | 23.89 грн |
250+ | 23.05 грн |
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Технічний опис HSS-B20-NP-04 CUI Devices
Description: HEATSINK TO-220 6.5W ALUMINUM, Packaging: Box, Material: Aluminum, Length: 1.450" (36.83mm), Shape: Rectangular, Fins, Type: Board Level, Width: 1.750" (44.45mm), Package Cooled: TO-220, Attachment Method: Bolt On, Power Dissipation @ Temperature Rise: 6.5W @ 75°C, Thermal Resistance @ Forced Air Flow: 3.76°C/W @ 200 LFM, Thermal Resistance @ Natural: 11.54°C/W, Fin Height: 0.370" (9.40mm), Material Finish: Black Anodized, Part Status: Active.
Інші пропозиції HSS-B20-NP-04
Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
---|---|---|---|---|---|
HSS-B20-NP-04 | Виробник : CUI Devices | Heat Sinks 36.83 x 44.5 x 9.4mm TO-220 bolt on |
на замовлення 1098 шт: термін постачання 21-30 дні (днів) |