HMTSW-110-08-G-D-228-RA Samtec
на замовлення 63 шт:
термін постачання 21-30 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 268.28 грн |
| 100+ | 183.33 грн |
| 500+ | 141.78 грн |
| 1000+ | 137.55 грн |
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Технічний опис HMTSW-110-08-G-D-228-RA Samtec
Description: CONN HEADER R/A 20POS 2.54MM, Packaging: Bulk, Connector Type: Header, Current Rating (Amps): 3A, Mounting Type: Through Hole, Right Angle, Number of Positions: 20, Number of Rows: 2, Style: Board to Board or Cable, Operating Temperature: -55°C ~ 125°C, Contact Type: Male Pin, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Contact Material: Phosphor Bronze, Insulation Color: Natural, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Post: Gold, Part Status: Active, Contact Shape: Square, Insulation Height: 0.240" (6.10mm), Shrouding: Unshrouded, Insulation Material: Liquid Crystal Polymer (LCP), Row Spacing - Mating: 0.100" (2.54mm), Contact Length - Mating: 0.228" (5.80mm).
Інші пропозиції HMTSW-110-08-G-D-228-RA за ціною від 290.72 грн до 290.72 грн
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ | ||||
|---|---|---|---|---|---|---|---|---|---|
| HMTSW-110-08-G-D-228-RA | Виробник : Samtec Inc. |
 Description: CONN HEADER R/A 20POS 2.54MMPackaging: Bulk Connector Type: Header Current Rating (Amps): 3A Mounting Type: Through Hole, Right Angle Number of Positions: 20 Number of Rows: 2 Style: Board to Board or Cable Operating Temperature: -55°C ~ 125°C Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Phosphor Bronze Insulation Color: Natural Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Gold Part Status: Active Contact Shape: Square Insulation Height: 0.240" (6.10mm) Shrouding: Unshrouded Insulation Material: Liquid Crystal Polymer (LCP) Row Spacing - Mating: 0.100" (2.54mm) Contact Length - Mating: 0.228" (5.80mm) |
на замовлення 182 шт: термін постачання 21-31 дні (днів) |
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HMTSW-110-08-G-D-228-RA | Виробник : Samtec |
Conn Unshrouded Header HDR 20 POS 2.54mm Solder RA Side Entry Thru-Hole Bulk |
товар відсутній |