HSS-B20-095H CUI Devices
Виробник: CUI Devices
Description: HEATSINK TO-220 4.1W ALUMINUM
Packaging: Bag
Material: Aluminum
Length: 0.441" (11.20mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 0.866" (22.00mm)
Package Cooled: TO-220
Attachment Method: PC Pin
Power Dissipation @ Temperature Rise: 4.1W @ 75°C
Thermal Resistance @ Forced Air Flow: 6.50°C/W @ 200 LFM
Thermal Resistance @ Natural: 18.34°C/W
Fin Height: 0.626" (15.90mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEATSINK TO-220 4.1W ALUMINUM
Packaging: Bag
Material: Aluminum
Length: 0.441" (11.20mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 0.866" (22.00mm)
Package Cooled: TO-220
Attachment Method: PC Pin
Power Dissipation @ Temperature Rise: 4.1W @ 75°C
Thermal Resistance @ Forced Air Flow: 6.50°C/W @ 200 LFM
Thermal Resistance @ Natural: 18.34°C/W
Fin Height: 0.626" (15.90mm)
Material Finish: Black Anodized
Part Status: Active
на замовлення 1106 шт:
термін постачання 21-31 дні (днів)
Кількість | Ціна без ПДВ |
---|---|
6+ | 56.73 грн |
10+ | 51.64 грн |
25+ | 49.03 грн |
50+ | 44.81 грн |
100+ | 44.19 грн |
250+ | 41.17 грн |
500+ | 38.11 грн |
1000+ | 34.54 грн |
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Технічний опис HSS-B20-095H CUI Devices
Description: HEATSINK TO-220 4.1W ALUMINUM, Packaging: Bag, Material: Aluminum, Length: 0.441" (11.20mm), Shape: Rectangular, Fins, Type: Board Level, Vertical, Width: 0.866" (22.00mm), Package Cooled: TO-220, Attachment Method: PC Pin, Power Dissipation @ Temperature Rise: 4.1W @ 75°C, Thermal Resistance @ Forced Air Flow: 6.50°C/W @ 200 LFM, Thermal Resistance @ Natural: 18.34°C/W, Fin Height: 0.626" (15.90mm), Material Finish: Black Anodized, Part Status: Active.
Інші пропозиції HSS-B20-095H
Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
---|---|---|---|---|---|
HSS-B20-095H | Виробник : CUI Devices | Heat Sinks 19 x 22 x 11.2mm TO-220 solder pin |
товар відсутній |