FSI-130-03-G-S-AB Samtec Inc.
Виробник: Samtec Inc.
Description: CONN STACKING 30POS SMD GOLD
Packaging: Tube
Features: Board Guide
Connector Type: Stacking Compression
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 30
Pitch: 0.039" (1.00mm)
Height Above Board: 0.118" (3.00mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Number of Rows: 1
Description: CONN STACKING 30POS SMD GOLD
Packaging: Tube
Features: Board Guide
Connector Type: Stacking Compression
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 30
Pitch: 0.039" (1.00mm)
Height Above Board: 0.118" (3.00mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Number of Rows: 1
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Технічний опис FSI-130-03-G-S-AB Samtec Inc.
Description: CONN STACKING 30POS SMD GOLD, Packaging: Tube, Features: Board Guide, Connector Type: Stacking Compression, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 30, Pitch: 0.039" (1.00mm), Height Above Board: 0.118" (3.00mm), Contact Finish Thickness: 10.0µin (0.25µm), Number of Rows: 1.
Інші пропозиції FSI-130-03-G-S-AB
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FSI-130-03-G-S-AB | Виробник : Samtec |
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