![HSE-B18635-035H HSE-B18635-035H](https://download.siliconexpert.com/pdfs/2018/11/26/16/5/11/19453/cui_/manual/253358.jpg)
HSE-B18635-035H CUI DEVICES
![hse-b18x-035h.pdf](/images/adobe-acrobat.png)
Heat Sink Passive TO-218 Vertical Thru-Hole Aluminum 6063-T5 4.49C/W Black Anodized
товар відсутній
Відгуки про товар
Написати відгук
Технічний опис HSE-B18635-035H CUI DEVICES
Description: HEAT SINK, EXTRUSION,TO-218, 63., Packaging: Box, Material: Aluminum Alloy, Length: 2.500" (63.50mm), Shape: Rectangular, Angled Fins, Type: Board Level, Vertical, Width: 1.638" (41.60mm), Package Cooled: TO-218, Attachment Method: Bolt On and PC Pin, Power Dissipation @ Temperature Rise: 16.7W @ 75°C, Thermal Resistance @ Forced Air Flow: 2.24°C/W @ 200 LFM, Thermal Resistance @ Natural: 4.49°C/W, Fin Height: 0.984" (25.00mm), Material Finish: Black Anodized.
Інші пропозиції HSE-B18635-035H
Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
---|---|---|---|---|---|
![]() |
HSE-B18635-035H | Виробник : CUI DEVICES |
![]() |
товар відсутній |
|
![]() |
HSE-B18635-035H | Виробник : CUI DEVICES |
![]() |
товар відсутній |
|
![]() |
HSE-B18635-035H | Виробник : CUI Devices |
![]() Packaging: Box Material: Aluminum Alloy Length: 2.500" (63.50mm) Shape: Rectangular, Angled Fins Type: Board Level, Vertical Width: 1.638" (41.60mm) Package Cooled: TO-218 Attachment Method: Bolt On and PC Pin Power Dissipation @ Temperature Rise: 16.7W @ 75°C Thermal Resistance @ Forced Air Flow: 2.24°C/W @ 200 LFM Thermal Resistance @ Natural: 4.49°C/W Fin Height: 0.984" (25.00mm) Material Finish: Black Anodized |
товар відсутній |
|
![]() |
HSE-B18635-035H | Виробник : CUI Devices |
![]() |
товар відсутній |