HSS-B20-061H-03 CUI Devices
Виробник: CUI Devices
Description: HEATSINK TO-220 2.9W ALUMINUM
Packaging: Bag
Material: Aluminum
Length: 0.512" (13.00mm)
Shape: Rectangular, Fins
Type: Board Level
Width: 0.512" (13.00mm)
Package Cooled: TO-220
Attachment Method: PC Pin
Power Dissipation @ Temperature Rise: 2.9W @ 75°C
Thermal Resistance @ Forced Air Flow: 5.72°C/W @ 200 LFM
Thermal Resistance @ Natural: 25.86°C/W
Fin Height: 0.748" (19.00mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEATSINK TO-220 2.9W ALUMINUM
Packaging: Bag
Material: Aluminum
Length: 0.512" (13.00mm)
Shape: Rectangular, Fins
Type: Board Level
Width: 0.512" (13.00mm)
Package Cooled: TO-220
Attachment Method: PC Pin
Power Dissipation @ Temperature Rise: 2.9W @ 75°C
Thermal Resistance @ Forced Air Flow: 5.72°C/W @ 200 LFM
Thermal Resistance @ Natural: 25.86°C/W
Fin Height: 0.748" (19.00mm)
Material Finish: Black Anodized
Part Status: Active
на замовлення 2955 шт:
термін постачання 21-31 дні (днів)
Кількість | Ціна без ПДВ |
---|---|
7+ | 43.46 грн |
10+ | 39.73 грн |
25+ | 37.71 грн |
50+ | 34.46 грн |
100+ | 33.99 грн |
250+ | 31.67 грн |
500+ | 29.31 грн |
1000+ | 26.57 грн |
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Технічний опис HSS-B20-061H-03 CUI Devices
Description: HEATSINK TO-220 2.9W ALUMINUM, Packaging: Bag, Material: Aluminum, Length: 0.512" (13.00mm), Shape: Rectangular, Fins, Type: Board Level, Width: 0.512" (13.00mm), Package Cooled: TO-220, Attachment Method: PC Pin, Power Dissipation @ Temperature Rise: 2.9W @ 75°C, Thermal Resistance @ Forced Air Flow: 5.72°C/W @ 200 LFM, Thermal Resistance @ Natural: 25.86°C/W, Fin Height: 0.748" (19.00mm), Material Finish: Black Anodized, Part Status: Active.
Інші пропозиції HSS-B20-061H-03
Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
---|---|---|---|---|---|
HSS-B20-061H-03 | Виробник : CUI Devices | Heat Sinks 19 x 13 x 12.7mm TO-220 solder pin |
товар відсутній |