Технічний опис FTMH-113-02-L-DV-A-P-TR Samtec
Description: CONN HEADER SMD 26POS 1MM, Packaging: Tape & Reel (TR), Features: Board Guide, Pick and Place, Connector Type: Header, Current Rating (Amps): 2.8A per Contact, Mounting Type: Surface Mount, Number of Positions: 26, Number of Rows: 2, Style: Board to Board, Operating Temperature: -55°C ~ 125°C, Contact Type: Male Pin, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Contact Material: Phosphor Bronze, Insulation Color: Black, Pitch - Mating: 0.039" (1.00mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Post: Tin, Contact Shape: Square, Insulation Height: 0.059" (1.50mm), Shrouding: Unshrouded, Insulation Material: Liquid Crystal Polymer (LCP), Row Spacing - Mating: 0.039" (1.00mm), Contact Length - Mating: 0.075" (1.90mm).
Інші пропозиції FTMH-113-02-L-DV-A-P-TR
Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
---|---|---|---|---|---|
|
FTMH-113-02-L-DV-A-P-TR | Виробник : Samtec Inc. |
![]() Packaging: Tape & Reel (TR) Features: Board Guide, Pick and Place Connector Type: Header Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 26 Number of Rows: 2 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Phosphor Bronze Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Tin Contact Shape: Square Insulation Height: 0.059" (1.50mm) Shrouding: Unshrouded Insulation Material: Liquid Crystal Polymer (LCP) Row Spacing - Mating: 0.039" (1.00mm) Contact Length - Mating: 0.075" (1.90mm) |
товар відсутній |
|
![]() |
FTMH-113-02-L-DV-A-P-TR | Виробник : Samtec |
![]() |
товар відсутній |