HSS-B20-0508H-01S CUI Devices
Виробник: CUI Devices
Description: HEATSINK TO-220 4.7W ALUMINUM
Packaging: Bag
Material: Aluminum
Length: 0.500" (12.70mm)
Shape: Rectangular, Fins
Type: Board Level
Width: 1.000" (25.40mm)
Package Cooled: TO-220
Attachment Method: Bolt On and Board Mounts
Power Dissipation @ Temperature Rise: 4.7W @ 75°C
Thermal Resistance @ Forced Air Flow: 5.87°C/W @ 200 LFM
Thermal Resistance @ Natural: 15.83°C/W
Fin Height: 1.180" (29.97mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEATSINK TO-220 4.7W ALUMINUM
Packaging: Bag
Material: Aluminum
Length: 0.500" (12.70mm)
Shape: Rectangular, Fins
Type: Board Level
Width: 1.000" (25.40mm)
Package Cooled: TO-220
Attachment Method: Bolt On and Board Mounts
Power Dissipation @ Temperature Rise: 4.7W @ 75°C
Thermal Resistance @ Forced Air Flow: 5.87°C/W @ 200 LFM
Thermal Resistance @ Natural: 15.83°C/W
Fin Height: 1.180" (29.97mm)
Material Finish: Black Anodized
Part Status: Active
на замовлення 678 шт:
термін постачання 21-31 дні (днів)
Кількість | Ціна без ПДВ |
---|---|
7+ | 48.62 грн |
10+ | 44.91 грн |
25+ | 42.59 грн |
50+ | 38.93 грн |
100+ | 38.41 грн |
250+ | 35.78 грн |
500+ | 33.12 грн |
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Технічний опис HSS-B20-0508H-01S CUI Devices
Description: HEATSINK TO-220 4.7W ALUMINUM, Packaging: Bag, Material: Aluminum, Length: 0.500" (12.70mm), Shape: Rectangular, Fins, Type: Board Level, Width: 1.000" (25.40mm), Package Cooled: TO-220, Attachment Method: Bolt On and Board Mounts, Power Dissipation @ Temperature Rise: 4.7W @ 75°C, Thermal Resistance @ Forced Air Flow: 5.87°C/W @ 200 LFM, Thermal Resistance @ Natural: 15.83°C/W, Fin Height: 1.180" (29.97mm), Material Finish: Black Anodized, Part Status: Active.
Інші пропозиції HSS-B20-0508H-01S
Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
---|---|---|---|---|---|
HSS-B20-0508H-01S | Виробник : CUI Devices | Heat Sinks 29.97 x 25.4 x12.7mm TO-220 bolt on/pin |
товар відсутній |